CXG1077TN High Power SPDT Switch Description The CXG1077TN is a SPDT (Single Pole Dual Throw) antenna switch MMIC used in personal communication handsets such as JCDMA. This IC is designed using the Sony’s GaAs J-FET process. Features • Low control voltage • Low control current • Low insertion loss • High power handling • High intercept point • Small package Vctl (H) =2.8 V Ictl=30 µA (Typ.) @2.8 V 0.35 dB (Typ.) @900 MHz P1dB: 33 dBm (Typ.) @900 MHz Ip3=60 dBm (Typ.) TSSOP-10pin Application SPDT switch for digital cellular telephones such as JCDMA handsets. 10 pin (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Control voltage Vctl 7 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 Operating Condition Control voltage CTL (H) CTL (L) 2.5 to 5 0 to 0.5 V °C °C V V Structure GaAs J-FET MMIC Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E99408-TE CXG1077TN Block Diagram RF3 VCTLA VCTLB High Low Low High RF1 RF2 RF1-RF2 ON RF1-RF3 OFF RF1-RF2 OFF RF1-RF3 ON Electrical Characteristics (Ta=25 °C) Symbol Insertion loss Isolation IL ISO VSWR VSWR Output harmonics 2fo, 3fo Input IP3 IIP3 Input power for 1 dB compression P1dB Switching speed TSW Control current TSW I CTL Condition ∗1 ∗2 ∗1 ∗2 ∗1, ∗2 ∗1 ∗2 ∗3 ∗1 ∗2 ∗1 Pin=25 dBm, 900 MHz, CW, 0/2.8 V Control ∗2 Pin=25 dBm, 1.8 GHz, CW, 0/2.8 V Control ∗3 Pin=21 dBm (900 MHz) +21 dBm (901 MHz), 0/2.8 V Control —2— Min. 20 15 28 28 Typ. 0.35 Max. 0.6 Unit dB 0.5 22 17 1.2 0.8 dB dB dB 60 33 33 100 30 1.4 –30 –30 54 300 50 dBm dBm dBm dBm dBm ns µA CXG1077TN Package Outline/Pin Configuration Unit : mm RF2 CTLA GND GND GND RF1 GND GND RF3 CTLB 1 10 10pin TSSOP (PLASTIC) Recommended Circuit Rctl 1kΩ 6 RF2 CTLA 5 C2 100pF C1 100pF 7 8 4 CXG1077TN 3 RF1 51kΩ 9 2 10 1 C2 100pF Rctl 1kΩ RF3 C2 100pF CTLB C1 100pF When using the CXG1077TN, the following external components should be used: C1: This is used for signal line filtering. 100 pF is recommended. C2: This is used for RF De-coupling and must be used in all applications. 100 pF is recommended. Rctl: This resistor is used to give improved ESD performance. —3— CXG1077TN Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 0.1 10 6 + 0.15 0.1 – 0.05 0.45 ± 0.15 3.2 ± 0.2 ∗2.2 ± 0.1 5 1 0.5 + 0.08 0.22 – 0.07 0.1 0.25 0° to 10° M A (0.1) + 0.025 0.12 – 0.015 Package Outline (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.02g SONY CODE TSSOP-10P-L01 —4—