ILX518K 5363-pixel × 3 line CCD Linear Sensor (Color) Description The ILX518K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads legal-size documents at a density of 600 DPI, and A3-size documents at a density of 400 DPI. 8 15 φ2 NC 9 14 NC D63 S1 5363 5363 5363 17 4 20 A A A A A A AA AA φ2 φLH VDD φ1 VOUT-R 1 VOUT-G 22 VOUT-B 21 B G R D15 D14 13 φROG-B φROG-R 10 GND 11 φ1 φ1 φRS 16 VDD GND 7 Driver 11 NC 6 17 φ2 3 6 2 φ1 Driver 18 NC Red 5 S5363 CCD Register Read Out Gate GND Green 19 NC S5363 CCD Register Read Out Gate 4 Blue φLH S5363 CCD Register Read Out Gate 8 φ2 15 16 VDD 20 VDD 1 3 1 φRS 1 21 VOUT-B D14 D15 2 D14 D15 GND D63 S1 22 VOUT-G D63 S1 D64 1 D64 VOUT-R D64 D75 Pin Configuration (Top View) D75 V °C °C D75 Absolute Maximum Ratings • Supply voltage VDD 15 • Operating temperature –10 to +55 • Storage temperature –30 to +80 GND φROG-R φROG-G 12 Driver 10 φROG-B 13 Block Diagram Driver Features • Number of effective pixels: 16089 pixels (5363 pixels × 3) • Pixel size: 8µm × 8µm (8µm pitch) • Distance between line: 64µm (8 Lines) • Single-sided readout • Ultra low lag / High sensitivity • Single 12V power supply • Input clock pulse: CMOS 5V drive • Number of output 3 (R, G, B) • Package: 22 pin Plastic-DIP (400 mil) 22 pin DIP (Plastic) 12 φROG-G Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E95814B9X-PS ILX518K Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 VOUT-R Signal out (red) 12 φROG-G Clock pulse input 2 GND GND 13 φROG-B Clock pulse input 3 φRS Clock pulse input 14 NC NC 4 φLH Clock pulse input 15 φ2 Clock pulse input 5 GND GND 16 VDD 12V power supply 6 φ1 Clock pulse input 17 φ2 Clock pulse input 7 NC NC 18 NC NC 8 φ1 Clock pulse input 19 NC NC 9 NC NC 20 VDD 12V power supply 10 φROG-R Clock pulse input 21 VOUT-B Signal out (blue) 11 GND GND 22 VOUT-G Signal out (green) Recommended Supply Voltage Item Min. Typ. Max. Unit VDD 11.4 12.0 12.6 V Clock Characteristics Item Symbol Min. Typ. Max. Unit Input capacity of φ1, φ2 Cφ1, Cφ2 — 850 — pF Input capacity of φLH CφLH — 10 — pF Input capacity of φRS CφRS — 10 — pF Input capacity of φROG∗ CφROG — 10 — pF ∗ It indicates that φROG-R, φROG-G, φROG-B as φROG. Clock Frequency Item Symbol φ1, φ2, φLH, φRS fφ1, fφ2, fφLH, fφRS Min. Typ. Max. Unit — 1 5 MHz Input Clock Pulse Voltage Condition Item φ1, φ2, φLH, φRS, φROG pulse voltage Min. Typ. Max. Unit High level 4.75 5.0 5.25 V Low level — 0 0.1 V –2– ILX518K Electrooptical Characteristics (Note 1) Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm) Item Symbol Min. Typ. Max. Unit Remarks V/(lx · s) Note 2 Red RR 1.3 2.0 2.7 Green RG 2.1 3.2 4.3 Blue RB 1.6 2.5 3.4 Sensitivity nonuniformity PRNU — 4 20 % Note 3 Saturation output voltage VSAT 2 3.2 — V Note 4 Red SER 0.74 1.6 — Green SEG 0.46 1 — lx · s Note 5 Blue SEB 0.58 1.28 — Dark voltage average VDRK — 0.3 2 mV Note 6 Dark signal nonuniformity DSNU — 1.5 5 mV Note 6 Image lag IL — 0.02 — % Note 7 Supply current IVDD — 26 50 mA — Total transfer efficiency TTE 92 98 — % — Output impedance ZO — 250 — Ω — Offset level VOS — 6.5 — V Note 8 Dynamic range DR 1000 10670 — — Note 9 Sensitivity Saturation exposure Note 1) In accordance with the given electrooptical characteristics, the black level is defined as the average value of D2, D3 to D12. 2) For the sensitivity test light is applied with a uniform intensity of illumination. 3) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT-G = 500mV (Typ.) PRNU = (VMAX – VMIN) /2 VAVE × 100 [%] Where the 5363 pixels are divided into blocks of 114 (Last block is 119 pixel). The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4) Use below the minimum value of the saturation output voltage. 5) Saturation exposure is defined as follows. SE = VSAT R Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6) Optical signal accumulated time τint stands at 10ms. 7) VOUT-G = 500mV (Typ.) VOUT 8) Vos is defined as indicated bellow. VOUT indicates VOUT-R, VOUT-G, and VOUT-B. 9) Dynamic range is defined as follows. DR = VSAT VDRK AAA AA AAAAA AAAAA VOS GND When the optical signal accumulated time is shorter, the dynamic range gets wider because the optical signal accumulated time is in proportion to the dark voltage. –3– –4– VOUT φRS φ2 φ1 φLH φROG D3 D2 3 D1 2 1 VOUT indicates VOUT-R, VOUT-G, VOUT-B. D62 D15 D14 D13 4 Dummy signal (63 pixels) AAAAAAA A S5362 S5361 S2 S1 D63 1-line output period (5438 pixels) Optical black (49 pixels) D61 Note) The transfer pulses (φ1, φ2, φLH) must have more than 5438 cycles. 0 5 0 5 0 5 0 5 Clock Timing Chart 1 ILX518K D75 5438 D71 D70 D65 D64 S5363 ILX518K Clock Timing Chart 2 t4 t5 φROG t2 t6 t7 φ1 t1 t3 φ2 Clock Timing Chart 3 t7 t6 φ1 φLH φ2 t10 t11 t9 φRS t8 t13 VOUT AAAAAAAAA AAAAAAAAA t12 –5– AAA AAA ILX518K Clock Pulse Recommended Timing Symbol Item φROG, φ1 pulse timing t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 φROG pulse high level period φROG, φ1 pulse timing φROG pulse rise time φROG pulse fall time φ1 pulse rise time/φ2 pulse fall time φ1 pulse fall time/φ2 pulse rise time φRS pulse high level period φRS, φLH pulse timing φRS pulse rise time φRS pulse fall time Signal output delay time ∗ These timing is the recommended condition under fφRS = 1MHz. –6– Min. Typ. Max. Unit 50 100 — ns 800 1000 — ns 800 1000 — ns 0 5 10 ns 0 5 10 ns 0 20 60 ns 0 20 60 ns — ns — ns 45 250∗ 250∗ 0 10 30 ns 0 10 30 ns — 10 — ns — 10 — ns 45 47µF/16V Tr1 ∗ Data rate fφRS = 1MHz. 0.1µF 12V VOUT-G Tr1 2 1 100Ω φRS 3 100Ω 7 6 2Ω φ1 8 9 φROG-R 10 IC1 11 IC1 IC1: 74AC04 Tr1: 2SC2785 Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. φLH 4 5 12 13 14 15 16 17 18 19 φROG-G 20 2Ω φROG-B 21 Tr1 VOUT-B φ2 22 100Ω 5.1kΩ VOUT-G 5.1kΩ 100Ω 100Ω VOUT-R 5.1kΩ VOUT-B VOUT-R VDD GND NC φRS NC φLH φ2 GND VDD φ1 –7– NC φ2 φ1 NC NC φROG-B φROG-R φROG-G GND Application Circuit∗ ILX518K ILX518K Example of Representative Characteristics (VDD = 12V, Ta = 25°C) Spectral sensitivity characteristics (Standard characteristics) 1 Relative sensitivity 0.8 0.6 0.4 0.2 0 400 450 500 550 600 650 700 Wavelength [nm] Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 Output voltage rate Output voltage rate 5 1 0.5 0.1 1 0.5 0.1 0 10 20 30 40 50 60 1 5 10 Ta – Ambient temperature [°C] τ int – Integration time [ms] Offset level vs. VDD characteristics (Standard characteristics) Offset level vs. temperature characteristics (Standard characteristics) 12 12 Ta = 25°C 10 VOS – Offset level [V] VOS – Offset level [V] 10 8 6 ∆VOS ∆VDD 4 0.3 2 0 11.4 8 6 ∆VOS ∆Ta 4 –0.5mV/°C 2 0 12 0 12.6 VDD [V] 10 20 30 40 50 Ta – Ambient temperature [°C] –8– 60 ILX518K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm , , Cover glass 0.9Nm ,, ,, ,, ,, Plastic portion 39N 29N 29N Adhesive Ceramic portion (1) (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. –9– ILX518K 3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. – 10 – 5.0 ± 0.3 – 11 – V H 7.93 ± 0.3 1 Plastic, Ceramic GOLD PLATING 42ALLOY 5.43g LS-B21(E) PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER 2.54 0.3 M *53.00 or 54.2 0.51 42.904(8µmX5363pixels) 55.7 ± 0.3 22pin DIP(400mil) No.1 Pixel(Green) 22 PACKAGE STRUCTURE 4.0 ± 0.5 Unit : mm 11 12 *7.3 or 9.0 10.16 10.0 ± 0.3 3.58 *The dimension of cover glass is 54.2 X 9.0mm or 53.0 X 7.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. 1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm. 4.28 ± 0.5 0˚to 9˚ 0.25 Package Outline ILX518K