ONSEMI MBRS410ET3

MBRS410ET3
Preferred Device
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Typical applications are AC−DC and DC−DC converters, reverse
battery protection, and “ORing” of multiple supply voltages and any
other application where performance and size are critical.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
4.0 AMPERES, 10 VOLTS
Features
•
•
•
•
•
•
•
•
•
Very Low VF Accompanied by Low IR
1st in the Market Place with a 10 VR Schottky Rectifier
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Designed for Low Leakage
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Pb−Free Package is Available
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics
AYWW
B4E1G
G
• Case: Epoxy, Molded
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
B4E1
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Ratings:
Machine Model = C
Human Body Model = 3B
ORDERING INFORMATION
MAXIMUM RATINGS
Symbol
Value
Unit
Device
Package
Shipping †
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
10
V
MBRS410ET3
SMC
2500/Tape & Reel
2500/Tape & Reel
Average Rectified Forward Current
(@ TL = 130°C)
IO
4.0
SMC
(Pb−Free)
IFSM
250
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
TJ
−65 to +150
°C
Preferred devices are recommended choices for future use
and best overall value.
Rating
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
MBRS410ET3G
A
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 2
1
Publication Order Number:
MBRS410ET3/D
MBRS410ET3
THERMAL CHARACTERISTICS
Characteristic
Symbol
5 mm x 5 mm
(Note 2)
1 Inch x 1/2 inch
RqJL
12
7.0
RqJA
109
59
VF
TJ = 25°C
TJ = 100°C
0.475
0.500
0.525
0.370
0.395
0.430
TJ = 25°C
TJ = 100°C
50
150
2000
4000
Unit
°C/W
Thermal Resistance,
Junction−to−Lead
Thermal Resistance,
Junction−to−Ambient
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 2.0 A)
(IF = 4.0 A)
(IF = 8.0 A)
Maximum Instantaneous Reverse Current (Note 1)
IR
(Rated dc Voltage, VR = 5.0 V)
(Rated dc Voltage, VR = 10 V)
V
mA
1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
2. Mounted with Minimum Recommended Pad Size, PC Board FR4.
100
25°C
VF @ 125°C
IF, MAXIMUM INSTANTANEOUS
FORWARD CURRENT (A)
IF, INSTANTANEOUS FORWARD
CURRENT (A)
100
−40°C
100°C
10
75°C
1
0.1
VF @ 125°C
25°C
100°C
10
75°C
1
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
0.2
0.3
0.4
0.5
0.6
0.7
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−02
10,000
100°C
1.0E−04
75°C
1.0E−05
25°C
1.0E−06
1.0E−07
25°C
f = 1 MHz
C, CAPACITANCE (pF)
IR, REVERSE CURRENT (A)
IR @ 125°C
1.0E−03
1000
0
2
4
6
8
10
0
2
4
6
8
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
http://onsemi.com
2
10
MBRS410ET3
IF, AVERAGE FORWARD
CURRENT (A)
8
RATED VOLTAGE
APPLIED
RqJL = 12 °C/W
TJ = 125°C
dc
7
6
5
PFO, AVERAGE POWER DISSIPATION (W)
9
SQUARE WAVE
4
3
2
1
0
100
110
120
130
140
150
160
TL, LEAD TEMPERATURE (°C)
3.5
dc
3
TJ = 125°C
2.5
2
SQUARE WAVE
1.5
1
0.5
0
0
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 5. Current Derating, Junction−to−Lead
1
2
3
4
5
6
7
8
9
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 6. Forward Power Dissipation
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 7. Thermal Response, Junction−to−Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.01
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
t, TIME (S)
Figure 8. Thermal Response, Junction−to−Ambient (1 inch pad)
http://onsemi.com
3
MBRS410ET3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403−03
ISSUE E
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
3.00
3.07
0.23
0.30
5.84
6.10
6.86
7.11
7.94
8.13
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
L
L1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
Literature Distribution Center for ON Semiconductor
USA/Canada
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Phone: 81−3−5773−3850
Email: [email protected]
http://onsemi.com
4
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MBRS410ET3/D