DATA SHEET SHEET DATA PHOTOCOUPLERS PS8602, PS8602L HIGH NOISE REDUCTION HIGH SPEED ANALOG OUTPUT TYPE 8 PIN PHOTOCOUPLER DESCRIPTION PS8602 and PS8602L is a 8-pin high speed photocoupler containing a GaAIAs LED on input side and a P-N photodiode and a high speed amplifier transistor on output side on one chip. PS8602 is in a plastic DIP (Dual In-line Package). PS8602L is lead bending type (Gull wing) for surface mount. FEATURES • High common mode transient immunity (OMR, OML: 2000 V/s MIN.) (VCC = 35 V MAX.) • High supply voltage • High speed response (tPHL, tPLH: 0.8 s MAX.) • High isolation voltage (BV: 5 000 Vr.m.s. MIN.) • TTL, CMOS compatible with a resistor • Taping product number (PS8602L-E3) • UL recognized [File No. E72422(s)] • VDE0884 recognized: option APPLICATIONS • Interface circuit for various instrumentations, control equipments. • Computer and peripheral manufactures. ORDERING INFORMATION PART NUMBER PACKAGE PS8602 8 pin DIP PS8602L 8 pin DIP, lead bending type PS8602L1 8 pin DIP, lead bending type (for long distance) PS8602L2 PS8602-V 8 pin DIP PS8602L-V 8 pin DIP, lead bending type PS8602L1-V 8 pin DIP, lead bending type (for long distance) PS8602L2-V SAFETY STANDARD APPROVAL Normal specification products • UL Approved VDE0884 specification products (option) • VDE Approved [Handling Precaution] This product is weak for static electricity by designed with high speed integrated circuit. So, protect against static electricity when handling. Document No. P11651EJ2V0DS00 (2nd edition) (Previous No. LC-2388) Date Published July 1996 P Printed in Japan © 1995 PS8602, PS8602L PACKAGE DIMENSIONS (Unit: mm) DIP (Dual In-line Package) Lead Bending type (Gull-wing) PS8602L PIN CONNECTIONS (Top View) 10.16 MAX. 1 5 1 4 1. 2. 3. 4. 6.5 8 5 2 3 Input NC Anode Cathode NC PIN CONNECTIONS (Top View) 8 10.16 MAX. 4 8 5. 6. 7. 8. Emitter VO NC VCC 1. 2. 3. 4. 1 3.8 MAX. 1 5 6.5 8 Output 7 6 3.8 MAX. 0.65 2.8 4.55 MIN. MAX. NC Anode Cathode NC 4 5. 6. 7. 8. Emitter VO NC VCC 1.27 MAX. 0 to 15o 0.9 ± 0.25 9.60 ± 0.4 2.54 0.25 2 3 Input 7.62 1.27 MAX. 2.54 0.50 ± 0.10 5 4 7.62 1.34 Output 7 6 0.05 to 0.2 PS8602 1.34 ± 0.10 0.25 M M Lead Bending type (for long distance) PS8602L1 PS8602L2 10.16 MAX. 10.16 MAX. 1 4 8 5 1 4 6.5 5 6.5 8 11.8 ± 0.4 10.16 7.62 3.8 MAX. 0.05 to 0.2 7.62 0.35 2.8 4.25 MIN. MAX. 3.8 MAX. 10.16 2.54 1.27 MAX. 0 to 15o 2.54 1.27 MAX. 1.34 ± 0.10 1.34 0.50 ± 0.10 2 0.25 M 0.25 M 0.9 ± 0.25 PS8602, PS8602L ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Diode Forward Current IF 25 mA Reverse Voltage VR 5 V Power Dissipation PD 45 mW Supply Voltage VCC 35 V Output Voltage VO 35 V Detector Output Current IO 8 mA Power Dissipation PC 100 mW Isolation Voltage *1 BV 5 000 Vr.m.s. Operating Temperature TA Storage Temperature Tstg 55 to +100 55 to +150 C C *1 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output. ELECTRICAL CHARACTERISTICS (TA = 25 C) Diode PARAMETER SYMBOL Forward Voltage VF Reverse Current IR MAX. UNIT TEST CONDITIONS 1.7 2.2 V IF = 16 mA 10 A VR = 5 V 1.6 mV/C Ct 60 pF V = 0, f = 1 MHz High Level Output Current IOH 1 3 500 nA IF = 0 mA, VCC = VO = 5.5 V High Level Output Current IOH 2 100 A IF = 0 mA, VCC = VO = 35 V Low Level Output Voltage VOL 0.1 0.4 V IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA Low Level Supply Current ICCL 50 A IF = 16 mA, VO = Open, VCC = 35 V High Level Supply Current ICCH 0.01 A IF = 0 mA, VO = Open, VCC = 35 V Current Transfer Ratio CTR % IF = 16 mA, VCC = 4.5 V, VO = 0.4 V Isolation Resistance R1-2 Vin-out = 1 kVDC Isolation Capacitance C1-2 0.7 pF V = 0, f = 1 MHz tPHL 0.5 0.8 s IF = 16 mA, VCC = 5 V RL = 1.9 k tPLH 0.3 0.8 s IF = 16 mA, VCC = 5 V RL = 1.9 k Junction Capacitance Coupler TYP. V F T Forward Voltage Temperature Coefficient Detector MIN. Propagation Delay Time (H L) *2 Propagation Delay Time (L H) *2 Common mode transient immunity at high level output Common mode transient immunity at low level output 1 15 11 10 IF = 16 mA CMH 2 000 V/s IF = 0 mA, VCM = 400 V RL = 4.1 k CML 2 000 V/s IF = 16 mA, VCM = 400 V RL = 4.1 k *3 *3 3 PS8602, PS8602L *2 Test Circuit for Propagation Delay Time. Pulse Input ( IF IF PW = 100 µs Duty Cycle = 1/10 ) IF Monitor 51 Ω 1 8 2 7 3 6 4 5 50 % VCC = 5 V 0 RL 5V VO 1.5 V VO Monitor 1.5 V VOL tPLH tPHL *3 Test Circuit for Common mode transient immunity IF 1 8 2 7 3 6 4 5 VCC = 5 V RL 90 % VCM 10 % tr 400 V 90 % 0V tf VO Monitor VO (IF = 0 mA) VCM VO (IF = 16 mA) 4 10 % 5V 2V 0.8 V VOL PS8602, PS8602L TYPICAL CHARACTERISTICS (TA = 25 C) MAX. FORWARD CURRENT vs. AMBIENT TEMPERATURE TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 120 PC - Transistor Power Dissipation - mW IF - MAX. Forward Current - mA 30 100 20 10 0 25 50 75 100 125 80 60 40 20 0 25 TA - Ambient Temperature - ˚C 125 10 IO - Output Current - mA IF - Forward Current - mA 100 OUTPUT CURRENT vs. OUTPUT VOLTAGE 100 10 TA = 100 ˚C 50 ˚C 25 ˚C 0 ˚C –25 ˚C 1.0 0.1 1.2 1.4 1.6 1.8 2.0 2.2 8 IF = 25 mA 6 IF = 15 mA 4 IF = 10 mA IF = 5 mA 2 0 2.4 IF = 20 mA 0 2 4 VF - Forward Voltage - V 6 8 10 12 14 20 NORMALIZED OUTPUT CURRENT vs. AMBIENT TEMPERATURE 2.0 VCC = 4.5 V VO = 0.4 V TA = 25 ˚C 30 20 10 ∆CTR - Current Transfer Raito 50 40 16 18 VO - Output Voltage - V CURRENT TRANSFER RATIO vs. FORWARD CURRENT CTR - Current Transfer Raito - % 75 TA - Ambient Temperature - ˚C FORWARD CURRENT vs. FORWARD VOLTAGE 0.01 1.0 50 Normalized to at TA = 25 ˚C VCC = 4.5 V VO = 0.4 V IF = 16 mA 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 .1 .5 1 5 10 IF - Forward Current - mA 50 100 0.0 –75 –50 –25 0 25 50 75 100 125 TA - Ambient Temperature - ˚C 5 PS8602, PS8602L OUTPUT VOLTAGE vs. FORWARD CURRENT RL 5 4 3 RL = 1.9 kΩ 2 5.6 kΩ 1 tPHL, tPLH - Propagation Delay Time - µ s 0 10 kΩ 0 2 4 6 8 10 12 14 16 10 VCC = VO = 35 V VCC = VO = 5.5 V 1 .1 –25 18 20 0 25 50 75 100 IF - Forward Current - (mA) TA - Ambient Temperature - ˚C PROPAGATION DELAY TIME vs. LOAD RESISTANCE PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 10 VCC = 5 V 5 IF = 16 mA tPLH 1 .5 tPHL .1 1 IF = 0 100 tPHL, tPLH - Propagation Delay Time - µ s VO - Output Voltage - V 6 5 10 RL - Load Resistance - kΩ 6 1000 VCC = 5 V IF VCC IOH - High Level Output Current - nA 7 HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 50 100 3.0 2.5 VCC = 5 V IF = 16 mA RL = 1.9 kΩ 2.0 1.5 1.0 tPLH 0.5 0.0 –75 –50 tPHL –25 0 25 50 75 TA - Ambient Temperature - ˚C 100 125 PS8602, PS8602L TAPING 1. TAPING DIRECTION PS8602L-E3 APAN ×× 101 NEC JAPAN PS86×× N 101 2. OUTLINE AND DIMENSIONS (TAPE) Unit: mm T0 P0 D0 RATINGS A 10.7 0.1 B 10.3 0.1 D0 1.55 0.1 D1 1.55 0.1 E 1.75 0.1 F 7.5 0.1 P0 4.0 0.1 P1 12.0 0.1 P2 2.0 0.1 T0 4.3 0.2 T1 0.3 W 16 0.3 SYMBOL RATINGS A 330 N 80 5.0 W 16.4 0 D1 B W F I E P2 SYMBOL T1 P1 A 3. OUTLINE AND DIMENSIONS (REEL) Unit: mm 2 ± 0.5 W +2.0 A φ 18.0 ± 0.5 φ 21 ± 0.8 R1.0 4. PACKING; 1000 pieces/reel 7 PS8602, PS8602L SOLDERING PRECAUTION (1) Infrared reflow soldering • Peak temperature : 235 C or lower (plastic surface) • Time : 30 s or less (Time during plastic surface temperature overs 210 C) • No. of reflow times : Three • Flux : Rosin-base flux PACKAGE’S SURFACE TEM (˚C) INFRARED RAY REFLOW TEMPERATURE PROFILE (ACTUAL HEAT) to 10 s 235 ˚C MAX 210 ˚C to 30 s 120 to 160 ˚C 60 to 90 s (PRE-HEAT) TIME (s) <NOTES> (1) Please avoid be removed the residual flux by water after the first reflow processes. Peak Temperature 235 ˚C or lower (2) Dip soldering • Peak temperature : 260 C or lower • Time : 10 s or less • Flux : Rosin-base flux 8 PS8602, PS8602L SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884) PARAMETER SYMBOL Application classification (DIN VDE0109) for rated line voltages 300 Veff for rated line voltages 600 Veff UNIT IV III Climatic test class (DIN IEC 68 Teil 1/09.80) Dielectric strength maximum operating isolation voltage. Test voltage (partial discharge test procedure a for type test and random test) Upr = 1.2 UIORM, Pd < 5 pC SPECK 55/100/21 UIORM Upr 890 1 068 Vpeak Vpeak Test voltage (partial discharge test procedure b for random test) Upr = 1.6 UIORM, Pd < 5 pC Upr 1 424 Vpeak Highest permissible overvoltage UTR 8 000 Vpeak Degree of pollution (DIN VDE0109) 2 Clearance distance > 7.0 mm Creepage distance > 7.0 mm Comparative tracking index (DIN IEC 112/VDE0303 part 1) CTI Material group (DIN VDE0109) 175 IIIa Storage temperature range Tstg 55 to +150 Cel Operating temperature range Tamb 55 to +100 Cel Ris min Ris min 10 11 10 12 ohm ohm Tsi Isi Psi 175 400 700 Cel mA mW Ris min 10 9 ohm Isolation resistance, minimum value UIO = 500 V dc at 25 Cel UIO = 500 V dc at Tamp maximum at least 100 Cel Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance UIO = 500 V dc at 175 Cel (Tsi) 9 PS8602, PS8602L CAUTION The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5