MURA260T3 Preferred Device Surface Mount Ultrafast Power Rectifier Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com Features • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (1.2 V Max @ 2.0 A, TJ = 150°C) Pb−Free Package is Available ULTRAFAST RECTIFIER 2 AMPERES, 600 VOLTS Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal SMA CASE 403D PLASTIC Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) MARKING DIAGRAM U5J AYWW G MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current @ TL = 145°C @ TL = 110°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 30 A TJ −65 to +175 °C Characteristic Symbol Value Unit Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) PsiJL (Note 2) RqJA 24 °C/W Operating Junction Temperature Range A 1.0 2.0 Device Code Assembly Location Year Work Week Pb−Free Package Device Package Shipping † MURA260T3 SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel MURA260T3G 216 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. February, 2006 − Rev. 3 = = = = = ORDERING INFORMATION THERMAL CHARACTERISTICS © Semiconductor Components Industries, LLC, 2006 U5J A Y WW G 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MURA260T3/D MURA260T3 ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 2.0 A, TJ = 25°C) (iF = 2.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr Max Unit V 1.45 1.20 mA 5.0 150 75 ns 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. 1000 TJ = 175°C IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT (mA) 100 10 TJ = 100°C 1 0.1 TJ = 25°C TJ = 175°C 100 TJ = 100°C 10 TJ = 25°C 0.01 100 200 300 400 500 1 600 100 200 300 400 500 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.3 0 VR, REVERSE VOLTAGE (VOLTS) IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 0 0.5 0.7 0.9 1.1 1.3 1.5 1.7 10 TC = 175°C 100°C 25°C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.5 0.7 0.9 1.1 1.3 1.5 1.7 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 2 600 1.9 MURA260T3 30 NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF 20 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 25 15 10 5 20 15 10 5 0 8 12 16 20 24 28 32 36 40 0 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance 4 dc 3 SQUARE WAVE 2 1 0 80 8 VR, REVERSE VOLTAGE (VOLTS) 5 60 4 VR, REVERSE VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (A) 4 0 100 140 120 160 180 160 180 0.8 0.7 0.6 SQUARE WAVE 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120 140 TA, AMBIENT TEMPERATURE (°C) Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) 4.5 4 dc 3.5 3 SQUARE WAVE 2.5 2 1.5 1 0.5 0 0.5 40 dc Figure 7. Current Derating, Lead 0 36 1 0.9 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 27 pF 25 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 3 3.5 MURA260T3 PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. HE E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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