PRELIMINARY DATA SHEET Silicon Transistor 2SC5336 NPN EPITAXIAL SILICON TRANSISTOR HIGH FREQUENCY LOW DISTORTION AMPLIFIER FEATURES • • PACKAGE DIMENSIONS High gain 2 | S21 | = 12 dB TYP, @f = 1 GHz, VCE = 10 V, Ic = 20 mA New power mini-mold package version of a 4-pin type gain-improved on the 2SC3357 (in millimeters) 4.5±0.1 1.6±0.2 1.5±0.1 Rating Unit Collector to Base Voltage VCBO 20 V Collector to Emitter Voltage VCEO 12 V Emitter to Base Voltage VEBO 3.0 V Collector Current IC 100 mA 1.2 W 150 °C –65 to +150 °C Note1 PT Total Power Dissipation Junction Temperature Tj Storage Temperature Tstg C E B 0.42 ±0.06 0.42 ±0.06 1.5 3.0 2 ELECTRICAL CHARACTERISTICS (TA = 25 °C) Symbol Test Conditions Collector Cutoff Current ICB0 VCB = 10 V, IE = 0 Emitter Cutoff Current IEB0 VEB = 1 V, IC = 0 DC Current Gain hFE VCE = 10 V, IC = 20 mA Gain Bandwidth Product fT VCE = 10 V, IC = 20 mA Feed-back Capacitance MIN. Note2 50 2 0.46 ±0.06 TYP. 120 MAX. Unit 1.0 µA 1.0 µA 250 6.5 Note3 Cre 0.25±0.02 PIN CONNECTIONS E: Emitter C: Collector B: Base Note 1. 0.7 mm × 16 cm double sided ceramic substrate (Copper plating) Parameter E 3.95±0.25 Symbol 0.8MIN. Parameter 2.45±0.1 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) GHz VCB = 10 V, IE = 0, f = 1.0 MHz 0.5 VCE = 10 V, IC = 20 mA, f = 1.0 GHz 12.0 dB dB Insertion Power Gain | S21e | Noise Figure NF VCE = 10 V, IC = 7 mA, f = 1.0 GHz 1.1 Noise Figure NF VCE = 10 V, IC = 40 mA, f = 1.0 GHz 1.8 0.8 3.0 pF dB Notes 2. Pulse measurement : PW ≤ 350 µS, Duty Cycle ≤ 2 % 3. Mesured by a 3-terminal bridge. Emitter and Case should be connected to the guard terminal. hFE Classification Rank RH RF RE Marking RH RF RE 50 to 100 80 to 160 hFE Document No. P10938EJ1V0DS00 (1st edition) Date Published April 1996 P Printed in Japan 125 to 250 © 1996 2SC5336 TYPICAL CHARACTERISTICS (TA = 25 °C) FEED BACK CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 5.0 Cre - Feed-back Capacitance - pF PT - Total Power Dissipation - W f = 1.0 MHZ 2.0 Ceramic Substrate 16 cm2 × 0.7 mm 1.0 Free Air Rth(j–a) 312.5 ˚C/W 0 50 100 3.0 2.0 1.0 0.5 0.3 1 150 S21e 2 - Insertion Power Gain - dB 100 50 10 0.5 1 10 5 10 20 30 10 5 1 3 5 10 20 30 50 IC - Collector Current - mA IC - Collector Current - mA GAIN BAND WIDTH PRODUCT vs. COLLECTOR CURRENT INSERTION GAIN .MAXIMUM GAIN vs. FREQUENCY 5 3 2 1 0.5 VCE = 10 V f = 1 GHZ 1 VCE = 10 V f = 1 GHZ 0 50 3 5 10 20 IC - Collector Current - mA 30 50 S21e 2 - Insertion Power Gain - dB MAG - Maximum Available Power Gain - dB hFE - DC Current Gain VCE = 10 V 20 fT - Gain Bandwidth Product - GHZ 10 15 200 2 5 INSERTION GAIN vs. COLLECTOR CURRENT DC CURRENT GAIN vs. COLLECTOR CURRENT 0.3 3 VCB - Collector to Base Voltage - V TA - Ambient Temperature - ˚C 100 S21e 2 MAG 20 10 VCE = 10 V IC = 20 mA 0 0.2 0.4 0.6 0.8 1.0 1.4 f - Frequency - GHZ 2.0 2SC5336 INTERMODULATION DISTORTION vs. COLLECTOR CURRENT NOISE FIGURE vs. COLLECTOR CURRENT 7 NF - Noise Figure - dB 6 IM2 - Intermoduration Distortion - dB VCE = 10 V f = 1 GHZ 5 4 3 2 1 0 0.5 1 5 10 IC - Collector Current - mA 50 –80 IM3 –70 –60 IM2 –50 VCE = 10 V at VO = 100 dB µ V/50 Ω Rg = Re = 50 Ω IM2 f = 90 + 100 MHZ IM3 f = 2 × 200 – 190 MHZ –40 –30 20 30 40 50 60 70 IC - Collector Current - mA 3 2SC5336 S-PARAMETER VCE = 10 V, IC = 20 mA S21 S11 S12 S22 f (MHz) MAG ANG MAG ANG MAG ANG MAG ANG 100 .519 − 74.5 30.931 131.9 .017 60.6 .752 − 30.2 200 .413 − 112.9 18.965 111.5 .031 61.9 .570 − 39.7 300 .413 − 133.4 13.324 101.9 .038 65.1 .465 − 39.8 400 .345 − 145.7 10.164 95.9 .045 69.8 .428 − 40.1 500 .331 − 153.8 8.177 91.8 .055 71.8 .436 − 41.1 600 .320 − 159.6 6.834 89.1 .064 70.9 .438 − 43.5 700 .302 − 166.8 5.832 86.7 .074 73.9 .434 − 47.5 800 .296 − 169.2 5.107 84.3 .077 74.4 .429 − 47.8 900 .283 − 173.2 4.600 83.1 .088 71.2 .436 − 46.5 1000 .285 − 179.8 4.200 82.3 .097 74.5 .455 − 47.8 1100 .265 175.2 3.930 80.8 .100 76.3 .467 − 46.8 1200 .260 174.1 3.979 78.5 .109 75.9 .529 − 47.4 1300 .263 166.0 3.741 68.6 .114 76.8 .551 − 55.8 1400 .242 163.0 3.115 66.6 .119 78.3 .509 − 55.8 1500 .252 160.1 2.844 65.7 .133 82.0 .510 − 58.5 1600 .253 154.0 2.595 64.1 .140 81.0 .496 − 55.2 1700 .253 149.9 2.420 63.7 .158 80.9 .515 − 54.8 1800 .257 147.2 2.305 63.0 .165 82.2 .518 − 56.5 1900 .262 143.0 2.171 62.6 .172 80.5 .536 − 58.6 2000 .273 141.5 2.049 61.2 .177 78.3 .524 − 61.5 4 2SC5336 S-PARAMETER VCE = 10 V, IC = 40 mA S21 S11 f (MHz) MAG S12 S22 ANG MAG ANG MAG ANG MAG ANG 100 .378 − 97.1 32.908 123.3 .017 71.1 .665 − 34.7 200 .317 − 131.8 18.819 106.0 .027 71.2 .487 − 38.7 300 .308 − 150.1 12.955 97.5 .035 71.8 .398 − 38.5 400 .299 − 158.7 9.775 93.1 .042 78.1 .393 − 36.9 500 .297 − 165.5 7.899 89.8 .052 78.5 .399 − 37.6 600 .288 − 169.2 6.586 87.6 .061 79.1 .407 − 39.9 700 .274 − 173.7 5.607 85.2 .071 77.4 .400 − 44.6 800 .261 − 177.3 4.879 83.5 .081 76.4 .415 − 47.4 900 .255 178.9 4.435 82.2 .092 76.5 .399 − 46.2 1000 .260 173.0 4.024 81.4 .095 77.6 .440 − 44.3 1100 .243 169.4 3.801 80.6 .098 77.1 .441 − 45.2 1200 .239 169.3 3.827 78.2 .109 78.3 .494 − 46.2 1300 .245 160.3 3.587 68.4 .117 78.0 .517 − 55.4 1400 .216 157.8 2.980 66.0 .125 80.3 .486 − 54.5 1500 .235 155.3 2.726 66.1 .137 86.5 .500 − 59.0 1600 .243 148.8 2.537 64.0 .143 80.6 .474 − 53.7 1700 .233 146.0 2.348 64.2 .159 81.2 .496 − 56.8 1800 .242 144.6 2.200 63.5 .163 80.4 .491 − 53.6 1900 .249 141.9 2.073 63.3 .171 81.7 .534 − 58.0 2000 .260 140.4 1.986 61.7 .184 77.5 .535 − 61.3 5 2SC5336 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard”, “Special”, and “Specific”. The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard : Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard” unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11