CXG1090TN High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic Description The CXG1090TN is a high power antenna switch MMIC. The CXG1090TN is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. The CXG1090TN has the integrated control logic and can be operated with CMOS input. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1090TN to be operated with low voltage. 16 pin TSSOP (Plastic) Features • Low insertion loss: 0.30dB (Typ.)@900MHz, 0.40dB (Typ.)@1.5GHz • Small package: TSSOP-16pin • High power handling: PldB: 37dBm • CMOS compatible input control • Low bias voltage: VDD = 3.0V Applications 2 × 4 antenna switch for digital cellular telephones such as PDC handsets. Structure GaAs J-FET MMIC Absolute Maximum Ratings • Bias voltage VDD • Control voltage Vctl • Operating temperature Topr • Storage temperature Tstg 7 5 –35 to +85 –65 to +150 V @Ta = 25°C V @Ta = 25°C °C °C GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E99747A9Z-PS CXG1090TN Block Diagram F1 RF4 (Ant/Ext.1) 9 F2 RF5 11 (Rx) RF6 13 (Diversity 1) 8 RF3 (Tx) 6 RF2 (Ant/Ext.2) RF1 (Diversity 2) F4 F3 4 F5 F6 F7 F8 14 3 RF-GND6 RF-GND1 Package Outline/Pin Configuration 9 8 RF3 GND 10 RF4 7 GND RF5 11 6 RF2 GND 12 5 GND RF6 13 4 RF1 RF-GND6 14 3 RF-GND1 15 2 CTLC CTLA 16 1 CTLB VDD Recommended Circuit 9 RF4 L1 GND RF5 L1 RF6 L1 RF-GND6 100pF 10 7 11 6 100pF GND 12 5 13 4 VDD 3 15 2 100pF 16 CTLA 1kΩ RF2 L1 GND RF1 100pF 14 L1 GND 100pF 100pF Z6 RF3 8 100pF L1 Z1 100pF RF-GND1 CTLC 1kΩ 1 CTLB 100pF 100pF –2– 1kΩ CXG1090TN Truth Table Control ON F1 F2 F3 F4 F5 F6 F7 F8 L RF3 → RF2 OFF ON OFF ON OFF OFF ON ON L H RF3 → RF4 ON OFF ON OFF OFF OFF ON ON L L L RF5 → RF2 ON OFF ON OFF OFF OFF ON ON L L H RF5 → RF4 OFF ON OFF ON OFF OFF ON ON L H L RF5 → RF6 OFF OFF OFF OFF ON OFF OFF ON L H H RF5 → RF1 OFF OFF OFF OFF OFF ON ON OFF CTLA CTLB CTLC H L H DC Bias Condition (Ta = 25°C) Parameter Min. Vctl (H) A to C Vctl (L) A to C VDD Typ. Max. Unit 2.4 3.6 V 0 0.8 V 2.8 3.2 V –3– CXG1090TN Electrical Characteristics Parameter Insertion loss Isolation VSWR ACP (±50kHz) ACP (±100kHz) 2nd harmonics 3nd harmonics (Vctl (L) = 0V, Vctl (H) = 3V, Ta = 25°C) Frequency Condition Typ. Max. Unit RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 0.32 0.55 dB RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 0.30 0.55 dB RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.55 0.85 dB RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.55 0.85 dB RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.5 0.8 dB RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.5 0.8 dB RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 17 19 dB RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 17 21 dB RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 17 21 dB RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 17 19 dB RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 27 34 dB RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 20 25 dB Each ON 810 to 960MHz Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 1.4 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 –67 –57 dBc –67 –55 dBc –75 –65 dBc –75 –62 dBc –67 –60 dBc –67 –57 dBc –67 –60 dBc –67 –57 dBc 85 150 µA VDD = 3.0V 0.45 1 mA VDD = 2.8V 0.4 0.9 mA 1.0 5.0 µs Control current Bias current Min. Switching speed ∗1 Input Signal: ACP (±50kHz) < –65dBc, APC (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd harmonics < –65dBc –4– CXG1090TN Package Outline Unit: mm 16PIN TSSOP(PLASTIC) 1.2MAX 4.1 S 2.05 A 16 B 0.08 S X2 9 0.2 S A B 3.9 (3.0) 0.1 ± 0.05 0.25 0.1 2.9 0.1 X X 8 X4 0.1 0.5 S A B 0.45 ± 0.1 1 0° to 8° 0.08 M S A 0.2 ± 0.02 + 0.036 0.22 – 0.03 DETAIL B 0.1 ± 0.01 + 0.026 0.12 – 0.02 B PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.03g SONY CODE TSSOP-16P-L01 –5–