SONY CXG1090TN

CXG1090TN
High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic
Description
The CXG1090TN is a high power antenna switch
MMIC. The CXG1090TN is suited to connect Tx/Rx
to one of 4 antennas in cellular handset such as PDC.
The CXG1090TN has the integrated control logic
and can be operated with CMOS input.
This IC is designed using the Sony's GaAs J-FET
process which enable the CXG1090TN to be operated
with low voltage.
16 pin TSSOP (Plastic)
Features
• Low insertion loss: 0.30dB (Typ.)@900MHz, 0.40dB (Typ.)@1.5GHz
• Small package: TSSOP-16pin
• High power handling: PldB: 37dBm
• CMOS compatible input control
• Low bias voltage: VDD = 3.0V
Applications
2 × 4 antenna switch for digital cellular telephones such as PDC handsets.
Structure
GaAs J-FET MMIC
Absolute Maximum Ratings
• Bias voltage
VDD
• Control voltage
Vctl
• Operating temperature Topr
• Storage temperature Tstg
7
5
–35 to +85
–65 to +150
V @Ta = 25°C
V @Ta = 25°C
°C
°C
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E99747A9Z-PS
CXG1090TN
Block Diagram
F1
RF4
(Ant/Ext.1)
9
F2
RF5 11
(Rx)
RF6 13
(Diversity 1)
8
RF3
(Tx)
6
RF2
(Ant/Ext.2)
RF1
(Diversity 2)
F4
F3
4
F5
F6
F7
F8
14
3
RF-GND6
RF-GND1
Package Outline/Pin Configuration
9
8
RF3
GND 10
RF4
7
GND
RF5 11
6
RF2
GND 12
5
GND
RF6 13
4
RF1
RF-GND6 14
3
RF-GND1
15
2
CTLC
CTLA 16
1
CTLB
VDD
Recommended Circuit
9
RF4
L1
GND
RF5
L1
RF6
L1
RF-GND6
100pF
10
7
11
6
100pF
GND
12
5
13
4
VDD
3
15
2
100pF
16
CTLA
1kΩ
RF2
L1
GND
RF1
100pF
14
L1
GND
100pF
100pF
Z6
RF3
8
100pF
L1
Z1
100pF
RF-GND1
CTLC
1kΩ
1
CTLB
100pF
100pF
–2–
1kΩ
CXG1090TN
Truth Table
Control
ON
F1
F2
F3
F4
F5
F6
F7
F8
L
RF3 → RF2
OFF
ON
OFF
ON
OFF
OFF
ON
ON
L
H
RF3 → RF4
ON
OFF
ON
OFF
OFF
OFF
ON
ON
L
L
L
RF5 → RF2
ON
OFF
ON
OFF
OFF
OFF
ON
ON
L
L
H
RF5 → RF4
OFF
ON
OFF
ON
OFF
OFF
ON
ON
L
H
L
RF5 → RF6
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
L
H
H
RF5 → RF1
OFF
OFF
OFF
OFF
OFF
ON
ON
OFF
CTLA
CTLB
CTLC
H
L
H
DC Bias Condition
(Ta = 25°C)
Parameter
Min.
Vctl (H) A to C
Vctl (L) A to C
VDD
Typ.
Max.
Unit
2.4
3.6
V
0
0.8
V
2.8
3.2
V
–3–
CXG1090TN
Electrical Characteristics
Parameter
Insertion loss
Isolation
VSWR
ACP (±50kHz)
ACP (±100kHz)
2nd harmonics
3nd harmonics
(Vctl (L) = 0V, Vctl (H) = 3V, Ta = 25°C)
Frequency
Condition
Typ.
Max.
Unit
RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V
0.32
0.55
dB
RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V
0.30
0.55
dB
RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
0.55
0.85
dB
RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
0.55
0.85
dB
RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
0.5
0.8
dB
RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
0.5
0.8
dB
RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V
17
19
dB
RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V
17
21
dB
RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
17
21
dB
RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
17
19
dB
RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
27
34
dB
RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V
20
25
dB
Each ON
810 to 960MHz
Port
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
RF3-RF2
RF3-RF4
1.4
889 to 960MHz
Pin = 29.5dBm, VDD = 3.0V∗1
Pin = 29.5dBm, VDD = 2.8V∗1
889 to 960MHz
Pin = 29.5dBm, VDD = 3.0V∗1
Pin = 29.5dBm, VDD = 2.8V∗1
889 to 960MHz
Pin = 29.5dBm, VDD = 3.0V∗1
Pin = 29.5dBm, VDD = 2.8V∗1
889 to 960MHz
Pin = 29.5dBm, VDD = 3.0V∗1
Pin = 29.5dBm, VDD = 2.8V∗1
–67
–57
dBc
–67
–55
dBc
–75
–65
dBc
–75
–62
dBc
–67
–60
dBc
–67
–57
dBc
–67
–60
dBc
–67
–57
dBc
85
150
µA
VDD = 3.0V
0.45
1
mA
VDD = 2.8V
0.4
0.9
mA
1.0
5.0
µs
Control current
Bias current
Min.
Switching speed
∗1 Input Signal: ACP (±50kHz) < –65dBc, APC (±100kHz) < –75dBc,
2nd harmonics < –65dBc, 3rd harmonics < –65dBc
–4–
CXG1090TN
Package Outline
Unit: mm
16PIN TSSOP(PLASTIC)
1.2MAX
4.1
S
2.05
A
16
B
0.08 S
X2
9
0.2
S A B
3.9
(3.0)
0.1 ± 0.05
0.25
0.1
2.9
0.1
X
X
8
X4
0.1
0.5
S A B
0.45 ± 0.1
1
0° to 8°
0.08 M S A
0.2 ± 0.02
+ 0.036
0.22 – 0.03
DETAIL B
0.1 ± 0.01
+ 0.026
0.12 – 0.02
B
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
LEAD MATERIAL
COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.03g
SONY CODE
TSSOP-16P-L01
–5–