ILX558K 5340-pixel × 3-line CCD Linear Sensor (Color) Description The ILX558K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 600DPI. Features • Number of effective pixels: 16020 pixels (5340 pixels × 3) • Pixel size: 4µm × 4µm (4µm pitch) • Distance between line: 32µm (8 lines) • Single-sided readout • Ultra low lag/High sensitivity • Single 12V power supply • Maximum data rate: 10MHz/Color • Input clock pulse: CMOS 5V drive • Number of output: 3 (R, G, B) • Package: 22-pin Plastic DIP (400mil) 1 R 22 φCLP 1 G 1 B 11 φROG-B Blue φ2 10 12 φROG-G Driver Driver 14 φROG-R Driver D18 D19 5340 5340 13 φ1 5340 φROG-B 11 D69 S1 φ2 10 φ1 14 φROG-R 13 9 1 NC φRS 15 NC 4 8 VDD NC 2 16 NC GND 7 CCD register NC Read out gate 17 NC Output amplifier 6 VOUT-B 20 NC CCD register 18 NC 3 5 VOUT-G NC Green 19 VOUT-R Read out gate 4 Output amplifier VDD CCD register Red 20 VOUT-B Read out gate 3 Output amplifier VOUT-G VOUT-R 19 21 NC D18 D19 2 D18 D19 GND 22 φCLP D69 S1 1 D69 S1 S5340 D70 φRS S5340 D70 D74 D75 Pin Configuration (Top View) S5340 D70 V °C D74 D75 15 –10 to +55 Block Diagram D74 D75 Absolute Maximum Ratings • Supply voltage VDD • Operating temperature 22 pin DIP (Plastic) 12 φROG-G Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E02951-PS ILX558K Pin Description Pin No. Symbol Description Pin No. Symbol Description 1 φRS Clock pulse input 12 φROG-G Clock pulse input 2 GND GND 13 φ1 Clock pulse input 3 VOUT-G Signal output (green) 14 φROG-R Clock pulse input 4 VDD 12V power supply 15 NC NC 5 NC NC 16 NC NC 6 NC NC 17 NC NC 7 NC NC 18 NC NC 8 NC NC 19 VOUT-R Signal output (red) 9 NC NC 20 VOUT-B Signal output (blue) 10 φ2 Clock pulse input 21 NC NC 11 φROG-B Clock pulse input 22 φCLP Clock pulse input Recommended Supply Voltage Item VDD Min. Typ. Max. Unit 11.4 12 12.6 V Clock Characteristics Item Symbol Min. Typ. Max. Unit Input capacitance of φ1, φ2 Cφ1, Cφ2 — 500 — pF Input capacitance of φRS CφRS — 10 — pF Input capacitance of φCLP CφCLP — 10 — pF Input capacitance of φROG CφROG — 10 — pF Min. Typ. Max. Unit — 1 10 MHz Clock Frequency Item Symbol Frequency of φ1, φ2, φRS, φCLP fφ1, fφ2, fφRS, fφCLP Input Clock Pulse Voltage Conditions Item φ1, φ2, φRS, φCLP, φROG pulse voltage Min. Typ. Max. Unit High level 4.75 5.0 5.25 V Low level — 0 0.1 V –2– ILX558K Electro-optical Characteristics (Note 1) (Ta = 25°C, VDD = 12V, fφRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Symbol Min. Typ. Max. Unit Remarks V/(lx · s) Note 2 Red RR 1.7 2.6 3.5 Green RG 2.0 3.1 4.2 Blue RB 1.6 2.5 3.4 Sensitivity nonuniformity PRNU — 4 20 % Note 3 Saturation output voltage VSAT 2.5 3.0 — V Note 4 Red SER — 1.15 — Green SEG — 0.97 — lx · s Note 5 Blue SEB — 1.2 — Dark voltage average VDRK — 2 5 mV Dark signal nonuniformity DSNU — 4 12 mV Image lag IL — 0.02 — % Note 7 Supply current IVDD — 30 50 mA — Total transfer efficiency TTE 92 98 — % — Output impedance ZO — 240 — Ω — Offset level VOS — 5.6 — V Note 8 Sensitivity Saturation exposure Note 6 Notes: 1. In accordance with the given electro-optical characteristics, the black level is defined as the average value of D18, D19 to D67. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (typ.) PRNU = (VMAX – VMIN)/2 VAVE × 100 [%] When the 5340 pixels are divided into blobks of 100, the maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time τ int stands at 5.5ms. 7. VOUT-G = 500mV (typ.) VOUT 8. Vos is defined as indicated bellow. VOUT indicates VOUT-R, VOUT-G and VOUT-B. VOS GND –3– Clock Timing Chart 1 5 φ1 φ2 5415 5414 3 5 2 0 1 φROG 0 5 0 φRS 5 0 5 D75 D74 D71 D70 S5340 S5339 S5338 S2 S1 D69 D68 D67 D19 D18 D17 D3 D2 0 D1 –4– φCLP VOUT Optical black (50 pixels) Dummy signal (69 pixels) 1-line output period (5415 pixels) Note) The transfer pulses (φ1, φ2) must have more than 5415 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. ILX558K φROG indicates φROG-R, φROG-G, φROG-B. ILX558K Clock Timing Chart 2 t4 t5 φROG t2 t6 φ1 t7 t1 t3 φ2 Clock Timing Chart 3 t6 t7 φ1 φ2 t9 φRS t10 t8 t14 t16 t15 t17 φCLP t13 t11 t12 VOUT –5– ILX558K Clock Pulse Recommended Timing Item Symbol Min. Typ. Max. Unit φROG, φ1 pulse timing t1 50 100 — ns φROG pulse high level period t2 3 5 — µs φROG, φ1 pulse timing t3 1 2 — µs φROG pulse rise time t4 0 5 — ns φROG pulse fall time t5 0 5 — ns φ1 pulse rise time/φ2 pulse fall time t6 0 20 — ns φ1 pulse fall time/φ2 pulse rise time t7 0 — ns φRS pulse high level period t8 30 20 50∗1 — ns φRS pulse rise time t9 0 20 — ns φRS pulse fall time t10 0 20 — ns t11 — 50 — ns t12 — 20 — ns t13 30 100 — ns t14 10 100 — ns t15 5 50 — ns φCLP pulse rise time t16 0 20 — ns φCLP pulse fall time t17 0 20 — ns Signal output delay time φCLP pulse high level period φCLP pulse timing ∗1 These timing are the recommended condition under fφRS = 1MHz. –6– Application Circuit∗ φCLP 500Ω φ1 φROG-R 500Ω φROG-G VOUT-R VOUT-B IC1 IC1 Tr1 100Ω 0.1µF 47µF/ 16V 2Ω NC NC NC φROG-R φ1 NC NC NC φ2 φROG-B 12 NC 13 NC 14 NC 15 VOUT-R 16 VDD 17 VOUT-B 18 VOUT-G 19 NC 20 GND 21 φCLP 22 100Ω φRS –7– 12V 100Ω 100Ω φROG-G 100Ω Tr1 1 2 3 4 5 6 7 8 9 10 11 100Ω 2Ω 100Ω 100Ω Tr1 IC1 IC1 VOUT-G φRS ∗ Data rate fφRS = 1MHz 500Ω φ2 φROG-B IC1: 74AC04 Tr1: 2SC2785 ILX558K Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. ILX558K Example of Representative Characteristics Spectral sensitivity characteristics (Standard characteristics) 1.0 R 0.9 G B Relative sensitivity 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 Wavelength [nm] –8– 600 650 700 ILX558K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass Plastic portion 39N 29N 0.9Nm 29N Adhesive Ceramic portion (1) (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion. –9– ILX558K 3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. – 10 – Package Outline Unit: mm 22Pin DIP( 400mil ) 0˚ to 9˚ 32.0 ± 0.3 21.360 ( 5340Pixels ) 6.22 ± 0.3 10.0 ± 0.3 5.0 ± 0.3 V 10.16 12 22 No. 1Pixel ( GreenMain ) H 11 0.25 1 2.1 4.0 ± 0.5 – 11 – 2.54 2.8 ± 0.5 ( 2.9 ) 0.51 0.3 M 1. The height from the bottom to the sensor surface is 1.61 ± 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. PACKAGE STRUCTURE Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 2.21g DRAWING NUMBER LS-D19(E) ILX558K Sony Corporation PACKAGE MATERIAL