TC1173 300mA CMOS LDO with Shutdown, ERROR Output and Bypass FEATURES GENERAL DESCRIPTION ■ The TC1173 is a precision output (typically ±0.5%) CMOS low dropout regulator. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators!). TC1173 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load) and internal feed-forward compensation for fast response to step changes in load. An error output (ERROR) is asserted when the TC1173 is outof-regulation (due to a low input voltage or excessive output current). ERROR can be set as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.05µA (typical) and VOUT and ERROR fall to zero when the shutdown input is low. The TC1173 incorporates both over-temperature and over-current protection. The TC1173 is stable with an output capacitor of only 1µF and has a maximum output current of 300mA. ■ ■ ■ ■ ■ ■ ■ ■ Extremely Low Supply Current for Longer Battery Life! Very Low Dropout Voltage Guaranteed 300mA Output Standard or Custom Output Voltages ERROR Output Can be Used as a Low Battery Detector or Processor Reset Generator Power-Saving Shutdown Mode Bypass Input for Ultra-Quiet Operation Over-Current and Over-Temperature Protection Space-Saving MSOP Package Option APPLICATIONS ■ ■ ■ ■ ■ ■ ■ Battery-Operated Systems Portable Computers Medical Instruments Instrumentation Cellular / GSM / PHS Phones Linear Post-Regulator for SMPS Pagers ORDERING INFORMATION TYPICAL APPLICATION 1 C1 1µF 2 VOUT VIN GND NC 8 3 4 NC Bypass CBYPASS 470pF (Optional) SHDN ERROR 6 Package TC1173-xxVOA TC1173-xxVUA 8-Pin SOIC 8-Pin MSOP Junction Temp. Range – 40°C to +125°C – 40°C to +125°C VIN Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0 xx indicates output voltages 7 TC1173 Part Number R3 1M Other output voltages are available. Please contact TelCom Semiconductor for details. 5 ERROR Shutdown Control (from Power Control Logic) PIN CONFIGURATION MSOP VOUT GND NC Bypass 1 8 2 7 3 4 TC1173VUA 6 5 VIN NC SHDN ERROR SOIC VOUT 1 8 VIN GND 2 7 NC NC 3 TC1173VOA 6 SHDN Bypass 4 TC1173-2 2/2/00 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices. 5 ERROR 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 ABSOLUTE MAXIMUM RATINGS* Storage Temperature ............................ – 65°C to +150°C Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V Lead Temperature (Soldering, 10 Sec.) ................ +300°C Input Voltage .............................................................. 6.5V Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3) Power Dissipation .................... Internally Limited (Note 7) Operating Temperature .................... – 40°C < TJ < 125°C *Absolute Maximum Ratings indicate device operation limits beyond damage may occur. Device operation beyond the limits listed in Electrical Characteristics is not recommended. ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C Symbol Parameter Test Conditions VIN IOUTMAX VOUT Input Operating Voltage Maximum Output Current Output Voltage Note 1 ∆VOUT/∆T VOUT Temperature Coefficient Note 2 ∆VOUT/∆VIN ∆VOUT/VOUT VIN – VOUT Line Regulation Load Regulation Dropout Voltage (Note 4) ISS1 ISS2 PSRR IOUTSC ∆VOUT∆PD eN Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise (VR + 1V) < VIN < 6V IL = 0.1mA to IOUTMAX (Note 3) IL = 0.1mA IL = 100mA IL = 300mA SHDN = VIH SHDN = 0V FRE ≤ 1kHz VOUT = 0V Note 5 F = 1kHz, COUT = 1µF, RLOAD = 50Ω Min — 300 — VR - 2.5% — Typ VR — — ± 0.5% Max Units 6.0 — — VR + 2.5% — V mA V — — — — — — — 40 0.05 0.5 20 80 240 50 0.05 60 550 0.04 260 45 — — — — 15 %VIN %VIN 1.0 — — — — — 0.95 x VR 50 — 400 — — V mV V mV — — — ppm/°C 0.35 2.0 30 160 480 90 0.5 — 650 — — % % mV µA µA dB mA V/W nV/√Hz SHDN Input VIH VIL SHDN Input High Threshold SHDN Input Low Threshold ERROR Output VMIN VOL VTH VOL Minimum Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis 1mA Flows to ERROR Note 7 NOTES: 1. VR is the user-programmed regulator output voltage setting. 2. TC VOUT = (VOUTMAX – VOUTMIN) x 10 6 VOUT x ∆T 3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. 7. Hysteresis voltage is referenced to VR. TC1173-2 2/2/00 2 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical), VOUT falls to zero and ERROR is disabled. DETAILED DESCRIPTION The TC1173 is a fixed output, low drop-out regulator. Unlike bipolar regulators, the TC1173 supply current does not increase with load current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in RTC and CMOS RAM battery back-up applications). TC1173 pin functions are detailed below: ERROR Output ERROR is driven low whenever VOUT falls out of regulation by more than – 5% (typical). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g., ERROR = VOL at 4.75V (typ) for a 5.0V regulator and 2.85V (typ) for a 3.0V regulator). ERROR output operation is shown in Figure 2. Note that ERROR is active when VOUT is at or below VTH, and inactive when VOUT is above VTH + VH. As shown in Figure 1, ERROR can be used as a battery low flag, or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C3 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V.) PIN DESCRIPTIONS Pin No. Symbol 1 2 3 4 VOUT GND NC Bypass 5 ERROR 6 SHDN 7 8 NC VIN Description Regulated voltage output Ground terminal No connect Reference bypass input. Connecting a 470pF to this input further reduces output noise. Out-of-Regulation Flag (Open Drain Output). This output goes low when VOUT is outof-tolerance by approximately -5%. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05µA (typical). No connect Unregulated supply input VOUT VTH Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is above VIH, and shutdown (disabled) when SHDN is at or below VIL. Hysteresis (VH) ERROR VIH VOL VOUT 1 C1 1µF 2 VOUT VIN GND NC 4 NC Bypass CBYPASS 470pF (Optional) SHDN ERROR VIN Output Capacitor A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance of 5Ω or less. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately – 30°C, solid tantalums are recommended for applications operating below – 25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 7 TC1173 3 Figure 2: ERROR Output Operation 8 6 5 R3 1M ERROR Shutdown Control (from Power Control Logic) Figure 1: Typical Application Circuit TC1173-2 2/2/00 3 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: GIVEN: Thermal Considerations Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. FIND: PD ≈ (VINMAX - VOUTMIN)ILOADMAX = [(3.0 x 1.1) - (2.7 x .995)]250 x 10-3 = 155mW Maximum allowable power dissipation: PD ≈ (TJMAX– TAMAX) JA PD ≈ (VINMAX – VOUTMIN)ILOADMAX PD = VINMAX = VOUTMIN = ILOADMAX = worst case actual power dissipation maximum voltage on VIN minimum regulator output voltage maximum output (load) current = (125 – 55) 200 = 350mW In this example, the TC1173 dissipates a maximum of only 155mW; far below the allowable limit of 350mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350mW into Equation 1, from which VINMAX = 4.1V. Equation 1. The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C), and the thermal resistance from junction-to-air (JA). The 8-Pin SOIC package has a JA of approximately 160°C/Watt, while the 8-Pin MSOP package has a JA of approximately 200°C/Watt; both when mounted on a single layer FR4 dielectric copper clad PC board. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. PDMAX = (TJMAX – TAMAX) JA Where all terms are previously defined. Equation 2. TC1173-2 2/2/00 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Where: VINMAX = 3.0V ± 10% VOUTMIN = 2.7V ± 0.5% ILOADMAX = 250mA TJMAX = 125°C TAMAX = 55°C JA = 200°C/W 8-Pin MSOP Package 4 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 TYPICAL CHARACTERISTICS 2.00 10.0 RLOAD = 50Ω COUT = 1µF Noise (µV/√/ HZ) 0.008 0.006 0.004 0.002 1.80 LOAD REGULATION (%) 0.010 LINE REGULATION (%) Load Regulation Output Noise Line Regulation 0.012 1.0 0.1 0.000 –0.002 20 40 60 0.0 0.01 80 100 120 0.80 0.60 1 to 100mA 0.40 1 to 50mA 0.01 10 1 100 0.00 –40 –20 1000 Supply Current DROPOUT VOLTAGE (V) 80.0 70.0 60.0 50.0 85°C 0.30 70°C 0.25 40 60 80 100 120 VOUT vs. Temperature 3.075 125°C 0.35 20 TEMPERATURE (°C) Dropout Voltage vs. Load Current 0.40 90.0 0 FREQUENCY (KHz) 100.0 SUPPLY CURRENT (µA) 1.20 1.00 VIN = 4V ILOAD = 100µA CLOAD = 3.3µF 3.025 VOUT (V) 0 TEMPERATURE (°C) 25°C 0.20 0°C 0.15 2.975 0.10 –40°C 0.05 40.0 –40 –20 0.00 0 20 40 60 80 100 120 TEMPERATURE (°C) 0 50 100 Power Supply Rejection Ratio VOUT = 5V –35dB R LOAD = 50Ω –40dB VINAC = 50mV p-p –45dB –50dB COUT = 1µF –55dB –60dB –65dB –70dB –75dB –80dB 10 100 1K 10K 150 200 LOAD CURRENT (mA) –30dB PSRR (dB) 1 to 300mA 1.40 0.20 –0.004 –40 –20 100K 1M FREQUENCY (KHz) TC1173-2 2/2/00 1.60 5 250 300 2.925 –40 –20 0 20 40 60 80 100 120 TEMPERATURE (°C) 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 TAPE AND REEL DIAGRAMS Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed User Direction of Feed PIN 1 W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed User Direction of Feed PIN 1 W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP TC1173-2 2/2/00 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in 6 300mA CMOS LDO With Shutdown, ERROR Output, And Bypass TC1173 PACKAGE DIMENSIONS 8-Pin SOIC (Narrow) PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .010 (0.25) .007 (0.18) 8° MAX. .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .050 (1.27) .016 (0.40) 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .008 (0.20) .005 (0.13) 6° MAX. .006 (0.15) .002 (0.05) .028 (0.70) .016 (0.40) Dimensions: inches (mm) Sales Offices TelCom Semiconductor, Inc. 1300 Terra Bella Avenue P.O. Box 7267 Mountain View, CA 94039-7267 TEL: 650-968-9241 FAX: 650-967-1590 E-Mail: [email protected] TC1173-2 2/2/00 TelCom Semiconductor, GmbH Lochhamer Strasse 13 D-82152 Martinsried Germany TEL: (011) 49 89 895 6500 FAX: (011) 49 89 895 6502 2 7 TelCom Semiconductor H.K. Ltd. 10 Sam Chuk Street, Ground Floor San Po Kong, Kowloon Hong Kong TEL: (011) 852-2350-7380 FAX: (011) 852-2354-9957