E2C0029-27-Y4 ¡ Semiconductor MSC7128-xx ¡ Semiconductor This version:MSC7128-xx Nov. 1997 Previous version: Jul. 1996 5 ¥ 7-Dot Character ¥ 16-Digit Display Controller/Driver GENERAL DESCRIPTION The MSC7128-xx is a general purpose display controller for vacuum fluorescent display tube. The MSC7128-xx drives displays with up to 35 anodes (dots) and up to 16 grids (characters) plus a cursor. The controller accepts command and display data input words on a clocked serial input line. Commands control the on/off duty cycle, starting character position, number of characters to display and display modes (PLA mode and Lamp Test mode). An internal PLA-type character generator provides character decoding and dot pattern generation for the full 128 characters. A 35 ¥ 128-bit PLA (ROM) code is programmable. FEATURES • Logic supply voltage (VDD) :+5V • VF driver supply voltage (VEE) :–55V • Driver output current – VF grid driver :–30mA – VF anode driver :–2mA – VF cursor driver :–10mA • Direct drive capability for vacuum fluorescent display (no pull-down resistor is required) • Built-in oscillation circuit • Built-in power-on-reset circuit with external C • Serial host interface (data in, clock, chip select) • Serial data input for 8-bit control and display data words • Command functions – On/off duty cycle : 0/16 to 15/16 – Character display position : 0 to 15 – Number of display digits :1 to 16 – Display modes : PLA mode, and Lamp Test mode • Built-in 35 x 128-bit PLA-type character generator – Character font :5 ¥ 7 – Number of characters :128 – Programmable PLA code • Package options: 64-pin plastic SDIP (SDIP64-P-750-1.78) (Product name : MSM7128-xxSS) 64-pin plastic QFP (QFP64-P-1420-1.00-BK) (Product name : MSM7128-xxGS-BK) xx indicates the code number. 1/27 8 CS CS CP COMMAND DECODER 5 fW R L W/R TIMING GENERATOR TEST STEP 4 4 b0-3 W.A.C. LOAD W.A.C. COUNT RESET 4 D.G LOAD OE LR S LT RESET fSEG WRITE ADDRESS COUNTER 4 4 4 COM DRIVER COM1 COM2 16 READ ADDRESS COUNTER RESET fDIG SEG34 SEG35 SEG36 OE COM14 COM15 COM16 RESET b0-3 DUTYCYCLE REGISTER R 4 36 LATCH W.A.C. COUNT TEST COUNT V SS ADDRESS SELECTOR CONTROL CP RESET CS SEG1 SEG2 CHARACTER GENERATOR 35 35 ¥ 128 BITS ROM ROM PC1 PC2 RAMPC fR 4 RESET SEG DRIVER LATCH DECODER RESET OSC 7 LR 3 b4-6 OSCI OSCO 8 8BITS ¥ b0-7 16 WORDS CP RESET 8 DISPLAY DATA BUFFER PLA ¡ Semiconductor 8-BIT SHIFT REGISTER LATCH BLOCK DIAGRAM RAM V DD DA RESET b0-3 D.G LOAD DIGIT COUNT REGISTER A=B A B ADDRESS COMP 4 V EE RESET DUTY AND BLANK GENERATOR 2/27 RESET BLANK DUTY AND BLANK MSC7128-xx DUTYCYCLE COUNTER 4 b0-3 ¡ Semiconductor MSC7128-xx INPUT AND OUTPUT CONFIGURATION • INPUT PIN VDD DA CS CP OSCI VDD VDD R RESET TEST COUNT TEST STEP GND • OUTPUT PIN VDD OSCO VDD SEG1 - 35 VDD VEE SEG36 COM1-16 VEE 3/27 ¡ Semiconductor MSC7128-xx PIN CONFIGURATION (TOP VIEW) OSC0 OSCI TEST COUNT TEST STEP VSS VEE COM 1 COM 2 COM 3 COM 4 COM 5 COM 6 COM 7 COM 8 COM 9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 SEG 36 SEG 35 SEG 34 SEG 33 SEG 32 SEG 31 SEG 30 SEG 29 SEG 28 SEG 27 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 CS DA CP RESET VDD 1 VDD 2 SEG 1 SEG 2 SEG 3 SEG 4 SEG 5 SEG 6 SEG 7 SEG 8 SEG 9 SEG 10 SEG 11 SEG 12 SEG 13 SEG 14 SEG 15 SEG 16 SEG 17 SEG 18 SEG 19 SEG 20 SEG 21 SEG 22 SEG 23 SEG 24 SEG 25 SEG 26 64-Pin Plastic Shrink DIP 4/27 , ¡ Semiconductor MSC7128-xx VDD2 56 52 DA CP 57 VDD1 CS 58 RESET OSC O 59 53 OSC I 60 54 TEST COUNT 61 55 VSS TEST STEP 62 COM 1 VEE 63 64 PIN CONFIGURATION (TOP VIEW) 3 49 SEG 3 COM 5 4 48 SEG 4 COM 6 5 47 SEG 5 COM 7 6 46 SEG 6 COM 8 7 45 SEG 7 COM 9 8 44 SEG 8 COM 10 9 43 SEG 9 COM 11 10 42 SEG 10 COM 12 11 41 SEG 11 COM 13 12 40 SEG 12 COM 14 13 39 SEG 13 COM 15 14 38 SEG 14 COM 16 15 37 SEG 15 SEG 36 16 36 SEG 16 SEG 35 17 35 SEG 17 SEG 34 18 34 SEG 18 SEG 33 19 33 SEG 19 SEG 20 32 COM 4 SEG 21 31 SEG 2 SEG 22 30 50 SEG 23 29 2 SEG 24 28 COM 3 SEG 26 26 SEG 25 27 SEG 1 SEG 28 24 SEG 27 25 51 SEG 30 22 SEG 29 23 1 SEG 32 20 SEG 31 21 COM 2 64-Pin Plastic QFP 5/27 ¡ Semiconductor MSC7128-xx PIN DESCRIPTION Symbol Type VDD1 — VDD2 — VSS — VEE — DA I Microcomputer Serial data input from LSB (positive logic) CP I Microcomputer Shift clock input. Data is shifted at the leading edge of the CP. CS I Microcomputer Chip select input. When the PIN is High, the serial data transfer is inhibited. OSCI I OSCO O RESET Connected to Power source Description VDD1 – VSS: Internal logic supply voltage VDD2 – VEE: VF tube driving circuit supply voltage — RC oscillation, external RC pin. fOSC = 250kHz at C = 100pF and R = 47kW. I — Reset input (pull-up resistor built in). When the pin is Low, the internal logic is reset, and the outputs of SEG1 to SEG36 and COM1 to COM16 are Low. O VF tube grid electrode VF tube grid electrode driving outputs. This pin can be connected directly to the VF tube. No pull-down resistor is required. IOH > –30mA COM1 ~ COM16 O VF tube 5 ¥ 7 -dot anode electrode driving outputs. VF tube anode electrode This pin can be connected directly to the VF tube. No pull-down resistor is required. IOH > –2mA SEG36 O VF tube cursor anode electrode driving output. VF tube anode electrode This pin can be connected directly to the VF tube. No pull-down resistor is required. IOH > –10mA TEST STEP I — Test mode setting input (normally open) TEST COUNT I — Test clock input (normally open) SEG1 ~ SEG35 6/27 ¡ Semiconductor MSC7128-xx ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Power Supply Voltage (1) VDD–VSS — –0.3 to +6.5 V Power Supply Voltage (2) VDD–VEE — 0 to 65 V Input Voltage VIN–VSS — –0.3 to VDD + 0.3 V PD Ta £ 25°C Up to 1.0 W TSTG — –55 to +150 °C IO1 COM1 to COM16 –40 mA IO2 SEG1 to SEG35 –4 mA IO3 SEG36 –15 mA Power Dissipation Storage Temperature Output Current RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Typ. Max. Unit Power Supply Voltage (1) VDD–VSS — 4.5 — 5.5 V Power Supply Voltage (2) VDD–VEE — 10 — 60 V High Level Input Voltage VIH–VSS — 0.7VDD — — V Low Level Input Voltage VIL–VSS — — — 0.3VDD V CP Frequency f CP — — — 500 kHz OSC Frequency fOSC 100pF, 47kW 170 220 270 kHz Operating Temperature Top — –20 — +75 °C 7/27 ¡ Semiconductor MSC7128-xx ELECTRICAL CHARACTERISTICS DC Characteristics (VDD–Vss = 5V±10%, VDD–VEE = 60V, Ta = –20 to +75°C) Parameter Symbol Condition Min. High Level Input Voltage VIH — Low Level Input Voltage VIL — — V — 0.3VDD V VDD = 5.5V VIN = 5V –5 5 mA IIH2 TEST STEP TEST COUNT VDD = 5.5V VIN = 5V 0.25 1 mA IIL1 DA, CP, CS TEST STEP TEST COUNT VDD = 5.5V VIH = 0.5V –5 5 mA –25 –100 mA RESET VDD = 5.5V VIH = 0.5V VOH1 OSCO IOH = –500mA VDD–0.6 — V VOH2 COM1~16 IOH = –30mA VDD–4 — V VOH3 SEG1~35 IOH = –2mA VDD–3 — V VOH4 SEG36 IOH = –10mA VDD–4 — V VOL1 OSCO IOL = 500mA — VSS+0.6 V VOL2 COM1~16 IOL = 100mA — VEE+3 V VOL3 SEG1~35 IOL = 100mA — VEE+3 V VOL4 SEG36 IOL = 100mA — VEE+3 V All SEGs on, 16-digit display, duty cycle 15/16, no load — 15 mA ISS2 All SEGs Low, all COMs High — 1.5 mA IEE1 All SEGs on, 16-digit display, duty cycle 15/16, no load — 1.0 mA IEE2 All SEGs Low, all COMs High — 15 mA IIL2 ISS1 Current Consumption 0.7VDD DA, CP, CS RESET Low Level Input Current Low Level Output Voltage Unit IIH1 High Level Input Current High Level Output Voltage Max. 8/27 ¡ Semiconductor MSC7128-xx AC Characteristics (VDD–VSS = 5V±10%, Ta = –20 to +75°C) Symbol Condition Min. Max. Unit CP Cycle Time Parameter tCP — 2 — ms CP Pulse Width tWCP — 1 — ms tDS — 0.5 — ms Data Hold Time tDH — 0.5 — ms CS Set-up Time tCSS — 1 — ms CS Hold Time tCSH — 32T* — s OSC Frequency fOSC R = 47kW, C = 100pF 170 270 kHz Data Set-up Time *T = 1/fOSC TIMING DIAGRAM Data Timing 0.3 tCP tWCP 0.3 tCSS tCSH tDS 0.7 0.3 tDH 0.7 VALID 0.3 0.3 0.3 VALID VALID 9/27 ¡ Semiconductor MSC7128-xx Data LSB/MSB Timing END OF DATA WORD CP NEXT DATA WORD MSB LSB tDOFF VDD VEE DATA INPUT OFF TIME tDOFF = 32Tmin (T=1/fOSC) t1 = Frame count t2 = Display timing t3 = Blank timing T = 1/fOSC n = 1 to 36 SEG n COM 16 COM 15 COM 14 COM 13 COM 12 COM 11 COM 10 COM 9 COM 8 COM 7 COM 6 COM 5 COM 4 COM 3 COM 2 COM 1 60T 4T t2 t3 t1=64¥16=1024T VDD VEE Digit Timing (16-Digit Display) When fOSC = 245kHz t1 = 4.096ms t2 = 240ms t3 = 16ms 10/27 ¡ Semiconductor MSC7128-xx Reset Timing VDD tRESET ON tRESET OFF RESET DATA VALID DA OPTION 1 When a capacitor is connected between the RESET pin and VSS, RESET ON TIME tRESET ON : 250ms typ. RESET OFF TIME tRESET OFF : 50ms min. (External capacitor : 1mF) OPTION 2 When a RESET signal is externally input, RESET ON TIME tRESET ON : 50ms min. RESET OFF TIME tRESET OFF : 50ms min. 11/27 ¡ Semiconductor MSC7128-xx FUNCTIONAL DESCRIPTION Data Transfer Method and Command Write Method A display control command or data is written by the 8-bit serial transfer method. The figure below shows the write timing. When the CS pin is Low, data can be transferred. Data of 8 bits in length is input to the DA pin sequentially starting with the LSB. (LSB first) Data is shifted at the rising edge of a shift clock pulse which is input to the CP pin as shown in the figure below. When 8-bit data is entered, an inner LOAD signal is automatically generated, and data is written into the registers and RAM. Therefore, there is no need to input an external LOAD signal. If the CS pin is changed from Low to High, the serial transfer is inhibited, and data, which is entered after the CS pin is changed from High to Low, is recognized in units of 8 bits. The first 8 bits become the first byte, and the second 8 bits become the second byte and the next 8 bits become either the first byte or the second byte depending on the selected command. CS CP tDOFF*1 DA b0 b1 b2 b3 b4 b5 b6 b7 LSB First Byte tCSH*2 b0 b1 b2 b3 b4 b5 b6 b7 MSB LSB Second Byte MSB *1 tDOFF : Refer to Data LSB/MSB Timing. *2 tCSH : Refer to AC Characteristics and Data Timing. Command Type First Byte No. Second Byte Command b7 b6 b5 b4 b3 b2 b1 b0 b7 b6 b5 b4 b3 b2 b1 b0 0 Address Set 1 0 0 0 X X X X X X X X X3 X2 X1 X0 1 Character Code Set 1 0 0 1 X X X X 2 Display Duty Set 1 0 1 0 X X X X X 3 Number of Display Digits Set 1 0 1 1 X X X X X X X X DG3 DG2 DG1 DG0 4 Lamp Test 1 1 0 0 X X X X X X X X CU CH6 CH5 CH4 CH3 CH2 CH1 CH0 X X X DC3 DC2 DC1 DC0 X X X LT *1 When character codes are to be continuously transferred, addresses are automatically incremented (internally). Accordingly, neither the Address Set command nor the first byte of the Character Code Set command are required to set the second and the following character codes. *2 X : Don’t care 12/27 ¡ Semiconductor MSC7128-xx Command Description • Address set command When the code of a display character is to be set, this command is used to specify the display location (digit number) of the character. The relation between the digit number X and common outputs COM1 to COM16 is as follows: X COM Input 0 COM1 1 COM2 15 COM16 Command format LSB 1 0 0 0 X X X X 1st byte LSB X X X X X3 X2 X1 X0 2nd byte Digit number ¥ (0 to 15) • Character code set command This command is used to specify the character to be displayed in the digit place specified by the Address Set command. Bits 0 to 6 of the second byte are used to specify the character code, and bit 7 is used to specify "Yes" or "No" of cursor display. Command format LSB 1 0 0 1 X X X X 1st byte CU CH6 CH5 CH4 CH3 CH2 CH1 CH0 2nd byte 7-bit character code Select one of 128 codes 0: Without cursor (SEG36 OFF) 1: With cursorout (SEG36 ON) 13/27 ¡ Semiconductor MSC7128-xx An automatic address increment function is built in. To write multidigit display character codes, issue the Address Set command. To transfer the second and later digit display character codes, the first byte (operation code) of the Character Code command is not required. Input the second byte. When this command is executed, 8-bit data for the second byte and later bytes, which is provided before the CS pin is turned High, is all treated as display character data. Transfer examples of the Address Set command and the Character Set command CS 1st DATA 2nd 1st 2nd Address Set command 2nd 2nd 2nd Character Set command Example 1: The display for COM3 and the following is changed. LSB 1 0 0 0 X X X X LSB X X X X 0 0 1 0 Specify the digit number X=2 (COM3) LSB 1 0 0 1 X X X X LSB CU CH6 CH5 CH4 CH3 CH2 CH1 CH0 CU CH6 CH5 CH4 CH3 CH2 CH1 CH0 CU CH6 CH5 CH4 CH3 CH2 CH1 CH0 Write the first character code Write the character code to be displayed ON COM4 Write the character code to be displayed ON COM5 X=15 (COM16) is followed by X= 0 (COM1) 14/27 ¡ Semiconductor MSC7128-xx Number of Display Digits Set Command This command is used to set the digit count register and the number of display digits. The number of digits to be set ranges from 1 to 16. Command format LSB 1 0 1 1 X X X X 1st byte LSB X X X X DG3 DG2 DG1 DG0 2nd byte Number of digits DG (0 to 15) The relation between the value of DG to be set and COM under display control is as follows: DG COM Displayed DG COM Displayed 0 COM1 - COM16 8 COM1 - COM8 1 COM1 9 COM1 - COM9 2 COM1 - COM2 10 COM1 - COM10 3 COM1 - COM3 11 COM1 - COM11 4 COM1 - COM4 12 COM1 - COM12 5 COM1 - COM5 13 COM1 - COM13 6 COM1 - COM6 14 COM1 - COM14 7 COM1 - COM7 15 COM1 - COM15 15/27 ¡ Semiconductor MSC7128-xx Display Duty Set Command Assuming the original oscillation cycle as T, the time allocated to 1-digit display is 64T. The actual display time may be specified as 0 to 60T in increments of 4T. Assuming the number of display digits as n and the parameter provided by the Display Duty Set command as DC, the resultant display duty cycle ratio is as follows: 4 (DC) 64n = (DC) 16n Command format LSB 1 0 1 0 X X X X 1st byte LSB X X X X DG3 DG2 DG1 DG0 2nd byte DC value (0 to 15) Lamp Test Command This command is used to set the All-Segment Display mode. If this occurs, the 36 segments for each digit to be displayed are put into the ON state. The number of display digits and the display duty cycle depend on the contents of the digit count register and of the duty register. The contents of the internal RAM are not affected by this command. When the command is released, the original display appears once again. Command format LSB 1 1 0 0 X X X X 1st byte LSB X X X X X X X LT 2nd byte 0: Normal mode 1: Lamp test mode 16/27 ¡ Semiconductor MSC7128-xx Power On Reset Operation Operations when the RESET pin is Low are as follows: a. All segment driver outputs are Low. b. All grid driver outputs are Low. c. The number of display digits is set to 16. d. The display duty cycle is set to 0. Test Step and Test Count These pins are used for inspection before shipment, and should not be used by the user. When this IC is mounted, leave them open or connect to VSS. If they are connected to other pins, a malfunction may be caused. 17/27 ¡ Semiconductor MSC7128-xx Relation Between Segment Output and VF Tube Dots 1-1 2-1 3-1 4-1 5-1 SEG1 SEG2 SEG3 SEG4 SEG5 1-2 2-2 3-2 4-2 5-2 SEG6 SEG7 SEG8 SEG9 SEG10 1-3 2-3 3-3 4-3 5-3 SEG11 SEG12 SEG13 SEG14 SEG15 1-4 2-4 3-4 4-4 5-4 SEG16 SEG17 SEG18 SEG19 SEG20 1-5 2-5 3-5 4-5 5-5 SEG21 SEG22 SEG23 SEG24 SEG25 1-6 2-6 3-6 4-6 5-6 SEG26 SEG27 SEG28 SEG29 SEG30 1-7 2-7 3-7 4-7 5-7 SEG31 SEG32 SEG33 SEG34 SEG35 Cursor SEG36 18/27 ¡ Semiconductor MSC7128-xx Data Setup Flow Power on Address set Character set Display digit set Display duty set CS DA 1st 2nd 1st 2nd 2nd 2nd 2nd 1st 2nd 1st 2nd CP address set 1st : 2nd : character set Number of display digits set Display duty set the first byte the second byte Note: To avoid display malfunction due to external noise, re-set occasionally the number of display digits set and display duty set. 19/27 ¡ Semiconductor MSC7128-xx MSC7128-01 ROM CODE ADDRESS 0(00H) ADDRESS 1(01H) ADDRESS 2(02H) ADDRESS 3(03H) ADDRESS 4(04H) ADDRESS 5(05H) ADDRESS 6(06H) ADDRESS 7(07H) ADDRESS 8(08H) ADDRESS 9(09H) ADDRESS 10(0AH) ADDRESS 11(0BH) ADDRESS 12(0CH) ADDRESS 13(0DH) ADDRESS 14(0EH) ADDRESS 15(0FH) ADDRESS 16(10H) ADDRESS 17(11H) ADDRESS 18(12H) ADDRESS 19(13H) ADDRESS 20(14H) ADDRESS 21(15H) ADDRESS 22(16H) ADDRESS 23(17H) ADDRESS 24(18H) ADDRESS 25(19H) ADDRESS 26(1AH) ADDRESS 27(1BH) ADDRESS 28(1CH) ADDRESS 29(1DH) 20/27 ¡ Semiconductor MSC7128-xx ADDRESS 30(1EH) ADDRESS 31(EFH) ADDRESS 32(20H) ADDRESS 33(21H) ADDRESS 34(22H) ADDRESS 35(23H) ADDRESS 36(24H) ADDRESS 37(25H) ADDRESS 38(26H) ADDRESS 39(27H) ADDRESS 40(28H) ADDRESS 41(29H) ADDRESS 42(2AH) ADDRESS 43(2BH) ADDRESS 44(2CH) ADDRESS 45(2DH) ADDRESS 46(2EH) ADDRESS 47(2FH) ADDRESS 48(30H) ADDRESS 49(31H) ADDRESS 50(32H) ADDRESS 51(33H) ADDRESS 52(34H) ADDRESS 53(35H) ADDRESS 54(36H) 21/27 ¡ Semiconductor MSC7128-xx ADDRESS 55(37H) ADDRESS 56(38H) ADDRESS 57(39H) ADDRESS 58(3AH) ADDRESS 59(3BH) ADDRESS 60(3CH) ADDRESS 61(3DH) ADDRESS 62(3EH) ADDRESS 63(3FH) ADDRESS 64(40H) ADDRESS 65(41H) ADDRESS 66(42H) ADDRESS 67(43H) ADDRESS 68(44H) ADDRESS 69(45H) ADDRESS 70(46H) ADDRESS 71(47H) ADDRESS 72(48H) ADDRESS 73(49H) ADDRESS 74(4AH) ADDRESS 75(4BH) ADDRESS 76(4CH) ADDRESS 77(4DH) ADDRESS 78(4EH) ADDRESS 79(4FH) 22/27 ¡ Semiconductor MSC7128-xx ADDRESS 80(50H) ADDRESS 81(51H) ADDRESS 82(52H) ADDRESS 83(53H) ADDRESS 84(54H) ADDRESS 85(55H) ADDRESS 86(56H) ADDRESS 87(57H) ADDRESS 88(58H) ADDRESS 89(59H) ADDRESS 90(5AH) ADDRESS 91(5BH) ADDRESS 92(5CH) ADDRESS 93(5DH) ADDRESS 94(5EH) ADDRESS 95(5FH) ADDRESS 96(60H) ADDRESS 97(61H) ADDRESS 98(62H) ADDRESS 99(63H) ADDRESS 100(64H) ADDRESS 101(65H) ADDRESS 102(66H) ADDRESS 103(67H) ADDRESS 104(68H) 23/27 ¡ Semiconductor MSC7128-xx ADDRESS 105(69H) ADDRESS 106(6AH) ADDRESS 107(6BH) ADDRESS 108(6CH) ADDRESS 109(6DH) ADDRESS 110(6EH) ADDRESS 111(6FH) ADDRESS 112(70H) ADDRESS 113(71H) ADDRESS 114(72H) ADDRESS 115(73H) ADDRESS 116(74H) ADDRESS 117(75H) ADDRESS 118(76H) ADDRESS 119(77H) ADDRESS 120(78H) ADDRESS 121(79H) ADDRESS 122(7AH) ADDRESS 123(7BH) ADDRESS 124(7CH) ADDRESS 125(7DH) ADDRESS 126(7EH) ADDRESS 127(7FH) 24/27 ¡ Semiconductor MSC7128-xx APPLICATION CIRCUIT ANODE (SEGMENT) Heater Transformer VF Display GRID (DIGIT) MCU +5V VDD DA Output Port VDD CP SEG1 - 36 COM1 - 16 MSC7128-xx CS + – GND TEST TEST VSS STEP COUNT RESET OSCI OSCO R + – VEE C R1 +60V + – ZD 25/27 ¡ Semiconductor MSC7128-xx PACKAGE DIMENSIONS (Unit : mm) SDIP64-P-750-1.78 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin Cu alloy Solder plating 5 mm or more 8.70 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 26/27 ¡ Semiconductor MSC7128-xx (Unit : mm) QFP64-P-1420-1.00-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.25 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 27/27