CXG1101TN SP3T Antenna Switch for TDMA800/1900/AMPS800 Triple Mode Application Description The SP3T is a high power antenna switch MMIC for use in TDMA800/1900/AMPS800 triple mode handsets. One Antenna can be routed to one of AMPS, PCS Tx and PCS Rx. This IC is designed using the Sony's JFET process for low insertion loss. 10 pin TSSOP (Plastic) Features • Low second harmonics < –31dBm at 29dBm @2.8V • Low insertion loss: 0.3dB (Ant. – AMPS) • Small package size: TSSOP-10pin (3.2mm × 2.8mm) Applications TDMA800/1900/AMPS800 triple mode handsets. Structure GaAs J-FET MMIC Absolute Maximum Ratings (Ta = 25°C) • Control voltage | VCTL | 5 VCTL (H) – VCTL (L) 5 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –60 to +150 V V °C °C Notes on Handling GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Block Diagram Pin Configuration ON Ant 6 5 Rx (TDMA1900 (Rx)) 3 Tx (TDMA1900 (Tx)) Ant 6 5 Rx (TDMA1900 (Rx)) GND 7 4 GND CTL1 8 3 Tx (TDMA1900 (Tx)) CTL2 9 2 GND CTL3 10 1 AMPS CTL1 ON CTL2 ON 1 AMPS CTL3 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E00443B25-PS CXG1101TN Recommended Circuit CRF (100pF) Ant CRF (100pF) 6 5 7 4 8 3 9 2 10 1 RCTL (1kΩ) CTL1 Rx (TDMA1900 (Rx)) CRF (100pF) Tx (TDMA1900 (Tx)) Cbypass (100pF) RCTL (1kΩ) CTL2 Cbypass (100pF) RCTL (1kΩ) CTL3 CRF (100pF) AMPS Cbypass (100pF) When using this IC, the following external parts should be used: RCTL: This resistor is used to improve ESD performance. 1kΩ is recommended. CRF: This capacitor is used for RF de-coupling and must be used for all applications. 100pF is recommended. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. –2– CXG1101TN Truth Table On Pass CTL1 CTL2 CTL3 Ant – Rx (TDMA1900 (Rx)) H L L Ant – Tx (TDMA1900 (Tx)) L H L Ant – AMPS L L H Electrical Characteristics VCTL = 0/2.8V control. All measurements are made in a 50Ω system, and unused ports are terminated with 50Ω. Item Insertion loss Isolation VSWR Harmonics Symbol IL ISO. Control current ∗1 ∗2 ∗3 ∗4 Condition 2fo 3fo Min. Typ. Max. Unit Ant – Tx ∗1 — 0.60 0.85 dB Ant – Rx ∗2 — 0.65 0.90 dB Ant – AMPS ∗3 — 0.30 0.55 dB Ant – Tx 14 16 — dB Ant – Rx 14 16 — dB Ant – AMPS 18 21 — dB — 1.2 1.5 — — –45 –31 dBm — –40 –31 dBm 32 35 — dBm — 100 500 ns — 5 20 µA VSWR 1dB compression input power P1dB Switching speed Port (Ta = 25°C) Ant – Tx Ant – AMPS ∗1, ∗3 Ant – Tx Ant – AMPS VCTL = 2.8V TSW ∗4 ICTL Pin = 29dBm, 1900MHz Pin = 10dBm, 1900MHz Pin = 29dBm, 800MHz No signal input –3– CXG1101TN Package Outline Unit: mm 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 0.1 10 + 0.15 0.1 – 0.05 0.45 ± 0.15 3.2 ± 0.2 ∗2.2 ± 0.1 6 5 1 0.5 0.22 0.1 0.25 0° to 10° M (0.1) + 0.025 0.12 – 0.015 A (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: “∗” Dimensions do not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.02g TSSOP-10P-L01 SONY CODE SCT Ass'y 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 0.1 10 + 0.15 0.1 – 0.05 0.45 ± 0.15 3.2 ± 0.2 ∗2.2 ± 0.1 6 5 1 0.5 0.22 0.1 0.25 0° to 10° M (0.1) + 0.025 0.12 – 0.015 A (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: “∗” Dimensions do not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.02g TSSOP-10P-L01 SONY CODE LEAD PLATING SPECIFICATIONS ITEM SPEC. LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm –4– Sony Corporation