SHARP LH531000B-S

LH531000B-S
CMOS 1M (128K × 8) 3 V-Drive MROM
FEATURES
DESCRIPTION
• 131,072 words × 8 bit organization
The LH531000B-S is a mask-programmable ROM
organized as 131,072 × 8 bits. It is fabricated using
silicon-gate CMOS process technology.
• Access time: 500 ns (MAX.)
• Power consumption:
Operating: 64.8 mW (MAX.)
Standby: 108 µW (MAX.)
• Mask-programmable control pin:
Pin 20 = CE/OE/OE
• Static operation
• Three-state outputs
• Low power supply: 2.6 V to 3.6 V
• Package: 28-pin, 450-mil SOP
PIN CONNECTIONS
28-PIN SOP
TOP VIEW
A15
1
28
VCC
A12
2
27
A14
A7
3
26
A13
A6
4
25
A8
A5
5
24
A9
A4
6
23
A11
A3
7
22
A16
A2
8
21
A10
A1
9
20
CE/OE/OE
A0
10
19
D7
D0
11
18
D6
D1
12
17
D5
D2
13
16
D4
GND
14
15
D3
531000BS-1
Figure 1. Pin Connections for DIP Package
1
LH531000B-S
CMOS 1M MROM
A16 22
A15 1
A14 27
A13 26
A10 21
A9 24
A8 25
A7 3
A6 4
A5 5
MEMORY
MATRIX
(131,072 x 8)
ADDRESS DECODER
ADDRESS BUFFER
A12 2
A11 23
A4 6
A3 7
A2 8
COLUMN SELECTOR
A1 9
A0 10
SENSE AMPLIFIER
CE
BUFFER
TIMING
GENERATOR
CE/OE/OE 20
OE
BUFFER
OUTPUT BUFFER
28
14
VCC GND
11
D0
12
D1
13
D2
15
D3
16
D4
17
D5
18
D6
19
D7
531000BS-2
Figure 2. LH531000B-S Block Diagram
PIN DESCRIPTION
SIGNAL
A0 – A16
D0 – D7
CE/OE/OE
PIN NAME
NOTE
Address input
1
PIN NAME
VCC
Power supply
(2.6 V to 3.6 V)
GND
Ground
Data output
Chip Enable input or
Output Enable input
NOTE:
1. Active level of CE/OE/OE is mask-programmable.
2
SIGNAL
NOTE
CMOS 1M MROM
LH531000B-S
TRUTH TABLE
CE
OE/OE
MODE
SUPPLY CURRENT
H
–
High-Z
Standby
L
–
Output
Operating
–
L/H
High-Z
–
H/L
Output
Operating
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
UNIT
Supply voltage
VCC
–0.3 to +7.0
V
Input voltage
VIN
–0.3 to VCC + 0.3
V
Output voltage
VOUT
–0.3 to VCC + 0.3
V
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
– 65 to +150
°C
RECOMMENDED OPERATING CONDITIONS (TA = 0°C to +70°C)
PARAMETER
SYMBOL
MIN.
VCC
2.6
Supply voltage
TYP.
MAX.
UNIT
3.6
V
DC CHARACTERISTICS (VCC = 2.6 V to 3.6 V, TA = 0°C to +70°C)
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Input ‘Low’ voltage
VIL
–0.3
0.4
V
Input ‘High’ voltage
V IH
0.8 × VCC
VCC + 0.3
V
0.4
V
NOTE
Output ‘Low’ voltage
VOL
I OL = 400 µA
Output ‘High’ voltage
VOH
I OH = –100 µA
Input leakage current
| ILI |
V IN = 0 V to VCC
10
µA
Output leakage current
| ILO |
V OUT = 0 V to VCC
10
µA
1
2
0.8 × VCC
V
Operating current
ICC
t RC = 500 ns
18
mA
Standby current
ISB
CE = VCC – 0.2 V
30
µA
Input capacitance
CIN
f = 1 MHz
T A = 25°C
10
pF
10
pF
Output capacitance
COUT
NOTE:
1. CE/OE = VIH, OE = VIL
2. Outputs open
AC CHARACTERISTICS (VCC = 2.6 V to 3.6 V, TA = 0°C to +70°C)
PARAMETER
SYMBOL
MIN.
500
MAX.
UNIT
Read cycle time
tRC
Address access time
tAA
500
ns
Chip enable access time
tACE
500
ns
Output enable delay time
tOE
200
ns
Output hold time
tOH
CE to output in High-Z
tCHZ
OE to output in High-Z
tOHZ
NOTE
ns
10
ns
150
ns
1
ns
NOTE:
1. This is the time required for the output to become high-impedance.
3
LH531000B-S
CMOS 1M MROM
AC TEST CONDITIONS
PARAMETER
RATING
Input voltage amplitude
Input rise/fall time
0.4 V to (0.8 × VCC) V
10 ns
Input/output reference level
Output load condition
1.5 V
1TTL + 100 pF
CAUTION
To stabilize the power supply, it is recommended that a high-frequency bypass capacitor be connected between
the VCC pin and the GND pin.
tRC
A0 - A16
tAA
(NOTE)
CE
tACE
tCHZ
(NOTE)
OE
OE
tOHZ
tOE
(NOTE)
D0 - D 7
tOH
DATA VALID
NOTE: The output data becomes valid when the last
intervals, tAA, tACE, or tOE, have concluded.
Figure 3. Timing Diagram
4
531000BS-3
CMOS 1M MROM
LH531000B-S
PACKAGE DIAGRAM
28SOP (SOP028-P-0450)
0.50 [0.020]
0.30 [0.012]
1.27 [0.050]
TYP.
1.70 [0.067]
28
15
8.80 [0.346]
8.40 [0.331]
1
12.40 [0.488]
11.60 [0.457]
10.60 [0.417]
14
1.70 [0.067]
0.20 [0.008]
0.10 [0.004]
18.20 [0.717]
17.80 [0.701]
0.15 [0.006]
1.025 [0.040]
2.40 [0.094]
2.00 [0.079]
0.20 [0.008]
0.00 [0.000]
1.025 [0.040]
DIMENSIONS IN MM [INCHES]
MAXIMUM LIMIT
MINIMUM LIMIT
28SOP
28-pin, 450-mil SOP
ORDERING INFORMATION
LH531000B
Device Type
N
Package
-S
Low-Voltage Operation
28-pin, 450-mil SOP (SOP028-P-0450)
CMOS 1M (128K x 8) Mask-Programmable ROM
Example: LH531000BN-S (CMOS 1M (128K x 8) Mask-Programmable ROM, Low-Voltage Operation,
28-pin, 450-mil SOP)
531000BS-4
5