DG-001019 PREPARED BY: SHAR!FW$~~~~~;~., APPROVED BY: ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION Jan/19/00 ‘. . 13 pages .: ‘-*+E’~SE~~T~ DMSION: .\.\” ;r y ,o’:.>.r.b\, optbE~~~~~c~e\i~ion -...,b? :;” !,f&%\ \ DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. LTlE9OA / 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting kom use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers I [ If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in fimction and precision, such as ; * Transportation control and safety equipment (aircraft, train automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment I [ l Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) I * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 1 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMERS APPROVAL - DATE: BY: Department General Manager of Engineering Dept.,IB Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION 1. Application This specification applies to the light emitting diode device Model No. LTlESOA. [GaP(Yellow-green)cbip LED device] 2. Outline dimensions and terminal cormecti~n~ . ..-..............-....Refer to the attachedsheetPage2. 3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-5. 3- 1.Absolutemaximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. CharacteristicsDiagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Referto the attachedsheetPage6. 4- 1. Test itemsandtest conditions 4-2. Failurejudgementcriteria 5. Incominginspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Referto the attachedsheetPage7. 5-I. hrspectionmethod 5-2. Descriptionof inspectionandcriteria 6. Taping specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.......*.....* 6-1. Taping 6-2. Packingspecification 6-3. Label 6-4. Luminousintensityrank Refer to the attachedsheetPage8-10. 7. Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage Il. 7- 1. Reflow soldering 8 Precautionsforuse............................................... Refer to the attachedsheetPage 12. 8-1. Precautionsmattersfor designingcircuit 8-2. Cleaningmethod 9 Environment..................................................... 9-l. Ozonospheredestructivechemicals. 9-2. Bromic non-burningmaterials Referto the attachedsheetPage 12. 2. Outline dimensions and terminal connections 3. 6 Cathcde mark(blacti n cc -6 . t Terminal ,I;x connection O-Anode oc athode 0-Q unit mm PW: Resin: Material Glass-Epoxy Epoxy Finish Drawing No. Au Plated 51201002 3. Ratings and characteristics (Notel) Duty ratio=l/lO,Pulse width=O.lms (Note2) Manual soldering Max3s (Note 3)Measured by SHARP EG&G MODEL550(Radiometer/Photometersyste- (Tolerance : f 15%) 3-3. Derating Curve Peak Forward Current Derating Curve Forward Cm-rent Derating Curve 60 $ 60 j 50 E 40 E 6 30 -$j 20 2 g 10 +i k 0 -25 0 25 50 7565100 0 -25 125 Ambient Temperature Ta(“C) 0 25 50 7565100 125 Ambient Temperature Ta(%) Peak Forward Current vs. Duty Ratio (Ta=259c) I l/loo l/10 Duty Raito 1 10 I 34. Characteristics Diagram(typ) (Note I) Forward Current vs.Forward Voltage Relative Luminous Intensity vs. Ambient Temperature IIF=2omAI CTa=250C) loo0 Q @ .2 E Y 2 loo 0 .c E 3 8 2 3 3 1 1.2 1.4 1.6 1.6 2 2.2 2.4 Forward Voltage VF(V) R&he, Luminous Iitedy -a!. Forward 1ol""""""""" -60 -40 -20 0 20 40 60 80 Ambient Temprature Ta(“C) CmmB Cla=250C) 1000% Forward Current IF(mA) (Note 1) Above characteristic data are typical data and not a guarantteed data. 100 120 4. Reliability The reliability of products shall be satisfied with items listed below. Confidence level: 90% 4- 1. Test items and test conditions I Test items Test conditions I temperature cycling -25”c(3Omin)-+lOO”c(3Omin),3Otimes I n=22, c=o 10 High temp. and high humidity storage Ta=+60”C, 9O%RH, t-500h n=22, c=o 10 High temperature storage Ta=lOO”C,t=SOOh n=22, c=o 10 Low temperature storage Ta=-25”C,t-500h I n=22, c=o 10 n=22, C=O 10 n=ll, C=O 20 n=ll, C=O 20 n=ll, c=O 20 Operating test Mechanical shock Variable f?equency vibration Soldering heat Ta=25”C,I,=30mA,t=50Oh 15 ooom/s2, o.sms, 3times I *X&Y+Z direction 200m/s2, 100-2 000-IOOHAsweepfor I 4times/*X.*Y.*Z direction Refer to the attached sheet, Page 11/12 ltimes 4min., 4-2. Failure judgement criteria * 1 Parameter Symbol Forward voltage VF VF > u&L. Reverse current IR IR > U.S.L. x 2.0 Luminous intensity Iv The Grst stage value X 0.5 > Iv * 1: Meas+g condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. Failure judgement criteria *2 x 1.2 5. Incoming inspection 5- 1. Inspection method A single sampling plan, normal inspection level S4 based on IS0 2859-l shall be adopted. 5-2. Description of inspection and criteria JO. Inspection items Criteria 1 Radiation color Not correct 2 Taping Product inserted in reverse direction 3 Solderability 1 Plating abnormality observed over 50% or greater percentage * 1 4 Electra-optical characteristics Not conforming to, the specification 5 Outline dimensions Not conforming to the specification 6 Appearance Dust : @0.8mm or more Defect AQL Major defect 0.1% Minor defect 0.4% Thread dust : 2Smm or more in length and 0.25mm or more in width Air bubbles : 4 0.8mm or more Scratch : 2.5mm or more in length and 0.25mm or more in width However&e product is qualified as a good unit if the scrach does not touch the Auwire.when seen from the front. Resin barr : Over the unspecified tolerance Resin ond plated crack :0.3mrn or more 7 Solderability 2 could solder 50% or greater and less than 90% out of judgement area * 1 . _ 6-l .Taping 6-I-l.Shape and dimension of tape(TYP.) ension exe 6-I-2.Shape and dimension of reel(TYP.) Parameter Symbol ~Dimaasio~/ Remarks 6-l-3 .Taping specification (2) Cover tapestrengthagainstpeeling:F=O.l-UN( 6 =lOOorless) Cover tape t <- ’ Forward Carrier ‘Tape speed : 5mm/s tape (3) Tapestrengthagainstbending: The radiusof bendingcircle shouldbe30mmor more. If it is lessthan3Omm,the cover may peel. There shouldnot bejoint of cover tape or carrier tape. (4) Jointing of tape: Average 3,OOOpcs. per reel (5) Quantity per reel: Average 0.02gI product (6) Massper product: Average 15OgI packing (7)Massper packing: (8) Others: @ There shouldnot be missingabovecontinuousthree products. @ Productsshouldbe easilytakenout. @ Productsshouldnot be attachedto the cover tapeat peeling. 6-2. Packingspecification 6-2-l. Dampproofpackage In other to avoid the absorptionof humidity in transportandstorage, the productsare packed in aluminumsleeve. Label 6-2-2.Strage conditions Temperature : 5 to 30°C Humidity : less than 6O%RH 6-2-3.Treatmentafter opening (1) Pleasemakea solderingwithin 15 daysafter openingunderfollowing condition; Temperature: 5 to 30°C Humidity : lessthan6O%RH (2) In casethe devicesare not usedfor a longtime after opening,tbe storagein dry box is recommendable. Or it isbetter to repackthe deviceswith a desiccativeby tbe sealerandput them in the somestorage conditionsas6-2-2. Then they shouldbe usedwithin 15 days. (3) Pleasemakea solderingafter a following bakingtreatmentif unusedterm shouldbe over the conditionsof (2) *Recommendable conditions: 0 in taping Temprature:60”Cto 65”C,Time:36to 48 hours @ in individual (on PWB or metallictray) Temprature:100°Cto1200C ,Time:2to 3 hours - Model number - Quantityofproducts PART No. + EL4J C-3 Bar code - Lot m&ber(Notel) and Luminous rank 3T No.IW9819 - Production Cm@’ (Note l)Lot number indication 0 Production plant code(to be indicated alphabetically) @ Prod&ion lot(smgle or double figures) @ Year of production(the last two figures of the year) @ Month of production (to be indicated alphabetically with January corresponding to A) @ Date of production(0 l-3 1) 64Luminous intensity rank (Note2) (Note3) I A B C D I I J 1 1 Luminous intensity 13.6 22.1 16.3 265 19.6 31.7 23.5 38.2 58.5 70.2 - Unit ,!Ta=25”C) Condition mcd Ir=2OmA 95.0 (114.0) (Tolerance : f 15%) (Note 2) Not ask the delivery ratio of each rank. (Note 3) In case of the distribution of the hrminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. L 7- 1Jteflow soldering (1) It is not recommended to exceed the soldering temperature and time shown below. Caused by substrate- bend or the other mechanical stress during reflow soldering may happen Au wire disconnection etc. Therefore please check and study your solder reflow machine’s beat condition. (2) Reflow soldering temper&u-e profile to be done under the following condition. Time(s) Recommendable Thermal Model (3) Recommendable Metal Mask pattern for screen print Recommend OSmm to 0.7mm thickness metal mask for screen print. Caused by solder reflow condition, solder paste, substrate and the other material etc., may change solderability. Please check and study actual solderability before usage. Center / -. of the product ._ w c\i J * - 1.75 - & 2 0 - _ 1.75 ~ I -- Recommended soldar pattern (U&mm) I Jad19IOO 8. Precautions for use 8- 1. Precautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant 8-2. Cleaning method Please use only the following types of solvenL”water” Recommend conditions: RT. 4OkHz,3OW/l, time is less than 3 minutes Please check the effect on the product from ultrasonic bath, ultrasonic output, duration, board size method. and product mounting Please test the cleaning method under actual conditions and check for abnormalities before actual use. 9. Enviromnent 9- 1. Ozonosphere destructive chemicals. (1) The product doesn’t contain following substance. (2) The product doesn’t have a production line whose process requires following substance. Restricted part: CFCs,haloneqCCl.+Trichloroethane(Methychloroform) 9-2. Bromic non-burning materials The product doesn’t contain bromic non-burning materials(PBBOs,PBBs) LT1E90A, surface mount, yellow-green, 3 mm x 3 mm, 670 nm, chip LED