SONY CXG1064ATN

CXG1064ATN
High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic
Description
The CXG1064ATN is a high power antenna switch
MMIC. The CXG1064ATN is suited to connect
Tx/Rx to one of 4 antennas in cellular handset such
as PDC.
The CXG1064ATN has the integrated control logic
and can be operated with CMOS input.
This IC is designed using the Sony’s GaAs J-FET
process which enable the CXG1064ATN to be
operated with low voltage.
Features
• Low insertion loss :
0.35 dB (Typ.) @900 MHz, 0.45 dB (Typ.) @1.5 GHz
• Small package
: TSSOP-16 pin
• High power handling : P1dB : 37 dBm
• CMOS compatible input control
• Low bias voltage
: VDD=3.0 V
16 pin TSSOP (Plastic)
Absolute Maximum Ratings (Ta=25 °C)
• Bias voltage
VDD
7
• Control voltage
Vctl
5
• Operating temperature Topr
–35 to +85
• Storage temperature
Tstg –65 to +150
V
V
°C
°C
Applications
2 × 4 antenna switch for digital cellular telephones
such as PDC handsets.
Structure
GaAs J-FET MMIC
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E98Y52-TE
CXG1064ATN
Block Diagram
F1
RF4
(Ant/Ext.1)
F2
RF5
(Rx)
RF6
(Diversity 1)
F5
RF3
(Tx)
F4
F3
RF2
(Ant/Ext.2)
F6
RF1
(Diversity 2)
F7
F8
Package Outline/Pin Configuration
RF4
RF3
GND
GND
RF5
RF2
GND
GND
RF6
RF1
GND
GND
VDD
CTLC
CTLA
CTLB
16
1
16pin TSSOP (PLASTIC)
Recommended Circuit
L1
9
L1
RF4
RF3
8
100pF
100pF
10 GND
GND
7
11 RF5
RF2
6
L1
L1
100pF
100pF
12 GND
GND
5
RF1
4
CXG1064ATN
L1
13 RF6
L1
100pF
100pF
14 GND
GND
3
15 VDD
CTLC
2
100pF
16 CTLA
1kΩ
100pF
CTLB
100pF
1kΩ
100pF
1kΩ
1
∗ DC blocking capacitors (CRF) are needed.
∗ Recommended to use bypass capacitors (Cbypass).
∗ Recommended to use control resistors (RCTL), when it is necessary to improve the electrostatic discharge
strength (ESD).
—2—
CXG1064ATN
Truth Table
CTLA
H
H
L
L
L
L
Control
CTLB
L
L
L
L
H
H
CTLC
L
H
L
H
L
H
ON
F1
F2
F3
F4
F5
F6
F7
F8
RF3 → RF2
RF3 → RF4
RF5 → RF2
RF5 → RF4
RF5 → RF6
RF5 → RF1
OFF
ON
ON
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
ON
OFF
ON
ON
ON
ON
ON
ON
OFF
DC Bias Condition
Parameter
Vctl (H) A to C
Vctl (L) A to C
VDD
(Ta=25 °C)
Min.
2.4
0
2.6
Typ.
Max.
3.6
0.8
4.5
Unit.
V
V
V
—3—
CXG1064ATN
Electrical Characteristics 1
Parameter
Insertion loss
Isolation
VSWR
ACP (±50 kHz)
ACP (±100 kHz)
2nd Harmonics
3rd Harmonics
Control current
Bias current
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
Each ON
Port
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
(Vctl (L)=0 V, Vctl (H)=3 V, Ta=25 °C)
Frequency
889 MHz
to 960 MHz
810 MHz
to 885 MHz
810 MHz
to 885 MHz
889 MHz
to 960 MHz
810 MHz
to 885 MHz
810 MHz
to 885 MHz
810 MHz
to 960 MHz
889 MHz
to 960 MHz
889 MHz
to 960 MHz
889 MHz
to 960 MHz
889 MHz
to 960 MHz
Condition
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
Min.
18
18
18
18
25
22
Typ.
0.35
0.35
0.55
0.55
0.5
0.5
20
22
22
20
34
26
Max.
0.60
0.60
0.80
0.80
0.75
0.75
Unit.
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.4
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
VDD=3.0 V
VDD=2.8 V
Switching speed
∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc
2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc
∗2 Pin=29.5 dBm, VDD=3.0 V
∗3 Pin=29.5 dBm, VDD=2.8 V
∗4 Pin=7 dBm, VDD=3.0
∗5 Pin=7 dBm, VDD=2.8
—4—
–70
–70
–75
–75
–70
–70
–70
–70
60
0.6
0.6
1
–60
–55
–70
–65
–60
–60
–60
–55
120
1.1
1.0
5
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
µA
mA
mA
µs
CXG1064ATN
Electrical Characteristics 2
Parameter
Insertion loss
Isolation
VSWR
ACP (±50 kHz)
ACP (±100 kHz)
2nd Harmonics
3rd Harmonics
Control current
Bias current
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
Each ON
Port
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
(Vctl (L)=0 V, Vctl (H)=3 V, Ta=25 °C)
Frequency
1429 MHz
to 1453 MHz
1477 MHz
to 1501 MHz
1477 MHz
to 1501 MHz
1429 MHz
to 1453 MHz
1477 MHz
to 1501 MHz
1477 MHz
to 1501 MHz
1429 MHz
to 1501 MHz
1429 MHz
to 1453 MHz
1429 MHz
to 1453 MHz
1429 MHz
to 1453 MHz
1429 MHz
to 1453 MHz
Condition
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
Min.
14
16
16
14
25
18
Typ.
0.45
0.45
0.65
0.65
0.60
0.60
16
18
18
16
30
21
Max.
0.70
0.70
0.95
0.95
0.90
0.90
Unit.
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.4
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
VDD=3.0 V
VDD=2.8 V
Switching speed
∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc
2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc
∗2 Pin=29.5 dBm, VDD=3.0 V
∗3 Pin=29.5 dBm, VDD=2.8 V
∗4 Pin=7 dBm, VDD=3.0
∗5 Pin=7 dBm, VDD=2.8
—5—
–70
–70
–75
–75
–75
–70
–70
–70
60
0.6
0.6
1
–60
–55
–70
–65
–60
–55
–60
–55
120
1.1
1.0
5
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
µA
mA
mA
µs
CXG1064ATN
Electrical Characteristics 3
Parameter
Insertion loss
Isolation
VSWR
ACP (±50 kHz)
ACP (±100 kHz)
2nd Harmonics
3rd Harmonics
Control current
Bias current
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
Each ON
Port
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
(Vctl (L)=0 V, Vctl (H)=3 V, Ta=–35 °C to +85 °C)
Frequency
889 MHz
to 960 MHz
810 MHz
to 885 MHz
810 MHz
to 885 MHz
889 MHz
to 960 MHz
810 MHz
to 885 MHz
810 MHz
to 885 MHz
810 MHz
to 960 MHz
889 MHz
to 960 MHz
889 MHz
to 960 MHz
889 MHz
to 960 MHz
889 MHz
to 960 MHz
Condition
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
Min.
18
18
18
18
25
22
Typ.
0.35
0.35
0.55
0.55
0.5
0.5
20
22
22
20
34
26
Max.
0.90
0.90
1.10
1.10
1.05
1.05
Unit.
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.4
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
VDD=3.0 V
VDD=2.8 V
Switching speed
∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc
2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc
∗2 Pin=29.5 dBm, VDD=3.0 V
∗3 Pin=29.5 dBm, VDD=2.8 V
∗4 Pin=7 dBm, VDD=3.0
∗5 Pin=7 dBm, VDD=2.8
—6—
–70
–70
–75
–75
–70
–70
–70
–70
60
0.6
0.6
1
–55
–50
–65
–60
–55
–55
–55
–50
150
1.3
1.2
5
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
µA
mA
mA
µs
CXG1064ATN
Electrical Characteristics 4
Parameter
Insertion loss
Isolation
VSWR
ACP (±50 kHz)
ACP (±100 kHz)
2nd Harmonics
3rd Harmonics
Control current
Bias current
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
RF3-RF2
RF3-RF4
RF5-RF2
RF5-RF4
RF5-RF1
RF5-RF6
Each ON
Port
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
(Vctl (L)=0 V, Vctl (H)=3 V, Ta=–35 °C to +85 °C)
Frequency
1429 MHz
to 1453 MHz
1477 MHz
to 1501 MHz
1477 MHz
to 1501 MHz
1429 MHz
to 1453 MHz
1477 MHz
to 1501 MHz
1477 MHz
to 1501 MHz
1429 MHz
to 1501 MHz
1429 MHz
to 1453 MHz
1429 MHz
to 1453 MHz
1429 MHz
to 1453 MHz
1429 MHz
to 1453 MHz
Condition
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗2, ∗3
∗2, ∗3
∗4, ∗5
∗4, ∗5
∗4, ∗5
∗4, ∗5
Min.
14
16
16
14
25
18
Typ.
0.45
0.45
0.65
0.65
0.60
0.60
16
18
18
16
30
21
Max.
1.00
1.00
1.25
1.25
1.2
1.2
Unit.
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.4
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
∗1, ∗2
∗1, ∗3
VDD=3.0 V
VDD=2.8 V
Switching speed
∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc
2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc
∗2 Pin=29.5 dBm, VDD=3.0 V
∗3 Pin=29.5 dBm, VDD=2.8 V
∗4 Pin=7 dBm, VDD=3.0
∗5 Pin=7 dBm, VDD=2.8
—7—
–70
–70
–75
–75
–75
–70
–70
–70
60
0.6
0.6
1
–55
–50
–65
–60
–55
–50
–55
–50
150
1.3
1.2
5
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
µA
mA
mA
µs
CXG1064ATN
Unit : mm
16PIN TSSOP(PLASTIC)
1.2MAX
4.1
S
2.05
A
16
B
0.08 S
X2
9
0.2
S A B
0.1 ± 0.05
(3.0)
3.9
2.9
0.1
X
0.25
0.1
X
8
X4
0.1
0.5
S A B
0.45 ± 0.1
1
0° to 8°
0.08 M S A
B
0.2 ± 0.02
+ 0.036
0.22 – 0.03
DETAIL B
0.1 ± 0.01
+ 0.026
0.12 – 0.02
Package Outline
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
LEAD MATERIAL
COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.03g
SONY CODE
TSSOP-16P-L01
—8—