LOGIC LMU216JC20

LMU16/216
LMU16/216
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
16 x 16-bit Parallel Multiplier
DEVICES INCORPORATED
FEATURES
DESCRIPTION
❑ 20 ns Worst-Case Multiply Time
❑ Low Power CMOS Technology
❑ Replaces Fairchild MPY016/TMC216,
Cypress CY7C516, IDT 7216L, and
AMD Am29516
The LMU16 and LMU216 are highspeed, low power 16-bit parallel
multipliers. The LMU16 and
LMU216 are functionally identical;
they differ only in packaging.
❑ Two’s Complement, Unsigned, or
Mixed Operands
The LMU16 and LMU216 produce
the 32-bit product of two 16-bit
numbers. Data present at the A
inputs, along with the TCA control
bit, is loaded into the A register on
the rising edge of CLK A. B data
and the TCB control bit are
similarly loaded by CLK B. The
TCA and TCB controls specify the
A and B operands as two’s
complement when HIGH, or
unsigned magnitude when LOW.
❑ Three-State Outputs
❑ 68-pin PLCC, J-Lead
LMU16/216 BLOCK DIAGRAM
B 15-0/
R 15-0
TCA
A 15-0
TCB
16
16
CLK A
A REGISTER
REGISTER
32
RS
FORMAT ADJUST
16
16
FT
CLK M
At the output, the Right Shift control
(RS) selects either of two output
formats. RS LOW produces a 31-bit
product with a copy of the sign bit
inserted in the MSB postion of the
least significant half. RS HIGH gives a
full 32-bit product. Two 16-bit output
registers are provided to hold the
most and least significant halves of the
result (MSP and LSP) as defined by
RS. These registers are loaded on the
rising edge of CLK M and CLK L
respectively. For asynchronous
output, these registers may be made
transparent by setting the feed
through control (FT) HIGH.
The two halves of the product may be
routed to a single 16-bit three-state
output port (MSP) via a multiplexer.
MSPSEL LOW causes the MSP
outputs to be driven by the most
significant half of the result. MSPSEL
HIGH routes the least significant half
of the result to the MSP outputs. In
addition, the LSP is available via the B
port through a separate three-state
buffer.
B REGISTER
CLK B
RND
RND is loaded on the rising edge of
the logical OR of CLK A and CLK B.
RND, when HIGH, adds ‘1’ to the
most significant bit position of the
least significant half of the product.
Subsequent truncation of the 16 least
significant bits produces a result
correctly rounded to 16-bit precision.
RESULT
CLK L
REGISTER
MSPSEL
OEM
The output multiplexer control
MSPSEL uses a pin which is a supply
ground in the Fairchild MPY016H/
TMC216H. When this control is LOW
(GND), the function is that of the
MPY016H/TMC216H, thus allowing
full compatibility.
OEL
16
16
R 31-16
Multipliers
1
08/16/2000–LDS.16/216-N
LMU16/216
DEVICES INCORPORATED
FIGURE 1A.
16 x 16-bit Parallel Multiplier
INPUT FORMATS
AIN
BIN
Fractional Two’s Complement (TCA, TCB = 1)
15 14 13
–20 2–1 2–2
2 1 0
2–13 2–14 2–15
15 14 13
–20 2–1 2–2
(Sign)
2 1 0
2–13 2–14 2–15
(Sign)
Integer Two’s Complement (TCA, TCB = 1)
15 14 13
–215 214 213
2 1 0
22 21 20
15 14 13
–215 214 213
(Sign)
2 1 0
22 21 20
(Sign)
Unsigned Fractional (TCA, TCB = 0)
15 14 13
2–1 2–2 2–3
2 1 0
2–14 2–15 2–16
15 14 13
2–1 2–2 2–3
2 1 0
2–14 2–15 2–16
Unsigned Integer (TCA, TCB = 0)
15 14 13
215 214 213
FIGURE 1B.
2 1 0
22 21 20
15 14 13
215 214 213
2 1 0
22 21 20
OUTPUT FORMATS
MSP
LSP
Fractional Two’s Complement (RS = 0)
31 30 29
–20 2–1 2–2
18 17 16
2–13 2–14 2–15
15 14 13
–20 2–16 2–17
(Sign)
2 1 0
2–28 2–29 2–30
(Sign)
Fractional Two’s Complement (RS = 1)
31 30 29
–21 20 2–1
18 17 16
2–12 2–13 2–14
15 14 13
2–15 2–16 2–17
2 1 0
2–28 2–29 2–30
(Sign)
Integer Two’s Complement (RS = 1)
31 30 29
–231 230 229
18 17 16
218 217 216
15 14 13
215 214 213
2 1 0
22 21 20
(Sign)
Unsigned Fractional (RS = 1)
31 30 29
2–1 2–2 2–3
18 17 16
2–14 2–15 2–16
15 14 13
2–17 2–18 2–19
2 1 0
2–30 2–31 2–32
Unsigned Integer (RS = 1)
31 30 29
231 230 229
18 17 16
218 217 216
15 14 13
215 214 213
2 1 0
22 21 20
Multipliers
2
08/16/2000–LDS.16/216-N
LMU16/216
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8)
Storage temperature ........................................................................................................... –65°C to +150°C
Operating ambient temperature ........................................................................................... –55°C to +125°C
VCC supply voltage with respect to ground ............................................................................ –0.5 V to +7.0 V
Input signal with respect to ground ........................................................................................ –3.0 V to +7.0 V
Signal applied to high impedance output ............................................................................... –3.0 V to +7.0 V
Output current into low outputs ............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
OPERATING CONDITIONS To meet specified electrical and switching characteristics
Mode
Temperature Range (Ambient)
Active Operation, Commercial
Active Operation, Military
Supply Voltage
0°C to +70°C
4.75 V ≤ VCC ≤ 5.25 V
–55°C to +125°C
4.50 V ≤ VCC ≤ 5.50 V
ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4)
Symbol
Parameter
Test Condition
Min
VOH
Output High Voltage
VCC = Min., IOH = –2.0 mA
VOL
Output Low Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input High Voltage
VIL
Input Low Voltage
(Note 3)
IIX
Input Current
IOZ
Typ
Max
2.4
Unit
V
0.5
V
2.0
VCC
V
0.0
0.8
V
Ground ≤ VIN ≤ VCC (Note 12)
±20
µA
Output Leakage Current
Ground ≤ VOUT ≤ VCC (Note 12)
±20
µA
ICC1
VCC Current, Dynamic
(Notes 5, 6)
25
mA
ICC2
VCC Current, Quiescent
(Note 7)
1.0
mA
12
Multipliers
3
08/16/2000–LDS.16/216-N
LMU16/216
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
SWITCHING CHARACTERISTICS
COMMERCIAL OPERATING RANGE (0°C to +70°C) Notes 9, 10 (ns)
Symbol
Parameter
tMC
Clocked Multiply Time
tMUC
Unclocked Multiply Time
tPW
Clock Pulse Width
tS
Input Setup Time
tH
Input Hold Time
tD
Output Delay
tSEL
Output Select Delay
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
LMU16/216–
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*
65
55
45*
35*
25
20
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Min Max Min Max Min Max Min Max Min Max Min Max
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55
45
35
25
20
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85
75
65
55
38
30
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15
15
15
10
10
9
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15
15
15
12
12
11
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1
1
1
1
1
1
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30
30
25
20
18
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25
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22
20
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MILITARY OPERATING RANGE (–55°C to +125°C) Notes 9, 10 (ns)
Symbol
Parameter
tMC
Clocked Multiply Time
tMUC
Unclocked Multiply Time
tPW
Clock Pulse Width
tS
Input Setup Time
tH
Input Hold Time
tD
Output Delay
tSEL
Output Select Delay
tENA
Three-State Output Enable Delay (Note 11)
tDIS
Three-State Output Disable Delay (Note 11)
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LMU16/216–
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*
75
65
55*
40*
30*
25*
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Min Max Min Max Min Max Min Max Min Max Min Max
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65
55
40
30
25
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95
85
75
60
43
38
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20
15
15
15
10
10
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15
15
15
15
12
12
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2
2
2
2
2
2
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30
30
25
20
20
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25
20
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20
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25
25
25
22
22
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SWITCHING WAVEFORMS
tS
tH
INPUT
tPW
tPW
CLK A
CLK B
tD
CLK L
CLK M
tMC
tSEL
MSPSEL
tMUC
OEL
OEM
tDIS
R31-0
tENA
HIGH IMPEDANCE
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*DISCONTINUED SPEED GRADE
Multipliers
4
08/16/2000–LDS.16/216-N
LMU16/216
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
NOTES
1. Maximum Ratings indicate stress
specifications only. Functional operation of these products at values beyond
those indicated in the Operating Conditions table is not implied. Exposure to
maximum rating conditions for extended periods may affect reliability.
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
tDIS test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified IOH and IOL at an output
voltage of VOH min and VOL max
2. The products described by this spec- respectively. Alternatively, a diode
ification include internal circuitry de- bridge with upper and lower current
signed to protect the chip from damagsources of I OH and I OL respectively,
ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be
cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF
less, conventional precautions should minimum, and may be distributed.
be observed during storage, handling,
and use of these circuits in order to This device has high-speed outputs caavoid exposure to excessive electrical pable of large instantaneous current
stress values.
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
3. This device provides hard clamping of testing of this device. The following
transient undershoot and overshoot. In- measures are recommended:
put levels below ground or above VCC
will be clamped beginning at –0.6 V and a. A 0.1 µF ceramic capacitor should be
VCC + 0.6 V. The device can withstand installed between VCC and Ground
indefinite operation with inputs in the leads as close to the Device Under Test
range of –0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors
tion will not be adversely affected, how- should be installed between device VCC
ever, input current levels will be well in and the tester common, and device
ground and tester common.
excess of 100 mA.
4. Actual test conditions may vary from b. Ground and VCC supply planes
those designated but operation is guar- must be brought directly to the DUT
anteed as specified.
socket or contactor fingers.
5. Supply current for a given applica- c. Input voltages should be adjusted to
tion can be accurately approximated by: compensate for inductive ground and VCC
noise to maintain required DUT input
NCV2 F
levels relative to the DUT ground pin.
4
where
10. Each parameter is shown as a min-
11. For the tENA test, the transition is
measured to the 1.5 V crossing point
with datasheet loads. For the tDIS test,
the transition is measured to the
±200mV level from the measured
steady-state output voltage with
±10mA loads. The balancing voltage, V TH , is set at 3.5 V for Z-to-0
and 0-to-Z tests, and set at 0 V for Zto-1 and 1-to-Z tests.
12. These parameters are only tested at
the high temperature extreme, which is
the worst case for leakage current.
FIGURE A. OUTPUT LOADING CIRCUIT
S1
DUT
IOL
VTH
CL
IOH
FIGURE B. THRESHOLD LEVELS
tENA
OE
Z
tDIS
1.5 V
1.5 V
3.5V Vth
0
1.5 V
1.5 V
Z
1
VOL*
0.2 V
VOH*
0.2 V
0
Z
1
Z
0V Vth
VOL* Measured VOL with IOH = –10mA and IOL = 10mA
VOH* Measured VOH with IOH = –10mA and IOL = 10mA
imum or maximum value. Input requirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the exter6. Tested with all outputs changing ev- nal system must supply at least that
ery cycle and no load, at a 5 MHz clock much time to meet the worst-case requirements of all parts. Responses from
rate.
the internal circuitry are specified from
7. Tested with all inputs within 0.1 V of the point of view of the device. Output
VCC or Ground, no load.
delay, for example, is specified as a
8. These parameters are guaranteed maximum since worst-case operation of
any device always provides data within
but not 100% tested.
that time.
N = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
Multipliers
5
08/16/2000–LDS.16/216-N
LMU16/216
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
LMU16 — ORDERING INFORMATION
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64-pin
68-pin
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64
A4
1
A5
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63
2
A3
A6
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1
2
3
4
5
6
7
8
9
10
11
62
3
A2
A7
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4
A1
A8
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5
A0
A9
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A
59
6
OEL
A10
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NC CLK B OEL A1
A11
A3
A5
A7
A9
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58
7
CLK L
A11
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B
57
8
CLK B
A12
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56
9
R0, B0
A13
R/B1 R/B0 CLK L A0
A2
A4
A6
A8
A10 A12 NC
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55
10
R1, B1
A14
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C
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54
11
R2, B2
A15
A14 A13
R/B3 R/B2
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12
R3, B3
CLK A
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D
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52
13
RND
R4, B4
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R/B5 R/B4
CLK A A15
51
14
TCA
R5, B5
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E
50
15
TCB
R6, B6
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Top View
R/B7 R/B6
TCA RND
49
16
VCC
R7, B7
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Through Package
48
17
R8, B8
VCC
F
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47
18
R9, B9
GND
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R/B9 R/B8
VCC TCB
(i.e., Component Side Pinout)
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46
19
GND
R10, B10
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G
45
20
MSPSEL
R
11
,
B
11
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R/B11 R/B10
GND VCC
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44
21
FT
R12, B12
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H
43
22
RS
R
13
,
B
13
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MSPSEL GND
R/B13 R/B12
42
23
OEM
R14, B14
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41
24
CLK M
R15, B15
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J
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40
25
R31
R16
R/B15 R/B14
RS
FT
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39
26
R17
R30
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K
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27
R18
R29
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NC R16 R18 R20 R22 R24 R26 R28 R30 CLK M OEM
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28
R19
R28
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L
36
29
R20
R27
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R17 R19 R21 R23 R25 R27 R29 R31 NC
35
30
R21
R26
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31
R22
R25
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33
32
R23
R24
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Discontinued Package
Discontinued Package
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1234567890123456789012345678901212345678901234561234567890123456789012345678901212345678901234567
1234567890123456789012345678901212345678901234567
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Speed
Sidebraze Hermetic DIP
(D6)
Ceramic Pin Grid Array
(G2)
0°C to +70°C — COMMERCIAL SCREENING
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
Multipliers
6
08/16/2000–LDS.16/216-N
LMU16/216
DEVICES INCORPORATED
16 x 16-bit Parallel Multiplier
LMU216 — ORDERING INFORMATION
NC
CLK M
OEM
RS
FT
MSPSEL
GND
GND
VCC
VCC
TCB
TCA
RND
CLK A
A15
A14
A13
68-pin
10
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61
60
11
59
12
58
13
57
14
56
15
55
16
54
17
Top
View
18
19
53
52
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
NC
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
OEL
CLK L
CLK B
R15, B15
R14, B14
R13, B13
R12, B12
R11, B11
R10, B10
R9, B9
R8, B8
R7, B7
R6, B6
R5, B5
R4, B4
R3, B3
R2, B2
R1, B1
R0, B0
NC
R31
R30
R29
R28
R27
R26
R25
R24
R23
R22
R21
R20
R19
R18
R17
R16
NC
Speed
Plastic J-Lead
Chip Carrier (J2)
0°C to +70°C — COMMERCIAL SCREENING
25 ns
20 ns
LMU216JC25
LMU216JC20
–55°C to +125°C — COMMERCIAL SCREENING
–55°C to +125°C — MIL-STD-883 COMPLIANT
Multipliers
7
08/16/2000–LDS.16/216-N