LOGIC LPR520JC22

LPR520
LPR520
DEVICES INCORPORATED
4 x 16-bit Multilevel Pipeline Register
4 x 16-bit Multilevel Pipeline Register
DEVICES INCORPORATED
FEATURES
DESCRIPTION
❑ Four 16-bit Registers
❑ Implements Double 2-Stage
Pipeline or Single 4-Stage Pipeline
Register
The LPR520 is functionally compatible with the L29C520 but have 16-bit
inputs and outputs. The LPR520 is
implemented in low power CMOS.
❑ Hold, Shift, and Load Instructions
❑ Separate Data In and Data Out Pins
❑ High-Speed, Low Power CMOS
Technology
The LPR520 contains four registers
which can be configured as two
independent, 2-level pipelines or as
one 4-level pipeline.
❑ Three-State Outputs
❑ 44-pin PLCC, J-Lead
The Instruction pins, I1-0, control the
loading of the registers. The registers
may be configured as a four-stage
delay line, with data loaded into R1
and shifted sequentially through R2,
R3, and R4. Also, data may be loaded
from the inputs into either R1 or R3
with only R2 or R4 shifting. Finally,
I1-0 may be set to prevent any register
from changing.
TABLE 1.
LPR520 INSTRUCTION TABLE
MUX
I1
I0
Description
L
L
D➞R1
R1➞R2
R2➞R3
R3➞R4
L
H
HOLD
HOLD
D➞R3
R3➞R4
H
L
D➞R1
R1➞R2
HOLD
HOLD
H
H
ALL REGISTERS ON HOLD
16
Y15-0
OE
REGISTER 4
REGISTER 3
REG 1
REG 2
REG 3
REG 4
MUX
D15-0
REGISTER 2
REGISTER 1
LPR520 BLOCK DIAGRAM
16
The S1-0 select lines control a 4-to-1
multiplexer which routes the contents
of any of the registers to the Y output
pins. The independence of the I and S
controls allows simultaneous write
and read operations on different
registers.
2
S1-0
TABLE 2.
2
I1-0
CLK
OUTPUT SELECT
S1 S0
Register Selected
L
L
Register 4
L
H
Register 3
H
L
Register 2
H
H
Register 1
Pipeline Registers
1
08/02/2000–LDS.P520-C
LPR520
DEVICES INCORPORATED
4 x 16-bit Multilevel Pipeline Register
MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8)
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature ........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground ............................................................................ –0.5 V to +7.0 V
Input signal with respect to ground ........................................................................................ –3.0 V to +7.0 V
Signal applied to high impedance output ............................................................................... –3.0 V to +7.0 V
Output current into low outputs ............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS To meet specified electrical and switching characteristics
Mode
Temperature Range (Ambient)
Active Operation, Commercial
Active Operation, Military
Supply Voltage
0°C to +70°C
4.75 V ≤ VCC ≤ 5.25 V
–55°C to +125°C
4.50 V ≤ VCC ≤ 5.50 V
ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4)
Symbol
Parameter
Test Condition
Min
VOH
Output High Voltage
VCC = Min., IOH = –2.0 mA
2.4
VOL
Output Low Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input High Voltage
VIL
Input Low Voltage
(Note 3)
IIX
Input Current
IOZ
Typ
Max
Unit
V
0.5
V
2.0
VCC
V
0.0
0.8
V
Ground ≤ VIN ≤ VCC (Note 12)
±20
µA
Output Leakage Current
Ground ≤ VOUT ≤ VCC (Note 12)
±20
µA
ICC1
VCC Current, Dynamic
(Notes 5, 6)
40
mA
ICC2
VCC Current, Quiescent
(Note 7)
1.0
mA
10
Pipeline Registers
2
08/02/2000–LDS.P520-C
LPR520
DEVICES INCORPORATED
4 x 16-bit Multilevel Pipeline Register
SWITCHING CHARACTERISTICS
COMMERCIAL OPERATING RANGE (0°C to +70°C) Notes 9, 10 (ns)
Symbol
LPR520–
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*
25
22
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Min
Max
Min
Max
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25
22
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25
20
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10
10
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13
10
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3
3
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13
10
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3
3
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25
21
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25
15
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Parameter
tPD
Clock to Output Delay
tSEL
Select to Output Delay
tPW
Clock Pulse Width
tSI
Instruction Setup Time
tHI
Instruction Hold Time
tSD
Data Setup Time
tHD
Data Hold Time
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
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15*
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Min
Max
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15
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15
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8
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6
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1
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6
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1
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15
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12
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MILITARY OPERATING RANGE (–55°C to +125°C) Notes 9, 10 (ns)
Symbol
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LPR520–
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*
30
24*
18*
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Min
Max
Min
Max
Min
Max
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30
24
18
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30
22
18
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15
10
9
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15
10
8
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5
3
2
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15
10
8
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5
3
2
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25
22
16
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20
16
13
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Parameter
tPD
Clock to Output Delay
tSEL
Select to Output Delay
tPW
Clock Pulse Width
tSI
Instruction Setup Time
tHI
Instruction Hold Time
tSD
Data Setup Time
tHD
Data Hold Time
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
SWITCHING WAVEFORMS
I1-0
tSI
tHI
tSD
tHD
D15-0
tPW
CLK
tPW
S1-0
tPD
tSEL
OE
tDIS
tENA
HIGH IMPEDANCE
Y15-0
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*DISCONTINUED SPEED GRADE
Pipeline Registers
3
08/02/2000–LDS.P520-C
LPR520
DEVICES INCORPORATED
4 x 16-bit Multilevel Pipeline Register
NOTES
1. Maximum Ratings indicate stress
specifications only. Functional operation of these products at values beyond
those indicated in the Operating Conditions table is not implied. Exposure to
maximum rating conditions for extended periods may affect reliability.
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified IOH and IOL at an output
voltage of VOH min and VOL max
2. The products described by this spec- respectively. Alternatively, a diode
ification include internal circuitry de- bridge with upper and lower current
signed to protect the chip from damagsources of IOH and I OL respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF
less, conventional precautions should minimum, and may be distributed.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs caavoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
3. This device provides hard clamping of testing of this device. The following
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above VCC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
VCC + 0.6 V. The device can withstand installed between VCC and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
tion will not be adversely affected, how- should be installed between device VCC
ever, input current levels will be well in and the tester common, and device
ground and tester common.
excess of 100 mA.
4. Actual test conditions may vary from b. Ground and VCC supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
5. Supply current for a given applica- c. Input voltages should be adjusted to
tion can be accurately approximated by: compensate for inductive ground and VCC
noise to maintain required DUT input
NCV2 F
levels relative to the DUT ground pin.
4
where
10. Each parameter is shown as a minN = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
6. Tested with all outputs changing every cycle and no load, at a 5 MHz clock
rate.
7. Tested with all inputs within 0.1 V of
VCC or Ground, no load.
8. These parameters are guaranteed
but not 100% tested.
11. For the tENA test, the transition is
measured to the 1.5 V crossing point
with datasheet loads. For the tDIS test,
the transition is measured to the
±200mV level from the measured
steady-state output voltage with
±10mA loads. The balancing voltage, V TH , is set at 3.5 V for Z-to-0
and 0-to-Z tests, and set at 0 V for Zto-1 and 1-to-Z tests.
12. These parameters are only tested at
the high temperature extreme, which is
the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
S1
DUT
IOL
VTH
CL
IOH
FIGURE B. THRESHOLD LEVELS
tENA
OE
Z
tDIS
1.5 V
1.5 V
3.5V Vth
0
1.5 V
1.5 V
Z
1
VOL*
0.2 V
VOH*
0.2 V
0
Z
1
Z
0V Vth
VOL* Measured VOL with IOH = –10mA and IOL = 10mA
VOH* Measured VOH with IOH = –10mA and IOL = 10mA
imum or maximum value. Input requirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the external system must supply at least that
much time to meet the worst-case requirements of all parts. Responses from
the internal circuitry are specified from
the point of view of the device. Output
delay, for example, is specified as a
maximum since worst-case operation of
any device always provides data within
that time.
Pipeline Registers
4
08/02/2000–LDS.P520-C
LPR520
DEVICES INCORPORATED
Speed
Plastic DIP
(P3)
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
NC
7
6
5
4
3
2
1 44 43 42 41 40
39
8
38
9
37
10
36
11
Top
View
12
13
35
34
33
14
32
15
31
16
30
17
29
18 19 20 21 22 23 24 25 26 27 28
NC
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
Y11
D13
D14
D15
CLK
GND
OE
Y15
Y14
Y13
Y12
NC
LPR520 — ORDERING INFORMATION
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40-pin — 0.6" wide
44-pin
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40
VCC
I0
1
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39
2
I1
S0
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38
3
D0
S1
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37
4
D1
Y0
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36
5
D2
Y1
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35
6
D3
Y2
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34
7
D4
Y3
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33
8
D5
Y4
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32
9
D6
Y5
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31
10
D7
Y6
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30
11
D8
Y7
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29
12
D9
Y8
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28
13
D10
Y9
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27
14
D11
Y10
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26
15
D12
Y11
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25
16
D13
Y12
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24
17
D14
Y13
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23
18
D15
Y14
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22
19
CLK
Y15
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21
20
GND
OE
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Discontinued Package
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NC
D2
D1
D0
I1
I0
VCC
S0
S1
Y0
Y1
4 x 16-bit Multilevel Pipeline Register
Plastic J-Lead Chip Carrier
(J1)
Ceramic DIP
(C11)
0°C to +70°C — COMMERCIAL SCREENING
22 ns
LPR520JC22
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
Pipeline Registers
5
08/02/2000–LDS.P520-C