CXP7400P10 CMOS 8-bit Single Chip Microcomputer Description The CXP7400P10 is a CMOS 8-bit microcomputer integrating on a single chip an A/D converter, serial interface, timer/counter, time-base timer, capture timer/counter, remote control receive circuit, PWM output, and the like besides the basic configurations of 8-bit CPU, ROM, RAM, and I/O port. The CXP7400P10 also provides the sleep/stop functions that enable lower power consumption. The CXP7400P10 is the PROM-incorporated version of the CXP740056/740096/740010 with builtin mask ROM. This provides the additional feature of being able to write directly into the program. Thus, it is most suitable for evaluation use during system development and for small-quantity production. 100 pin QFP (Plastic) 100 pin LQFP (Plastic) Structure Silicon gate CMOS IC Features • A wide instruction set (211 instructions) which covers various types of data. — 16-bit arithmetic/multiplication and division/Boolean bit operation instructions • Minimum instruction cycle 167ns at 24MHz operation (4.5 to 5.5V) 333ns at 12MHz operation (2.7 to 5.5V) 122µs at 32kHz operation (2.7 to 5.5V) • Incorporated PROM capacity 120K bytes • Incorporated RAM capacity 4096 bytes • Peripheral functions — A/D converter 8 bits, 8 channels, successive approximation method (Conversion time 10.3µs at 24MHz) — Serial interface Srart-stop synchronization (UART), 1 channel Incorporated buffer RAM (Auto transfer for 1 to 32 bytes), 2 channels 8-bit clock syncronization (MSB/LSB first selectable), 1 channel — Timer 8-bit timer 2 channels, 8-bit timer/counter 2 channels, 19-bit time-base timer, 16-bit capture timer/counter 32kHz timer/counter — Remote control receive circuit Noise elimination circuit 8-bit pulse measuring counter, 6-stage FIFO — PWM output 12 bits, 2 channels • Interruption 22 factors, 15 vectors, multi-interruption possible • Standby mode Sleep/stop • Package 100-pin plastic QFP/LQFP Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E98518-PS 8-BIT TIMER/COUNTER 0 8-BIT TIMER 1 8-BIT TIMER/COUNTER 2 8-BIT TIMER 3 16-BIT CAPTURE TIMER/COUNTER 4 EC0 TO0 EC1 TO1 TO2 CINT EC2 ADJ SERIAL INTERFACE UNIT (CH2) BUFFER RAM BUFFER RAM SI2 SO2 SCK2 SERIAL INTERFACE UNIT (CH1) SERIAL INTERFACE UNIT (CH0) FIFO 12-BIT PWM GENERATOR 1 12-BIT PWM GENERATOR 0 UART BAUD RATE GENERATOR UART RECEIVER UART TRANSMITTER CS0 SI0 SO0 SCK0 CS1 SI1 SO1 SCK1 AVSS A/D CONVERTER AVDD REMOCON IN 12 AVREF RMC PWM0 PWM1 RxD TxD AN0 to AN11 2 2 2 PRESCALER/ TIME-BASE TIMER PROM 120K BYTES SPC 700 αII CPU CORE PORT K 32kHz TIMER/COUNTER RAM 4096 BYTES CLOCK GENERATOR/ SYSTEM CONTROL 5 PK3 to PK7 NMI INT0 INT1 INT2 INT3 INT4 INTERRUPT CONTROLLER TEX TX EXTAL XTAL RST VDD VSS Vpp 2 PK1 to PK2 –2– PORT I PORT H PORT G PORT F PORT E PORT D PORT C PORT B PORT A PORT J Block Diagram PH0 to PH7 PI1 to PI7 8 7 PJ0 to PJ7 PG0 to PG7 8 8 PF0 to PF7 PE2 to PE7 6 8 PE0 to PE1 PD0 to PD7 PC0 to PC7 PB0 to PB7 PA0 to PA7 2 8 8 8 8 CXP7400P10 CXP7400P10 PI4/INT1/CS1 PI5/SCK1 PI3/TO0/ADJ PI1/RMC PI2/NMI PK2/TEX PK1/TX VSS VDD Vpp PA6 PA7 PA4 PA5 PA2 PA3 PA0 PA1 PC7 PC6 Pin Assignment (Top View) 100-pin QFP package AA 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 PC5 1 PC4 2 PC3 3 PC2 4 PC1 5 80 PI6/SO1 79 PI7/SI1 78 PE0/INT0 77 PE1/INT2 76 PE2/PWM0 PC0 6 75 PE3/PWM1 PB7/SI2 7 74 PE4 PB6/SO2 8 73 PE5 PB5/SCK2 9 72 PE6 PB4/TO2 10 71 PE7 PB3 11 70 PG0/TxD PB2 12 69 PG1/RxD PB1 13 68 PG2/EC0 PB0 14 67 PG3/EC1 PJ7 15 66 PG4/EC2 PJ6 16 65 PG5/INT3 PJ5 17 64 PG6/INT4 PJ4 18 63 PG7/CINT PJ3 19 62 AN0 PJ2 20 61 AN1 PJ1 21 60 AN2 PJ0 22 59 AN3 PD7 23 58 PF0/AN4 PD6 24 57 PF1/AN5 PD5 25 56 PF2/AN6 PD4 26 55 PF3/AN7 PD3 27 54 AVDD PD2 28 53 AVREF PD1 29 52 AVSS PD0 30 51 PF4/AN8 Note) 1. Vpp (Pin 90) is left open. 2. VSS (Pins 41 and 88) are both connected to GND. –3– PF5/AN9 PF6/AN10 PF7/AN11 PK4/SO0 PK3/SCK0 PK5/SI0 PK6/CS0 XTAL EXTAL VSS RST PK7/TO1 PH0 PH1 PH2 PH3 PH4 PH6 PH5 PH7 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 CXP7400P10 PI7/SI1 PE0/INT0 PI6/SO1 PI5/SCK1 PI3/TO0/ADJ PI4/INT1/CS1 PI1/RMC PI2/NMI PK2/TEX PK1/TX VDD VSS PA7 Vpp PA5 PA6 PA4 PA2 PA3 PA0 PA1 PC7 PC6 PC4 PC5 Pin Assignment (Top View) 100-pin LQFP package 1 PE1/INT2 2 74 PE2/PWM0 PC1 AA 75 PC2 3 73 PE3/PWM1 PC0 4 72 PE4 PB7/SI2 5 71 PE5 PB6/SO2 6 70 PE6 PB5/SCK2 7 69 PE7 PB4/TO2 8 68 PG0/TxD PB3 9 67 PG1/RxD PB2 10 66 PG2/EC0 PB1 11 65 PG3/EC1 PB0 12 64 PG4/EC2 PJ7 13 63 PG5/INT3 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 PC3 PJ6 14 62 PG6/INT4 PJ5 15 61 PG7/CINT PJ4 16 60 AN0 PJ3 17 59 AN1 PJ2 18 58 AN2 PJ1 19 57 AN3 PJ0 20 56 PF0/AN4 PD7 21 55 PF1/AN5 PD6 22 54 PF2/AN6 PD5 23 53 PF3/AN7 PD4 24 52 AVDD PD3 25 51 AVREF Note) 1. Vpp (Pin 88) is left open. 2. VSS (Pins 39 and 86) are both connected to GND. –4– AVSS PF5/AN9 PF4/AN8 PF6/AN10 PF7/AN11 PK3/SCK0 PK4/SO0 PK5/SI0 EXTAL PK6/CS0 XTAL VSS RST PK7/TO1 PH0 PH1 PH2 PH4 PH3 PH5 PH6 PH7 PD0 PD1 PD2 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 CXP7400P10 Pin Description Symbol I/O PA0 to PA7 I/O PB0 to PB3 I/O PB4/TO2 I/O/Output PB5/SCK2 I/O/I/O PB6/SO2 I/O/Output PB7/SI2 I/O/Input Description (Port A) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) (Port B) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) 16-bit timer/counter rectangular wave output. Serial clock I/O (CH2). Serial data output (CH2). Serial data input (CH2). I/O (Port C) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) PD0 to PD7 I/O (Port D) 8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA sink current. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) PE0/INT0 Input/Input PC0 to PC7 PE1/INT2 Input/Input PE2/PWM0 Output/Output PE3/PWM1 Output/Output PE4 to PE7 Output PF0/AN4 to PF7/AN11 I/O/Input (Port E) 8-bit port. Lower 2 bits are for input; upper 6 bits are for output. (8 pins) (Port F) 8-bit I/O port. I/O can be set in a unit of single bits. PF4 to PF7 can be set in a unit of single bits as standby release inputs. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) –5– External interrupt inputs. (2 pins) 12-bit PWM outputs. (2 pins) Analog inputs to A/D converter. (8 pins) CXP7400P10 I/O Symbol PG0/TxD I/O/Output PG1/RxD I/O/Input PG2/EC0 I/O/Input PG3/EC1 I/O/Input PG4/EC2 I/O/Input PG5/INT3 I/O/Input PG6/INT4 I/O/Input PG7/CINT I/O/Input PH0 to PH7 Output PI1/RMC I/O/Input PI2/NMI I/O/Input Description UART transmission data output. (Port G) 8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) UART reception data input. External event input for 8-bit timer/counter 0. External event input for 8-bit timer/counter 2. External event input for 16-bit timer/counter. External interrupt inputs. (2 pins) External capture input to 16-bit timer/counter. (Port H) 8-bit output port. Operated as N-ch open drain output for medium voltage drive (12V) and large current (12mA). (8 pins) Remote control receiver circuit input. Non-maskable interrupt input. (Port I) 7-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (7 pins) Output for the 8-bit timer/counter 1 rectanguler waves and TEX oscillation frequency demultiplication. PI3/TO0/ ADJ I/O/Output/ Output PI4/INT1/ CS1 I/O/Input/ Input PI5/SCK1 I/O/I/O PI6/SO1 I/O/Output Serial data output (CH1). PI7/SI1 I/O/Input Serial data input (CH1). PJ0 to PJ7 I/O PK1/TX Input PK2/TEX Input/Input PK3/SCK0 I/O/I/O PK4/SO0 I/O/Output PK5/SI0 I/O/Input PK6/CS0 I/O/Input PK7/TO1 I/O/Output External interrupt input. Chip select input for serial interface (CH1). Serial clock I/O (CH1). (Port J) 8-bit I/O port. I/O can be set in a unit of single bits. Standby release input can be set in a unit of single bits. Incorporation of pull-up resistor can be set through the program in a unit of single bits. (8 pins) Crystal connectors for 32-kHz timer/counter clock oscillation circuit. (Port K) 7-bit port. Lower 2 bits are for For usage as event counter, connect clock input; upper 5 bits are for I/O. oscillation source to TEX, and leave TX open. I/O can be set in a unit of single bits. Serial clock I/O (CH0). For PK3 to PK7, incorporation of pull-up resistor can be set Serial data output (CH0). through the program in a unit Serial data input (CH0). of single bits. Chip select input for serial inteface (CH0). (7 pins) 8-bit timer/counter 3 rectangular wave output. –6– CXP7400P10 Symbol I/O Description Analog inputs to A/D converter. (4 pins) AN0 to AN3 Input EXTAL Input Connects a crystal for system clock oscillation. When a clock is supplied externally, input it to EXTAL pin and input a reversed phase clock to XTAL pin. Input System reset; active at Low level. XTAL RST Vpp Positive power supply pin for incorporated PROM writing. Leave this pin open for normal operation. (Connected to VDD internally.) AVDD Positive power supply of A/D converter. AVREF Input Reference voltage input of A/D converter. AVSS GND of A/D converter. VDD Positive power supply. VSS GND. Connect both VSS pins to GND. –7– CXP7400P10 I/O Circuit Format for Pins Pin Circuit format Port A Port B Port C AAAA AAAAA AAAA AAAAA AAAAA AAAAA “0” after a reset Ports A, B, C direction “0” after a reset Internal data bus RD (Ports A, B, C) 18 pins Port B ∗ Pull-up resistor Ports A, B, C data PA0 to PA7 PB0 PB2 PC0 to PC7 After a reset AAAA AAAA AAAA AAAA AAAA A A AA AA IP ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) ∗ Pull-up resistor “0” after a reset Port B data PB1 PB3 Port B direction “0” after a reset Internal data bus RD (Port B) Hi-Z A A AA AA Hi-Z IP Schmitt input ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) 2 pins AAAA AAAA AAAAA AAAAA AAAAA AAAAA AAAAA PortB Port I Port K ∗ Pull-up resistor “0” after a reset AA AA AA AA TO2, TO0/ADJ, TO1 PB4/TO2 PI3/TO0/ADJ PK7/TO1 Ports B, I, K function select “0” after a reset Ports B, I, K data Ports B, I, K direction IP “0” after a reset Internal data bus RD (Ports B, I, K) ∗ Pull-up transistors 3 pins approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) –8– Hi-Z CXP7400P10 Circuit format Pin After a reset Port B Port I AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA Port K ∗ Pull-up resistor “0” after a reset Output buffer capability “0” after a reset Output enable PB5/SCK2 PI5/SCK1 PK3/SCK0 SCK2, SCK1, SCK0 Ports B, I, K function select “0” after a reset Ports B, I, K data Ports B, I, K direction AA AA AA AA Hi-Z IP “0” after a reset Internal data bus Schmitt input RD (Ports B, I, K) ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) SCK2, SCK1, SCK0 3 pins Port B Port G Port I AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA AAAA Port K ∗ Pull-up resistor “0” after a reset Output buffer capability PB6/SO2 PG0/TxD PI6/SO1 PK4/SO0 “0” after a reset Output enable SO2, TxD, SO1, SO0 AA AA AA Ports B, G, I, K function select “0” after a reset Ports B, G, I, K data Ports B, G, I, K direction IP “0” after a reset Internal data bus RD (Ports B, G, I, K) ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) 4 pins –9– Hi-Z CXP7400P10 Circuit format Pin Port B Port G PB7/SI2 PG1/RxD PG2/EC0 PG3/EC1 PG4/EC2 PG5/INT3 PG6/INT4 PG7/CINT PI1/RMC PI2/NMI PI4/INT1/CS1 PI7/SI1 PK5/SI0 PK6/CS0 Port I Port K AAAAA AAAAA AAAAA AAAAA AAAAA After a reset ∗ Pull-up resistor “0” after a reset Ports B, G, I, K data Ports B, G, I, K direction AA A AA A IP “0” after a reset Schmitt input Internal data bus Hi-Z RD (Ports B, G, I, K) SI2, RxD, EC0, EC1, EC2, INT3, INT4, CINT, RMC, NMI, INT1/CS1, SI1, SI0, CS0 ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) 14 pins Port D AAAA AAAA AAAA AAAA AAAA ∗2 Pull-up resistor “0” after a reset Port D data PD0 to PD7 ∗1 Port D direction IP Internal data bus RD (Port D) Hi-Z ∗1 Large current 12mA (VDD = 4.5 to 5.5V) 4.5mA (VDD = 2.7 to 3.3V) ∗2 Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) 8 pins Port E AA AA A AAAA AAAA Schmitt input PE0/INT0 PE1/INT2 2 pins INT0, INT2 IP Internal data bus RD (Port E) – 10 – Hi-Z CXP7400P10 Circuit format Pin After a reset Port E AAAA AAAA AAAA AAAA AAAA AA AA PWM0, PWM1 PE2/PWM0 PE3/PWM1 Port E function select “0” after a reset Port E data Hi-Z Hi-Z by writing to Port E data register or Port E function select register → Output active Internal data bus 2 pins RD (Port E) AA AA Port E Port E data PE4 PE5 Internal data bus RD (Port E) Hi-Z Hi-Z by writing to Port E data register → Output active 2 pins Port E AAAA AAAA AA AA Port E data PE6 “1” after a reset Internal data bus 1 pin "H" level RD (Port E) Port E ∗ Internal reset signal PE7 AAAA AAAA AA AA Port E data “1” after a reset Internal data bus RD (Port E) 1 pin AN0 to AN3 AAAA AA ) ) Input multiplexer A/D converter IP 4 pins ∗ Pull-up transistors approx. 150kΩ (VDD = 4.5 to 5.5V) approx. 200kΩ (VDD = 2.7 to 3.3V) "H" level "H" level at ON resistance of pull-up transistor during a reset. – 11 – Hi-Z CXP7400P10 Circuit format Pin Port F AAAA AAAA AAAA AAAA AAAA AAAA AAAA After a reset ∗ Pull-up resistor “0” after a reset Port F data PF0/AN4 to PF3/AN7 Port F direction “0” after a reset Internal data bus AA AA A A IP Hi-Z RD (Port F) Port F function select “0” after a reset A/D converter 4 pins Port F Input multiplexer AAAA AAAA AAAA AAAA AAAA AAAA AAAA A AAAAA AAAA ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) ∗ Pull-up resistor “0” after a reset Port F data Port F direction “0” after a reset Internal data bus PF4/AN8 to PF7/AN11 RD (Port F) AA AA AA IP Port F function select Hi-Z “0” after a reset Standby release Edge detection Polarity select “0” after a reset Input multiplexer A/D converter ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) 4 pins – 12 – CXP7400P10 Circuit format Pin Port H AAAA ∗ Port H data PH0 to PH7 “1” after a reset Hi-Z ∗ High tension proof 12V Large current 12mA (VDD = 4.5 to 5.5V) 4.5mA (VDD = 2.7 to 3.3V) Internal data bus RD (Port H) 8 pins Port J AA AA After a reset AAAA AAAA AAAA AAAA AAAA ∗ Pull-up resistor “0” after a reset AA AA AA Port J data Port J direction IP “0” after a reset PJ0 to PJ7 Internal data bus RD (Port J) Hi-Z Standby release AAAA A AAAA Edge detection Polarity select “0” after a reset 8 pins ∗ Pull-up transistors approx. 100kΩ (VDD = 4.5 to 5.5V) approx. 150kΩ (VDD = 2.7 to 3.3V) Port K TEX oscillation circuit control “1” after a reset Internal data bus RD (Port K) PK1/TX PK2/TEX Internal data bus RD (Port K) Schmitt input PK2/TEX IP IP Clock input 2 pins PK1/TX – 13 – Oscillation stop port input CXP7400P10 Circuit format Pin EXTAL XTAL 2 pins After a reset AA AA A AA AA A AA AA EXTAL IP • Diagram shows circuit configuration during oscillation. • When program stops the oscillation, the feedback registor disconnects, and XTAL is driven at "H" level. IP Oscillation XTAL Pull-up resistor RST AA Mask option OP 1 pin AA Schmitt input IP – 14 – "L" level (during a reset) CXP7400P10 Absolute Maximum Ratings Item (Vss = 0V reference) Rating Unit VDD –0.3 to +7.0 V Vpp V AVDD –0.3 to +13.0 AVSS to +7.0∗1 AVSS –0.3 to +0.3 V AVREF V VIN AVSS to +7.0 –0.3 to +7.0∗2 Output voltage VOUT –0.3 to +7.0∗2 V High level output current IOH –5 mA Output (value per pin) –50 mA Total for all output pins IOL 15 mA All pins excluding large current outputs (value per pin) IOLC 20 mA Large current outputs (value per pin) ∗3 Low level total output current ∑IOL 100 mA Total for all output pins Operating temperature Topr –20 to +75 °C Storage temperature Tstg –55 to +150 °C Allowable power dissipation PD Supply voltage Input voltagte Symbol High level total output current ∑IOH Low level output current 600 380 Remarks Incorporated PROM V V mW QFP package LQFP package ∗1 AVDD and VDD must be set to the same voltage. ∗2 VIN and VOUT must not exceed VDD + 0.3V. ∗3 The large current output pins are Port D and H (PD, PH). Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should be conducted under the recommended operating conditions. Exceeding these conditions may adversely affect the reliability of the LSI. – 15 – CXP7400P10 Recommended Operating Conditions Item Supply voltage Analog voltage Symbol VDD AVDD VIH High level input voltage VIHS VIHEX VIL Low level input voltage VILS VILEX Operating temperature Topr (Vss = 0V reference) Min. Max. Unit Remarks 4.5 5.5 V 2.7 5.5 V fc = 24MHz or less Guaranteed operation range for 1/2 and 1/4 fc = 12MHz or less frequency dividing clock 2.7 5.5 V Guaranteed operation range for 1/16 frequency dividing clock or sleep mode 2.7 5.5 V Guarantteed operaion range for TEX 2.5 5.5 V 2.7 5.5 V Guaranteed data hold operation range during stop mode ∗1 0.7VDD VDD V ∗2, ∗6 0.8VDD VDD V ∗2, ∗7 0.8VDD VDD V VDD – 0.4 VDD + 0.3 V VDD – 0.2 VDD + 0.2 V Hysteresis input∗3 EXTAL pin∗4, ∗6, TEX pin∗5, ∗6 0 0.3VDD V EXTAL pin∗4, ∗7, TEX pin∗5, ∗7 ∗2, ∗6 0 0.2VDD V ∗2, ∗7 0 0.2VDD V –0.3 0.4 V Hysteresis input∗3 EXTAL pin∗4, ∗6, TEX pin∗5, ∗6 –0.3 0.2 V EXTAL pin∗4, ∗7, TEX pin∗5, ∗7 –20 +75 °C ∗1 AVDD and VDD must be set to the same voltage. ∗2 Normal input port (PA, PB0, PB2, PB4, PB6, PC, PD, PF, PG0, PI3, PI6, PJ, PK1, PK2, PK4, PK7) ∗3 RST, PB1, PB3, PB5/SCK2, PB7/SI2, PE0/INT0, PE1/INT2, PG1/RxD, PG2/EC0, PG3/EC1, PG4/EC2, PG5/INT3, PG6/INT4, PG7/CINT, PI1/RMC, PI2/NMI, PI4/INT1/CS1, PI5/SCK1, PI7/SI1, PK3/SCK0, PK5/SI0, PK6/CS0 ∗4 Specifies only when the external clock is input. ∗5 Specifies only when the external event count is input. ∗6 This case applies to the range of 4.5 to 5.5V supply voltage (VDD). ∗7 This case applies to the range of 2.7 to 5.5V supply voltage (VDD). – 16 – CXP7400P10 Electrical Characteristics (Ta = –20 to +75°C, VSS = 0V reference) DC Characteristics (VDD = 4.5 to 5.5V) Item Symbol High level VOH output voltage Low level output voltage VOL Pins PA to PD, PE2 to PE7, PF to PG, PI to PJ, PK3 to PK7 PB5, PB6∗1, PG0∗1, PI5, PI6∗1, PK3, PK4∗1 IILE IIHT Input current IILT IILR IIL I/O leakage current IIZ Open drain output leakage current LLOH (N-ch Tr off state) Min. EXTAL TEX RST∗2 PA to PD∗3, PF to PG∗3, PI to PK∗3 PA to PD∗3, PF to PG∗3, PI to PK∗3, PE, AN0 to AN3 RST∗2 PH Typ. Max. Unit VDD = 4.5V, IOH = –0.5mA 4.0 V VDD = 4.5V, IOH = –1.2mA 3.5 V VDD = 4.5V, IOH = –1.0mA 4.0 V VDD = 4.5V, IOH = –2.4mA 3.5 V PA to PD, VDD = 4.5V, IOL = 1.8mA PE2 to PE7, PF to PG, PI to PJ, VDD = 4.5V, IOL = 3.6mA PK3 to PK7 PD, PH IIHE Conditions VDD = 4.5V, IOL = 12.0mA 0.4 V 0.6 V 1.5 V VDD = 5.5V, VIH = 5.5V 0.5 40 µA VDD = 5.5V, VIL = 0.4V –0.5 –40 µA VDD = 5.5V, VIL = 5.5V 0.1 10 µA VDD = 5.5V, VIL = 0.4V –0.1 –10 µA –1.5 –400 µA –45 µA VDD = 5.5V, VIL = 0.4V VDD = 4.5V, VIL = 4.0V –2.78 µA VDD = 5.5V VI = 0, 5.5V ±10 µA VDD = 5.5V VOH = 12V 50 µA – 17 – CXP7400P10 Item Symbol Pins Conditions 24MHz crystal oscillation (C1 = C2 = 15pF) IDD1 Min. Typ. Max. Unit 50 62 mA 1.8 9.0 mA 43 80 µA 13 40 µA 10 µA 20 pF VDD = 5V ± 0.5V Sleep mode IDDS1 VDD = 5V ± 0.5V Supply current∗4 IDD2 32kHz crystal oscillation (C1 = C2 = 47pF) VDD VDD = 3V ± 0.3V Sleep mode IDDS2 VDD = 3V ± 0.3V IDDS3 Stop mode (Termination of EXTAL and TEX pins crystal oscillation) VDD = 5V ± 0.5V Input capacity CIN PA to PD, PE0 to PE1, PF to PG, Clock 1MHz PI to PK, 0V for all pins excluding measured AN0 to AN3, pins EXTAL, RST 10 ∗1 This case applies that Port B buffer capability switching register (BUFB: 010F4h, bits 6 and 5 = "1, 1") and Ports G/I/K buffer capability switching register (BUFG: 010F5h, bits 0, 3, 4, 5 and 6 = "1, 1, 1, 1, 1") are ON. ∗2 RST pin specifies the input current when the pull-up resistor is selected, and specifies the leakage current when no resistor is selected. ∗3 PA to PD, PF to PG and PI to PK pins specify the input current when the pull-up resistor is selected, and specify the leakage current when no resistor is selected. ∗4 When all output pins are open. – 18 – CXP7400P10 Electrical Characteristics (Ta = –20 to +75°C, VSS = 0V reference) DC Characteristics (VDD = 2.7 to 3.3V) Item Symbol High level VOH output voltage Low level output voltage VOL Pins PA to PD, PE2 to PE7, PF to PG, PI to PJ, PK3 to PK7 PB5, PB6∗1, PG0∗1, PI5, PI6∗1, PK3, PK4∗1 IIHE EXTAL IIHT Input current IILT IILR IIL I/O leakage current IIZ Open drain output leakage current LLOH (N-ch Tr off state) Min. TEX RST∗2 PA to PD∗3, PF to PG∗3, PI to PK∗3 PA to PD∗3, PF to PG∗3, PI to PK∗3, PE, AN0 to AN3 RST∗2 PH Typ. Max. Unit VDD = 2.7V, IOH = –0.12mA 2.5 V VDD = 2.7V, IOH = –0.45mA 2.1 V VDD = 2.7V, IOH = –0.24mA 2.5 V VDD = 2.7V, IOH = –0.90mA 2.1 V PA to PD, VDD = 2.7V, IOL = 1.0mA PE2 to PE7, PF to PG, PI to PJ, VDD = 2.7V, IOL = 1.4mA PK3 to PK7 PD, PH IILE Conditions VDD = 2.7V, IOL = 4.5mA 0.25 V 0.4 V 0.9 V VDD = 3.3V, VIH = 3.3V 0.3 20 µA VDD = 3.3V, VIL = 0.3V –0.3 –20 µA VDD = 3.3V, VIL = 3.3V 0.1 10 µA VDD = 3.3V, VIL = 0.4V –0.1 –10 µA –0.9 –200 µA –20 µA VDD = 3.3V, VIL = 0.3V VDD = 3.3V, VIL = 2.7V –1.0 µA VDD = 3.3V VI = 0, 3.3V ±10 µA VDD = 3.3V VOH = 12V 50 µA – 19 – CXP7400P10 Item Symbol Pins 12MHz crystal oscillation (C1 = C2 = 15pF) IDD1 Supply current∗4 IDDS1 IDDS3 Conditions VDD = 3.0V ± 0.3V∗3 Min. Typ. Max. Unit 12 30 mA 0.7 3.5 mA 10 µA 20 pF Sleep mode VDD VDD = 3.0V ± 0.3V Stop mode (Termination of EXTAL and TEX pins crystal oscillation) VDD = 3.0V ± 0.3V Input capacity CIN PA to PD, PE0 to PE1, PF to PG, Clock 1MHz PI to PK, 0V for all pins excluding measured AN0 to AN3, pins EXTAL, RST 10 ∗1 This case applies that Port B buffer capability switching register (BUFB: 010F4h, bits 6 and 5 = "1, 1") and Ports G/I/K buffer capability switching register (BUFG: 010F5h, bits 0, 3, 4, 5 and 6 = "1, 1, 1, 1, 1") are ON. ∗2 RST pin specifies the input current when the pull-up resistor is selected, and specifies the leakage current when no resistor is selected. ∗3 PA to PD, PF to PG and PI to PK pins specify the input current when the pull-up resistor is selected, and specify the leakage current when no resistor is selected. ∗4 When all output pins are open. – 20 – CXP7400P10 AC Characteristics (1) Clock timing (Ta = –20 to +75°C, VDD = 2.7 to 5.5V, Vss = 0V reference) Item Symbol Pin Conditions Min. VDD = 4.5 to 5.5V fC XTAL EXTAL Fig. 1, Fig. 2 System clock input pulse width tXL, tXH EXTAL Fig. 1, Fig. 2 VDD = 4.5 to 5.5V External clock drive System clock input rise time, fall time EXTAL Fig. 1, Fig. 2 External clock drive EC Fig. 3 Event count input clock rise time, fall time tCR, tCF tEH, tEL tER, tEF EC Fig. 3 System clock frequency fC TEX TX VDD = 2.7 to 5.5V Fig. 2 (32kHz clock applied condition) Event count input clock pulse width tTL, tTH tTR, tTF TEX Fig. 3 TEX Fig. 3 System clock frequency Event count input clock pulse width Event count input clock rise time, fall time Typ. Max. 1 24 1 12 28 Unit MHz ns 37.5 200 tsys + 50∗1 ns ns 20 ms kHz 32.768 µs 10 20 ms ∗1 tsys indicates three values according to the contents of the clock control register (CLC: 000FEh) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (upper two bits = “00”), 4000/fc (upper two bits = “01”), 16000/fc (upper two bits = “11”) 1/fc VDD – 0.4V (VDD = 4.5 to 5.5V) VDD – 0.2V EXTAL 0.4V (VDD = 4.5 to 5.5V) 0.2V tXH tCF tXL tCR Fig. 1. Clock timing AAAA AAAA AAAA AAAAAAAAAAAA Crystal oscillation Ceramic oscillation EXTAL C1 External clock EXTAL XTAL C2 32kHz clock applied conditions Crystal oscillation TEX XTAL 74HC04 TX C1 C2 Fig. 2. Clock applied conditions 0.8VDD TEX EC0 EC1 EC2 0.2VDD tEH tTH tEF tTF tEL tTL Fig. 3. Event count clock timing – 21 – tER tTR CXP7400P10 (2) Serial transfer (CH0, CH1) Item Symbol (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Pin Conditions Min. Max. Unit CS↓ → SCK delay time tDCSK SCK0 SCK1 Chip select transfer mode (SCK = output mode) 1.5tsys + 200 ns CS↑ → SCK floating delay time tDCSKF SCK0 SCK1 Chip select transfer mode (SCK = output mode) 1.5tsys + 200 ns CS↓ → SO delay time tDCSO SO0 SO1 Chip select transfer mode 1.5tsys + 200 ns CS↑ → SO floating delay time tDCSOF SO0 SO1 Chip select transfer mode 1.5tsys + 200 ns CS High level width tWHCS CS0 CS1 Chip select transfer mode tsys + 200 ns SCK cycle time tKCY SCK0 SCK1 Input mode 2tsys + 200 ns 8000/fc ns SCK High and Low level width tKH tKL SCK0 SCK1 Input mode tsys + 100 ns Output mode 4000/fc – 50 ns SI input setup time (for SCK↑) tSIK SI0 SI1 SCK input mode –tsys + 100 ns 200 ns SI input hold time (for SCK↑) tKSI SI0 SI1 SCK input mode 2tsys + 200 ns 100 ns SCK↓ → SO delay time tKSO SO0 SO1 SCK input mode Output mode SCK output mode SCK output mode SCK output mode 2tsys + 200 ns 100 ns Note 1) tsys indicates three values according to the contents of the clock control register (CLC: 000FEh) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (upper 2 bits = “00”), 4000/fc (upper 2 bits = “01”), 16000/fc (upper 2 bits = “11”) Note 2) CS, SCK, SI and SO represent CS0, SCK0, SI0 and SO0 for CH0; they represent CS1, SCK1, SI1 and SO1 for CH1, respectively. Note 3) The load of SCK output mode and SO output delay time is 50pF + 1TTL. Note 4) This case applies that Port I/K output buffer capability switching register (BUFG: 010F5h, bits 6, 5, 4 and 3 = "0, 0, 0, 0") is OFF. – 22 – CXP7400P10 Serial transfer (CH0, CH1) Item Symbol (Ta = –20 to +75°C, VDD = 2.7 to 3.3V, Vss = 0V reference) Pin Conditions Min. Max. Unit CS↓ → SCK delay time tDCSK SCK0 SCK1 Chip select transfer mode (SCK = output mode) 1.5tsys + 250 ns CS↑ → SCK floating delay time tDCSKF SCK0 SCK1 Chip select transfer mode (SCK = output mode) 1.5tsys + 250 ns CS↓ → SO delay time tDCSO SO0 SO1 Chip select transfer mode 1.5tsys + 250 ns CS↑ → SO floating delay time tDCSOF SO0 SO1 Chip select transfer mode 1.5tsys + 250 ns CS High level width tWHCS CS0 CS1 Chip select transfer mode tsys + 200 ns SCK cycle time tKCY SCK0 SCK1 Input mode 2tsys + 200 ns 8000/fc ns SCK High and Low level widths tKH tKL SCK0 SCK1 Input mode tsys + 100 ns 4000/fc – 100 ns SI input setup time (for SCK↑) tSIK SI0 SI1 SCK input mode –tsys + 100 ns 200 ns SI input hold time (for SCK↑) tKSI SI0 SI1 SCK input mode 2tsys + 200 ns 100 ns SCK↓ → SO delay time tKSO SO0 SO1 SCK input mode Output mode Output mode SCK output mode SCK output mode SCK output mode 2tsys + 250 ns 125 ns Note 1) tsys indicates three values according to the contents of the clock control register (CLC: 000FEh) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (upper 2 bits = “00”), 4000/fc (upper 2 bits = “01”), 16000/fc (upper 2 bits = “11”) Note 2) CS, SCK, SI and SO represent CS0, SCK0, SI0 and SO0 for CH0; they represent CS1, SCK1, SI1 and SO1 for CH1, respectively. Note 3) The load of SCK output mode and SO output delay time is 50pF. Note 4) This case applies that Port I/K output buffer capability switching register (BUFG: 010F5h, bits 6, 5, 4 and 3 = "1, 1, 1, 1") is ON. – 23 – CXP7400P10 tWHCS CS0 CS1 0.8VDD 0.2VDD tKCY tDCSK tKL tDCSKF tKH 0.8VDD 0.8VDD SCK0 SCK1 0.2VDD tSIK tKSI 0.8VDD SI0 SI1 Input data 0.2VDD tDCSO tKSO tDCSOF 0.8VDD SO0 SO1 Output data 0.2VDD Fig. 4. Serial transfer CH0, CH1 timing – 24 – CXP7400P10 Serial transfer (CH2) Item (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference) Symbol Pin SCK cycle time tKCY SCK2 SCK High and Low level widths tKH tKL SCK2 SI input setup time (for SCK↑) tSIK SI2 SI input hold time (for SCK↑) tKSI SI2 SCK↓ → SO delay time tKSO SO2 Conditions Min. Max. Unit 1000 ns 8000/fc ns 400 ns 4000/fc – 50 ns SCK input mode 100 ns SCK output mode 200 ns SCK input mode 200 ns SCK output mode 100 ns Input mode Output mode Input mode Output mode SCK input mode 200 ns SCK output mode 100 ns Note 1) tsys indicates three values according to the contents of the clock control register (CLC: 000FEh) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (upper 2 bits = “00”), 4000/fc (upper 2 bits = “01”), 16000/fc (upper 2 bits = “11”) Note 2) SCK, SI and SO represent SCK2, SI2 and SO2 for CH2, respectively. Note 3) The load of SCK2 output mode and SO2 output delay time is 50pF + 1TTL. Note 4) This case applies that Port B output buffer capability switching register (BUFB: 010F4h, bits 6 and 5 = “0, 0”) is OFF. Serial transfer (CH2) Item (Ta = –20 to +75°C, VDD = 2.7 to 3.3V, Vss = 0V reference) Symbol Pin SCK cycle time tKCY SCK2 SCK High and Low level widths tKH tKL SCK2 SI input setup time (for SCK↑) tSIK SI2 SI input hold time (for SCK↑) tKSI SI2 SCK↓ → SO delay time tKSO SO2 Conditions Min. Max. Unit 1000 ns 8000/fc ns 400 ns 4000/fc – 100 ns SCK input mode 100 ns SCK output mode 200 ns SCK input mode 200 ns SCK output mode 100 ns Input mode Output mode Input mode Output mode SCK input mode 250 ns SCK output mode 125 ns Note 1) tsys indicates three values according to the contents of the clock control register (CLC: 000FEh) upper 2 bits (CPU clock selection). tsys [ns] = 2000/fc (upper 2 bits = “00”), 4000/fc (upper 2 bits = “01”), 16000/fc (upper 2 bits = “11”) Note 2) SCK, SI and SO represent SCK2, SI2 and SO2 for CH2, respectively. Note 3) The load of SCK2 output mode and SO2 output delay time is 50pF. Note 4) This case applies that Port B output buffer capability switching register (BUFB: 010F4h, bits 6 and 5 = “1, 1”) is ON. – 25 – CXP7400P10 tKCY tKL tKH 0.8VDD SCK2 0.2VDD tSIK tKSI 0.8VDD SI2 Input data 0.2VDD tKSO 0.8VDD SO2 Output data 0.2VDD Fig. 5. Serial transfer CH2 timing – 26 – CXP7400P10 (3) A/D converter characteristics (Ta = –20 to +75°C, VDD = AVDD = 4.5 to 5.5V, AVREF = 4.0 to AVDD, Vss = AVSS = 0V reference) Item Symbol Pin Conditions Min. Typ. Resolution Ta = 25°C VDD = AVDD = AVREF = 5.0V VSS = AVSS = 0V Linearity errror Absolute error tCONV tSAMP Conversion time Sampling time Reference input voltage VREF AVREF Analog input voltage AN0 to AN11 VIAN IREF AVREF current IREFS VDD = AVDD = 4.5 to 5.5V Unit 8 Bits ±2 LSB ±3 LSB 31/fADC∗3, ∗4 µs 10/fADC∗3, ∗4 µs AVDD – 0.5 V 0 V Operation mode AVREF Max. 0.6 Sleep mode Stop mode 32kHz operation mode 1.0 mA 10 µA (Ta = –20 to +75°C, VDD = AVDD = 2.7 to 3.3V, AVREF = 2.7 to AVDD, Vss = AVSS = 0V reference) Item Symbol Pin Conditions Min. Typ. Resolution Ta = 25°C VDD = AVDD = AVREF = 3.0V VSS = AVSS = 0V Linearity errror Absolute error Conversion time Sampling time Reference input voltage VREF AVREF Analog input voltage AN0 to AN11 IREF AVREF current IREFS Digital conversion value VDD = AVDD = 2.7 to 3.3V Operation mode AVREF FFh FEh Linearity error 01h 00h VFT VZT Unit 8 Bits ±2 LSB ±3 LSB 31/fADC∗3, ∗4 10/fADC∗3, ∗4 tCONV tSAMP VIAN Max. Analog input Sleep mode Stop mode 32kHz operation mode µs µs AVDD – 0.3 V 0 V 0.4 0.7 mA 10 µA ∗1 VZT: Value at which the digital conversion value changes from 00h to 01h and vice versa. ∗2 VFT: Value at which the digital conversion value changes from FEh to FFh and vice versa. ∗3 fADC indicates the below values due to the contents of bit 6 (CKS) of the A/D control register (ADC: 000F9h). PS3 selected fADC = fc/4 PS4 selected fADC = fc/8 However, when PS3 is selected, fc is 12MHz or less. ∗4 Sub clock operated tCONV = 34/fTEX tSAMP = 10/fTEX Fig. 6. Definition of A/D converter terms – 27 – CXP7400P10 (4) Interruption, reset input (Ta = –20 to +75°C, VDD = 2.7 to 5.5V, Vss = 0V reference) Item Symbol Pin External interruption High and Low level widths tIH tIL INT0 INT1 INT2 INT3 INT4 NMI Reset input Low level width tRSL RST Conditions Min. Unit 1 µs 32/fc µs tIH INT0 INT1 INT2 INT3 INT4 NMI (NMI is specified only for the falling edge) Max. tIL 0.8VDD 0.2VDD tIL tIH Fig. 7. Interruption input timing tRSL RST 0.2VDD Fig. 8. RST input timing – 28 – CXP7400P10 Appendix AAAAA AAAAA AAAA AAAAA AAAA AAAAA A A A A AA (i) Main clock EXTAL XTAL Rd C1 (ii) Main clock (iii) Sub clock EXTAL TEX XTAL TX Rd C2 Rd C1 C2 C1 C2 Fig. 9. Recommended oscillation circuit Manufacturer MURATA MFG CO., LTD. Model CSA10.0MTZ 10.0 CSA12.0MTZ 12.0 CSA16.00MXZ040 CST10.0MTW∗ 16.0 Seiko Instruments Inc. 10.0 C1 (pF) C2 (pF) 30 30 5 5 30 30 CST12.0MTW∗ 12.0 CST16.00MXW0C1∗ 16.0 5 5 8.0 18 18 12.0 12 12 16.0 10 10 8.0 10 10 12.0 5 5 16.0 Open Open 32.768kHz 18 18 RIVER ELETEC HC-49/U03 CORPORATION KINSEKI LTD. fc (MHz) HC-49/U (-S) VTC-200 SP-T ∗ Indicates types with on-chip grounding capacitor (C1, C2). ∗1 XTAL series resistor (Rd = 500Ω or less) is hard to affect noise by ESD. – 29 – Rd (Ω) Circuit example Remarks (i) 0 ∗1 (ii) 330 ∗1 (i) 0 ∗1 330k (iii) CL = 12.5pF CXP7400P10 Characteristics Curve IDD vs. VDD IDD vs. fc (fc = 24MHz, Ta = 25°C, Typical) (VDD = 5.0V, Ta = 25°C, Typical) 50.0 1/2 dividing mode 1/4 dividing mode 20.0 1/16 dividing mode 1/2 dividing mode 40 10.0 Sleep mode 1.0 0.5 32kHz operation mode 0.1 (100µA) 0.05 (50µA) IDD – Supply current [mA] IDD – Supply current [mA] 5.0 30 1/4 dividing mode 20 32kHz sleep mode 10 0.01 (10µA) 1/16 dividing mode Sleep mode 2 3 4 5 0 6 0 VDD – Supply voltage [V] 10 20 24 fc – System clock [MHz] IDD vs. VDD IDD vs. fc (fc = 12MHz, Ta = 25°C, Typical) (VDD = 3.0V, Ta = 25°C, Typical) 50.0 1/2 dividing mode 20.0 1/4 dividing mode 10.0 40 1/16 dividing mode Sleep mode IDD – Supply current [mA] IDD – Supply current [mA] 5.0 1.0 0.5 0.1 (100µA) 0.05 (50µA) 30 1/2 dividing mode 20 1/4 dividing mode 10 0.01 (10µA) 1/16 dividing mode 2 3 4 5 0 6 VDD – Supply voltage [V] – 30 – Sleep mode 0 10 20 24 fc – System clock [MHz] CXP7400P10 Unit: mm 100PIN QFP (PLASTIC) 23.9 ± 0.4 + 0.4 20.0 – 0.1 + 0.1 0.15 – 0.05 80 51 + 0.4 14.0 – 0.1 17.9 ± 0.4 15.8 ± 0.4 50 81 A 31 100 1 0.65 30 + 0.15 0.3 – 0.1 0.13 + 0.2 0.1 – 0.05 + 0.35 2.75 – 0.15 M 0° to 10° DETAIL A 0.8 ± 0.2 (16.3) 0.15 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE QFP-100P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE QFP100-P-1420 LEAD MATERIAL 42/COPPER ALLOY PACKAGE MASS 1.7g JEDEC CODE 100PIN LQFP (PLASTIC) 16.0 ± 0.2 ∗ 14.0 ± 0.1 75 51 76 (15.0) 50 0.5 ± 0.2 A 26 (0.22) 100 1 0.5 + 0.08 0.18 – 0.03 25 0.13 M + 0.2 1.5 – 0.1 + 0.05 0.127 – 0.02 0.1 0.1 ± 0.1 0° to 10° 0.5 ± 0.2 Package Outline DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING SONY CODE LQFP-100P-L01 LEAD TREATMENT EIAJ CODE LQFP100-P-1414 LEAD MATERIAL 42 ALLOY PACKAGE MASS 0.8g JEDEC CODE – 31 –