SONY CXP845P60

CXP845P60
CMOS 8-bit Single Chip Microcomputer
Description
The CXP845P60 is a CMOS 8-bit microcomputer
integrating on a single chip an A/D converter, serial
interface, timer/counter, time-base timer, capture
timer/counter, PWM output and the like besides the
basic configurations of 8-bit CPU, PROM, RAM and
I/O port.
The CXP845P60 also provides a sleep/stop functions
that enable to execute the power-on reset function or
lower the power consumption.
The CXP845P60 is the PROM-incorporated version
of the CXP84548 with built-in mask ROM. This
provides the additional feature of being able to write
directly into the program. Thus, it is most suitable for
evaluation use during system development and for
small-quantity production.
80 pin QFP (Plastic)
80 pin LQFP (Plastic)
80 pin LFLGA (Plastic)
Features
• A wide instruction set (213 instructions) which covers various types of data
— 16-bit arithmetic/multiplication and division/Boolean bit operation instructions
• Minimum instruction cycle
143ns at 28MHz operation (4.5 to 5.5V)
200ns at 20kHz operation (3.0 to 5.5V)
• Incorporated PROM capacity 60K bytes
• Incorporated RAM capacity
1472 bytes
• Peripheral functions
— A/D converter
8 bits, 8 channels, successive approximation method
(Conversion time of 1.93µs at 28MHz, 2.7µs at 20MHz)
— Serial interface
Incorporated 8-bit, 8-stage FIFO (Auto transfer for 1 to 8 bytes,
latch output function, MSB/LSB first selectable), 1 channel
8-bit clock sync type, 1 channel
— Timer
8-bit timer
8-bit timer/counter
19-bit time-base timer
16-bit capture time/counter
— PWM output
8 bits, 2 channels
• Interruption
14 factors, 14 vectors, multi-interruption possible
• Standby mode
Sleep/stop
• Package
80-pin plastic QFP/LQFP
80-pin plastic LFLGA
Structure
Silicon gate CMOS IC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E96825B9Y-PS
–2–
TO
CINT
EC1
16-BIT CAPTURE
TIMER/COUNTER 2
8-BIT TIMER 1
8-BIT TIMER/COUNTER 0
EC0
FIFO
SERIAL INTERFACE UNIT 1
SERIAL
INTERFACE
UNIT 0
SI1
SO1
SCK1
CS0
SI0
SO0
SCK0
LAT0
8-BIT PWM GENERATOR 1
PWM1
A/D CONVERTER
AVss
8-BIT PWM GENERATOR 0
8
AVREF
PWM0
AN0 to AN7
2
2
INT0
INT1
INT2
INT3
INTERRUPT CONTROLLER
Block Diagram
PRESCALER/
TIME-BASE TIMER
PROM
60K BYTES
SPC700
CPU CORE
EXTAL
XTAL
RST
VDD
Vss
RAM
1472 BYTES
CLOCK
GENERATOR/
SYSTEM CONTROL
8
PI0 to PI7
PH0 to PH7
PG0 to PG7
8
8
PF0 to PF7
PE4 to PE7
4
8
PE0 to PE3
PD0 to PD7
PC0 to PC7
PB0 to PB7
PA0 to PA7
4
8
8
8
8
CXP845P60
PORT I PORT H PORT G PORT F PORT E PORT D PORT C PORT B PORT A
NMI
CXP845P60
PI5
PI7
PI6
PG0
PG1
PG3
PG2
VDD
Vpp
PG5
PG4
PG6
PG7
PF0
PF1
PF2
Pin Assignment (Top View) 80-pin QFP package
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
PF3
1
64
PI4
PF4
2
63
PI3/INT3
PF5
3
62
PI2/INT2
PF6
4
61
PI1/INT1
PF7
5
60
PI0/INT0
PD0
6
59
PE5/TO/PWM1
PD1
7
58
PE4/PWM0
PD2
8
57
PE3/NMI
PD3
9
56
PE2/CINT
PD4
10
55
PE1/EC1
PD5
11
54
PE0/EC0
PD6
12
53
PB7/SO1
PD7
13
52
PB6/SI1
PC0
14
51
PB5/SCK1
PC1
15
50
PB4/SO0
PC2
16
49
PB3/SI0
PC3
17
48
PB2/SCK0
PC4
18
47
PB1/CS0
PC5
19
46
PB0/LAT0
PC6
20
45
PA7/AN7
PC7
21
44
PA6/AN6
PH0
22
43
PA5/AN5
PH1
23
42
PA4/AN4
PH2
24
41
PA3/AN3
PA2/AN2
PA1/AN1
AVREF
PA0/AN0
AVSS
PE7
VSS
PE6
XTAL
EXTAL
PH7
RST
PH6
PH5
PH3
PH4
25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Note) Vpp (Pin 73) should be left open. (Internally connected to VDD.)
However, this pin is used for the Flash EEPROM-incorporated version (CXP845F60).
–3–
CXP845P60
PI3/INT3
PI4
PI5
PI6
PI7
PG0
PG1
PG2
PG3
VDD
Vpp
PG4
PG5
PG6
PG7
PF0
PF1
PF2
PF3
PF4
Pin Assignment (Top View) 80-pin LQFP package
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
1
60
PI2/INT2
PF6
2
59
PI1/INT1
PF7
3
58
PI0/INT0
PD0
4
57
PE5/TO/PWM1
PD1
5
56
PE4/PWM0
PD2
6
55
PE3/NMI
PD3
7
54
PE2/CINT
PD4
8
53
PE1/EC1
PD5
9
52
PE0/EC0
PD6
10
51
PB7/SO1
PD7
11
50
PB6/SI1
PC0
12
49
PB5/SCK1
PC1
13
48
PB4/SO0
PC2
14
47
PB3/SI0
PC3
15
46
PB2/SCK0
PC4
16
45
PB1/CS0
PC5
17
44
PB0/LAT0
PC6
18
43
PA7/AN7
PC7
19
42
PA6/AN6
PH0
20
41
PA5/AN5
PA4/AN4
PA3/AN3
PA2/AN2
PA1/AN1
PA0/AN0
AVREF
PE7
AVSS
PE6
VSS
XTAL
EXTAL
RST
PH7
PH6
PH5
PH4
PH3
PH2
21 22 23 24 25 26 27 28 31 29 30 32 33 34 35 37 36 38 39 40
PH1
PF5
Note) Vpp (Pin 71) should be left open. (Internally connected to VDD.)
However, this pin is used for the Flash EEPROM-incorporated version (CXP845F60).
–4–
CXP845P60
Pin Assignment (Top View) 80-pin LFLGA package
80
78
75
72
69
67
65
62
PF4
PF2
PG7
PG4
PG3
PG1
PI7
PI4
2
1
79
76
73
70
66
63
61
PF6
PF5
PF3
PF0
PG5
VDD
PG0
PI5
PI3
PI2
5
3
4
77
74
71
68
64
59
58
PD1
PF7
PD0
PF1
PG6
Vpp
PG2
PI6
PI1
PI0
7
6
8
57
56
55
PD3
PD2
PD4
PE5
PE4
PE3
9
10
11
54
53
52
PD5
PD6
PD7
PE2
PE1
PE0
60
12
13
14
51
50
49
PC0
PC1
PC2
PB7
PB6
PB5
15
16
17
48
46
47
PC3
PC4
PC5
PB4
PB2
PB3
18
19
24
28
31
34
37
44
43
45
PC6
PC7
PH4
RST
VSS
AVSS
PA1
PB0
PA7
PB1
20
21
23
26
30
33
36
39
41
42
PH0
PH1
PH3
PH6
XTAL
PE7
PA0
PA3
PA5
PA6
29
32
35
38
22
25
27
PH2
PH5
PH7
EXTAL PE6 AVREF PA2
40
PA4
Note) Vpp (Pin 71) should be left open. (Internally connected to VDD.)
However, this pin is used for the Flash EEPROM-incorporated version (CXP845F60).
–5–
CXP845P60
Pin Description
Symbol
I/O
PA0/AN0
to
PA7/AN7
I/O/Analog input
PB0/LAT0
I/O/Output
PB1/CS0
I/O/Input
PB2/SCK0
I/O/I/O
PB3/SI0
I/O/Input
PB4/SO0
I/O/Output
PB5/SCK1
I/O/I/O
PB6/SI1
I/O/Input
PB7/SO1
I/O/Output
Description
(Port A)
8-bit I/O port. I/O can be
set in a unit of single bits.
Incorporation of the
pull-up resistor can be set
through the software in a
unit of 4 bits.
(8 pins)
Analog inputs to A/D converter.
(8 pins)
Latch output for serial interface (CH0).
(Port B)
8-bit I/O port. I/O can be
set in a unit of single bits.
Incorporation of pull-up
resistor can be set
through the software in a
unit of 4 bits.
(8 pins)
Chip select input for serial interface (CH0).
Serial clock I/O (CH0).
Serial data input (CH0).
Serial data output (CH0).
Serial clock I/O (CH1).
Serial data input (CH1).
Serial data output (CH1).
I/O
(Port C)
8-bit I/O port. I/O can be set in a unit of single bits. Can drive 12mA sync
current. Incorporation of pull-up resistor can be set through the software
in a unit of 4 bits.
(8 pins)
PD0 to PD7
I/O
(Port D)
8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pullup resistor can be set through the software in a unit of 4 bits.
(8 pins)
PE0/EC0
Input/Input
PE1/EC1
Input/Input
PE2/CINT
Input/Input
PE3/NMI
Input/Input
PE4/PWM0
Output/Output
PE5/TO/
PWM1
Output/Output/
Output
PE6
Output
PE7
Output
PC0 to PC7
PF0 to PF7
I/O
External event inputs for timer/counter.
(2 pins)
(Port E)
8-bit port. Lower 4 bits
are for inputs; upper
4 bits are for outputs.
(8 pins)
Capture trigger input.
Non-maskable interruption request input.
8-bit PWM0 output.
Rectangular wave output for 16-bit timer/
counter and 8-bit PWM1 output.
(Port F)
8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of
pull-up resistor can be set through the software in a unit of 4 bits.
(8 pins)
–6–
CXP845P60
Symbol
I/O
Description
I/O
(Port G)
8-bit I/O port. I/O can be set in a unit of single bits. Incorporation of pullup resistor can be set through the software in a unit of 4 bits.
(8 pins)
PH0 to PH7
I/O
(Port H)
8-bit I/O port. I/O and standby release input function can be set in a unit
of single bits. Incorporation of pull-up resistor can be set through the
software in a unit of 4 bits.
(8 pins)
PI0/INT0
to
PI3/INT3
I/O/Input
PI4 to PI7
I/O
EXTAL
Input
XTAL
Output
RST
I/O
PG0 to PG7
External interruption
request inputs.
(4 pins)
Connects a crystal for system clock oscillation. When the clock is supplied
externally, input to EXTAL; opposite phase clock should be input to XTAL.
System reset for active at Low level. This pin is I/O pin, and outputs Low
level at the power on with the power-on reset function executed.
Positive power supply for incorporated PROM writing.
Leave this pin open (internally connected to VDD).
This is used for the Flash EEPROM-incorporated version (CXP845F60).
Vpp
AVREF
(Port I)
8-bit I/O port. I/O can be set in a unit of single
bits. Incorporation of pull-up resistor can be set
through the software in a unit of 4 bits.
(8 pins)
Input
Reference voltage input for A/D converter.
AVss
A/D converter GND.
VDD
Positive power supply.
Vss
GND
–7–
CXP845P60
Input/Output Circuit Formats for Pins
AAA
AAA
AAA
AAA
AAA
AAA
AAA
Pin
Port A
When reset
Circuit format
∗
Pull-up resistor
"0" when reset
AA
AA
AA
Port A data
PA0/AN0
to
PA7/AN7
Port A direction
IP
"0" when direction
Data bus
Input protection
circuit
Hi-Z
RD (Port A)
Port A function
selection
Input multiplexer
"0" when reset
A/D converter
8 pins
Port B
AAA
AAA
AAA
AAA
AAA
AAA
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
∗
Pull-up resistor
"0" when reset
LAT0
Latch output enable
AA
AA
AA
Port B data
PB0/LAT0
IP
Port B direction
Hi-Z
"0" when reset
Data bus
RD (Port B)
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
1 pin
Port B
AAAA
AAAA
AAAA
AAAA
AAAA
∗
Pull-up resistor
"0" when reset
Port B data
PB1/CS0
PB3/SI0
PB6/SI1
Port B direction
AA
A
AA
A
IP
"0" when reset
Schmitt input
Data bus
RD (Port B)
3 pins
CS0
SI0
SI1
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
–8–
Hi-Z
CXP845P60
Pin
When reset
Circuit format
Port B
AAAA
AAAA
AAAA
AAAA
AAAA
∗
Pull-up resistor
"0" when reset
SCK OUT
Serial clock output enable
AA
AA
AA
Port B function
selection
"0" when reset
PB2/SCK0
PB5/SCK1
IP
Port B data
Hi-Z
Port B direction
"0" when reset
Data bus
Schmitt input
RD (Port B)
SCK0, SCK1 in
2 pins
Port B
AAA
AAA
AAA
AAA
AAA
AAA
AAA
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
∗
Pull-up resistor
SO
Serial data output enable
AA
AA
AA
Port B function
selection
"0" when reset
PB4/SO0
PB7/SO1
IP
Port B data
Hi-Z
Port B direction
"0" when reset
Data bus
RD (Port B)
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
2 pins
Port C
AAAA
AAAA
AAAA
AAAA
AAAA
∗2
Pull-up resistor
"0" when reset
Port C data
PC0 to PC7
*1
Port C direction
"0" when reset
Data bus
RD (Port C)
AA
A
AA
A
IP
∗1 Large current drive
12mA (VDD = 4.5 to 5.5V)
5mA (VDD = 3.0 to 3.6V)
∗2 Pull-up transistor
Approx. 100kW (VDD = 4.5 to 5.5V)
Approx. 300kW (VDD = 3.0 to 3.6V)
8 pins
–9–
Hi-Z
CXP845P60
Pin
When reset
Circuit format
Port E
PE0/EC0
PE1/EC1
PE2/CINT
PE3/NMI
AA
AA
AAAA
AAAA
AAAA
AAAA
AAAA
Schmitt input
EC0, EC1
CINT, NMI
IP
4 pins
Port E
RD (Port E)
AA
AA
PWM0
Port E function
selection
"0" when reset
PE4/PWM0
Hi-Z
Data bus
Port E data
"1" when reset
High level
Data bus
1 pin
RD (Port E)
AAAA
AAAA
AAAAAAAA
AAAA
AAAAA
AAAA
AAAAA
AAAAA
Port E
Internal reset signal
PE5/TO/
PWM1
Port E data
00
"1" when reset
TO
PWM1
01
1x
MPX
Port E function selection
(upper)
Port E function selection
(lower)
"00" when reset
TO output enable
1 pin
Port E
AAAA
AAAA
"0" when reset
Data bus
2 pins
AA
AA(
High level
with resistor
of pull-up
transistor
ON for reset
∗ Pull-up transistor
Approx. 150kΩ (VDD = 4.5 to 5.5V)
Approx. 400kΩ (VDD = 3.0 to 3.6V)
AA
AA
Port E data
PE6, PE7
∗
RD (Port E)
– 10 –
Low level
)
CXP845P60
Pin
Port D
Port F
Port G
PD0 to PD7
PF0 to PF7
PG0 to PG7
PI4 to PI7
When reset
Circuit format
AAAA
AAAA
AAAAAA
AAAAAA
AAAAAA
AAAAAA
∗
Pull-up resistor
A
AA
A
AA
"0" when reset
Ports D, F, G, I data
Port I
Ports D, F, G, I direction
IP
"0" when reset
Data bus
RD
Hi-Z
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
28 pins
Port H
AAAA
AAAA
AAAA
AAAA
AAAA
∗
Pull-up resistor
AA
A
AA
A
"0" when reset
Port H data
PH0 to PH7
Port H direction
IP
"0" when reset
Data bus
A
A
AAAA
AAAA
AAAA
AAAA
AAAA
RD (Port H)
Edge detection
Standby release
8 pins
Port I
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
∗
Pull-up resistor
"0" when reset
Port I data
PI0/INT0
to
PI3/INT3
Port I direction
"0" when reset
Data bus
A
AA
A
AA
IP
Schmitt input
RD
INT0
INT1
INT2
INT3
∗ Pull-up transistor
Approx. 100kΩ (VDD = 4.5 to 5.5V)
Approx. 300kΩ (VDD = 3.0 to 3.6V)
4 pins
– 11 –
Hi-Z
Hi-Z
CXP845P60
Pin
EXTAL
XTAL
2 pins
RST
1 pin
When reset
Circuit format
AA
AA
AA
AA
EXTAL
AA AA
AA
IP
IP
• Diagram shows the circuit
composition during oscillation.
• Feedback resistor is removed
during stop mode and XTAL
becomes High level.
Oscillation
XTAL
AA
Pull-up resistor
AA
Schmitt input
Low level
IP
From power-on reset circuit
– 12 –
CXP845P60
Absolute Maximum Ratings
(Vss = 0V reference)
Item
Symbol
Ratings
Unit
VDD
–0.3 to +7.0
V
AVSS
V
VIN
–0.3 to +0.3
–0.3 to +7.0∗1
Output voltage
VOUT
–0.3 to +7.0∗1
V
High level output current
IOH
–5
mA
Output (value per pin)
High level total output current
∑IOH
–50
mA
Total for all output pins
IOL
15
mA
IOLC
20
mA
All pins excluding large current outputs
(value per pin)
Large current outputs (value per pin∗2)
Low level total output current
∑IOL
100
mA
Total for all output pins
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +150
°C
600
mW
QFP-80P-L01
380
mW
LQFP-80P-L01
500
mW
LFLGA-80P-02
Supply voltage
Input voltage
Low level output current
Allowable power dissipation
PD
Remarks
V
∗1 VIN and VOUT must not exceed VDD + 0.3V.
∗2 The large current drive transistor is the N-ch transistor of Port C (PC).
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding these conditions may adversely
affect the reliability of the LSI.
Recommended Operating Conditions
Item
Supply voltage∗1
High level input
voltage
Low level input
voltage
Operating temperature
∗1
∗2
∗3
∗4
Symbol
(Vss = 0V reference)
Min.
Max.
4.5
(3.0)
5.5
3.5
(2.7)
5.5
2.0
5.5
VIH
0.7VDD
VDD
V
VIHS
0.8VDD
VDD
V
VIHEX
0.9VDD
VDD + 0.3
V
Hysteresis input∗3
EXTAL∗4
VIL
0
0.3VDD
V
∗2
VILS
0
0.2VDD
V
VILEX
–0.3
0.1VDD
V
Topr
–20
+75
°C
VDD
Unit
Remarks
Guaranteed operation range for 1/2 and 1/4
frequency dividing modes
V
Guaranteed operation range for 1/16 frequency
dividing and sleep modes
Guaranteed data hold range during stop mode
∗2
Hysteresis input∗3
EXTAL∗4
Specifies values in parenthesis for 1 to 20MHz system clock operation.
Normal input ports (PA, PB0, PB4, PB7, PC, PE0 to PE3, PD, PF to PH, PI4 to PI7)
RST, CINT, CS0, SCK0, SCK1, EC0, EC1, SI0, SI1, NMI, INT0, INT1, INT2, INT3
Specifies only during external clock input.
– 13 –
CXP845P60
Electrical Characteristics
DC Characteristics (VDD = 4.5 to 5.5V)
Item
High level
output voltage
Low level
output voltage
Symbol
VOH
Pins
PA to PD,
PE4 to PE7,
PF to PI,
RST (only VOL)
VOL
PC
IIHE
EXTAL
IILE
Input current
I/O leakage
current
IILR
RST
IIL
PA to PD∗1
PF to PI∗1
IIZ
PA to PD∗1
PF to PI∗1
PE0 to PE3
Conditions
Min.
Typ. Max.
Unit
VDD = 4.5V, IOH = –0.5mA
4.0
V
VDD = 4.5V, IOH = –1.2mA
3.5
V
VDD = 4.5V, IOL = 1.8mA
0.4
V
VDD = 4.5V, IOL = 3.6mA
0.6
V
VDD = 4.5V, IOL = 12.0mA
1.5
V
VDD = 5.5V, VIH = 5.5V
0.1
25
µA
VDD = 5.5V, VIL = 0.4V
–0.1
–25
µA
–1.5
–400
µA
–50
µA
VDD = 5.5V, VIL = 4.0V
VDD = 4.5V, VIL = 4.0V
–2.78
µA
VDD = 5.5V,
VI = 0, 5.5V
±10
µA
35
64
mA
2.5
10
mA
30
µA
20
pF
For 1/2 frequency dividing mode
IDD1
VDD = 5.5V, 28MHz crystal oscillation
(C1 = C2 = 1pF)
IDD2
Supply
current ∗2
(Ta = –20 to +75°C, Vss = 0V reference)
Sleep mode
IDDS1
VDD
IDDS2
VDD = 5.5V, 28MHz crystal oscillation
(C1 = C2 = 1pF)
Stop mode
IDDS3
Input
capacity
CIN
VDD = 5.5V, termination of 28MHz
crystal oscillation
PA to PD,
PE0 to PE3,
PF to PI,
EXTAL,
RST
Clock 1MHz
0V for all pins excluding measured
pins
10
∗1 For PA to PD and PF to PI pins, specifies the input current when pull-up resistance is selected; leakage
current when no resistance is selected.
∗2 When all pins are open.
– 14 –
CXP845P60
DC Characteristics (VDD = 3.0 to 3.6V)
Item
High level
output voltage
Low level
output voltage
Symbol
VOH
VOL
Pins
IIHE
Input current
I/O leakage
current
IILR
EXTAL
RST
IIL
PA to PD∗1
PF to PI∗1
IIZ
PA to PD∗1
PF to PI∗1
PE0 to PE3
Typ. Max. Unit
2.7
V
2.3
V
VDD = 3.0V, IOL = 5mA
0.3
V
0.5
V
1.0
V
VDD = 3.6V, VIH = 3.6V
0.05
15
µA
VDD = 3.6V, VIL = 0.3V
–0.05
–15
µA
–0.7
–200
µA
–30
µA
VDD = 3.6V, VIL = 0.3V
VDD = 3.0V, VIL = 2.7V
–1.0
µA
VDD = 3.6V,
VI = 0, 3.6V
VDD = 3.6V, 20MHz crystal oscillation
(C1 = C2 = 10pF)
IDD2
±5
µA
14.5
30
mA
0.85
4.0
mA
5
µA
Sleep mode
IDDS1
VDD
IDDS2
Min.
For 1/2 frequency dividing mode
IDD1
Supply
current∗2
Conditions
VDD = 3.0V, IOH = –0.15mA
PA to PD,
VDD = 3.0V, IOH = –0.5mA
PE4 to PE7,
PF to PI,
VDD = 3.0V, IOL = 1.2mA
RST (only VOL)
VDD = 3.0V, IOL = 1.6mA
PC
IILE
(Ta = –20 to +75°C, VSS = 0V reference)
VDD = 3.6V, 20MHz crystal oscillation
(C1 = C2 = 10pF)
Stop mode
IDDS3
VDD = 3.6V, termination of
20MHz crystal oscillation
∗1 For PA to PD and PF to PI pins, specifies the input current when pull-up resistance is selected; leakage
current when no resistance is selected.
∗2 When all pins are open.
– 15 –
CXP845P60
AC Characteristics
(Ta = –20 to +75°C, VDD = 3.0 to 5.5V, Vss = 0V reference)
(1) Clock timing
Item
Symbol
Pin
Conditions
System clock frequency
fC
VDD = 4.5 to 5.5V
XTAL
Fig. 1, Fig. 2
EXTAL
System clock input pulse width
tXL,
tXH
EXTAL
Fig. 1, Fig. 2 VDD = 4.5 to 5.5V
External clock drive
EXTAL
Fig. 1, Fig. 2
External clock drive
EC0
EC1
Fig. 3
EC0
EC1
Fig. 3
System clock input
rise time, fall time
Event count input clock
pulse width
Event count input clock
rise time, fall time
tCR,
tCF
tEH,
tEL
tER,
tEF
Min.
Typ. Max. Unit
1
28
1
20
MHz
15.6
ns
23
100
tsys + 50∗1
ns
ns
20
ns
∗1 tsys indicates the three values according to the contents of the clock control register (CLC: 00FEh) upper
2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
1/fc
VDD – 0.4V
EXTAL
0.4V
tXH
tCF
tXL
tCR
Fig. 1. Clock timing
AAAAA
AAAA
AAAAA
AAAA
AAAAAAAAA
Crystal oscillation
Ceramic oscillation
EXTAL
External clock
EXTAL
XTAL
C1
C2
XTAL
74HC04
Fig. 2. Clock applied conditions
0.8VDD
EC0
EC1
0.2VDD
tEH
tTH
tEF
tTF
tEL
tTL
Fig. 3. Event count clock timing
– 16 –
tER
tTR
CXP845P60
(2) Serial transfer (CH0)
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Pin
Condition
Min.
Max.
Unit
CS0 ↓ → SCK0
delay time
tDCSK
SCK0
Chip select transfer mode
(SCK0 = output mode)
1.5tsys + 100
ns
CS0 ↑ → SCK0
float delay time
tDCSKF SCK0
Chip select transfer mode
(SCK0 = output mode)
1.5tsys + 100
ns
CS0 ↓ → SO0
delay time
tDCSO SO0
Chip select transfer mode
1.5tsys + 100
ns
CS0 ↑ → SO0
float delay time
tDCSOF SO0
Chip select transfer mode
1.5tsys + 100
ns
CS0 High level width
tWHCS CS0
Chip select transfer mode
SCK0 cycle time
tKCY
SCK0
SCK0
High, Low level width
tKH
tKL
SCK0
SI0 input setup time
(for SCK0 ↑)
tSIK
SI0
SI0 input hold time
(for SCK0 ↑)
tKSI
SI0
SCK0 ↓ → SO0
delay time
tKSO
SO0
SCK0 ↓ → LAT0
output delay time
tLADLY LAT0
Latch output mode
(SCK0 = output mode)
LAT0 data pulse width
tLAPLS LAT0
Latch output mode
(SCK0 = output mode)
tsys + 150
2tsys + 200
ns
8000/fc
ns
tsys + 90
ns
4000/fc – 25
ns
SCK0 input mode
50
ns
SCK0 output mode
100
ns
tsys + 100
ns
50
ns
Input mode
Output mode
Input mode
Output mode
SCK0 input mode
SCK0 output mode
ns
tsys + 100
ns
50
ns
tKCY
tKCY + 50
ns
tKCY – 10
tKCY + 50
ns
SCK0 input mode
SCK0 output mode
Note 1) tsys indicates the three values according to the contents of the clock control register (CLC: 00FEh)
upper 2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
Note 2) The load condition for the SCK0 output mode, SO0 output delay time is 50pF + 1TTL.
– 17 –
CXP845P60
Serial transfer (CH0)
Item
(Ta = –20 to +75°C, VDD = 3.0 to 3.6V, Vss = 0V reference)
Symbol
Pin
Condition
CS0 ↓ → SCK0
delay time
tDCSK
SCK0
CS0 ↑ → SCK0
float delay time
Min.
Max.
Unit
Chip select transfer mode
(SCK0 = output mode)
1.5tsys + 200
ns
tDCSKF SCK0
Chip select transfer mode
(SCK0 = output mode)
1.5tsys + 200
ns
CS0 ↓ → SO0
delay time
tDCSO
SO0
Chip select transfer mode
1.5tsys + 200
ns
CS0 ↑ → SO0
float delay time
tDCSOF SO0
Chip select transfer mode
1.5tsys + 200
ns
CS0 High level width
tWHCS CS0
Chip select transfer mode
SCK0 cycle time
tKCY
SCK0
SCK0
High, Low level width
tKH
tKL
SCK0
SI0 input setup time
(for SCK0 ↑)
tSIK
SI0
SI0 input hold time
(for SCK0 ↑)
tKSI
SI0
SCK0 ↓ → SO0
delay time
tKSO
SO0
SCK0 ↓ → LAT0
output delay time
tLADLY LAT0
Latch output mode
(SCK0 = output mode)
LAT0 data pulse width
tLAPLS LAT0
Latch output mode
(SCK0 = output mode)
tsys + 200
2tsys + 200
ns
8000/fc
ns
tsys + 80
ns
4000/fc – 50
ns
SCK0 input mode
80
ns
SCK0 output mode
150
ns
tsys + 120
ns
70
ns
Input mode
Output mode
Input mode
Output mode
SCK0 input mode
SCK0 output mode
ns
tsys + 200
ns
80
ns
tKCY
tKCY + 100
ns
tKCY – 10
tKCY + 100
ns
SCK0 input mode
SCK0 output mode
Note 1) tsys indicates the three values according to the contents of the clock control register (CLC: 00FEh)
upper 2 bits (CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = "00"), 4000/fc (Upper 2 bits = "01"), 16000/fc (Upper 2 bits = "11")
Note 2) The load condition for the SCK0 output mode, SO0 output delay time is 50pF.
– 18 –
CXP845P60
tWHCS
0.8VDD
CS0
0.2VDD
tKCY
tDCSK
tKL
tDCSKF
tKH
0.8VDD
0.8VDD
0.8VDD
SCK0
0.2VDD
tSIK
tKSI
0.8VDD
Input
data
SI0
0.2VDD
tDCSO
tKSO
tDCSOF
0.8VDD
SO0
Output
data
0.2VDD
tLADLY
0.8VDD
LAT0
Fig. 4. Serial transfer CH0 timing
– 19 –
tLAPLS
0.8VDD
CXP845P60
(3) Serial transfer (CH1)
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, VSS = 0V reference)
Symbol
Pin
tKCY
SCK1
SCK1 High, Low level
width
tKH
tKL
SCK1
SI1 input setup time
(for SCK1 ↑)
tSIK
SI1
SI1 input hold time
(for SCK1 ↑)
tKSI
SI1
SCK1 ↓ → SO1 delay time
tKSO
SO1
SCK1 cycle time
Condition
Min.
Max.
Unit
500
ns
8000/fc
ns
200
ns
4000/fc – 25
ns
SCK1 input mode
50
ns
SCK1 output mode
100
ns
SCK1 input mode
100
ns
SCK1 output mode
50
ns
Input mode
Output mode
Input mode
Output mode
SCK1 input mode
100
ns
SCK1 output mode
50
ns
Note) The load condition for the SCK1 output mode, SO1 output delay time is 50pF + 1TTL.
(Ta = –20 to +75°C, VDD = 3.0 to 3.6V, VSS = 0V reference)
Item
SCK1 cycle time
Symbol
tKCY
Pin
SCK1
SCK1 High, Low level
width
tKH
tKL
SCK1
SI1 input setup time
(for SCK1 ↑)
tSIK
SI1
SI1 input hold time
(for SCK1 ↑)
tKSI
SCK1 ↓ → SO1 delay time
tKSO
SI1
SO1
Condition
Min.
Max.
Unit
700
ns
8000/fc
ns
300
ns
4000/fc – 50
ns
SCK1 input mode
70
ns
SCK1 output mode
150
ns
SCK1 input mode
150
ns
SCK1 output mode
70
ns
Input mode
Output mode
Input mode
Output mode
SCK1 input mode
150
ns
SCK1 output mode
80
ns
Note) The load condition for the SCK1 output mode, SO1 output delay time is 50pF.
– 20 –
CXP845P60
tKCY
tKL
tKH
0.8VDD
SCK1
0.2VDD
tSIK
tKSI
0.8VDD
Input data
SI1
0.2VDD
tKSO
0.8VDD
SO1
Output data
0.2VDD
Fig. 5. Serial transfer CH1 timing
– 21 –
CXP845P60
(4) A/D converter characteristics (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, AVREF = 4.0 to VDD, Vss = AVSS = 0V reference)
Item
Symbol
Pin
Condition
Min.
Typ.
Resolution
Linearity error
Zero transition voltage
VZT∗1
Full-scale transition
voltage
VFT∗2
Conversion time
tCONV
tSAMP
Sampling time
Ta = 25°C
VDD = AVREF = 5.0V
VSS = AVSS = 0V
Max.
Unit
8
Bits
±4
LSB
–10
10
70
mV
4910
4970
5030
mV
27/fADC∗3
6/fADC∗3
Reference input voltage VREF
AVREF
Analog input voltage
AN0 to AN7
VIAN
AVREF current
AVREF
IREFS
µs
VDD – 0.5
VDD
V
0
AVREF
V
1.0
mA
10
µA
0.6
Operation mode
IREF
µs
Sleep mode
Stop mode
(Ta = –20 to +75°C, VDD = 3.0 to 3.6V, AVREF = 2.7 to VDD, Vss = AVSS = 0V reference)
Item
Symbol
Pin
Condition
Min.
Typ.
Resolution
Linearity error
Zero transition voltage
VZT∗1
Full-scale transition
voltage
VFT∗2
Conversion time
tCONV
tSAMP
Sampling time
Ta = 25°C
VDD = AVREF = 3.3V
VSS = AVSS = 0V
Reference input voltage VREF
AVREF
Analog input voltage
AN0 to AN7
VIAN
IREFS
AVREF
Digital conversion value
FFh
FEh
Linearity error
01h
00h
VFT
VZT
Unit
8
Bits
±5
LSB
–10
6.5
70
mV
3216
3280.5
3345
mV
27/fADC∗3
µs
6/fADC∗3
µs
VDD – 0.3
VDD
V
0
AVREF
V
0.7
mA
5
µA
Operation mode
IREF
AVREF current
Max.
Sleep mode
Stop mode
0.4
∗1 VZT: Value at which the digital conversion value changes
from 00h to 01h and vice versa.
∗2 VFT: Value at which the digital conversion value changes
from FEh to FFh and vice versa.
∗3 fADC indicates the values below due to the contents of bit 6
(CKS) of the A/D control register (ADC: 00F9h).
fADC = fc (CKS = "0"), fc/2 (CKS = "1")
However, the selection for fADC = fc (CKS = "0") is limited in
the clock range of fc = 1 to 14MHz (VDD 4.5 to 5.5V) and
fc = 1 to 10MHz (VDD = 3.0 to 4.5V).
Analog input
Fig. 6. Definition of A/D converter terms
– 22 –
CXP845P60
(5) Interruption, reset input
Item
(Ta = –20 to +75°C, VDD = 3.0 to 5.5V, Vss = 0V reference)
Symbol
Pin
External interruption
High, Low level width
tIH
tIL
INT0
INT1
INT2
INT3
NMI
Reset input Low level width
tRSL
RST
Condition
Min.
Max.
Unit
1
µs
32/fc
µs
tIH
tIL
0.8VDD
INT0
INT1
INT2
INT3
NMI
(Specifies NMI only for
the falling edge.)
0.2VDD
tIL
tIH
0.8VDD
0.2VDD
Fig 7. Interruption input timing
tRSL
RST
0.2VDD
Fig. 8. RST input timing
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, VSS = 0V reference)
(6) Power-on reset
Item
Symbol
tR
tOFF
Power supply rise time
Power supply cut-off time
Pin
VDD
Condition
Power-on reset
4.5V
VDD
0.2V
tR
tOFF
Turn the power on smoothly.
Fig. 9. Power-on reset
– 23 –
Max.
Unit
0.05
50
ms
1
Repetitive power-on reset
0.2V
Min.
ms
Appendix
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
(i) Main clock
EXTAL
(ii) Main clock
EXTAL
XTAL
XTAL
Rd
Rd
C1
CXP845P60
C2
C1 C2
Fig. 10. SPC700 Series recommended oscillation circuit
Manufacturer
MURATA
MFG
CO., LTD.
Model
fc (MHz)
CSA8.00MTZ
8.00
CSA10.0MTZ
10.00
CSA12.00MTZ
CST8.00MTW∗
12.00
CST10.0MT∗
10.00
CST12.0MTW∗
12.00
C2 (pF)
Rd (Ω)
Circuit
example
(i)
30
30
0
(ii)
CSA16.00MXZ040
CST16.00MXZ0C1∗
16.00
5
5
0
(i)
16.00
5
5
0
(ii)
CSA20.00MXZ040
20.00
OPEN
OPEN
0
CSA24.00MXZ040
24.00
3
3
0
CSA28.00MXZ040
CCR20.0MC6∗
28.00
3
3
0
20.00
16
16
0
24.00
16
16
0
HC49/U-S
28.00
1
1
220
CX-11F
28.00
1
1
220
TDK
CORPORATION. CCR24.0MC6∗
KINSEKI LTD.
8.00
C1 (pF)
(i)
(ii)
(i)
Models with an asterisk (∗) have the built-in ground capacitance (C1, C2).
Selection Guide
Option item
Product name
Package
Mask
OTP
CXP84540 CXP84548 CXP845P60Q-180-pin plastic
QFP/LQFP/LFLGA
80-pin plastic QFP
ROM capacitance 40K bytes 48K bytes
CXP845P60R-1-
CXP845P60GA-1-
80-pin plastic LQFP 80-pin plastic LFLGA
PROM 60K bytes
Reset pin
pull-up resistor
Existent/Non-existent
Existent
Power-on
reset function∗1
Existent/Non-existent
Existent
∗1 When the OTP product with the power-on reset function is used outside the range of VDD = 4.5 to 5.5V, be
sure to keep the external reset (setting the RST pin to Low) for the oscillation stable time or more.
– 24 –
CXP845P60
Characteristics Curves
IDD vs. fc
(VDD = 5V, Ta = 25°C, Typical)
IDD vs. VDD
(fc = 28MHz, Ta = 25°C, Typical)
1/2 dividing mode
1/2 dividing mode
1/4 dividing mode
20.0
30
10.0
1/16 dividing mode
Sleep mode
20
1.0
0.5
0.1
(100µA)
0.05
(50µA)
Stop mode
IDD – Supply current [mA]
IDD – Supply current [mA]
5.0
0.01
(10µA)
1/4 dividing mode
15
10
1/16 dividing mode
5
2
3
4
5
7
6
Sleep mode
VDD – Supply voltage [V]
0
10
20
fc – System clock [MHz]
30
IDD vs. fc
(VDD = 3.3V, Ta = 25°C, Typical)
IDD vs. VDD
(fc = 20MHz, Ta = 25°C, Typical)
1/2 dividing mode
20.0
1/4 dividing mode
10.0
Sleep mode
1.0
0.5
0.1
(100µA)
0.05
(50µA)
IDD – Supply current [mA]
IDD – Supply current [mA]
20
1/16 dividing mode
5.0
15
1/2 dividing mode
10
1/4 dividing mode
5
0.01
(10µA)
1/16 dividing mode
Sleep mode
2
3
4
5
6
7
0
VDD – Supply voltage [V]
– 25 –
20
10
fc – System clock [MHz]
30
CXP845P60
Unit: mm
80PIN QFP (PLASTIC)
23.9 ± 0.4
+ 0.1
0.15 – 0.05
+ 0.4
20.0 – 0.1
64
0.15
41
65
16.3
17.9 ± 0.4
+ 0.4
14.0 – 0.1
40
A
80
+ 0.2
0.1 – 0.05
1
24
+ 0.15
0.35 – 0.1
0.8
M
0.2
0.8 ± 0.2
25
+ 0.35
2.75 – 0.15
0° to 10°
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER PLATING
SONY CODE
QFP-80P-L01
LEAD TREATMENT
EIAJ CODE
QFP080-P-1420
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
1.6g
JEDEC CODE
80PIN LQFP (PLASTIC)
14.0 ± 0.2
∗
12.0 ± 0.1
60
41
40
(13.0)
61
21
(0.22)
80
0.5
0.5 ± 0.2
A
1
+ 0.08
0.18 – 0.03
20
0.13 M
+ 0.2
1.5 – 0.1
+ 0.05
0.127 – 0.02
0.1
0.1 ± 0.1
0° to 10°
0.5 ± 0.2
Package Outline
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
LQFP-80P-L01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
LQFP080-P-1212
LEAD MATERIAL
42 ALLOY
PACKAGE MASS
0.5g
JEDEC CODE
– 26 –
CXP845P60
Unit: mm
80PIN LFLGA
0.2
S A
X
PIN 1 INDEX
1.4MAX
0.10 S
9.0
0.2 S
0.2
S B
9.0
0.10MAX
x4
0.15
S
3 – φ0.50
0.3
80 – φ0.40 ± 0.05
0.8
0.8
B
1 2 3 4 5 6 7 8 9 10
0.9
0.3
0.4
K
J
H
G
F
E
D
C
B
A
0.5
0.3
0.9
0.4
PAC KAGE STRUC TURE
PA CKA GE MA TERIA L
SONY CODE
EIA J CODE
DETAIL X
φ0.08 M S A B
A
0.3
0.5
Package Outline
TERMINA L TREA TMENT
LFLGA -80P-02
P-LFLGA 80-9x9-0.8
JEDEC CODE
TERMINA L MA TERIA L
PA CKA GE MA SS
– 27 –
ORGA NIC SUBSTRA TE
GOLD PLA TING
NICKEL PLA TING
0.3g