CXG1064ATN High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic Description The CXG1064ATN is a high power antenna switch MMIC. The CXG1064ATN is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. The CXG1064ATN has the integrated control logic and can be operated with CMOS input. This IC is designed using the Sony’s GaAs J-FET process which enable the CXG1064ATN to be operated with low voltage. Features • Low insertion loss : 0.35 dB (Typ.) @900 MHz, 0.45 dB (Typ.) @1.5 GHz • Small package : TSSOP-16 pin • High power handling : P1dB : 37 dBm • CMOS compatible input control • Low bias voltage : VDD=3.0 V 16 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Bias voltage VDD 7 • Control voltage Vctl 5 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 V V °C °C Applications 2 × 4 antenna switch for digital cellular telephones such as PDC handsets. Structure GaAs J-FET MMIC GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E98Y52-TE CXG1064ATN Block Diagram F1 RF4 (Ant/Ext.1) F2 RF5 (Rx) RF6 (Diversity 1) F5 RF3 (Tx) F4 F3 RF2 (Ant/Ext.2) F6 RF1 (Diversity 2) F7 F8 Package Outline/Pin Configuration RF4 RF3 GND GND RF5 RF2 GND GND RF6 RF1 GND GND VDD CTLC CTLA CTLB 16 1 16pin TSSOP (PLASTIC) Recommended Circuit L1 9 L1 RF4 RF3 8 100pF 100pF 10 GND GND 7 11 RF5 RF2 6 L1 L1 100pF 100pF 12 GND GND 5 RF1 4 CXG1064ATN L1 13 RF6 L1 100pF 100pF 14 GND GND 3 15 VDD CTLC 2 100pF 16 CTLA 1kΩ 100pF CTLB 100pF 1kΩ 100pF 1kΩ 1 ∗ DC blocking capacitors (CRF) are needed. ∗ Recommended to use bypass capacitors (Cbypass). ∗ Recommended to use control resistors (RCTL), when it is necessary to improve the electrostatic discharge strength (ESD). —2— CXG1064ATN Truth Table CTLA H H L L L L Control CTLB L L L L H H CTLC L H L H L H ON F1 F2 F3 F4 F5 F6 F7 F8 RF3 → RF2 RF3 → RF4 RF5 → RF2 RF5 → RF4 RF5 → RF6 RF5 → RF1 OFF ON ON OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON ON OFF OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF ON ON ON ON ON OFF ON ON ON ON ON ON OFF DC Bias Condition Parameter Vctl (H) A to C Vctl (L) A to C VDD (Ta=25 °C) Min. 2.4 0 2.6 Typ. Max. 3.6 0.8 4.5 Unit. V V V —3— CXG1064ATN Electrical Characteristics 1 Parameter Insertion loss Isolation VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=25 °C) Frequency 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 810 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz Condition ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 Min. 18 18 18 18 25 22 Typ. 0.35 0.35 0.55 0.55 0.5 0.5 20 22 22 20 34 26 Max. 0.60 0.60 0.80 0.80 0.75 0.75 Unit. dB dB dB dB dB dB dB dB dB dB dB dB 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V Switching speed ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —4— –70 –70 –75 –75 –70 –70 –70 –70 60 0.6 0.6 1 –60 –55 –70 –65 –60 –60 –60 –55 120 1.1 1.0 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs CXG1064ATN Electrical Characteristics 2 Parameter Insertion loss Isolation VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=25 °C) Frequency 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1501 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz Condition ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 Min. 14 16 16 14 25 18 Typ. 0.45 0.45 0.65 0.65 0.60 0.60 16 18 18 16 30 21 Max. 0.70 0.70 0.95 0.95 0.90 0.90 Unit. dB dB dB dB dB dB dB dB dB dB dB dB 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V Switching speed ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —5— –70 –70 –75 –75 –75 –70 –70 –70 60 0.6 0.6 1 –60 –55 –70 –65 –60 –55 –60 –55 120 1.1 1.0 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs CXG1064ATN Electrical Characteristics 3 Parameter Insertion loss Isolation VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=–35 °C to +85 °C) Frequency 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 889 MHz to 960 MHz 810 MHz to 885 MHz 810 MHz to 885 MHz 810 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz 889 MHz to 960 MHz Condition ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 Min. 18 18 18 18 25 22 Typ. 0.35 0.35 0.55 0.55 0.5 0.5 20 22 22 20 34 26 Max. 0.90 0.90 1.10 1.10 1.05 1.05 Unit. dB dB dB dB dB dB dB dB dB dB dB dB 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V Switching speed ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —6— –70 –70 –75 –75 –70 –70 –70 –70 60 0.6 0.6 1 –55 –50 –65 –60 –55 –55 –55 –50 150 1.3 1.2 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs CXG1064ATN Electrical Characteristics 4 Parameter Insertion loss Isolation VSWR ACP (±50 kHz) ACP (±100 kHz) 2nd Harmonics 3rd Harmonics Control current Bias current RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 Each ON Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 (Vctl (L)=0 V, Vctl (H)=3 V, Ta=–35 °C to +85 °C) Frequency 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1453 MHz 1477 MHz to 1501 MHz 1477 MHz to 1501 MHz 1429 MHz to 1501 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz 1429 MHz to 1453 MHz Condition ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗2, ∗3 ∗2, ∗3 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 ∗4, ∗5 Min. 14 16 16 14 25 18 Typ. 0.45 0.45 0.65 0.65 0.60 0.60 16 18 18 16 30 21 Max. 1.00 1.00 1.25 1.25 1.2 1.2 Unit. dB dB dB dB dB dB dB dB dB dB dB dB 1.4 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 ∗1, ∗2 ∗1, ∗3 VDD=3.0 V VDD=2.8 V Switching speed ∗1 Input signal : ACP (±50 kHz) < –65 dBc, ACP (±100 kHz) < –75 dBc 2nd Harmonics < –65 dBc, 3rd Harmonics < –65 dBc ∗2 Pin=29.5 dBm, VDD=3.0 V ∗3 Pin=29.5 dBm, VDD=2.8 V ∗4 Pin=7 dBm, VDD=3.0 ∗5 Pin=7 dBm, VDD=2.8 —7— –70 –70 –75 –75 –75 –70 –70 –70 60 0.6 0.6 1 –55 –50 –65 –60 –55 –50 –55 –50 150 1.3 1.2 5 dBc dBc dBc dBc dBc dBc dBc dBc µA mA mA µs CXG1064ATN Unit : mm 16PIN TSSOP(PLASTIC) 1.2MAX 4.1 S 2.05 A 16 B 0.08 S X2 9 0.2 S A B 0.1 ± 0.05 (3.0) 3.9 2.9 0.1 X 0.25 0.1 X 8 X4 0.1 0.5 S A B 0.45 ± 0.1 1 0° to 8° 0.08 M S A B 0.2 ± 0.02 + 0.036 0.22 – 0.03 DETAIL B 0.1 ± 0.01 + 0.026 0.12 – 0.02 Package Outline PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.03g SONY CODE TSSOP-16P-L01 —8—