DATA SHEET PHOTOCOUPLER PS8701 HIGH NOISE REDUCTION HIGH-SPEED ANALOG OUTPUT TYPE 5-PIN SOP PHOTOCOUPLER DESCRIPTION The PS8701 is an optically coupled isolator containing a GaAlAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications. FEATURES • High common mode transient immunity (CMH, CML = ±10 kV/µs MIN.) • High supply voltage (VCC = 35 V) • High isolation voltage (BV = 2 500 Vr.m.s.) • High-speed response (tPHL = 0.8 µs MAX., tPLH = 1.2 µs MAX.) • Taping product number (PS8701-E3, E4, F3, F4) APPLICATIONS • Computer and peripheral manufactures • General purpose inverter • Substitutions for relays and pulse transformers • Power supply PACKAGE DIMENSIONS in millimeters 4.5 MAX. TOP VIEW 5 4 3 1. Anode 2. Cathode 3. GND 4. VO 5. VCC 1 2 7.0±0.3 1.3 0.15 +0.10 –0.05 2.0 0.1±0.1 2.3 MAX. 4.4 1.27 0.4 +0.10 –0.05 1.2 MAX. 0.5±0.3 0.25 M The information in this document is subject to change without notice. Document No. P12846EJ1V0DS00 (1st edition) Date Published August 1997 NS Printed in Japan © 1997 PS8701 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current IF 25 mA Reverse Voltage VR 3.0 V Power Dissipation PD 45 mW Supply Voltage VCC 35 V Output Voltage VO 35 V Output Current IO 8.0 mA Power Dissipation PC 100 mW Isolation Voltage BV 2 500 Vr.m.s. Operating Ambient Temperature TA –55 to +100 °C Storage Temperature Tstg –55 to +125 °C Diode Detector *1 *1 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output ELECTRICAL CHARACTERISTICS (TA = 25 °C) Parameter Diode VF IF = 16 mA Reverse Current IR VR = 3 V Terminal Capacitance Coupled 2 Conditions Forward Voltage Forward Voltage Temperature Coefficient Detector Symbol ∆VF/∆T Ct MIN. TYP. MAX. Unit 1.7 2.2 V 10 µA −1.6 mV/°C V = 0 V, f = 1 MHz 60 pF 3 IF = 16 mA High Level Output Current IOH (1) IF = 0 mA, VCC = VO = 5.5 V High Level Output Current IOH (2) IF = 0 mA, VCC = VO = 30 V Low Level Output Voltage VOL IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA 0.1 Low Level Supply Current ICCL IF = 16 mA, VO = open, VCC = 30 V 50 High Level Supply Current ICCH IF = 0 mA, VO = open, VCC = 30 V 0.01 2 Current Transfer Ratio CTR IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 20 35 15 500 nA 100 µA 0.4 V µA % Ω 11 Isolation Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60 % 10 Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 Propagation Delay Time *1 (H → L) tPHL IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ, CL = 15 pF 0.5 0.8 Propagation Delay Time *1 (L → H) tPLH 0.6 1.2 Common Mode Transient Immunity at *2 High Level Output CMH IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ, VCM = 1.5 kV 10 Common Mode Transient Immunity at *2 Low Level Output CML IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ, VCM = 1.5 kV −10 pF µs kV/µs PS8701 *1 Test circuit for propagation delay time Pulse input 0.1 µ F (Pulse width = 100 µ s, Duty cycle = 1/10) Input (Monitor) Input VCC = 5 V RL = 2.2 kΩ VO (Monitor) CL = 15 pF 50 % 5V Output 1.5 V VOL 47 Ω tPHL tPLH CL is approximately 15 pF which includes probe and stray wiring capacitance *2 Test circuit for common mode transient immunity 1.5 kV VCM 90 % IF 0.1 µ F VCC = 5 V RL = 4.1 kΩ VO (Monitor) 10 % tr VO (IF = 0 mA) VCM VO (IF = 16 mA) 0V tf 5V 2V 0.8 V VOL USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pase capacitor of more than 0.1 µF is used between VCC and GND near device. 3 PS8701 TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified) TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) 40 30 20 10 25 0 50 75 40 20 50 75 100 HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE TA = +100 ˚C +50 ˚C +25 ˚C 1 0 ˚C –25 ˚C 0.1 1.2 1.4 1.6 1.8 2.0 2.2 IF = 0 mA 100 VCC = VO = 30 V VCC = VO = 5.5 V 10 1 0.1 –25 2.4 0 25 50 75 100 Forward Voltage VF (V) Ambient Temperature TA (˚C) CURRENT TRANSFER RATIO vs. FORWARD CURRENT NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE VCC = 4.5 V, VO = 0.4 V 70 60 50 40 30 20 10 0 0.5 25 FORWARD CURRENT vs. FORWARD VOLTAGE High Level Output Current IOH (nA) Forward Current IF (mA) 60 Ambient Temperature TA (˚C) 80 Current Transfer Ratio CTR (%) 80 1 000 0.01 1.0 1 5 10 Forward Current IF (mA) 4 100 Ambient Temperature TA (˚C) 100 10 120 0 100 50 Normalized Current Transfer Raio CTR Diode Power Dissipation PD (mW) 50 1.6 Normalized to 1.0 at TA = 25 ˚C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 1.4 ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, 1.2 1.0 0.8 0.6 0.4 0.2 0.0 –50 –25 0 25 50 75 Ambient Temperature TA (˚C) 100 PS8701 OUTPUT VOLTAGE vs. FORWARD CURRENT OUTPUT CURRENT vs. OUTPUT VOLTAGE 6 Output Voltage VO (V) IF = 25 mA 6 20 mA 15 mA 4 10 mA 5 mA 2 0 Propagation Delay Time tPHL, tPLH (µs) 5 8 2 4 6 8 10 12 14 16 RL = 2.2 kΩ 2 0 18 20 5.6 kΩ 2 4 6 8 10 12 14 16 18 20 Forward Current IF (mA) PROPAGATION DELAY TIME vs. FORWARD CURRENT PROPAGATION DELAY TIME vs. LOAD RESISTANCE VCC = 5 V, RL = 2.2 kΩ 2.0 tPHL 1.0 tPLH 5 10 15 20 25 Forward Current IF (mA) Normalized Propagation Delay Time tPHL, tPLH 3 Output Voltage VO (V) 3.0 0 4 1 Propagation Delay Time tPHL, tPLH (µs) Output Current IO (mA) 10 10 VCC = 5 V, IF = 16 mA tPLH 1 tPHL 0.1 1k 10 k 100 k Load Resistance RL (Ω) NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE 5 Normalized to 1.0 at TA = 25 ˚C, IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ 4 3 2 tPLH tPHL 1 0 –50 –25 0 25 50 75 100 Ambient Temperature TA (˚C) 5 PS8701 TAPING SPECIFICATIONS (in millimeters) 1.55±0.1 2.4±0.1 4.6±0.1 7.4±0.1 5.5±0.1 1.55±0.1 12.0±0.2 2.0±0.1 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 0.3 8.0±0.1 Taping Direction PS8701-E4 PS8701-F4 PS8701-E3 PS8701-F3 Outline and Dimensions (Reel) 1.5±0.5 ˚ 6.0±1 Packing: PS8701-E3, E4 900 pcs/reel PS8701-F3, F4 3 500 pcs/reel 6 φ 13.0±0.5 2.0±0.5 60 1.5±0.1 ˚ φ 66 120 PS8701-E3, E4: φ 178 PS8701-F3, F4: φ 330 φ 21.0±0.8 1.5±0.1 12.4 +2.0 –0.0 18.4 MAX. PS8701 RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 235 °C (package surface temperature) • Time of temperature higher than 210 °C 30 seconds or less • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 235 ˚C (peak temperature) 210 ˚C to 30 s 120 to 160 ˚C 60 to 90 s (preheating) Time (s) Caution Please avoid to removed the residual flux by water after the first reflow processes. Peak temperature 235 ˚C or below (2) Dip soldering • Temperature 260 °C or below (molten solder temperature) • Time 10 seconds or less • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) 7 PS8701 CAUTION Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5