SEME-LAB IRF9240-SMD

IRF9240
IRF9240–SMD
MECHANICAL DATA
25.15 (0.99)
26.67 (1.05)
P–CHANNEL
POWER MOSFET
6.35 (0.25)
9.15 (0.36)
10.67 (0.42)
11.18 (0.44)
1.52 (0.06)
3.43 (0.135)
1
2
22.23
(0.875)
max.
0.97 (0.060)
1.10 (0.043)
16.64 (0.655)
17.15 (0.675)
29.9 (1.177)
30.4 (1.197)
38.61 (1.52)
39.12 (1.54)
D
G
S
3
(case)
3.84 (0.151)
4.09 (0.161)
7.92 (0.312)
12.70 (0.50)
FEATURES
TO–3 Package
Pin 1 – Gate
Pin 2 – Source
2
7 (0
8 (0
8 (0
8 (0
• AVAILABLE IN TO-3 (TO-204AA) AND
CERAMIC SURFACE MOUNT PACKAGES
1 6 .0 2 (0 .6 3 1 )
1 5 .7 3 (0 .6 1 9 )
4 .1 4 (0 .1 6 3 )
3 .8 4 (0 .1 5 1 )
• HIGH VOLTAGE
3 .6 0 (0 .1 4 2 )
M a x .
3
9 .6
9 .3
1 1 .5
1 1 .2
.3 8
.3 6
.4 5
.4 4
1 )
9 )
6 )
4 )
0 .5 0 (0 .0 2 0 )
0 .2 6 (0 .0 1 0 )
SMD1
Pin 1 – Gate
• P–CHANNEL POWER MOSFET
• INTEGRAL PROTECTION DIODE
1
1 0 .6 9 (0 .4 2 1 )
1 0 .3 9 (0 .4 0 9 )
0 .7 6
(0 .0 3 0 )
m in .
0 .8 9
(0 .0 3 5 )
m in .
3 .7 0 (0 .1 4 6 )
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
3 .4 1 (0 .1 3 4 )
Pin 3 – Drain
Pin 2 – Source
Note: IRFNxxxx also available with
pins 1 and 3 reversed.
Pin 3 – Drain
TO–3
— TO–3 (TO–204AA) Metal Package
TO–220 SM — TO–220 Ceramic Surface Mount Package
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
VDSS
VDGR
VGS
ID
IDM
PD
ILM
Tj
Tstg
Semelab plc.
Drain – Source Voltage
Drain – Gate Voltage (RGS = 20KW)
Gate – Source Voltage
Continuous Drain Current
@ Tcase = 25°C
@ Tcase = 100°C
Pulsed Drain Current
Max. Power Dissipation
@ Tcase = 25°C
Linear Derating Factor
(TO 3 package only)
Inductive Current , Clamped
Operating Junction and
(TO 3 package only)
Storage Temperature Range
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: [email protected]
Website: http://www.semelab.co.uk
–200V
–200V
±20V
–11A
–7.0A
–44A
125W
1W / °C
–44A
–55 to 150°C
Prelim. 7/00
IRF9240
IRF9240–SMD
ELECTRICAL RATINGS (Tcase = 25°C unless otherwise stated)
BVDSS
Characteristic
Drain – Source Breakdown Voltage
VGS(TH)
Gate Threshold Voltage
IGSS
IDSS
Test Conditions
VGS = 0V , ID = –250mA
VDS = VGS , ID = –250mA
Min.
–200
Typ.
–2
–100
nA
VGS = 20V
100
nA
VDS = Max. Rating , VGS = 0V
–250
mA
–1000
mA
On State Drain Current 1
Static Drain – Source On-State Resistance
Forward Transconductance 1
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer capacitance
Qg
Total Gate Charge
Qgs
Gate – Source Charge
Qgd
Gate – Drain (“Miller”) Charge
td(on)
Turn–on Delay Time
td(off)
tf
V
VGS = –20V
gfs
tr
–4
Gate – Source Leakage Current (reverse)
VDS = 0.8 x Max. Rating
VGS = 0V , Tcase = 125°C
RDS(ON)
Unit
V
Gate – Source Leakage Current (forward)
Zero Gate Voltage Drain Current
ID(ON)
Max.
Rise Time
Turn-off Delay Time
Fall Time
VDS > ID(ON) x RDS(ON) Max
VGS = –10V
–11
VGS = –10V , ID = –6A
VDS > ID(ON) x RDS(ON) Max
ID = –6A
A
0.35
4
0.5
6
S
VGS = 0V
1100
1300
VDS = –25V
375
450
f = 1MHz
150
250
VGS = –15V
70
90
ID = –22A
55
VDS = 0.8 x Max. Rating
15
VDD = 0.5 x BVDSS
ID = –6A
ZO = 4.7W
W
pF
nC
20
30
10
15
12
18
8
12
ns
LD
Internal Drain Inductance
5.0
nH
LS
Internal Source Inductance
12.5
nH
THERMAL CHARACTERISTICS
Characteristic
RqJC
Junction to Case
RqCS
Case to Sink
RqJA
Junction to Ambient
TL
Max. Lead Temperature 0.063 ” from case for 10 sec.
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic
Continuous Source Current (Body Diode)
IS
I
Pulsed Source Current1 (Body Diode)
Min.
Typ.
(TO-3 package only)
(TO-3 package only)
0.1
Diode Forward Voltage2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
°C/W
30
(TO-3 package only)
Test Conditions
300
Min.
Typ.
VGS = 0V , IS = – 11A
Max.
–11
–4.6
Tcase = 25°C
IF = –11A , dlF / dt = 100A/ms
Tj = 150°C
IF = –11A , dlF / dt = 100A/ms
Tj = 150°C
°C/W
°C
–44
SM
VSD
Max. Unit
1.0 °C/W
Unit
A
V
270
ns
2.0
mC
1) Pulse Test: Pulse Width < 300mS , Duty Cycle £ 2%
2) Repetitive Rating: Pulse Width limited by maximum junction temperature.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: [email protected]
Website: http://www.semelab.co.uk
Prelim. 7/00