DATA SHEET
MOS INTEGRATED CIRCUIT
µ PD168117
7-CHANNEL H-BRIDGE DRIVER
WITH A MICRO STEP FUNCTION SUPPORTING PULSE INPUT
DESCRIPTION
The µ PD168117 is a 7-channel H-bridge driver with a micro step function supporting pulse input that consists of a
CMOS control circuit and a MOS output stage. It can reduce the current consumption and the voltage loss at the
output stage compared with a conventional driver using bipolar transistors, thanks to employment of a MOS process.
Moreover, at the µ PD168117, micro step control of 128 divisions can perform stepping motor drive by the pulse input,
and motor can be driven by low noise and low vibration.
The package is a 56-pin WQFN that helps reduce the mounting area and height.
The µ PD168117 can be used to drive two stepping motors, or two DC motors and one coil.
FEATURES
• Seven H-bridge circuits employing power MOS FET
• Low-voltage driving
VDD = 2.7 to 3.6 V
VM = 2.7 to 5.5 V
• Output on-state resistance: 1.0 Ω TYP., 1.5 Ω MAX. (sum of top and bottom stage, ch1 to ch4, and ch7)
1.5 Ω TYP., 2.0 Ω MAX. (sum of top and bottom stage, ch5 and ch6)
• PWM output (ch1 to ch6), linear output (ch7)
• Output current
<ch1 to ch6>
DC current: 0.4 A/ch (when each channel is used independently)
Peak current: 0.7 A/ch (when each channel is used independently)
<ch7>
DC current: 0.5 A/ch (when used independently)
Peak current: 0.7 A/ch (when used independently)
• Input logic frequency: 150 kHz supported
• Under-voltage lockout circuit
Shuts down the internal circuit at VDD = 1.7 V TYP.
• Overheat protection circuit
Operates at 150°C or more and shuts down internal circuitry.
• 56-pin WQFN (□8 mm, 0.5 mm pitch)
ORDERING INFORMATION
Part Number
µ PD168117K9-9B4-A
Package
Note
56-pin plastic WQFN (8 x 8)
Note Pb-free (This product does not contain Pb in external electrode and other parts.)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. S17310EJ2V0DS00 (2nd edition)
Date Published December 2004 NS CP(K)
Printed in Japan
The mark
shows major revised points.
2004
µ PD168117
1. PIN CONFIGURATION
Package: 56-pin plastic WQFN (8 x 8)
3 to 5 V
22 µF
43 IN7A
30
29
1000 pF x 4
FIL2
31
FIL3
32
OUT4A
33
VM34
34
OUT4B
35
PGND34
36
OUT3A
37
VM34
38
OUT3B
39
VREF7
40
SELVREF7
41
SEL7
IN7B
42
FIL4
M
FIL1 28
10 kΩ 150 pF
44 FIL7
FB4 27
45 R7
FB3 26
46 FB7
FB2 25
47 OUT7A
FB1 24
10 kΩ
1Ω
48 VM7
VM12 22
50 VDD
OUT1A 21
51 LGND
PGND12 20
52 COSC
OUT2B 19
53 OE1
VM12 18
OUT5B
MODE4/IN4B
MODE3
MODE2
MODE1
IN6B
IN6A
56 OE2/IN3A
VM56
IN5A 16
OUT5A
55 CW1
PGND56
OUT2A 17
OUT6A
54 CLK1
OUT6B
100 pF
at 300 kHz PWM
49 OUT7B
CW2/IN4A
10 µF 3 V
CLK2/IN3B
22 µF 3 to 5 V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
M
3 to 5 V
2
5 kΩ x 4
OUT1B 23
IN5B 15
M
22 µF
Data Sheet S17310EJ2V0DS
M
3 to 5 V
22 µF
µ PD168117
2. PIN FUNCTIONS
(1/2)
Pin No.
Pin Name
Function
1
CLK2/IN3B
H-bridge 3, H-bridge 4 CLK input pin/H-bridge 3 input pin B
2
CW2/IN4A
H-bridge 3, H-bridge 4 driving direction input pin/H-bridge 4 input pin A
3
OUT6B
H-bridge 6 output pin B
4
OUT6A
H-bridge 6 output pin A
5
PGND56
H-bridge 5, H-bridge 6 GND pin
6
OUT5A
H-bridge 5 output pin A
7
VM56
H-bridge 5, H-bridge 6 power supply pin
8
OUT5B
H-bridge 5 output pin B
9
MODE4/IN4B
Mode selection pin 4/H-bridge 4 input pin B
10
MODE3
Mode selection pin 3
11
MODE2
Mode selection pin 2
12
MODE1
Mode selection pin 1
13
IN6B
H-bridge 6 input pin B
14
IN6A
H-bridge 6 input pin A
15
IN5B
H-bridge 5 input pin B
16
IN5A
H-bridge 5 input pin A
17
OUT2A
H-bridge 2 output pin A
18
VM12
H-bridge 1, H-bridge 2 power supply pin
19
OUT2B
H-bridge 2 output pin B
20
PGND12
H-bridge 1, H-bridge 2 GND pin
21
OUT1A
H-bridge 1 output pin A
22
VM12
H-bridge 1, H-bridge 2 power supply pin
23
OUT1B
H-bridge 1 output pin B
24
FB1
Current detection resistor connection pin 1
25
FB2
Current detection resistor connection pin 2
26
FB3
Current detection resistor connection pin 3
27
FB4
Current detection resistor connection pin 4
28
FIL1
Filter capacitor connection pin 1
29
FIL2
Filter capacitor connection pin 2
30
FIL3
Filter capacitor connection pin 3
31
FIL4
Filter capacitor connection pin 4
32
OUT4A
H-bridge 4 output pin A
33
VM34
H-bridge 3, H-bridge 4 power supply pin
34
OUT4B
H-bridge 4 output pin B
35
PGND34
H-bridge 3, H-bridge 4 GND pin
36
OUT3A
H-bridge 3 output pin A
37
VM34
H-bridge 3, H-bridge 4 power supply pin
38
OUT3B
H-bridge 3 output pin B
Data Sheet S17310EJ2V0DS
3
µ PD168117
(2/2)
Pin No.
4
Pin Name
Function
39
VREF7
ch7 reference voltage external input pin
40
SELVREF7
ch7 reference voltage setup selection pin
41
SEL7
ch7 excitation mode selection pin
42
IN7B
H-bridge 7 input pin B
43
IN7A
H-bridge 7 input pin A
44
FIL7
Amplifier operation stabilizing filter connection pin
45
R7
Amplifier operation stabilizing resistor connection pin
46
FB7
Current detection resistor connection pin 7
47
OUT7A
H-bridge 7 output pin A
48
VM7
H-bridge 7 power supply pin
49
OUT7B
H-bridge 7 output pin B
50
VDD
Logic block power supply pin
51
LGND
Logic block GND pin
52
COSC
Chopping frequency setting capacitor connection pin
53
OE1
H-bridge 1, H-bridge 2 output enable pin
54
CLK1
H-bridge 1, H-bridge 2 CLK input pin
55
CW1
H-bridge 1, H-bridge 2 driving direction input pin
56
OE2/IN3A
H-bridge 3, H-bridge 4 output enable pin/H-bridge 3 input pin A
Data Sheet S17310EJ2V0DS
µ PD168117
3. BLOCK DIAGRAM
LGND VDD OE1 CLK1 CW1 MODE1 MODE3 MODE2
FB1
Current
Sense 1
FB2
Current
Sense 2
OSC
Current
Sense 3
VM12
OUT1A
OUT1B
OE2/ CLK2/ CW2/ MODE4/
IN3A IN3B IN4A IN4B
Current
Sense 4
FB4
VM34
ch1/ch2
Control
ch3/ch4
Control
OUT3A
ch3
H-bridge
OUT3B
FIL1
OUT2B
PGND34
Control and
Pre-driver
FIL3
ch2
H-bridge
TSD
UVLO
FIL2
OUT4A
ch4
H-bridge
OUT4B
200 mV
VREF7
VM56
PGND56
FB3
ch1
H-bridge
PGND12
OUT2A
COSC
ch5
H-bridge
OUT5A
FIL4
IN7A
ch6
H-bridge
IN7B
VM7
OUT5B
ch7
H-bridge
IN5A IN5B
IN6A IN6B OUT6A OUT6B SELVREF7 R7 FIL7 FB7 OUT7A
VREF7 SEL7
Data Sheet S17310EJ2V0DS
OUT7B
5
µ PD168117
4. STANDARD CONNECTION EXAMPLE
8
CPU
10 µF
3V
VDD
LGND
FB1
Current
Sense 1
FB2
Current
Sense 2
MODE2
MODE3
OUT1A
OUT1B
1000 pF
OE2/ CLK2/ CW2/ MODE4/
IN3A IN3B IN4A IN4B
OSC
Current
Sense 3
Current
Sense 4
1000 pF
VM34
ch1/ch2
Control
ch3/ch4
Control
OUT3A
ch3
H-bridge
OUT3B
PGND34
Control and
Pre-driver
TSD
1000 pF
OUT4A
ch4
H-bridge
UVLO
OUT4B
200 mV
VREF7
VM56
M
FIL3
ch2
H-bridge
FIL2
PGND56
5 kΩ
FB4
FIL1
OUT2B
FB3
ch1
H-bridge
PGND12
OUT2A
COSC
100 pF
VM12
5 kΩ x 2
M
OE1 CLK1 CW1 MODE1
ch5
H-bridge
OUT5A
FIL4
M
1000 pF
IN7A
ch6
H-bridge
IN7B
3 to 5 V
VM7
OUT5B
ch7
H-bridge
IN5A IN5B
SELVREF7
IN6A IN6B OUT6A OUT6B VREF7 SEL7 R7 FIL7 FB7 OUT7A
22 µF
OUT7B
10 kΩ
M
10 kΩ 150 pF
1Ω
ex. 150 mV
Cautions 1. Be sure to connect all of the pins which have more than one.
2. The constants shown in the above diagram are provided as examples only. Perform design
based on thorough evaluation with the actual machine.
6
Data Sheet S17310EJ2V0DS
µ PD168117
5. FUNCTION OPERATION TABLE
5.1 Power Save Function
This IC can be placed in the power-save mode by making MODE1, MODE2, MODE3, and MODE4 high level.
This function allows holding of the excitation position when the stepping motor mode is selected and the operation to
be started from where the excitation position is held when the power-save mode is cleared. In the power-save mode,
the current consumption is reduced to 20 µA TYP. because the internal circuits other than UVLO are stopped.
The operation modes of ch1 to ch4 can be set by a combination of MODE1 to MODE4. For the combination of the
MODE pins, refer to Table 5−1. MODE Pin Truth Table.
Table 5−1. Mode Pin Truth Table
MODE1
MODE2
MODE3
MODE4
Operation Mode
(/IN4B)
ch1, ch2
ch3, ch4
2-phase excitation
General-purpose driving
H
1-2 phase excitation
(current limiting)
H
L
Micro step
L
H
H
L
2-phase excitation
2-phase excitation
L
H
H
H
1-2 phase excitation
1-2 phase excitation
H
L
L
L
2-phase excitation (current
2-phase excitation (current
limiting)
limiting)
1-2 phase excitation
1-2 phase excitation
(current limiting)
(current limiting)
L
L
L
L
L
L
H
L
L
IN4B input
H
H
L
H
L
2-phase excitation
Micro step
H
L
H
H
1-2 phase excitation
Micro step
H
H
L
L
Micro step
2-phase excitation
H
H
L
H
Micro step
1-2 phase excitation
H
H
H
L
Micro step
Micro step
H
H
H
H
Power save mode
Remark H: High level, L: Low level
Data Sheet S17310EJ2V0DS
7
µ PD168117
5.2 ch1, ch2 (Dedicated to Stepping Motor)
CLK1
x
CW1
OE1
Operation Mode
L
H
Pulse progress, CW mode
L
H
Pulse progress, CW mode
H
H
Pulse progress, CCW mode
H
H
Pulse progress, CCW mode
x
L
Output Hi-Z (The internal follows the above-mentioned
mode of operation)
Remark x: High level or low level, Hi-Z: High impedance
5.3 ch3, ch4 (Selecting Stepping Motor, DC Motor and Coil Driving)
<Stepping motor drive mode>
CLK2
x
CW2
OE2
Operation Mode
L
H
Pulse progress, CW mode
L
H
Pulse progress, CW mode
H
H
Pulse progress, CCW mode
H
H
Pulse progress, CCW mode
x
L
Output Hi-Z (The internal follows the above-mentioned
mode of operation)
<General-purpose drive mode>
IN3A/IN4A
IN3B/IN4B
OUT3A/OUT4A
OUT3B/OUT4B
L
L
Z
Z
L
H
H
L
H
H
L
H
Note
H
H
Note
Operation Mode
Stop
Reverse
L
Forward
H
Brake
Note When the µ PD168117 is used for constant-current driving (when a sense resistor is connected to the FB
pin), chopping driving is performed.
Remark Z: Output high impedance
8
Data Sheet S17310EJ2V0DS
µ PD168117
5.4 ch5, ch6
IN5A/IN6A
IN5B/IN6B
OUT5A/OUT6A
OUT5B/OUT6B
L
L
Z
Z
Stop
L
H
L
H
Reverse
H
L
H
L
Forward
H
H
H
H
Brake
Forward
Reverse
VM
ON
Operation Mode
OFF
OFF
LOAD
B
ON
A
Brake
VM
ON
OFF
LOAD
ON
LOAD
A
B
OFF
OFF
GND
VM
OFF
B
ON
GND
Stop
ON
LOAD
A
OFF
VM
OFF
A
B
OFF
GND
OFF
GND
Data Sheet S17310EJ2V0DS
9
µ PD168117
5.5 ch7
IN7A
IN7B
OUT7A
OUT7B
H-bridge Output State
Q1
Q2
Q3
Q4
L
L
Z
Z
OFF
OFF
OFF
OFF
L
H
L
H
OFF
ON
ON
OFF
(linear)
H
L
H
(linear)
L
ON
OFF
OFF
(linear)
H
H
H
H
ON
ON
OFF
VM7
Q1
Q2
OUT7A
OUT7B
−
+
−
+
Q3
Q4
5.6 SEL7 Pin
The current that flows into ch7 can be changed by setting the SEL7 pin.
SEL7
10
ON
(linear)
Operation Mode
L
Weak excitation mode (Current 2/3 of the normal setting flows.)
H
Normal operation mode (Comparison operation with reference voltage)
Data Sheet S17310EJ2V0DS
OFF
µ PD168117
5.7 Reference Voltage Settings
The external setting mode, in which the reference voltage is input to VREF7 externally, and the internal setting mode,
in which the internal reference voltage is used, can be switched using the SELVREF7 pin.
When using the external setting mode, the voltage which will become reference voltage must be applied to the VREF7
pin.
The functions for the SEL7 pin will be enabled, regardless of the external/internal setting mode. The voltage (when
external setting mode is set), and the 200 mV (when the internal setting mode is set) that are applied to the VREF7 pin
are equivalent to normal operation mode (SEL7 = H).
SELVREF7
Operation Mode
L
External setting mode (Voltage must be applied to VREF7)
H
Internal setting mode (200 mV setting)
6. COMMAND INPUT TIMING CHART
Figure 6−1. In The Micro Step Mode
Internal reset signal
(Reset = L)
1
2
3
4
5
6 7 8 9 10
11
12 13 14 15 1617 18 19 20 21 22 23 24
CLK
CW
OE
1
2
3
4
5
6 7 8 9 10
11
12 13 14 15 14 13 12 11 10 9 8 7 6
Pulse output
Chopping pulse
CW mode
Output
Hi-Z
CW mode
CCW mode
Output
Hi-Z
Reset state
Reset state
Remark The motor excitation output is equivalent to the pulse output. The excitation position of the motor is
changed by the rising edge timing of the pulse output (equals the rising or falling edges of CLK).
Data Sheet S17310EJ2V0DS
11
µ PD168117
7. FUNCTIONAL DEPLOYMENT
7.1 Reset Function
This whole IC can be changed into a reset state by setting all of MODE1 to MODE4 to H, and all of IN5A, IN5B, IN6A,
IN6B, IN7A, and IN7B to L. In the state of reset, an output will be in Hi-Z state, and since it stops operation of an internal
circuit, it can make self-consumption current below 1 µA.
Be sure to perform a reset operation.
In the reset operation, the internal circuitry is stopped whenever possible, so that the self current consumption can
be reduced. When the external input signal is stopped, the current consumption can be lowered to 1 µA MAX.
Immediately after release of reset, excitation is started from the position where the current of ch1 is 100% and the
current of ch2 is 0%, in the micro step drive mode and 1-2 phase excitation drive mode. In the 2-phase excitation
drive mode, excitation is started from the position where the currents of ch1 and ch2 are 100%.
7.2 2-phase Excitation Drive Mode and 1-2 Phase Excitation Drive Mode
In the 2-phase excitation drive mode, current of ±100% is allowed to flow into ch1 and ch2 simultaneously. In the 12 phase excitation drive mode, the motor can be driven at a higher torque by allowing a current to flow so that the
synthesized torque of ch1 and ch2 is the same as the torque at phase 1 position. The 2-phase excitation, 1-2 phase
excitation, and micro step driving modes are selected by the MODE1 to MODE4 pins.
Note that 100% (= saturation drive mode) and a mode in which the current set by the sense resistor is used
can be selected by the MODE pin. Current control is performed by chopping drive.
7.3 Micro Step Drive Mode of Stepping Motor
The current flowing into the H-bridge is constant by using a vector value so that one period can be stopped in 1/128
steps. This function is provided to realize high-accuracy positioning control of a stepping motor.
To realize this micro step driving, the following functions are internally realized by the driver.
• Detection of current flowing into each channel by sense resistor as voltage value
• Synthesizing half the dummy sine waveform generated by the internal D/A with PWM oscillation waveform for
chopping operation
• Driver stage performing PWM drive based on result of comparing detected voltage and synthesized
waveform
Because the internal dummy sine wave consists of 128 steps per period, it can be used to drive a stepping motor
using 128 divisions. The micro step drive mode, 2-phase excitation drive mode, and 1-2 phase excitation drive mode
can be selected by using external pins.
12
Data Sheet S17310EJ2V0DS
µ PD168117
Figure 7−1. Concept of Micro Step Drive Operation
+
M
A
7.4 Input Signals (CLK, OE and CW pins, stepping motor control methods)
The motor is driven by the pulses input to the CLK1 (CLK2) pin. The pulses advance by one at the rising and falling
edges of the CLK1 (CLK2) signal.
When the CLK1 (CLK2) pin is fixed to low levels, the internal excitation positions do not progress, regardless of the
input status of the OE1 (OE2) pin.
Since 1 electrical angle cycle is divided by 128, it equals 1 electrical angle cycle because of the 64-clock input.
Since both edges are used for control, the pulse intervals that are output rely on the pulse duty which is input. It is
suggested that pulses with a duty of 50% should be input.
The rotational direction of the motor is set by CW1 (CW2).
In CW mode, the current for ch2 (ch4) is output delayed by a 90º phase in relation to the current for ch1 (ch3).
In CCW mode, the current for ch2 (ch4) is output advanced by a 90º phase in relation to the current for ch1 (ch3).
7.5 Output Enable (OE) Pin
The OE1 (OE2) pin can be used to forcibly stop pulse output of ch1 and ch2 (or ch3 and ch4).
When OE1 (OE2) = L, the output is forcibly made to go into Hi-Z. Moreover, since an internal excitation position can
make it go on also at OE1 (OE2) pin = L, an internal excitation position advances in inputting a pulse into CLK1 (CLK2)
pin.
The internal information will be held if OE1 (OE2) = L and CLK1 (CLK2) pin are fixed to low level. Motor position
information is memorized unless it is reset. In performing stepping motor control, be sure to give as OE1 (OE2) = H.
Data Sheet S17310EJ2V0DS
13
µ PD168117
7.6 Current Detection Resistor Connection (FB) Pin
(1) ch1 to ch4
The current detection resistor is connected when current driving is necessary. It is used for micro step driving and
solenoid driving.
The peak value (at 100% current of ch1 (ch3) or ch2 (ch4)) of output current is decided by the
resistance RFB linked to FB1 (FB3) and FB2 (FB4). This IC contains the reference power supply VREF for current value
comparison (500 mV TYP.) in the internal, and performs the drive which makes the current value acquired from RFB
and VREF an output current peak value.
The current that flows into the output is {500 mV (reference voltage) /FB pin resistance x 1050}.
Peak output current: IMAX (A) ≅ VREF (V) ÷ RFB (Ω) x 1050
Example)
Where FB = 4.7 kΩ
Output current = 500 (mV) /4.7 (kΩ) x 1050
≅ 111.7 (mA)
This means constant current driving of about 111.7 mA.
When current driving is not performed, connect the FB pin to GND.
(2) ch7
Connect the current detection circuit between the source of the driver low side and GND. Because the circuit is
configured to detect current directly, connect a detection resistor of low resistance (1 Ω maximum).
The current that flows into the output is {200 mV (reference voltage) /FB7 pin resistance} (when SEL7 = H).
Output current: IMAX (A) ≅ VREF (V) ÷ RFB (Ω)
Example)
Where FB7 = 0.5 Ω
Output current = 200 (mV) /0.5 (Ω)
= 400 (mA)
This means constant current driving of 400 mA.
Because only ch7 employs the linear drive mode and directly detects the output current, the current accuracy is
determined only by the external resistor and the offset of the current control amplifier.
The above example shows (SELVREF7 = H) using the internal reference voltage. When applying reference voltage
externally, set SELVREF7 to L, then apply voltage to the VREF7 pin. The output current can be calculated by transposing
200 mV in the computational expression.
14
Data Sheet S17310EJ2V0DS
µ PD168117
7.7 Selecting 2-phase Excitation/Micro Step Drive Mode
The 2-phase excitation, 1-2 phase excitation, or micro step drive mode can be selected by using the MODE1 to
MODE4 pins. Refer to Table 5−1. Mode Pin Truth Table for details.
Immediately after release of reset, the IC is initialized. In the 1-2 phase excitation and micro step drive mode,
excitation is started from the position where the output current of ch1 (ch3) is 100% and output current of ch2 (ch4) is
0%. In the 2-phase excitation drive mode, excitation is started from the position where the currents of both ch1 (ch3)
and ch2 (ch4) are +100%.
When the mode is changed from the micro step driving to the 2-phase excitation (or 1-2 phase excitation), the
position of micro step is held until CLK is input.
When the rotation direction does not change, pulse output is started by the first CLK input, the position is skipped to
the 2-phase position of the next quadrant (or to the closest 1-2 phase position at the rotation direction destination),
and driving is started.
When the rotation direction changes, it is skipped to 2-phase position of the next quadrant, or 1-2-phase position to
the direction which changed, and a drive is started.
Figure 7−2. Concept of Change Operation, Micro Step Driving ↔ 2-phase Excitation (1-2 Phase Excitation)
(4)
Microstep stop
position (example 1)
2-phase excitation
stop position
(1)
Skipes to the next
quadrant
Microstep stop
position (example 2)
(3)
(2)
7.8 Under-voltage Lockout (UVLO) Circuit
This function is to forcibly stop the operation of the IC to prevent malfunctioning if VDD drops. When UVLO operates,
the IC is in the reset status. If VDD drops abruptly in the order of several µs, this function may not operate.
7.9 Overheat Protection (TSD) Circuit
This function is to forcibly stop the operation of the IC to protect it from destruction due to overheating if the chip
temperature of the IC rises.
The overheat protection circuit operates when the chip temperature rises to 150°C or more. When overheat is
detected, all the circuits are stopped. When reset state or when UVLO is detected, the overheat protection circuit
does not operate.
7.10 Power Up Sequence
This IC has a circuit that prevents current from flowing into the VM pin when VDD = 0 V. Therefore, the current that
flows into the VM pin is cut off 1 µA MAX. when VDD = 0 V.
Data Sheet S17310EJ2V0DS
15
µ PD168117
8. NOTE ON CORRECT USE
8.1 Transmitting Data
Data input at reset state is ignored.
8.2 Pin Processing of Unused Circuit
The input/output pins of an unused circuit must be processed as specified below.
A VM power supply pin is provided for each output circuit. The current consumption of the internal circuit can be
reduced by dropping the VM power of the unused circuit to GND. However, if there are multiple power supply pins, be
sure to connect all of them to the same potential.
<ch1, ch2>
Lower OE1, CLK1, and CW1.
Open FIL1, FIL2, OUT1A, OUT1B, OUT2A, and OUT2B.
Connect FB1 and FB2 to GND.
<ch3, ch4>
Set the general-purpose drive mode.
Lower OE2/IN3A, CLK2/IN3B, CW2/IN4A.
Higher MODE4/IN4B.
Open FIL3, FIL4, OUT3A, OUT3B, OUT4A, and OUT4B.
Connect FB3 and FB4 to GND.
<ch5, ch6>
Lower IN5A (IN6A) and IN5B (IN6B) .
Open OUT5A (OUT6A) and OUT5B (OUT6B) .
<ch7>
Lower SEL7, SELVREF7, IN7A, and IN7B.
Open OUT7A and OUT7B.
Connect VREF7, FIL7, FB7, and R7 to GND.
8.3 Input Pin Processing
The signal input pins for this IC are not equipped with on-chip pull down/pull up resistors. When the VDD power is on,
the logic for all of the input pins must be set to either H or L.
16
Data Sheet S17310EJ2V0DS
µ PD168117
9. STEPPING MOTOR DRIVING WAVEFORM
Figure 9−1. 2-phase Excitation Output Mode
Figure 9−2. 1-2 Phase Excitation Output Mode
Phase A current
Phase A current
100%
100%
70% of
a current
setting
70% of
a current
setting
−100%
−100%
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
6
7
8
Phase B current
Phase B current
100%
100%
70% of
a current
setting
70% of
a current
setting
−100%
−100%
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
Remark Solid line: Output duty 100% drive, Dotted line: Current control drive (The current is in accordance with the
current setting.)
Data Sheet S17310EJ2V0DS
17
µ PD168117
Figure 9−3. Micro Step Drive Mode
RESET position
100
99.5
98.1 95.7
92.4
88.2
83.1
77.3
70.7
ch1 current
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0
−9.8
−19.5
−29.0
−38.3
−47.1
−55.6
−63.4
−70.7
−77.3
−83.1
−88.2
−92.4
−98.1 −95.7
−100 −99.5
0
5
10 15 20 25 30 35 40
45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130
ch2 current
100
99.5
98.1 95.7
92.4
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0
−9.8
−19.5
−29.0
−38.3
−47.1
−55.6
−63.4
−70.7
−77.3
−83.1
−88.2
−92.4
−98.1 −95.7
−100 −99.5
0
5
10 15 20 25 30 35 40
45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130
Remark The horizontal axis of the above charts indicates the number of steps. The above charts show an example
in the CW (forward) mode.
The current flowing into phases A and B is positive in the direction from OUT pin A to OUT pin B, and
negative in the direction from OUT pin B to OUT pin A. Because the micro step drive mode is in actuality
128 steps, it equals 1 electrical angle cycle.
18
Data Sheet S17310EJ2V0DS
µ PD168117
10. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25°C, glass epoxy board of 100 mm x 100 mm x 1 mm with copper foil area
of 15%)
Parameter
Power supply voltage
Symbol
Condition
Rating
Unit
VDD
Control block
−0.5 to +6.0
V
VM
Motor block
−0.5 to +6.0
V
−0.5 to VDD +0.5
V
Input voltage
VIN
Output pin voltage
VOUT
Motor block
6.2
V
DC output current (ch1 to 6ch)
ID(DC)
DC (during output independent operation)
±0.4
A/ch
DC output current (ch7)
ID(DC)
DC (during output independent operation)
±0.5
A/ch
Instantaneous output current
ID(pulse)
PW < 10 ms, Duty Cycle ≤ 20%
±0.7
A/ch
(during output independent operation)
Power consumption
PT
1.0
W
Peak junction temperature
Tch(MAX)
150
°C
Storage temperature
Tstg
−55 to +150
°C
Remark The overheat protection circuit operates at Tch > 150°C. When overheat is detected, all the circuits are
stopped. The overheat protection circuit does not operate at reset or on detection of ULVO.
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions (TA = 25°C, glass epoxy board of 100 mm x 100 mm x 1 mm with copper
foil area of 15%)
Parameter
Power supply voltage
Symbol
Condition
MIN.
TYP.
MAX.
Unit
VDD
Control block
2.7
3.6
V
VM
Motor block
2.7
5.5
V
0
VDD
V
Input voltage
VIN
DC output current (ch1 to 6ch)
ID(DC)
DC (during output independent operation)
−0.3
+0.3
A/ch
DC output current (ch7)
ID(DC)
DC (during output independent operation)
−0.4
+0.4
A/ch
Instantaneous output current
ID(pulse)
PW < 10 ms, Duty Cycle ≤ 20%
−0.6
+0.6
A/ch
(during output independent operation)
COSC (during 300 kHz TYP. oscillation)
Capacitor capacitance
ch7 reference voltage input
VREF7
100
0.1
pF
0.7
V
150
kHz
75
°C
range
Logic input frequency
fIN
Operating temperature range
TA
−10
Data Sheet S17310EJ2V0DS
19
µ PD168117
Figure 10−1. AC timing waveform
6.7 µ s MIN.
2.0 µs MIN.
2.0 µ s MIN.
CLK
0.1 µ s MIN.
0.1 µ s MIN.
0.1 µ s MIN.
CW
0.1 µ s MIN.
0.1 µ s MIN.
0.1 µ s MIN.
MODE
(including reset)
Electrical Characteristics (Unless otherwise specified, TA = 25°C, VDD = 3.0 V, VM = 3.0 V)
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
VDD pin current in standby mode
IDD(STB)
During reset
1.0
µA
VDD pin current in during operation
IDD(ACT)
During non-reset
5.0
mA
High-level input current
IIH
VIN = VDD
1.0
µA
Low-level input current
IIL
VIN = 0 V
High-level input voltage
VIH
Low-level input voltage
VIL
COSC oscillation frequency
fOSC
COSC = 150 pF
100
H-bridge on-state resistance
Ron
IM = 0.3 A, sum of upper and lower
1.0
1.5
Ω
Ron56
IM = 0.3 A, sum of upper and lower
1.5
2.0
Ω
1.0
µA
1.7
2.5
V
−1.0
µA
0.7 x VDD
V
0.3 x VDD
V
kHz
stages (ch1 to ch4, and ch7)
stages (ch5 and ch6)
Output leakage current
Note1
Low-voltage detection voltage
Internal reference voltage
Current detection ratio
Note2
IM(off)
Per VM pin, All control pin: low level
VDDS
VREF
ch1 to ch4
450
500
550
mV
VREF7
ch7, during SELVREF7 = H
180
200
220
mV
IM = 0.1 A, with sense resistor of 5 kΩ,
950
1050
1150
0.02
0.35
1.0
µs
0.02
0.35
1.0
µs
Note2
ch1 to ch4
Output turn-on time
ton
Output turn-off time
toff
RL = 20 Ω, ch1 to ch6
Notes 1. This IC has a circuit that prevents current from flowing into the VM pin when VDD = 0 V.
2. The accuracy of the output current for ch1 to ch4 depends upon the motor that is actually used, but the
current fluctuations of the IC are determined by reference voltage and current detection ratios. Assume that
the total of the reference voltage VREF and current sense circuit errors are equal to ±10%.
20
Data Sheet S17310EJ2V0DS
µ PD168117
11. PACKAGE DRAWING
56-PIN PLASTIC WQFN (8x8)
HD
D
D /2
HD /2
42
43
4−C0.5
29
28
A2
E /2
A1
HE E
C
DETAIL OF P PART
HE /2
15
14
56
1
x4
ZE
f
ZD
y1
A
S
c1 c2
S A B
b1
S
b
y
S
TERMINAL SECTION
P
x4
B
t
S A B
A
(UNIT:mm)
ITEM
D
E
7.75
f
0.20
HD
8.00
HE
8.00
t
0.20
A
0.67 +0.08
–0.04
A1
0.03 +0.02
–0.025
A2
0.64
b
0.23±0.05
b1
0.20±0.03
c
0.08MIN.
0.08MIN.
e
b
x
M
DIMENSIONS
7.75
0.17
c1
0.14−0.16
c2
0.14−0.20
Lp
e
0.50
S A B
Lp
NOTES
1 "t" AND "f" EXCLUDES MOLD FLASH
2 ALTHOUGH THERE ARE 4 TERMINALS IN THE CORNER PART
OF A PACKAGE, THESE TERMINALS ARE NOT DESIGNED FOR
INTERCONNECTION, BUT FOR MANUFACTURING PROCESS OF
THE PACKAGE, THEREFOR DO NOT INTEND TO SOLDER THESE
4 TERMINALS, SOLDERABLITY OF THE 4 TERMINALS ARE NOT
GUARANTEED.
Data Sheet S17310EJ2V0DS
0.40±0.10
x
0.05
y
0.08
y1
0.10
ZD
0.625
ZE
0.625
P56K9-50-9B4
21
µ PD168117
12. RECOMMENDED SOLDERING CONDITIONS
The µ PD168117 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µ PD168117K9-9B4-A
Note1
: 56-pin plastic WQFN (8 x 8)
Process
Infrared reflow
Conditions
Symbol
Package peak temperature: 260°C, Time: 60 seconds MAX. (at 220°C or higher) ,
Count: Three times or less, Exposure limit: 3 days
Note2
IR60-103-3
(after that, prebake at 125°C
for 10 hours) , Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Precaution>
Products other than in heat-resistant trays (such as those packaged in a magazine,
taping, or non-thermal-resistant tray) cannot be baked in their package.
Notes 1. Pb-free (This product does not contain Pb in external electrode and other parts.)
2. After opening the dry pack, store it a 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating) .
22
Data Sheet S17310EJ2V0DS
µ PD168117
NOTES FOR CMOS DEVICES
1
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2
HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3
PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred.
Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded.
The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4
STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5
POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6
INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
Data Sheet S17310EJ2V0DS
23
µ PD168117
Reference Documents
NEC Semiconductor Device Reliability/Quality Control System (C10983E)
Quality Grades On NEC Semiconductor Devices (C11531E)
• The information in this document is current as of December, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1