LH1514AB/AAC/AACTR 2 Form A Solid State Relay High Frequency FEATURES • • • • • • • • • • • • Package Dimensions in Inches (mm) Load Voltage, 15 V Load Current, 150 mA Switching Capability up to 50 MHz Blocking Capability Dependent upon Signal dv/dt Low and Typical RON 5.0 Ω 1.0 ms Actuation Time Low Power Consumption 3750 VRMS I/O Isolation Balanced Switching Linear AC/DC Operation Clean, Bounce-free Switching Surface-mountable DIP pin one ID 4 3 • UL – File No. E52744 • CSA – Certification 093751 • VDE 0884 Approval 5 6 Part Identification Part Number Description LH1514AB 8-pin DIP, Tubes LH1514AAC 8-pin SMD, Gullwing, Tubes LH1514AACTR 8-pin SMD, Gullwing, Tape and Reel Document Number: 83814 Revision 17-August-01 7 S1' S2 S2' 8 7 6 5 .045 (1.14) .030 (0.76) S1 S1' S2 S2' 8 1 .390 (9.91) .379 (9.63) 2 3 4 .300 (7.62) .031 (0.79) typ. 4° typ. .150 (3.81) .130 (3.30) .050 (1.27) 10° .035 (.89) .020 (.51) .250 (6.35) .230 (5.84) 3°–9° .012 (.30) .008 (.20) .100 (2.54) typ. .130 (3.30) .110 (2.79) SMD Pin one I.D. APPLICATIONS • Protection Switching (T1 sparing) – Digital Access Cross Connects – D-type Channel Breaks – Intraoffice Data Routing • Transmission Switching – T1 Multiplexing – DSO (64 Kbits/s) – DS1 (1.544 Mbits/s) – E1, DS1A (2.048 Mbits/s) – DS1C (3.152 Mbits/s) – DS2 (6.312 Mbits/s) • Instrumentation – Scanners – Testers – Measurement Equipment • See Application Note S1 .268 (6.81) .255 (6.48) .022 (.56) .018 (.46) AGENCY APPROVALS 1 2 .268 (6.81) .255 (6.48) .390 (9.91) .379 (9.63) .045 (1.14) .030 (0.78) 4° typ. .050 (1.27) typ. .031 (.79) typ. .150 (3.81) .130 (3.30) Radius .008 (.25) .004 (.10) .040 (1.02) .020 (.51) .100 (2.54) typ. .395 (10.03) .375 (9.52) .312 (7.80) .298 (7.52) 10° .315 (8.00) typ. 3° to 7° .010 (2.54) typ. DESCRIPTION The LH1514 is a DPST normally open (2 Form A) SSR that can be used in balanced high-frequency applications like T1 switching. With its low ON-resistance and high actuation rate, the LH1514 is also very attractive as a general-purpose 2 Form A SSR for balanced signals. The relays are constructed using a GaAlAs LED for actuation control and an integrated monolithic die for the switch output. The die, fabricated in a dielectrically isolated Smart Power BiCMOS, is comprised of a photodiode array, switch control circuitry, and NMOS switches. In balanced switching applications, internal circuitry shunts high-frequency signals between two poles when the SSR is off. This balanced T termination technique provides high isolation for the load. www.vishay.com 3–72 Absolute Maximum Ratings, TA=25°C Recommended Operating Conditions Parameter Sym. Min. Typ. Max. Unit LED Forward Current for Switch Turn-on (TA=–40°C to +85°C) IFon 10 — 20 mA Stresses in excess of the Absolute Maximum Ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to maximum rating conditions for extended periods can adversely affect device reliability. Ambient Operating Temperature Range, TA .................. –40° to +85°C Storage Temperature Range, Tstg ................................ –40° to +150°C Pin Soldering Temperature, t=10 s max, TS ................................ 260°C Input/Output Isolation Voltage, VISO .....................................3750 VRMS LED Input Ratings: Continuous Forward Current, IF...............................................50 mA Reverse Voltage, IR≤10 µA, VR ...................................................10 V Output Operation: dc or Peak ac Load Voltage, IL≤1.0 µA, VL ................................15 V Continuous dc Load Current, IL Each Pole, Two Poles Operating Simultaneously .................150 mA Power Dissipation, PDISS ..........................................................600 mW Electrical Characteristics, TA=25°C Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Parameter Symbol Min. Typ. Max. Unit Test Condition LED Forward Current, Switch Turn-on IFon — 2.0 5.0 mA IL=100 mA, t=10 ms LED Forward Current, Switch Turn-off IFoff 0.2 1.8 — mA VL=±10 V LED Forward Voltage VF 1.15 1.26 1.45 V IF=10 mA ON-resistance RON 2.0 3.0 5.0 Ω IF=10 mA, IL=±50 mA Pole-to-pole ON-resistance Matching (S1 to S2) — — 0.2 1.0 DΩ IF=10 mA, IL=±50 mA Output Off-state Bleed-through* — — 70 100 mVpeak f=1.5 MHz square wave tr/tf=5.0 ns (See Figure 13.) Output Off-state Leakage — — 3x10–12 200x10–9 A 20x10–12 1.0x10–6 A Output Off-state Leakage Pole to Pole — — 1.0 5.0 µA IF=0 mA, VL=±5.0 V VL=±15 V IF=10 mA Pins 7, 8 ±3.0 V Pins 5, 6 Gnd Output Capacitance Pins 5 to 6, 7 to 8 — Pole-to-pole Capacitance (S1 to S2) — — 2.0 50 µA Pins 7, 8 ±15 V Pins 5, 6 Gnd — 20 — pF IF=0 mA, VL=0 — — 20 50 — — pF pF IF=0 mA, VL=0 V IF=10 mA, VL=0 V Turn-on Time ton — 0.4 1.0 ms IF=10 mA, IL=20 mA Turn-off Time toff — 0.6 1.0 ms IF=10 mA, IL=20 mA * Guaranteed by component measurement during wafer probe. Document Number: 83814 Revision 17-August-01 www.vishay.com 3–73 Typical Performance Characteristics Figure 1. LED Forward Current for Switch Turn-on/off Figure 4. Breakdown Voltage Distribution Typical 3.5 100 IL=100 mA n=180 80 3.0 60 2.5 % LED Forward Current (mA) 4.0 2.0 40 1.5 20 1.0 0.5 –40 0 –20 0 20 40 60 10 80 15 Ambient Temperature (°C) 30 Figure 5. Output Isolation 25 100 VP=10 V RL=50 Ω 20 80 Isolation (dB) Leakage Current (pA) 25 Breakdown Voltage (V) Figure 2. Leakage Current vs. Applied Voltage 15 10 5 60 40 20 0 105 0 0 4 8 12 16 20 106 107 108 Frequency (Hz) Applied Voltage (V) Figure 3. ON-Resistance vs. Temperature Figure 6. Insertion Loss (per Pole) vs. Frequency 8 0.5 6 0.4 4 Insertion Loss (dB) Change in On-resistance (%) Normalized to 25°C 20 2 0 –2 0.3 0.2 0.1 –4 –6 –40 RL=90 Ω –20 0 20 40 Ambient Temperature (°C) Document Number: 83814 Revision 17-August-01 60 80 0 10 2 10 4 106 108 Frequency (Hz) www.vishay.com 3–74 Figure 9. ton/toff vs. Temperature Figure 7. ton vs. LED Forward Current 1.1 10 toff IL=20 mA 1.0 Turn-on/off Time (ms) Turn-on Time (ms) 8 85°C 6 25°C 4 –40°C 2 0.9 0.8 0.7 0.6 0.5 ton 0.4 0 0 10 20 30 40 0.3 –40 50 0 –20 60 80 Ambient Temperature (°C) LED Forward Current (mA) Figure 10. toff vs. LED Forward Current Figure 8. Bleed-through Voltage vs. Rise Time 1.2 100 IL=20 mA –40°C 1.0 80 Turn-off Time (ms) Peak Bleedthrough Voltage (mV) 40 20 60 40 0.8 25°C 0.6 85°C 0.4 20 0.2 0 0 5 10 15 20 Rise Time (ns) Document Number: 83814 Revision 17-August-01 25 30 0 10 20 30 40 50 LED Forward Current (mA) www.vishay.com 3–75 Figure 11. Pin Diagram and Pin Outs Functional Description Figure 12 shows the switch characteristics of the relay. The relay exhibits an ON-resistance that is exceptionally linear up to the knee current (IK). Beyond IK, the incremental resistance decreases, minimizing internal power dissipation. CONTROL + 1 CONTROL + 2 8 S1 7 S1' DPST In a 2 Form A relay, to turn the relay on, forward current is applied to the LED. The amount of current applied determines the amount of light produced for the photodiode array. This photodiode array develops a drive voltage for both NMOS switch outputs. For high-temperature or high-load current operations, more LED current is required. CONTROL– 3 6 S2 BLANK 4 5 S2' Figure 12. Typical ON Characteristics For high-frequency applications, the LH1514 must be wired as shown in the Figure 15 application diagram to minimize transmission crosstalk and bleed-through. A single LH1514 package switches a single transmit twisted pair or a single receive twisted pair. In this configuration when the SSR is turned off, the SSR parries high-frequency signals by shunting them through the SSR, thereby isolating the transformer load. +I 150 mA IL(max) 4.0 Ω IK 60 mA When switching alternate mark inversion (AMI) coding transmission, the most critical SSR parameter is dv/dt bleedthrough. This bleed-through is a result of the rise and fall time slew rates of the 3.0 V AMI pulses. The test circuit in Figure 13 illustrates these bleed-through glitches. It is important to recognize that the transmission limitations of the LH1514 are bleed-through related and not frequency related. The maximum frequency the LH1514 SSR can switch will be determined by the pulse rise and fall times and the sensitivity of the receive electronics to the resultant bleed-through. 5.0 Ω –0.3 V 0.3 V –V IK IL(max) +V –60 mA –150 mA At data rates above 2.0 Mbits/s, the 50 pF pole-to-pole capacitance of the LH1514 should be considered when analyzing the load match to the transmission line. Please refer to the T1 Switching with the LH1514 SSR Application Note for further information on load-matching and off-state blocking. –I Test Circuit Figure 13. Off-state Bleed-through tr 5.0 ns tf 5.0 ns NC 1 8 NC 2 7 50 Ω* 3.0 V NC 3 6 NC 4 5 f = 1.5 MHz 100 mV max 100 mV max * 50 Ω load is derived from T1 applications where a 100 Ω load is paralleled with a 100 Ω line. Document Number: 83814 Revision 17-August-01 www.vishay.com 3–76 Applications Figure 14. Protection Switching Application: T1 Interface Operating; Spare in Test Loopback Mode T1 INTERFACE 1 INTERFACE SPARE LH1514 LH1514 LH1514 LH1514 LH1514 LH1514 INTERFACE 2 (ETC.) LH1514 LH1514 LH1514 T1 LINE 1 Figure 15. T1 Multiplexer Receive Data (Interface 1, Operating) Features LH1514 1:2 100 Ω Z0 164 Ω 800 Ω RECEIVE DATA 90 Ω INTERFACE 1 LINE INTERFACE LH1514 1:2 164 Ω Document Number: 83814 Revision 17-August-01 800 Ω INTERFACE 2 www.vishay.com 3–77