SONY ILX558K

ILX558K
5340-pixel × 3-line CCD Linear Sensor (Color)
Description
The ILX558K is a reduction type CCD linear sensor
developed for color image scanner. This sensor
reads A4-size documents at a density of 600DPI.
Features
• Number of effective pixels: 16020 pixels
(5340 pixels × 3)
• Pixel size: 4µm × 4µm (4µm pitch)
• Distance between line: 32µm (8 lines)
• Single-sided readout
• Ultra low lag/High sensitivity
• Single 12V power supply
• Maximum data rate: 10MHz/Color
• Input clock pulse: CMOS 5V drive
• Number of output: 3 (R, G, B)
• Package:
22-pin Plastic DIP (400mil)
1
R
22
φCLP
1
G
1
B
11 φROG-B
Blue
φ2
10
12 φROG-G
Driver
Driver
14 φROG-R
Driver
D18
D19
5340
5340
13 φ1
5340
φROG-B 11
D69
S1
φ2 10
φ1
14 φROG-R
13
9
1
NC
φRS
15 NC
4
8
VDD
NC
2
16 NC
GND
7
CCD register
NC
Read out gate
17 NC
Output
amplifier
6
VOUT-B 20
NC
CCD register
18 NC
3
5
VOUT-G
NC
Green
19 VOUT-R
Read out gate
4
Output
amplifier
VDD
CCD register
Red
20 VOUT-B
Read out gate
3
Output
amplifier
VOUT-G
VOUT-R 19
21 NC
D18
D19
2
D18
D19
GND
22 φCLP
D69
S1
1
D69
S1
S5340
D70
φRS
S5340
D70
D74
D75
Pin Configuration (Top View)
S5340
D70
V
°C
D74
D75
15
–10 to +55
Block Diagram
D74
D75
Absolute Maximum Ratings
• Supply voltage
VDD
• Operating temperature
22 pin DIP (Plastic)
12 φROG-G
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E02951-PS
ILX558K
Pin Description
Pin No.
Symbol
Description
Pin No.
Symbol
Description
1
φRS
Clock pulse input
12
φROG-G
Clock pulse input
2
GND
GND
13
φ1
Clock pulse input
3
VOUT-G
Signal output (green)
14
φROG-R
Clock pulse input
4
VDD
12V power supply
15
NC
NC
5
NC
NC
16
NC
NC
6
NC
NC
17
NC
NC
7
NC
NC
18
NC
NC
8
NC
NC
19
VOUT-R
Signal output (red)
9
NC
NC
20
VOUT-B
Signal output (blue)
10
φ2
Clock pulse input
21
NC
NC
11
φROG-B
Clock pulse input
22
φCLP
Clock pulse input
Recommended Supply Voltage
Item
VDD
Min.
Typ.
Max.
Unit
11.4
12
12.6
V
Clock Characteristics
Item
Symbol
Min.
Typ.
Max.
Unit
Input capacitance of φ1, φ2
Cφ1, Cφ2
—
500
—
pF
Input capacitance of φRS
CφRS
—
10
—
pF
Input capacitance of φCLP
CφCLP
—
10
—
pF
Input capacitance of φROG
CφROG
—
10
—
pF
Min.
Typ.
Max.
Unit
—
1
10
MHz
Clock Frequency
Item
Symbol
Frequency of φ1, φ2, φRS, φCLP
fφ1, fφ2, fφRS, fφCLP
Input Clock Pulse Voltage Conditions
Item
φ1, φ2, φRS, φCLP, φROG
pulse voltage
Min.
Typ.
Max.
Unit
High level
4.75
5.0
5.25
V
Low level
—
0
0.1
V
–2–
ILX558K
Electro-optical Characteristics (Note 1)
(Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p,
Light source = 3200K, IR cut filter CM-500S (t = 1.0mm))
Item
Symbol
Min.
Typ.
Max.
Unit
Remarks
V/(lx · s)
Note 2
Red
RR
1.7
2.6
3.5
Green
RG
2.0
3.1
4.2
Blue
RB
1.6
2.5
3.4
Sensitivity nonuniformity
PRNU
—
4
20
%
Note 3
Saturation output voltage
VSAT
2.5
3.0
—
V
Note 4
Red
SER
—
1.15
—
Green
SEG
—
0.97
—
lx · s
Note 5
Blue
SEB
—
1.2
—
Dark voltage average
VDRK
—
2
5
mV
Dark signal nonuniformity
DSNU
—
4
12
mV
Image lag
IL
—
0.02
—
%
Note 7
Supply current
IVDD
—
30
50
mA
—
Total transfer efficiency
TTE
92
98
—
%
—
Output impedance
ZO
—
240
—
Ω
—
Offset level
VOS
—
5.6
—
V
Note 8
Sensitivity
Saturation exposure
Note 6
Notes:
1. In accordance with the given electro-optical characteristics, the black level is defined as the average value
of D18, D19 to D67.
2. For the sensitivity test light is applied with a uniform intensity of illumination.
3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2.
VOUT = 500mV (typ.)
PRNU =
(VMAX – VMIN)/2
VAVE
× 100 [%]
When the 5340 pixels are divided into blobks of 100, the maximum output of each block is set to VMAX, the
minimum output to VMIN and the average output to VAVE.
4. Use below the minimum value of the saturation output voltage.
5. Saturation exposure is defined as follows.
SE =
VSAT
R
Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB.
6. Optical signal accumulated time τ int stands at 5.5ms.
7. VOUT-G = 500mV (typ.)
VOUT
8. Vos is defined as indicated bellow.
VOUT indicates VOUT-R, VOUT-G and VOUT-B.
VOS
GND
–3–
Clock Timing Chart 1
5
φ1
φ2
5415
5414
3
5
2
0
1
φROG
0
5
0
φRS
5
0
5
D75
D74
D71
D70
S5340
S5339
S5338
S2
S1
D69
D68
D67
D19
D18
D17
D3
D2
0
D1
–4–
φCLP
VOUT
Optical black (50 pixels)
Dummy signal (69 pixels)
1-line output period (5415 pixels)
Note) The transfer pulses (φ1, φ2) must have more than 5415 cycles.
VOUT indicates VOUT-R, VOUT-G, VOUT-B.
ILX558K
φROG indicates φROG-R, φROG-G, φROG-B.
ILX558K
Clock Timing Chart 2
t4
t5
φROG
t2
t6
φ1
t7
t1
t3
φ2
Clock Timing Chart 3
t6
t7
φ1
φ2
t9
φRS
t10
t8
t14
t16
t15
t17
φCLP
t13
t11
t12
VOUT
–5–
ILX558K
Clock Pulse Recommended Timing
Item
Symbol
Min.
Typ.
Max.
Unit
φROG, φ1 pulse timing
t1
50
100
—
ns
φROG pulse high level period
t2
3
5
—
µs
φROG, φ1 pulse timing
t3
1
2
—
µs
φROG pulse rise time
t4
0
5
—
ns
φROG pulse fall time
t5
0
5
—
ns
φ1 pulse rise time/φ2 pulse fall time
t6
0
20
—
ns
φ1 pulse fall time/φ2 pulse rise time
t7
0
—
ns
φRS pulse high level period
t8
30
20
50∗1
—
ns
φRS pulse rise time
t9
0
20
—
ns
φRS pulse fall time
t10
0
20
—
ns
t11
—
50
—
ns
t12
—
20
—
ns
t13
30
100
—
ns
t14
10
100
—
ns
t15
5
50
—
ns
φCLP pulse rise time
t16
0
20
—
ns
φCLP pulse fall time
t17
0
20
—
ns
Signal output delay time
φCLP pulse high level period
φCLP pulse timing
∗1 These timing are the recommended condition under fφRS = 1MHz.
–6–
Application Circuit∗
φCLP
500Ω
φ1
φROG-R
500Ω
φROG-G
VOUT-R
VOUT-B
IC1
IC1
Tr1
100Ω
0.1µF
47µF/
16V
2Ω
NC
NC
NC
φROG-R
φ1
NC
NC
NC
φ2
φROG-B
12
NC
13
NC
14
NC
15
VOUT-R
16
VDD
17
VOUT-B
18
VOUT-G
19
NC
20
GND
21
φCLP
22
100Ω
φRS
–7–
12V
100Ω
100Ω
φROG-G
100Ω
Tr1
1
2
3
4
5
6
7
8
9
10
11
100Ω
2Ω
100Ω
100Ω
Tr1
IC1
IC1
VOUT-G
φRS
∗ Data rate fφRS = 1MHz
500Ω
φ2
φROG-B
IC1: 74AC04
Tr1: 2SC2785
ILX558K
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
ILX558K
Example of Representative Characteristics
Spectral sensitivity characteristics (Standard characteristics)
1.0
R
0.9
G
B
Relative sensitivity
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
450
500
550
Wavelength [nm]
–8–
600
650
700
ILX558K
Notes of Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for prevention of static charges.
2) Notes on Handling CCD Packages
The following points should be observed when handling and installing packages.
a) Remain within the following limits when applying static load to the package:
(1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer
perimeter of the glass portion.)
(2) Shearing strength: 29N/surface
(3) Tensile strength: 29N/surface
(4) Torsional strength: 0.9Nm
Cover glass
Plastic portion
39N
29N
0.9Nm
29N
Adhesive
Ceramic portion
(1)
(2)
(3)
(4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the package to crack or dust to be generated.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with soldering iron.
(3) Rapid cooling or heating.
(4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer.
(5) Applying the metal a crash or a rub against the plastic portion.
Note that the preceding notes should also be observed when removing a component from a board
after it has already been soldered.
d) The notch of the plastic portion is used for directional index, and that can not be used for reference of
fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap
with the notch of the plastic portion.
–9–
ILX558K
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W
soldering iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount,
cool sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.
Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static
electricity ionized air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to
scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
– 10 –
Package Outline
Unit: mm
22Pin DIP( 400mil )
0˚ to 9˚
32.0 ± 0.3
21.360 ( 5340Pixels )
6.22 ± 0.3
10.0 ± 0.3
5.0 ± 0.3
V
10.16
12
22
No. 1Pixel ( GreenMain )
H
11
0.25
1
2.1
4.0 ± 0.5
– 11 –
2.54
2.8 ± 0.5
( 2.9 )
0.51
0.3
M
1. The height from the bottom to the sensor surface is 1.61 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
PACKAGE STRUCTURE
Plastic
LEAD TREATMENT
GOLD PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE MASS
2.21g
DRAWING NUMBER
LS-D19(E)
ILX558K
Sony Corporation
PACKAGE MATERIAL