ISO-CMOS MT8812 8 x 12 Analog Switch Array Features ISSUE 5 • Internal control latches and address decoder • Short set-up and hold times • Wide operating voltage: 4.5V to 14.5V • 14Vpp analog signal capability • • R ON 65Ω max. @ V DD=14V, 25°C ∆R ON ≤10Ω @ V DD=14V, 25°C • Full CMOS switch for low distortion • Minimum feedthrough and crosstalk • Low power consumption ISO-CMOS technology Ordering Information MT8812AC 40 Pin Ceramic DIP MT8812AE 40 Pin Plastic DIP MT8812AP 44 Pin PLCC 0° to 70°C Description The Mitel MT8812 is fabricated in MITEL’s ISOCMOS technology providing low power dissipation and high reliability. The device contains a 8 x12 array of crosspoint switches along with a 7 to 96 line decoder and latch circuits. Any one of the 96 switches can be addressed by selecting the appropriate seven input bits. The selected switch can be turned on or off by applying a logical one or zero to the DATA input. Applications • PBX systems • Mobile radio • Test equipment /instrumentation • Analog/digital multiplexers • Audio/Video switching STROBE DATA RESET 1 VDD VSS 1 AX1 AX3 8 x 12 7 to 96 Decoder Switch Latches Array AY0 AY1 96 •••••••••••••••• AX0 AX2 November 1988 Xi I/O (i=0-11) 96 AY2 ••••••••••••••••••• Yi I/O (i=0-7) Figure 1 - Functional Block Diagram 3-27 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 VDD Y2 DATA Y1 NC Y0 NC X0 X1 X2 X3 X4 X5 NC NC AY1 AY0 AX2 AX1 Y4 NC NC X6 X7 X8 X9 X10 X11 NC NC NC AX3 RESET AY2 Y3 VDD Y2 DATA Y1 Y0 Y3 AY2 RESET AX3 AX0 NC NC X6 X7 X8 X9 X10 X11 NC Y7 NC Y6 STROBE Y5 VSS NC AX0 ISO-CMOS 6 5 4 3 2 1 44 43 42 41 40 7 39 8 38 9 37 10 36 11 35 12 34 13 33 14 32 15 31 16 30 29 17 18 19 20 21 22 23 24 25 26 27 28 NC NC X0 X1 X2 X3 X4 X5 NC NC NC Y7 Y6 STROBE Y5 VSS Y4 AX1 AX2 AY0 AY1 NC MT8812 40 PIN CERDIP/PLASTIC DIP 44 PIN PLCC Figure 2 - Pin Connections Pin Description Pin #* Name 1 2 3 4,5 6,7 8-13 Y3 AY2 RESET AX3,AX0 NC X6-X11 Description Y3 Analog (Input/Output): this is connected to the Y3 column of the switch array. Y2 Address Line (Input). Master RESET (Input): this is used to turn off all switches. Active High. X3 and X0 Address Lines (Inputs). No Connection. X6-X11 Analog (Inputs/Outputs): these are connected to the X6-X11 rows of the switch array. 14 NC No Connection. 15 Y7 Y7 Analog (Input/Output): this is connected to the Y7 column of the switch array. 16 NC No Connection. 17 Y6 Y6 Analog (Input/Output): this is connected to the Y6 column of the switch array. 18 STROBE STROBE (Input): enables function selected by address and data. Address must be stable before STROBE goes high and DATA must be stable on the falling edge of the STROBE. Active High. 19 Y5 Y5 Analog (Input/Output): this is connected to the Y5 column of the switch array. Ground Reference. 20 VSS 21 Y4 Y4 Analog (Input/Output): this is connected to the Y4 column of the switch array. 22, 23 AX1,AX2 X1 and X2 Address Lines (Inputs). 24, 25 AY0,AY1 Y0 and Y1 Address Lines (Inputs). 26, 27 NC No Connection. 28 - 33 X5-X0 X5-X0 Analog (Inputs/Outputs): these are connected to the X5-X0 rows of the switch array. 34 NC No Connection. 35 Y0 Y0 Analog (Input/Output): this is connected to the Y0 column of the switch array. 36 NC No Connection. 37 Y1 Y1 Analog (Input/Output): this is connected to the Y1 column of the switch array. 38 DATA DATA (Input): a logic high input will turn on the selected switch and a logic low will turn off the selected switch. Active High. 39 Y2 Y2 Analog (Input/Output): this is connected to the Y2 column of the switch array. Positive Power Supply. 40 VDD * Plastic DIP and CERDIP only. 3-28 ISO-CMOS MT8812 Functional Description Address Decode The MT8812 is an analog switch matrix with an array size of 8 x 12. The switch array is arranged such that there are 8 columns by 12 rows. The columns are referred to as the Y input/output lines and the rows are the X input/output lines. The crosspoint analog switch array will interconnect any X line with any Y line when turned on and provide a high degree of isolation when turned off. The control memory consists of a 96 bit write only RAM in which the bits are selected by the address input lines (AY0-AY2, AX0-AX3). Data is presented to the memory on the DATA input line. Data is asynchro-nously written into memory whenever the STROBE input is high and is latched on the falling edge of STROBE. A logical “1” written into a memory cell turns the corresponding crosspoint switch on and a logical “0” turns the crosspoint off. Only the crosspoint switches corresponding to the addressed memory location are altered when data is written into memory. The remaining switches retain their previous states. Any combination of X and Y lines can be interconnected by establishing appropriate patterns in the control memory. A logical “1” on the RESET input line will asynchronously return all memory locations to logical “0” turning off all crosspoint switches. The seven address lines along with the STROBE input are logically ANDed to form an enable signal for the resettable transparent latches. The DATA input is buffered and is used as the input to all latches. To write to a location, RESET must be low while the address and data lines are set up. Then the STROBE input is set high and then low causing the data to be latched. The data can be changed while STROBE is high, however, the corresponding switch will turn on and off in accordance with the data. Data must be stable on the falling edge of STROBE in order for correct data to be written to the latch. 3-29 MT8812 ISO-CMOS Absolute Maximum Ratings*- Voltages are with respect to VSS unless otherwise stated. Parameter Symbol Min Max Units 1 Supply Voltage VDD VSS -0.3 -0.3 16.0 VDD+0.3 V V 2 Analog Input Voltage VINA -0.3 VDD+0.3 V 3 Digital Input Voltage VIN VSS-0.3 VDD+0.3 V 4 Current on any I/O Pin I ±15 mA 5 Storage Temperature TS +150 °C 6 Package Power Dissipation 0.6 1.0 W W PLASTIC DIP CERDIP -65 PD PD * Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Recommended Operating Conditions - Voltages are with respect to VSS unless otherwise stated. Characteristics Sym Min Typ Max Units TO 0 25 70 °C 1 Operating Temperature 2 Supply Voltage VDD 4.5 14.5 V 3 Analog Input Voltage VINA VSS VDD V 4 Digital Input Voltage VIN VSS VDD V DC Electrical Characteristics†Characteristics 1 Voltages are with respect to VSS=0V, VDD =14V unless otherwise stated. Sym Quiescent Supply Current Test Conditions Min IDD 2 Off-state Leakage Current (See G.9 in Appendix) IOFF 3 Input Logic “0” level VIL 4 Input Logic “1” level VIH 5 Input Leakage (digital pins) Typ‡ Max Units Test Conditions 1 100 µA All digital inputs at VIN=VSS or VDD 7 15 mA ±1 ±500 nA All digital inputs at VIN=2.4V IVXi - VYjI = VDD - VSS See Appendix, Fig. A.1 0.8 V 2.4 V ILEAK 0.1 10 µA All digital inputs at VIN = VSS or VDD † DC Electrical Characteristics are over recommended temperature range. ‡ Typical figures are at 25°C and are for design aid only; not guaranteed and not subject to production testing. DC Electrical Characteristics- Switch Resistance - VDC is the external DC offset applied at the analog I/O pins. Characteristics Sym 25°C Typ Max 1 On-state VDD=14V Resistance VDD=12V VDD=10V VDD= 5V (See G.1, G.2, G.3 in Appendix) RON 45 60 65 145 65 85 95 220 2 Difference in on-state resistance between two switches (See G.4 in Appendix) ∆RON 5 10 3-30 60°C Typ Max 10 70°C Typ Units Test Conditions Max 75 95 110 260 Ω Ω Ω Ω VSS=0V,VDC=VDD/2, IVXi-VYjI = 0.4V See Appendix, Fig. A.2 10 Ω VDD=14V, VSS=0, VDC=VDD/2, IVXi-VYjI = 0.4V See Appendix, Fig. A.2 ISO-CMOS MT8812 AC Electrical Characteristics† - Crosspoint Performance-VDC is the external DC offset applied at the analog I/O pins. Voltages are with respect to VDD=7V, VDC=0V, VSS=-7V, unless otherwise stated. Characteristics Sym Min Typ‡ Max Units Test Conditions 1 Switch I/O Capacitance CS 20 pF f=1 MHz 2 Feedthrough Capacitance CF 0.2 pF f=1 MHz 3 Frequency Response Channel “ON” 20LOG(VOUT/VXi)=-3dB F3dB 45 MHz Switch is “ON”; VINA = 2Vpp sinewave; RL = 1kΩ See Appendix, Fig. A.3 4 Total Harmonic Distortion (See G.5, G.6 in Appendix) THD 0.01 % Switch is “ON”; VINA = 2Vpp sinewave f= 1kHz; RL=1kΩ 5 Feedthrough Channel “OFF” Feed.=20LOG (VOUT/VXi) (See G.8 in Appendix) FDT -95 dB All Switches “OFF”; VINA= 2Vpp sinewave f= 1kHz; RL= 1kΩ. See Appendix, Fig. A.4 6 Crosstalk between any two channels for switches Xi-Yi and Xj-Yj. Xtalk -45 dB VINA=2Vpp sinewave f= 10MHz; RL = 75Ω. -90 dB VINA=2Vpp sinewave f= 10kHz; RL = 600Ω. -85 dB VINA=2Vpp sinewave f= 10kHz; RL = 1kΩ. -80 dB VINA=2Vpp sinewave f= 1kHz; RL = 10kΩ. Refer to Appendix, Fig. A.5 for test circuit. ns RL=1kΩ; CL=50pF Xtalk=20LOG (VYj/VXi). (See G.7 in Appendix). 7 Propagation delay through switch tPS 30 † Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details. ‡ Typical figures are at 25°C and are for design aid only; not guaranteed and not subject to production testing. Crosstalk measurements are for Plastic DIPS only, crosstalk values for PLCC packages are approximately 5dB better. AC Electrical Characteristics† - Control and I/O Timings- VDC is the external DC offset applied at the analog I/O pins. Voltages are with respect to VDD=7V, VDC=0V, VSS=-7V, unless otherwise stated. Characteristics 1 Control Input crosstalk to switch (for CS, DATA, STROBE, Address) 2 Sym Min Typ‡ Max Units Test Conditions CXtalk 30 mVpp Digital Input Capacitance CDI 10 pF 3 Switching Frequency FO 4 Setup Time DATA to STROBE tDS 10 ns RL= 1kΩ, CL=50pF 5 Hold Time DATA to STROBE tDH 10 ns RL= 1kΩ, CL=50pF 6 Setup Time Address to STROBE tAS 10 ns RL= 1kΩ, CL=50pF 7 Hold Time Address to STROBE tAH 10 ns RL= 1kΩ, CL=50pF 8 STROBE Pulse Width tSPW 20 ns RL= 1kΩ, CL=50pF 9 RESET Pulse Width tRPW 40 ns RL= 1kΩ, CL=50pF 10 STROBE to Switch Status Delay tS 40 100 ns RL= 1kΩ, CL=50pF 11 DATA to Switch Status Delay tD 50 100 ns RL= 1kΩ, CL=50pF 12 RESET to Switch Status Delay tR 35 100 ns RL= 1kΩ, CL=50pF 20 VIN=3V+VDC squarewave; RIN=1kΩ, RL=10kΩ. See Appendix, Fig. A.6 f=1MHz MHz † Timing is over recommended temperature range. See Fig. 3 for control and I/O timing details. Digital Input rise time (tr) and fall time (tf) = 5ns. ‡ Typical figures are at 25°C and are for design aid only; not guaranteed and not subject to production testing. Refer to Appendix, Fig. A.7 for test circuit. 3-31 MT8812 ISO-CMOS tRPW 50% RESET 50% tSPW STROBE 50% 50% 50% tAS ADDRESS 50% 50% tAH DATA 50% 50% tDS tDH ON SWITCH* OFF tR tS tD tR Figure 3 - Control Memory Timing Diagram * See Appendix, Fig. A.7 for switching waveform ➀ AX0 AX1 AX2 AX3 AY0 AY1 AY2 Connection 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 X0-Y0 X1-Y0 X2-Y0 X3-Y0 X4-Y0 X5-Y0 ➀ No Connection ➀ No Connection X6-Y0 X7-Y0 X8-Y0 X9-Y0 X10-Y0 X11-Y0 ➀ No Connection ➀ No Connection 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ 0 ↓ 0 ↓ X0-Y1 1 0 1 1 1 0 0 X11-Y1 0 ↓ 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ 0 ↓ X0-Y2 1 0 1 1 0 1 0 X11-Y2 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ 1 ↓ 0 ↓ X0-Y3 1 0 1 1 1 1 0 X11-Y3 0 ↓ 0 ↓ 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ X0-Y4 1 0 1 1 0 0 1 X11-Y4 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ 0 ↓ 1 ↓ X0-Y5 1 0 1 1 1 0 1 X11-Y5 0 ↓ 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ 1 ↓ X0-Y6 1 0 1 1 0 1 1 X11-Y6 0 ↓ 0 ↓ 0 ↓ 0 ↓ 1 ↓ 1 ↓ 1 ↓ X0-Y7 1 0 1 1 1 1 1 X11-Y7 Table 1. Address Decode Truth Table This address has no effect on device status. 3-32 ↓↓ ↓↓ ↓↓ ↓↓ ↓↓ ↓↓ ↓↓