RF2189 Preliminary 2 3V, 2.5GHZ LINEAR POWER AMPLIFIER Typical Applications • Commercial and Consumer Systems • PCS Communication Systems • Portable Battery-Powered Equipment • Wireless LAN Systems • Broadband Spread-Spectrum Systems 2 POWER AMPLIFIERS • 2.5GHz ISM Band Applications Product Description 2 The RF2189 is a linear, medium-power, high-efficiency amplifier IC designed specifically for low voltage operation. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in 2.5GHz spread-spectrum transmitters. The device is provided in a 16-pin leadless chip carrier with a backside ground and is self-contained with the exception of the output matching network and power supply feed line. 0.45 0.28 3.75 1 0.80 TYP 0.75 0.50 3.75 1 + 1.60 4.00 12° 1.50 SQ INDEX AREA 3 3.20 0.75 0.65 4.00 1.00 0.90 0.05 0.00 NOTES: 1 Shaded Pin is Lead 1. 2 Dimensions in mm. Dimension applies to plated terminal and is measured between 0.10 mm and 0.25 mm from terminal tip. The terminal #1 identifier and terminal numbering convention 3 shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must be located within the zone indicated. The identifier may be either a mold or marked feature. 4 5 Optimum Technology Matching® Applied ü Si BJT Si Bi-CMOS GaAs HBT GaAs MESFET SiGe HBT Si CMOS Pins 1 and 9 are fused. Package Warpage: 0.05 max. Package Style: LCC, 16-Pin, 4x4 Features GND VCC2 VCC2 VCC1 NC • Single 3.3V Power Supply 1 16 15 14 13 • +25dBm Saturated Output Power • 20dB Small Signal Gain • High Power Added Efficiency Bias Circuits 12 RF OUT GND 2 GND 3 11 RF OUT NC 4 10 NC Functional Block Diagram Rev A4 010424 • 1800MHz to 2500MHz Frequency Range 9 GND 8 VPC 7 NC 6 RF IN NC 5 • Power Down Mode Ordering Information RF2189 RF2189 PCBA 3V, 2.5GHz Linear Power Amplifier Fully Assembled Evaluation Board RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com 2-249 RF2189 Preliminary Absolute Maximum Ratings Parameter POWER AMPLIFIERS 2 Supply Voltage Power Control Voltage (VPC) DC Supply Current Input RF Power Operating Ambient Temperature Storage Temperature Moisture sensitivity Parameter Rating Unit -0.5 to +6.0 -0.5 to 3.3 350 +12 -40 to +85 -40 to +150 JEDEC Level 3 VDC V mA dBm °C °C Specification Min. Typ. Max. Refer to “Handling of PSOP and PSSOP Products” on page 16-15 for special handling information. Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Unit T=25 °C, VCC =3.3V, VPC =3.0V, PIN =0dBm, Freq=2450MHz Overall Frequency Range Maximum Saturated Output Power Efficiency at Max Output Power Small Signal Gain Reverse Isolation Condition +23 1800 to 2500 +24 Second Harmonic 42 20 30 30 -50 IM3 IM5 IM7 Isolation Input Impedance Input VSWR Noise Figure -30 -35 -48 -30 50 2:1 7 19 -20 +26 MHz dBm % dB dB dB dBc -23 -30 -35 dBm dBm dBm dBm Ω PIN =+6dBm In “ON” state In “OFF” state Including second harmonic trap, see application circuit POUT =+17dBm in each tone POUT =+17dBm in each tone POUT =+17dBm in each tone In “OFF” state, PIN =0dBm dB Power Down Power Control “ON” 2.7 Power Control “OFF” PC Input Impedance 0 3.0 V 0.5 V Voltage supplied to control input; device is “ON” Voltage supplied to control input; device is “OFF” kΩ 5 Power Supply Operating Voltage Current Consumption 180 95 50 Current Consumption 2-250 3.0 to 5.0 260 150 320 175 V mA mA 100 <1 150 10 mA µA Power Down “ON”, at max output power Power Down “ON”, two-tone test +20dBm average output power Idle current Power Down “OFF” Rev A4 010424 RF2189 Preliminary Function GND 2 3 4 5 6 GND GND NC NC RF IN 7 8 NC PC Description Interface Schematic Ground connection. Keep traces physically short and connect immediately to ground plane for best performance. Same as pin 1. Same as pin 1. Not connected. 2 Not connected. RF input. This input is DC coupled, so an external blocking capacitor is required if this pin is connected to a DC path. Not connected. See pin 1. Power control pin. For maximum power this pin should be 3.3V. A higher voltage is not recommended. For less output power and reduced idle current this voltage may be reduced. VCC1 500Ω PC 9 GND 10 11 NC RF OUT 12 13 14 RF OUT NC VCC1 15 VCC2 To RF Stages Ground connection. Keep traces physically short and connect immediately to ground plane for best performance. Not internally connected. RF output and bias for the output stage. The power supply for the output transistor needs to be supplied to this pin. This can be done through a quarter-wave length microstrip line that is RF grounded at the other end, or through an RF inductor that supports the required DC currents. Same as pin 11. RF OUT See pin 11. Not connected. Power supply pin for the bias circuits. External low frequency bypass capacitors should be connected if no other low frequency decoupling is nearby. Bias supply pin for the first stage. A small tuning capacitor is required to set the desired frequency response. External low frequency bypass capacitors should be connected as shown in the application schematic if no other low frequency decoupling is nearby. See pin 5. VCC2 RF IN BIAS 16 Pkg Base VCC2 GND Rev A4 010424 Connected internally to pin 15. See pin 15. Ground connection. The backside of the package should be connected to the ground plane through a short path, i.e., vias under the device may be required. See pin 1 and 6. 2-251 POWER AMPLIFIERS Pin 1 RF2189 Preliminary Evaluation Board Schematic (Download Bill of Materials from www.rfmd.com.) C8 10 nF C2 1 nF VCCT 2 VCC POWER AMPLIFIERS L2 1 kΩ Ferrite C7 1 µF C30 9 pF C26 100 pF C6 10 pF 1 16 2 15 14 13 Bias Circuits 12 11 4 10 6 7 8 C4 22 pF 50 Ω µstrip 3 5 L1 3.3 nH C1 2.2 pF C3 15 pF 9 P1 P1-1 C13 10 nF C5 15 pF C15 22 uF 50 Ω µstrip J2 RF OUT 1 P2 VPC 2 P1-4 P1-5 P2-2 3 GND 4 VCC 5 VCC 1 GND 2 VPC CON2 CON5 J1 RF IN VPC 2-252 Rev A4 010424 RF2189 Preliminary Evaluation Board Layout Board Size 2.0” x 2.0” Board Thickness 0.031”; Board Material FR-4 POWER AMPLIFIERS 2 Rev A4 010424 2-253 RF2189 Preliminary POWER AMPLIFIERS 2 2-254 Rev A4 010424