® SP2209E High ESD Dual Port RS-232 Transceiver ■ Meets True EIA/TIA-232-F Standards ■ Complies with 89/336/EEC EMC Directive ■ Single +12V Power Supply ■ <5mA Low Power CMOS Operation ■ 100µA Low Standby Current ■ Operates With +3V Or +5V Logic ■ Allows +3.3V to +5V Standby Supply ■ Two Complete Serial Ports, 6 Drivers and 10 Receivers ■ One Receiver On Each Port Active In Standby ■ Failsafe Receiver Outputs ■ 460kbps Minimum Data Rate ■ Guaranteed LapLink® - Compatible ■ Ideal For High Speed RS-232 Applications ■ 0.1µF Charge Pump Capacitors ■ Low EMI Emissions (EN55022) ■ Pin Compatible To ADM2209E device ■ Enhanced ESD Specifications: +15KV Human Body Model +15KV EN61000-4-2 Air Discharge +8KV EN61000-4-2 Contact Discharge ■ Fast Transient Burst (EFT) Immunity (EN61000-4-2) DESCRIPTION The rugged, high ESD SP2209E device is a complete dual RS-232 port integrated onto a single integrated circuit. Six drivers and ten receivers provide designers a dual port solution fully meeting the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in applications such as personal desktop computers and workstations. Features include high transmission rates, low power consumption, an internal charge-pump power supply that requires only two capacitors, space saving 38-pin TSSOP package dimensions, and compatibility with the EU directive on electromagnetic compatibility. This device is ideal for operation in electrically harsh environments or where RS-232 cables are frequently being plugged and unplugged. This device is also immune to high RF field strengths without special shielding precautions. SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 1 © Copyright 2000 Sipex Corporation Output Voltages TXOUTA..............................................................+15V TXOUTB..............................................................+15V RXOUTA...................................-0.3V to (VSTBY + 0.3V) RXOUTB...................................-0.3V to (VSTBY + 0.3V) ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. Short-Circuit Duration TXOUTA....................................................Continuous TXOUTB....................................................Continuous VDD......................................................-0.3V to +14.0V VSTBY........................................................-0.3V to +7V Storage Temperature........................-65°C to +150°C Power Dissipation per package Input Voltages TXINA........................................-0.3V to (VSTBY + 0.3V) TXINB........................................-0.3V to (VSTBY + 0.3V) RXINA..................................................................+15V RXINB..................................................................+15V 38-pin TSSOP (derate 14.3mW/oC above +70oC).....1200mW SPECIFICATIONS Unless otherwise noted, the following specifications apply for VDD = +12.0V + 10%, VSTBY = +3.3V + 5% or +5V + 10%, C1 = C2 = 0.1µF, and TAMB = TMIN to TMAX. PARAMETER MIN. TYP. MAX. UNITS CONDITIONS 5 mA no load, all driver inputs at 0.4V or 2.1V, all receiver inputs at +15V or -15V 200 µA no load, all driver inputs at VSTBY or open 0.4 V TAMB = 25oC DC CHARACTERISTICS Supply Current Standby Supply Current, VSTBY 100 CMOS LOGIC INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Voltage LOW HIGH 2.1 Input Leakage Current 10 25 µA Driver input at 0V Output Voltage LOW 0.2 0.4 V IOL = +1.6mA V IOH = -40µA µA VDD = 0V, (except R5OUTA and R5OUTB) Output Voltage HIGH Output Leakage Current SP2209E DS/06 2.4 +0.05 +5 SP2209E High ESD Dual Port RS-232 Transceivers 2 © Copyright 2000 Sipex Corporation SPECIFICATIONS (continued) Unless otherwise noted, the following specifications apply for VDD = +12.0V + 10%, VSTBY = +3.3V + 5% or +5V + 10%, C1 = C2 = 0.1µF, and TAMB = TMIN to TMAX. PARAMETER MIN. TYP. Output Voltage Swing +5.0 +9.0 Output Resistance 300 Output Short-Circuit Current +5 MAX. UNITS CONDITIONS V all driver outputs loaded with 3KΩ to GND Ω VDD = VSTBY = 0V, VOUT = +2V DRIVER OUTPUTS +15 +30 mA one driver output shorted, VIN = 0.8V, VOUT = 0V RECEIVER INPUTS Input Voltage Range -15 Input Threshold LOW 0.4 +15 1.45 Input Threshold HIGH 1.7 Input Hysteresis 0.25 Input Resistance 3 V V 2.4 V 7 kΩ V 5 VIN = +15V TIMING CHARACTERISTICS Driver Maximum Data Rate 460 460 kbps 920 Driver Propagation Delay tPHL µs 1.0 tPLH 1.0 Driver Transition-Region Slew Rate Receiver Maximum Data Rate 6 4 16 16 V/µs 460 920 kbps Receiver Propagation Delay tPHL (R1x - R4x) tPLH (R1x -R4x) tPHL (R5x) tPLH (R5x) 0.4 0.4 0.75 0.75 1.0 1.0 2.0 2.0 µs RL = 3kΩ to 7kΩ, CL = 50pF to 470pF RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF TAMB = 0oC to +85oC, VSTBY = 5V + 10% only RL = 3kΩ to 7kΩ, CL = 50pF to 470pF, VSTBY = 5V + 5%, VDD = 12V + 5% RL = 3kΩ, CL = 1000pF, refer to Figures 3 and 5 RL = 3kΩ, CL = 1000pF, refer to Figures 3 and 5 RL = 3kΩ to 7kΩ, CL = 50pF to 470pF RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF VSTBY = 5V + 10% only, measurements taken from -3.0V to +3.0V or +3.0V to -3.0V CL = 150pF CL = 150pF, VSTBY = 5V + 5% only CL = 150pF, refer to Figures 4 and 6 CL = 150pF, refer to Figures 4 and 6 CL = 150pF, refer to Figures 4 and 6 CL = 150pF, refer to Figures 4 and 6 Receiver Output Rise Time 30 ns refer to Figures 4 and 6 Receiver Output Fall Time 30 ns refer to Figures 4 and 6 OPERATING CHARACTERISTICS Operating Voltage Range, VDD +10.8 +13.2 V Standby Voltage Range, VSTBY +3.15 +5.5 V Operating Temperature, TAMB -40 +85 oC SP2209E DS/06 +12.0 SP2209E High ESD Dual Port RS-232 Transceivers 3 © Copyright 2000 Sipex Corporation NAME FUNCTION PIN NUMBER R5OUTA +3.3V to +5V TTL/CMOS logic level receiver output for port A. 1 R4OUTA +3.3V to +5V TTL/CMOS logic level receiver output for port A. 2 R3OUTA +3.3V to +5V TTL/CMOS logic level receiver output for port A. 3 R2OUTA +3.3V to +5V TTL/CMOS logic level receiver output for port A. 4 R1OUTA +3.3V to +5V TTL/CMOS logic level receiver output for port A. 5 T3INA +3.3V to +5V TTL/CMOS logic level driver input for port A. 6 T2INA +3.3V to +5V TTL/CMOS logic level driver input for port A. 7 T1INA +3.3V to +5V TTL/CMOS logic level driver input for port A. 8 STBY +3.3V to +5V standby power supply for receivers R5OUTA and R5OUTB. 9 V DD +12V power supply 10 C+ Positive terminal for the polarized C1 charge-pump capacitor. 11 T1INB +3.3V to +5V TTL/CMOS logic level driver input for port B. 12 T2INB +3.3V to +5V TTL/CMOS logic level driver input for port B. 13 T3INB +3.3V to +5V TTL/CMOS logic level driver input for port B. 14 R1OUTB +3.3V to +5V TTL/CMOS logic level receiver output for port B. 15 R2OUTB +3.3V to +5V TTL/CMOS logic level receiver output for port B. 16 R3OUTB +3.3V to +5V TTL/CMOS logic level receiver output for port B. 17 R4OUTB +3.3V to +5V TTL/CMOS logic level receiver output for port B. 18 R5OUTB +3.3V to +5V TTL/CMOS logic level receiver output for port B. 19 R5INB RS-232 receiver input for port B. 20 R4INB RS-232 receiver input for port B. 21 R3INB RS-232 receiver input for port B. 22 R2INB RS-232 receiver input for port B. 23 R1INB RS-232 receiver input for port B. 24 T3OUTB RS-232 driver output for port B. 25 T2OUTB RS-232 driver output for port B. 26 T1OUTB RS-232 driver output for port B. 27 Ground. 28 C- Negative terminal for the polarized C1 charge-pump capacitor. 29 V- -12V output generated by the charge pump at the negative terminal of the polarized C2 charge-pump capacitor. 30 GND Table 1. Device Pin Description SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 4 © Copyright 2000 Sipex Corporation NAME FUNCTION PIN NUMBER T1OUTA RS-232 driver output for port A. 31 T2OUTA RS-232 driver output for port A. 32 T3OUTA RS-232 driver output for port A. 33 R1INA RS-232 receiver input for port A. 34 R2INA RS-232 receiver input for port A. 35 R3INA RS-232 receiver input for port A. 36 R4INA RS-232 receiver input for port A. 37 R5INA RS-232 receiver input for port A. 38 Table 1. Device Pin Description (continued) R5OUTA R4OUTA 1 38 R5INA 2 37 R4INA R3OUTA 3 36 R3INA R2OUTA R1OUTA 4 5 35 R2INA 34 R1INA T3INA 6 T2INA 7 33 T3OUTA 32 T2OUTA T1INA 8 31 T1OUTA STBY 9 30 V- SP2209E VDD 10 29 C- C+ 11 28 GND T1INB 12 27 T1OUTB T2INB 13 26 T2OUTB 25 T3OUTB T3INB 14 24 R1OUTB 15 R1INB R2OUTB 16 R3OUTB 17 23 R2INB 22 R3INB R4OUTB 18 21 R4INB R5OUTB 19 20 R5INB Figure 1. SP2209E Pinout Configuration SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 5 © Copyright 2000 Sipex Corporation +12V + 10 VDD STBY 11 C+ 0.1µF + TTL/CMOS INPUTS C1 SP2209E V- 9 + C2 29 C- GND 28 8 T1INA 400KΩ T1OUTA 7 T2INA 400KΩ T2OUTA 32 6 T3INA 400KΩ T3OUTA 33 R1INA 34 R2INA 35 R3INA 36 R4INA 37 R5INA 38 T1OUTB 27 5 R1OUTA +3.3V 0.1µF 30 + 0.1µF 0.1µF 31 RS-232 OUTPUTS 5KΩ 4 R2OUTA 5KΩ TTL/CMOS OUTPUTS 3 R3OUTA 5KΩ 2 R4OUTA RS-232 INPUTS 5KΩ 1 R5OUTA 5KΩ 12 T1INB TTL/CMOS INPUTS 400KΩ 13 T2INB 400KΩ T2OUTB 26 14 T3INB 400KΩ T3OUTB 25 15 R1OUTB R1INB 24 R2INB 23 R3INB 22 R4INB 21 R5INB 20 RS-232 OUTPUTS 5KΩ 16 R2OUTB 5KΩ TTL/CMOS OUTPUTS 17 R3OUTB 5KΩ 18 R4OUTB RS-232 INPUTS 5KΩ 19 R5OUTB 5KΩ Figure 2. SP2209E Typical Operating Circuit SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 6 © Copyright 2000 Sipex Corporation DESCRIPTION THEORY OF OPERATION The SP2209E device is a rugged, high ESD, complete dual RS-232 port integrated onto a single integrated circuit. Six drivers and ten receivers provide a dual port solution fully meeting the EIA/TIA-232 and ITU-T V.28/V.24 communication protocols and can be implemented in applications such as personal desktop computers and workstations. Refer to Figure 2 for a typical operating circuit. The SP2209E device is made up of four basic circuit blocks: 1. Drivers, 2. Receivers, 3. the Sipex proprietary charge pump, and 4. Standby circuitry. Drivers The drivers are inverting level transmitters that convert TTL or CMOS logic levels to EIA/TIA-232 levels with an inverted sense relative to the input logic levels. With VDD = +12V, the typical RS-232 output voltage swing is +9V with no load and +5V minimum fully loaded. Unused driver input may be left unconnected with an internal pull-up resistor pulling the inputs high forcing the driver outputs into a low state. The driver outputs are protected against infinite short-circuits to ground without degradation in reliability. These drivers comply with the EIA-TIA-232F and all previous RS-232 versions. Features include high transmission rates, low power consumption, space saving package dimensions, and compatibility with the EU directive on electromagnetic compatibility. EM compatibility includes protection against radiated and conducted interference including high levels of electrostatic discharge. This device is ideal for operation in electrically harsh environments or where RS-232 cables are frequently being plugged and unplugged. This device is also immune to high RF field strengths without special shielding precautions. Emissions are also controlled to within very strict limits. The drivers typically can operate at a minimum data rate of 460kbps fully loaded with 3KΩ in parallel with 1000pF, ensuring compatibility with PC-to-PC communication software. The SP2209E device is ideal for the new generation modem standards which require data rates greater than 460kbps. Refer to Figures 3 and 5 for driver propagation delay test circuit and waveforms, respectively. The SP2209E device features the inverter portion of Sipex's proprietary and patented (U.S. 5,306,954) on-board charge pump circuitry that generates a -9V voltage level from a single +12V power supply. The SP2209E device can operate at data rates of at least 460kbps fully loaded. Receivers Its low power CMOS operation makes the SP2209E device an ideal choice for power sensitive designs. The SP2209E device has two receivers, one for each RS-232 port, that remains active in the standby mode to allow the monitoring of peripheral devices while the rest of the system is in a power-saving standby mode. This allows the SP2209E device to wake up the entire system when any communication is initiated in peripheral devices. The SP2209E device has a low standby current of 100µA. SP2209E DS/06 The receivers convert EIA/TIA-232 levels to TTL or CMOS logic output levels. Should an unused receiver input be left unconnected, an internal 5kΩ pulldown resistor to ground will commit the output of the receiver to a HIGH state. Receiver inputs are also protected against overvoltages of up to +15V. Refer to Figures 4 and 6 for receiver propagation delay test circuit and waveforms, respectively. SP2209E High ESD Dual Port RS-232 Transceivers 7 © Copyright 2000 Sipex Corporation VIN A VIN VOUT TX 3kΩ A VOUT RX 150pF 1000pF C C Figure 4. Receiver Propagation Delay and Transition Time Test Circuit Figure 3. Driver Propagation Delay and Transition Time Test Circuit Data Transmission Rate > 460kbps, tF<5ns, tR<5ns DRIVER INPUT +3V 1.5V 0V V DRIVER OH OUTPUT VOL 1.5V tPHL tPLH +3V 0V +3V -3V -3V tF tR tSKEW = | tPHL - tPLH | Figure 5. Driver Propagation Delays Data Transmission Rate > 460kbps, tF<200ns, tR<200ns +3V RECEIVER INPUT -3V V RECEIVER OH OUTPUT VOL 0V 0V tPHL tPLH 80% 50% 80% 20% tF 20% tR tSKEW = | tPHL - tPLH | Figure 6. Receiver Propagation Delays SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 8 © Copyright 2000 Sipex Corporation One receiver in each RS-232 port can be kept active by a low current, +3.3V to +5V power supply while the rest of the channels are powered down. This allows the SP2209E device to monitor peripheral devices while the rest of the system is in a power-saving standby mode. The SP2209E device can be implemented as a power management device to wake up the entire system when any communication is initiated in peripheral devices. The SP2209E device has a low standby current of 100µA. Charge Pump The charge pump is a Sipex–patented design (U.S. 5,306,954) and uses a unique approach compared to older less–efficient designs. The charge pump requires two external capacitors using a two–phase voltage shifting technique with a 200kHz internal oscillator to attain a -9V power supply. Refer to Figure 7 for the internal charge pump circuit. The internal power supply consists of a charge pump that provides output voltages of at least +5V regardless of the input voltage (VDD). This is important to maintain compliant RS-232 levels regardless of power supply fluctuations. A description of each phase follows. Since receiver input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mV. This ensures that the receiver is virtually immune to noisy transmission lines and inputs with slow transition times. VC2- = -VDD VDD S3 S1 C2 C1 S2 S4 C2- Figure 7. Charge Pump Circuit Figure 8. Charge Pump Waveforms SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 9 © Copyright 2000 Sipex Corporation Phase 1 — VDD charge storage — S1 and S2 are closed. S3 and S4 are open. During this phase of the clock cycle, the positive side of capacitor, C1, is connected to VDD. The negative side of C1 is connected to GND. C1 is charged to +VDD. VDD Internal Shutdown Signal Phase 2 — VDD transfer — S1 and S2 are open. S3 and S4 are closed. The negative side of the capacitor, C2, is connected to C2-. The positive side of C2 is connected to GND. This transfers a negative generated voltage to C2. A negative voltage is built up on the negative side of C2 with each cycle of the oscillator. If the current drawn is small, the output voltage at C2- will be close to -VDD. As the current drawn at C2- increases, the output voltage will decrease in magnitude. The charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. Refer to Figure 8 for the internal charge pump waveforms. Figure 9. Internal Standby Detection Circuit discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up. There are different methods of ESD testing applied: a) MIL-STD-883, Method 3015.7 b) EN61000-4-2 Air-Discharge c) EN61000-4-2 Direct Contact Standby Circuitry The SP2209E device incorporates power saving, on board standby circuitry. The standby current is typically less than 100µA. The SP2209E device automatically enters a standby mode when the VDD power supply is removed. An internal comparator generates an internal shutdown signal that disables the internal oscillator disengaging the charge pump. Refer to Figure 9 for the internal standby detection circuit. The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 10. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently. The inverted output V- goes to ground. All driver outputs are disabled. The inputs of receivers 1 through 4 for both ports A and B are at high impedance. Receiver 5 for both ports A and B remain fully active as power management receiver lines to system peripherals that may come online during the standby mode. The EN61000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with EN61000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the ESD Tolerance The SP2209E device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static SP2209E DS/06 VSTBY SP2209E High ESD Dual Port RS-232 Transceivers 10 © Copyright 2000 Sipex Corporation equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for EN61000-4-2 is shown on Figure 11. There are two methods within EN61000-4-2, the Air Discharge method and the Contact Discharge method. holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC. The circuit model in Figures 10 and 11 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage. With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed. For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are 1.5kΩ an 100pF, respectively. For EN61000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively. The higher CS value and lower RS value in the EN61000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point. The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already APPLICATIONS With six drivers and ten receivers, the SP2209E device is ideal for applications requiring two RS-232 ports such as in desktop or portable computers. Refer to Figure 13. For typical DB9 serial ports for Data Terminal Equipment (DTE) RSS R RC C SW2 SW2 SW1 SW1 CSS DC Power Source Device Under Test Figure 10. ESD Test Circuit for Human Body Model SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 11 © Copyright 2000 Sipex Corporation Contact-Discharge Module R RSS RC C RV SW2 SW2 SW1 SW1 Device Under Test CSS DC Power Source RS and RV add up to 330Ω 330Ω ffor or IEC1000-4-2. Figure 11. ESD Test Circuit for EN61000-4-2 A standard serial mouse can be powered from the SP2209E drivers. Two driver outputs connected in parallel and set to VOH can be used to supply power to the V+ pin of the mouse. The third driver is set to VOL to link current from the V- terminal. Typical mouse specifications are 10mA at +6V and 5mA at -6V. to Data Circuit Terminating Equipment (DCE) interface implementation, 2 data lines, TxD and RxD, and 6 control lines, RTS, DTR, DSR, CTS, and RI, are required. The straight-through pinout for data lines in the SP2209E device allows a simplified PCB layout allowing ground lines to separate the signal lines and ground planes to be placed beneath the IC without the complication of a multi-layer PCB layout. LapLink Compatibility The SP2209E can operate up to 460kbps data rate under maximum driveload conditions of CL = 1000pF and RL = 3KΩ at minimum power supply voltages. i➙ A receiver from each port, R5INA and R5INB, are active while the rest of the channels are powered down. This allows the SP2209E device to monitor peripheral devices while the rest of the system is in a power-saving standby mode. Fail-Safe receiver outputs are pulled high if the receiver inputs are left unconnected or at zero input. The SP2209E device can be implemented as a power management device to wake up the entire system when any communication is initiated in peripheral devices. The SP2209E device has a low standby current of 100µA. 30A 15A 0A t=0ns t=30ns t➙ Figure 12. ESD Test Waveform for EN61000-4-2 DEVICE PIN TESTED HUMAN BODY MODEL Air Discharge Driver Outputs Receiver Inputs +15kV +15kV +15kV +15kV IEC1000-4-2 Direct Contact +8kV +8kV Level 4 4 Table 2. Transceiver ESD Tolerance Levels SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 12 © Copyright 2000 Sipex Corporation +3.3V to +5V 9 + STBY 0.1µF 29 DCD 5 V- 0.1µF 28 R1INA 34 DCD R2INA 35 DSR R3INA 36 RXD C- GND R1OUTA 30 + 0.1µF VDD SP2209E C+ + 11 + +12V 10 5KΩ DSR Super I/O Chip 4 R2OUTA 0.1µF DB-9 Connector COM1 5KΩ RXD 3 R3OUTA 5KΩ RTS 8 T1INA 400KΩ T1OUTA 31 RTS 6 TXD 7 T2INA 400KΩ T2OUTA 32 TXD 7 CTS 2 R4OUTA R4INA 37 CTS 8 9 5KΩ DTR RI 6 T3INA 1 400KΩ R5OUTA T3OUTA 33 DTR R5INA 38 RI 1 2 3 4 5 5KΩ DCD 15 R1OUTB R1INB 24 DCD R2INB 23 DSR R3INB 22 RXD 5KΩ DSR 16 R2OUTB DB-9 Connector COM2 5KΩ RXD 17 R3OUTB 5KΩ RTS 12 T1INB 400KΩ T1OUTB 27 RTS 6 TXD 13 T2INB 400KΩ T2OUTB 26 TXD 7 CTS 18 R4OUTB R4INB 8 21 CTS 9 5KΩ DTR 14 T3INB RI 19 R5OUTB T3OUTB 25 400KΩ R5INB 20 1 2 3 4 5 DTR RI 5KΩ Figure 13. Dual Serial Port Application with Two DB9 Connectors SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 13 © Copyright 2000 Sipex Corporation PACKAGE: PLASTIC THIN SMALL OUTLINE (TSSOP) E2 E D A Ø e B A1 L DIMENSIONS (mm) Minimum/Maximum SP2209E DS/06 38–PIN A (- /1.10) A1 (0.05/0.15) B (0.17/0.27) D (9.60/9.80) E (4.30/4.50) e (0.50 BSC) E2 (3.20 BSC) L (0.50/0.75) Ø 0°/8° SP2209E High ESD Dual Port RS-232 Transceivers 14 © Copyright 2000 Sipex Corporation ORDERING INFORMATION Model SP2209EEY ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Temperature Range -40°C to +85°C ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ Package Types 38-pin TSSOP Please consult the factory for pricing and availability on a Tape-On-Reel option. Corporation SIGNAL PROCESSING EXCELLENCE Sipex Corporation Headquarters and Sales Office 22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: [email protected] Sales Office 233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600 Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others. SP2209E DS/06 SP2209E High ESD Dual Port RS-232 Transceivers 15 © Copyright 2000 Sipex Corporation