NEC UPD444004LLE-A10

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD444004L
4M-BIT CMOS FAST SRAM
1M-WORD BY 4-BIT
Description
The µPD444004L is a high speed, low power, 4,194,304 bits (1,048,576 words by 4 bits) CMOS static RAM.
Operating supply voltage is 3.3 V ± 0.3 V.
The µPD444004L is packaged in a 32-pin PLASTIC SOJ.
Features
• 1,048,576 words by 4 bits organization
• Fast access time : 8, 10, 12 ns (MAX.)
• Output Enable input for easy application
• Single +3.3 V power supply
Ordering Information
Part number
Package
Access time
Supply current mA (MAX.)
ns (MAX.)
At operating
At standby
5
µPD444004LLE-A8
32-pin PLASTIC SOJ
8
180
µPD444004LLE-A10
(10.16 mm (400))
10
160
12
150
µPD444004LLE-A12
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M14427EJ4V0DS00 (4th edition)
Date Published May 2002 NS CP(K)
Printed in Japan
The mark  shows major revised points.
©
1999
µPD444004L
Pin Configuration (Marking Side)
/××× indicates active low signal.
32-pin PLASTIC SOJ (10.16 mm (400))
A0
1
32
A19
A1
2
31
A18
A2
3
30
A17
A3
4
29
A16
A4
5
28
A15
/CS
6
27
/OE
I/O1
7
26
I/O4
VCC
8
25
GND
GND
9
24
VCC
I/O2
10
23
I/O3
/WE
11
22
A14
A5
12
21
A13
A6
13
20
A12
A7
14
19
A11
A8
15
18
A10
A9
16
17
NC
A0 - A19
: Address Inputs
I/O1 - I/O4 : Data Inputs / Outputs
/CS
: Chip Select
/WE
: Write Enable
/OE
: Output Enable
VCC
: Power supply
GND
: Ground
NC
: No connection
Remark Refer to Package Drawing for the 1-pin index mark.
2
Data Sheet M14427EJ4V0DS
µPD444004L
A0
|
A19
I/O1
|
I/O4
Row decoder
Address buffer
Block Diagram
Memory cell array
4,194,304 bits
Input data
controller
Sense amplifier /
Switching circuit
Output data
controller
Column decoder
Address buffer
/CS
/OE
/WE
VCC
GND
Truth Table
/CS
/OE
/WE
Mode
I/O
Supply current
H
×
×
Not selected
High impedance
ISB
L
L
H
Read
DOUT
ICC
L
×
L
Write
DIN
L
H
H
Output disable
High impedance
Remark × : Don’t care
Data Sheet M14427EJ4V0DS
3
µPD444004L
Electrical Specifications
Absolute Maximum Ratings
Parameter
Symbol
Condition
Rating
Note
Unit
Supply voltage
VCC
–0.5
to +4.0
V
Input / Output voltage
VT
–0.5 Note to +4.0
V
Operating ambient temperature
TA
0 to 70
°C
Storage temperature
Tstg
–55 to +125
°C
Note –2.0 V (MIN.) (pulse width : 2 ns)
Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
3.3
3.6
V
VCC+0.3
V
+0.8
V
70
°C
Supply voltage
VCC
3.0
High level input voltage
VIH
2.0
Low level input voltage
VIL
–0.3
Operating ambient temperature
TA
0
Note –2.0 V (MIN.) (pulse width : 2 ns)
4
Data Sheet M14427EJ4V0DS
Note
µPD444004L
DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted)
Parameter
Symbol
Test condition
MIN.
TYP.
MAX.
Unit
Input leakage current
ILI
VIN = 0 V to VCC
–2
+2
µA
Output leakage current
ILO
VI/O = 0 V to VCC,
–2
+2
µA
mA
/CS = VIH or /OE = VIH or /WE = VIL
Operating supply current
Standby supply current
ICC
/CS = VIL,
Cycle time : 8 ns
180
II/O = 0 mA,
Cycle time : 10 ns
160
Minimum cycle time
Cycle time : 12 ns
150
ISB
/CS = VIH, VIN = VIH or VIL
40
ISB1
/CS ≥ VCC – 0.2 V,
5
mA
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
High level output voltage
VOH
IOH = –4.0 mA
Low level output voltage
VOL
IOL = +8.0 mA
Remark
2.4
V
0.4
V
MAX.
Unit
VIN : Input voltage
VI/O : Input / Output voltage
Capacitance (TA = 25 °C, f = 1 MHz)
Parameter
Symbol
Test condition
MIN.
TYP.
Input capacitance
CIN
VIN = 0 V
6
pF
Input / Output capacitance
CI/O
VI/O = 0 V
8
pF
Remarks 1. VIN : Input voltage
VI/O : Input / Output voltage
2. These parameters are periodically sampled and not 100% tested.
Data Sheet M14427EJ4V0DS
5
µPD444004L
AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted)
AC Test Conditions
Input Waveform (Rise and Fall Time ≤ 3 ns)
3.0 V
1.5 V
Test Points
1.5 V
1.5 V
Test Points
1.5 V
GND
Output Waveform
Output Load
AC characteristics directed with the note should be measured with the output load shown in Figure 1 or
Figure 2.
Figure 1
Figure 2
(tAA, tACS, tOE, tOH)
(tCLZ, tOLZ, tCHZ, tOHZ, tWHZ, tOW )
VTT = +1.5 V
+3.3 V
50 Ω
317 Ω
ZO = 50 Ω
I/O (Output)
I/O (Output)
30 pF
CL
Remark
6
351 Ω
CL includes capacitances of the probe and jig, and stray capacitances.
Data Sheet M14427EJ4V0DS
5 pF
CL
µPD444004L
Read Cycle
Parameter
Symbol
-A8
MIN.
-A10
MAX.
8
MIN.
-A12
MAX.
MIN.
10
Unit
Notes
MAX.
Read cycle time
tRC
12
ns
Address access time
tAA
8
10
12
ns
/CS access time
tACS
8
10
12
ns
/OE access time
tOE
4
5
6
ns
Output hold from address change
tOH
3
3
3
ns
/CS to output in low impedance
tCLZ
3
3
3
ns
/OE to output in low impedance
tOLZ
0
0
0
ns
/CS to output in high impedance
tCHZ
4
5
6
ns
/OE to output hold in high impedance
tOHZ
4
5
6
ns
1
2, 3
Notes 1. See the output load shown in Figure 1.
2. Transition is measured at ± 200 mV from steady-state voltage with the output load shown in Figure 2.
3. These parameters are periodically sampled and not 100% tested.
Read Cycle Timing Chart 1 (Address Access)
tRC
Address (Input)
tAA
tOH
I/O (Output)
Previous data out
Data out
Remarks 1. In read cycle, /WE should be fixed to high level.
2. /CS = /OE = VIL
Data Sheet M14427EJ4V0DS
7
µPD444004L
Read Cycle Timing Chart 2 (/CS Access)
tRC
Address (Input)
tAA
tACS
/CS (Input)
tCLZ
tCHZ
/OE (Input)
tOHZ
tOE
tOLZ
I/O (Output)
High impedance
Data out
Caution
Address valid prior to or coincident with /CS low level input.
Remark
In read cycle, /WE should be fixed to high level.
8
Data Sheet M14427EJ4V0DS
High impedance
µPD444004L
Write Cycle
Parameter
Symbol
-A8
MIN.
-A10
MAX.
MIN.
-A12
MAX.
MIN.
Unit
MAX.
Write cycle time
tWC
8
10
12
ns
/CS to end of write
tCW
6
7
8
ns
Address valid to end of write
tAW
6
7
8
ns
Write pulse width
tWP
6
7
8
ns
Data valid to end of write
tDW
4
5
6
ns
Data hold time
tDH
0
0
0
ns
Address setup time
tAS
0
0
0
ns
Write recovery time
tWR
0
0
0
ns
/WE to output in high impedance
tWHZ
Output active from end of write
tOW
4
3
5
6
3
Notes
3
ns
1, 2
ns
Notes 1. Transition is measured at ± 200 mV from steady-state voltage with the output load shown in Figure 2.
2. These parameters are periodically sampled and not 100% tested.
Write Cycle Timing Chart 1 (/WE Controlled)
tWC
Address (Input)
tCW
/CS (Input)
tAW
tAS
tWR
tWP
/WE (Input)
tOW
tWHZ
I/O (Input / Output)
Indefinite data out
tDW
High
impedance
tDH
Data in
High
impedance
Indefinite data out
Cautions 1. /CS or /WE should be fixed to high level during address transition.
2. Do not input data to the I/O pins while they are in the output state.
Remarks 1. Write operation is done during the overlap time of a low level /CS and a low level /WE.
2. When /WE is at low level, the I/O pins are always high impedance. When /WE is at high level, read
operation is executed. Therefore /OE should be at high level to make the I/O pins high impedance.
Data Sheet M14427EJ4V0DS
9
µPD444004L
Write Cycle Timing Chart 2 (/CS Controlled)
tWC
Address (Input)
tAS
tCW
/CS (Input)
tAW
tWP
tWR
/WE (Input)
tDW
High impedance
Data in
I/O (Input)
tDH
High impedance
Cautions 1. /CS or /WE should be fixed to high level during address transition.
2. Do not input data to the I/O pins while they are in the output state.
Remark
10
Write operation is done during the overlap time of a low level /CS and a low level /WE.
Data Sheet M14427EJ4V0DS
µPD444004L
Package Drawing
32-PIN PLASTIC SOJ (10.16 mm (400))
B
32
17
C
1
D
16
G
J
E
F
U
M
N
S
M
Q
T
P
S
K
I
H
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
B
21.26±0.2
C
10.16
D
11.18±0.2
E
1.005±0.1
F
0.74
G
3.5±0.2
H
2.545±0.2
I
0.8 MIN.
J
2.6
K
M
1.27(T.P.)
0.40±0.10
N
0.12
P
9.4±0.20
Q
T
0.1
R0.85
U
0.20 +0.10
−0.05
P32LE-400A-1
Data Sheet M14427EJ4V0DS
11
µPD444004L
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the µPD444004L.
Type of Surface Mount Device
µPD444004LLE
12
: 32-pin PLASTIC SOJ (10.16 mm (400))
Data Sheet M14427EJ4V0DS
µPD444004L
Revision History
Edition/
Date
4th edition/
Page
This
edition
Previous
edition
p.1, 2, 11, 12
p.1, 2, 12, 13
Type of
revision
Deletion
May 2002
Location
Ordering Information,
Description
(Previous edition → This edition)
32-pin PLASTIC TSOP (II)
Pin Configuration,
Package Drawing,
Type of Surface Mount Device
p.5
p.5
Deletion
DC Characteristics
Remark 2
p.7, 9
p.7, 9
Deletion
Read Cycle, Write Cycle
Remark
Data Sheet M14427EJ4V0DS
13
µPD444004L
[MEMO]
14
Data Sheet M14427EJ4V0DS
µPD444004L
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet M14427EJ4V0DS
15
µPD444004L
• The information in this document is current as of May, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
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patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
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redundancy, fire-containment, and anti-failure features.
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developed based on a customer-designated "quality assurance program" for a specific application. The
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Customers must check the quality grade of each semiconductor product before using it in a particular
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4