STSR220 ® HIGH EFFICIENCY SWITCHED MODE RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 2A VRRM 200V VF(max) 0.8V FEATURES AND BENEFITS VERY LOW CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD AND REVERSE RECOVERY TIMES HIGH SURGE CURRENT DESCRIPTION F126 (Plastic) Low voltage drop rectifiers suited for Switched Mode Power Supplies and for switching mode base drive and transistor circuit. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V VRSM Non repetitive peak reverse voltage 220 V IFRM Repetive peak forward current tp < 20µs 70 A IF (AV) Average forward current * Ta = 75°C δ = 0.5 2 A IFSM Surge non repetitive forward current tp = 10ms Sinusoidal 70 A Ptot Power dissipation * Ta = 75°C 1.85 W Tstg Tj Storage temperature range Maximum junction temperature - 40 to + 150 150 °C TL Maximum lead temperature for soldering during 10s at 4mm from case 230 °C * On infinite heatsink with 10mm lead length October 1999 - Ed: 2A 1/3 STSR220 THERMAL RESISTANCE Symbol Rth (j - a) Parameter Junction to ambient thermal resistance * Value Unit 40 °C/W * On infinite heatsink with 10mm lead lengh. STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter IR Reverse leakage current VF Forward voltage drop Test Conditions Max. Unit Tj = 25°C 10 µA Tj = 100°C 0.5 mA IF = 2A Tj = 25°C 1 V IF = 2A Tj = 100°C 0.8 VR = VRRM Min. Typ. RECOVERY CHARACTERISTICS Symbol Test Conditions Min. Max. Unit 35 ns trr Tj = 25°C VR = 30V IF = 1A diF/dt = -50A/µs Qrr Tj = 25°C VR < 30V IF = 2A diF/dt = -20A/µs 12 nC tfr Tj = 25°C Measured at 1.1x VF IF = 1A tr = 10ns 20 ns Tj = 25°C IF = 1A tr = 10ns 5 V VFP To evaluate the conduction losses use the following equation: P = 0.68 x IF(AV) + 0.06 IF2(RMS) 2/3 Typ. STSR220 PACKAGE MECHANICAL DATA F126 (Plastic) C C A D D B DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 6.05 6.20 6.35 0.238 0.244 0.250 B 2.95 3.00 3.05 0.116 0.118 0.120 C 26 31 1.024 D 0.76 0.86 0.030 0.81 1.220 0.032 0.034 Marking: type number; ring at cathode end Cooling method: by convection (method A) Weight: 0.4 g Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 3/3