TI DRV8412DDW

DRV8412
DRV8432
www.ti.com
SLES242C – DECEMBER 2009 – REVISED MAY 2010
Dual Full Bridge PWM Motor Driver
Check for Samples: DRV8412, DRV8432
FEATURES
1
•
•
•
•
•
•
•
•
•
•
High-Efficiency Power Stage (up to 97%) with
Low RDS(on) MOSFETs (80 mΩ at TJ = 25°C)
Operating Supply Voltage up to 50 V
(70 V Absolute Maximum)
DRV8412 (power pad down): up to 2 x 3 A
Continuous Output Current (2 x 6 A Peak) in
Dual Full Bridge Mode or 6 A Continuous
Current in Parallel Mode (12 A Peak)
DRV8432 (power pad up): up to 2 x 7 A
Continuous Output Current ( 2 x 12 A Peak) in
Dual Full Bridge Mode or 14 A Continuous
Current in Parallel Mode (24 A Peak)
PWM Operating Frequency up to 500 kHz
Integrated Self-Protection Circuits Including
Undervoltage, Overtemperature, Overload, and
Short Circuit
Programmable Cycle-by-Cycle Current Limit
Protection
Independent Supply and Ground Pins for Each
Half Bridge
Intelligent Gate Drive and Cross Conduction
Prevention
No External Snubber or Schottky Diode is
Required
APPLICATIONS
•
•
•
•
•
•
Brushed DC and Stepper Motors
Three Phase Permanent Magnet Synchronous
Motors
Robotic and Haptic Control System
Actuators and Pumps
Precision Instruments
TEC Drivers
DESCRIPTION
The DRV8412/32 are high performance, integrated
dual full bridge motor drivers with an advanced
protection system.
The DRV8412/32 require two power supplies, one at
12 V for GVDD and VDD, and another up to 50 V for
PVDD. The DRV8412/32 can operate at up to
500-kHz switching frequency while still maintain
precise control and high efficiency. They also have an
innovative protection system safeguarding the device
against a wide range of fault conditions that could
damage the system. These safeguards are
short-circuit protection, overcurrent protection,
undervoltage protection, and two-stage thermal
protection. The DRV8412/32 have a current-limiting
circuit that prevents device shutdown during load
transients such as motor start-up. A programmable
overcurrent detector allows adjustable current limit
and protection level to meet different motor
requirements.
The DRV8412/32 have unique independent supply
and ground pins for each half bridge, which makes it
possible to provide current measurement through
external shunt resistor and support multiple motors
with different power supply voltage requirements.
Simplified Application Diagram
GVDD
GVDD_B
OTW
FAULT
Controller
PVDD_A
OUT_A
RESET_AB
GND_A
PWM_B
GND_B
OC_ADJ
OUT_B
AGND
BST_B
BST_C
PVDD_C
M2
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
PWM_D
VDD
GVDD_C
M
PVDD_B
VREG
M3
PVDD
BST_A
PWM_A
GND
GVDD
GVDD_A
M
OUT_D
PVDD_D
PVDD
BST_D
GVDD_D
Because of the low RDS(on) of the H-Bridge MOSFETs
and intelligent gate drive design, the efficiency of
these motor drivers can be up to 97%, which enables
the use of smaller power supplies and heatsinks, and
are good candidates for energy efficient applications.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range unless otherwise noted
(1)
VALUE
VDD to GND
–0.3 V to 13.2 V
GVDD_X to GND
–0.3 V to 13.2 V
PVDD_X to GND_X
(2)
–0.3 V to 70 V
OUT_X to GND_X
(2)
–0.3 V to 70 V
BST_X to GND_X
(2)
–0.3 V to 80 V
Transient peak output current (per pin), pulse width limited by internal over-current protection circuit.
16 A
Transient peak output current for latch shut down (per pin)
20 A
VREG to AGND
–0.3 V to 4.2 V
GND_X to GND
–0.3 V to 0.3 V
GND to AGND
–0.3 V to 0.3 V
PWM_X to GND
–0.3 V to 4.2 V
OC_ADJ, M1, M2, M3 to AGND
–0.3 V to 4.2 V
RESET_X, FAULT, OTW to GND
–0.3 V to 7 V
Maximum continuous sink current (FAULT, OTW)
9 mA
Maximum operating junction temperature range, TJ
-40°C to 150°C
Storage temperature, TSTG
–55°C to 150°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
These voltages represent the dc voltage + peak ac waveform measured at the terminal of the device in all conditions.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
0
50
52.5
V
Supply for logic regulators and gate-drive circuitry
10.8
12
13.2
V
VDD
Digital regulator supply voltage
10.8
12
13.2
V
IO_PULSE
Pulsed peak current per output pin (could be limited by thermal)
15
A
IO
Continuous current per output pin (DRV8432)
7
A
FSW
PWM switching frequency
500
kHz
ROCP_CBC
OC programming resistor range in cycle-by-cycle current limit modes
24
200
kΩ
ROCP_OCL
OC programming resistor range in OC latching shutdown modes
22
200
kΩ
CBST
Bootstrap capacitor range
33
220
nF
TON_MIN
Minimum PWM pulse duration, low side
TA
Operating ambient temperature
PVDD_X
Half bridge X (A, B, C, or D) DC supply voltage
GVDD_X
(1)
2
50
-40
nS
85 (1)
°C
Depending on power dissipation and heat-sinking, the DRV8412/32 can support ambient temperature in excess of 85°C. Refer to the
package heat dissipation ratings table and package power deratings table.
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
DRV8412
DRV8432
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SLES242C – DECEMBER 2009 – REVISED MAY 2010
PACKAGE HEAT DISSIPATION RATINGS
DRV8412
DRV8432
RqJC, junction-to-case (power pad / heat slug) thermal
resistance
PARAMETER
1.1 °C/W
0.9 °C/W
RqJA, junction-to-ambient thermal resistance
25 °C/W
This device is not intended to be used without a
heatsink. Therefore, RqJA is not specified. See the
Thermal Information section.
Exposed power pad / heat slug area
34 mm2
80 mm2
PACKAGE POWER DERATINGS (DRV8412) (1)
PACKAGE
TA = 25°C
POWER
RATING
DERATING
FACTOR
ABOVE TA =
25°C
TA = 70°C POWER
RATING
TA = 85°C POWER
RATING
TA = 125°C POWER
RATING
44-PIN TSSOP (DDW)
5.0 W
40.0 mW/°C
3.2 W
2.6 W
1.0 W
(1)
Based on EVM board layout
MODE SELECTION PINS
MODE PINS
M3
M2
M1
OUTPUT
CONFIGURATION
0
0
0
2 FB or 4 HB
Dual full bridges (two PWM inputs each full bridge) or four half bridges with
cycle-by-cycle current limit
0
0
1
2 FB or 4 HB
Dual full bridges (two PWM inputs each full bridge) or four half bridges with
OC latching shutdown (no cycle-by-cycle current limit)
0
1
0
1 PFB
0
1
1
2 FB
1
x
x
DESCRIPTION
Parallel full bridge with cycle-by-cycle current limit
Dual full bridges (one PWM input each full bridge with complementary PWM
on second half bridge) with cycle-by-cycle current limit
Reserved
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
DEVICE INFORMATION
Pin Assignment
Here are the pinouts for the DRV8412/32:
• DRV8412: 44-pin TSSOP power pad down DDW package. This package contains a thermal pad that is
located on the bottom side of the device for dissipating heat through PCB.
• DRV8432: 36-pin PSOP3 DKD package. This package contains a thick heat slug that is located on the top
side of the device for dissipating heat through heatsink.
DRV8412
DDW Package
(Top View)
DRV8432
DKD Package
(Top View)
GVDD_C
1
44
VDD
NC
NC
PWM_D
RESET_CD
PWM_C
2
43
3
42
4
41
5
40
6
39
7
38
M1
M2
M3
VREG
AGND
GND
OC_ADJ
PWM_B
RESET_AB
PWM_A
8
37
9
36
10
35
FAULT
NC
NC
OTW
GVDD_B
11
34
12
33
13
32
14
31
15
30
16
29
17
28
18
27
19
26
20
25
21
24
22
23
GVDD_D
BST_D
NC
PVDD_D
PVDD_D
OUT_D
GND_D
GND_C
OUT_C
PVDD_C
BST_C
BST_B
PVDD_B
OUT_B
GND_B
GND_A
OUT_A
PVDD_A
PVDD_A
NC
BST_A
GVDD_A
GVDD_B
1
36
OTW
FAULT
PWM_A
2
35
3
34
4
33
RESET_AB
PWM_B
OC_ADJ
5
32
GND
AGND
VREG
M3
6
31
7
30
8
29
9
28
10
27
11
26
M2
M1
PWM_C
12
25
13
24
14
23
RESET_CD
PWM_D
15
22
16
21
VDD
GVDD_C
17
20
18
19
GVDD_A
BST_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
BST_C
PVDD_C
OUT_C
GND_C
GND_D
OUT_D
PVDD_D
BST_D
GVDD_D
PIN FUNCTIONS
PIN
(1)
4
NAME
DRV8412
DRV8432
FUNCTION
DESCRIPTION
(1)
AGND
12
9
P
Analog ground
BST_A
24
35
P
High side bootstrap supply (BST), external capacitor to OUT_A required
BST_B
33
28
P
High side bootstrap supply (BST), external capacitor to OUT_B required
BST_C
34
27
P
High side bootstrap supply (BST), external capacitor to OUT_C required
BST_D
43
20
P
High side bootstrap supply (BST), external capacitor to OUT_D required
GND
13
8
P
Ground
GND_A
29
32
P
Power ground for half-bridge A requires close decoupling capacitor to ground
GND_B
30
31
P
Power ground for half-bridge B requires close decoupling capacitor to ground
GND_C
37
24
P
Power ground for half-bridge C requires close decoupling capacitor to ground
GND_D
38
23
P
Power ground for half-bridge D requires close decoupling capacitor to ground
GVDD_A
23
36
P
Gate-drive voltage supply
GVDD_B
22
1
P
Gate-drive voltage supply
GVDD_C
1
18
P
Gate-drive voltage supply
GVDD_D
44
19
P
Gate-drive voltage supply
M1
8
13
I
Mode selection pin
I = input, O = output, P = power, T = thermal
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
DRV8412
DRV8432
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SLES242C – DECEMBER 2009 – REVISED MAY 2010
PIN
NAME
FUNCTION
DESCRIPTION
(1)
DRV8412
DRV8432
M2
9
12
I
Mode selection pin
M3
10
11
I
Reserved mode selection pin, AGND connection is recommended
NC
3,4,19,20,25,42
–
–
No connection pin. Ground connection is recommended
OC_ADJ
14
7
O
Analog overcurrent programming pin, requires resistor to AGND
OTW
21
2
O
Overtemperature warning signal, open-drain, active-low. An internal pull-up resistor
to VREG (3.3 V) is provided on output. Level compliance for 5-V logic can be
obtained by adding external pull-up resistor to 5 V
OUT_A
28
33
O
Output, half-bridge A
OUT_B
31
30
O
Output, half-bridge B
OUT_C
36
25
O
Output, half-bridge C
OUT_D
39
22
O
Output, half-bridge D
PVDD_A
26,27
34
P
Power supply input for half-bridge A requires close decoupling capacitor to ground.
PVDD_B
32
29
P
Power supply input for half-bridge B requires close decoupling capacitor to gound.
PVDD_C
35
26
P
Power supply input for half-bridge C requires close decoupling capacitor to ground.
PVDD_D
40,41
21
P
Power supply input for half-bridge D requires close decoupling capacitor to ground.
PWM_A
17
4
I
Input signal for half-bridge A
PWM_B
15
6
I
Input signal for half-bridge B
PWM_C
7
14
I
Input signal for half-bridge C
PWM_D
5
16
I
Input signal for half-bridge D
RESET_AB
16
5
I
Reset signal for half-bridge A and half-bridge B, active-low
RESET_CD
6
15
I
Reset signal for half-bridge C and half-bridge D, active-low
FAULT
18
3
O
Fault signal, open-drain, active-low. An internal pull-up resistor to VREG (3.3 V) is
provided on output. Level compliance for 5-V logic can be obtained by adding
external pull-up resistor to 5 V
VDD
2
17
P
Power supply for digital voltage regulator requires capacitor to ground for
decoupling.
VREG
11
10
P
Digital regulator supply filter pin requires 0.1-mF capacitor to AGND.
THERMAL PAD
-
N/A
T
Solder the exposed thermal pad to the landing pad on the pcb. Connect landing
pad to bottom side of pcb through via for better thermal dissipation.
HEAT SLUG
N/A
-
T
Mount heat sink with thermal interface on top of the heat slug for best thermal
performance.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
SYSTEM BLOCK DIAGRAM
VDD
4
Undervoltage
Protection
OTW
Internal Pullup
Resistors to VREG
FAULT
M1
Protection
and
I/O Logic
M2
M3
4
VREG
VREG
Power
On
Reset
AGND
Temp.
Sense
GND
RESET_AB
Overload
Protection
RESET_CD
Isense
OC_ADJ
GVDD_D
BST_D
PVDD_D
PWM_D
PWM
Rcv.
Ctrl.
Timing
Gate
Drive
OUT_D
FB/PFB−Configuration
Pulldown Resistor
GND_D
GVDD_C
BST_C
PVDD_C
PWM_C
PWM
Rcv.
Ctrl.
Timing
Gate
Drive
OUT_C
FB/PFB−Configuration
Pulldown Resistor
GND_C
GVDD_B
BST_B
PVDD_B
PWM_B
PWM
Rcv.
Ctrl.
Timing
Gate
Drive
OUT_B
FB/PFB−Configuration
Pulldown Resistor
GND_B
GVDD_A
BST_A
PVDD_A
PWM_A
PWM
Rcv.
Ctrl.
Timing
Gate
Drive
OUT_A
FB/PFB−Configuration
Pulldown Resistor
GND_A
6
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Product Folder Link(s): DRV8412 DRV8432
DRV8412
DRV8432
www.ti.com
SLES242C – DECEMBER 2009 – REVISED MAY 2010
ELECTRICAL CHARACTERISTICS
TA = 25 °C, PVDD = 50 V, GVDD = VDD = 12 V, fSw = 400 kHz, unless otherwise noted. All performance is in accordance
with recommended operating conditions unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.95
3.3
3.65
9
12
mA
2.5
mA
1
mA
Internal Voltage Regulator and Current Consumption
VREG
Voltage regulator, only used as a reference node
IVDD
VDD = 12 V
Idle, reset mode
VDD supply current
Operating, 50% duty cycle
V
10.5
Reset mode
1.7
IGVDD_X
Gate supply current per half-bridge
IPVDD_X
Half-bridge X (A, B, C, or D) idle current
Reset mode
0.7
MOSFET drain-to-source resistance, low side (LS)
TJ = 25°C, GVDD = 12 V
80
mΩ
80
mΩ
Operating, 50% duty cycle
8
Output Stage
RDS(on)
MOSFET drain-to-source resistance, high side (HS)
TJ = 25°C, GVDD = 12 V
VF
Diode forward voltage drop
TJ = 25°C - 125°C, IO = 5 A
tR
Output rise time
tF
tPD_ON
1
V
Resistive load, IO = 5 A
14
nS
Output fall time
Resistive load, IO = 5 A
14
nS
Propagation delay when FET is on
Resistive load, IO = 5 A
38
nS
tPD_OFF
Propagation delay when FET is off
Resistive load, IO = 5 A
38
nS
tDT
Dead time between HS and LS FETs
Resistive load, IO = 5 A
5.5
nS
8.5
V
I/O Protection
Gate supply voltage GVDD_X undervoltage
protection threshold
Vuvp,G
Vuvp,hyst
(1)
Hysteresis for gate supply undervoltage event
OTW (1)
Overtemperature warning
OTWhyst (1)
Hysteresis temperature to reset OTW event
OTSD (1)
Overtemperature shut down
OTEOTWdifferential (1)
0.8
115
125
V
135
°C
25
°C
150
°C
OTE-OTW overtemperature detect temperature
difference
25
°C
OTSDHYST (1)
Hysteresis temperature for FAULT to be released
following an OTSD event
25
°C
IOC
Overcurrent limit protection
Resistor—programmable, nominal, ROCP = 27 kΩ
9.7
A
IOCT
Overcurrent response time
Time from application of short condition to Hi-Z of
affected FET(s)
250
ns
RPD
Internal pulldown resistor at the output of each
half-bridge
Connected when RESET_AB or RESET_CD is
active to provide bootstrap capacitor charge
1
kΩ
Static Digital Specifications
VIH
High-level input voltage
PWM_A, PWM_B, PWM_C, PWM_D, M1, M2, M3
2
3.6
V
VIH
High-level input voltage
RESET_AB, RESET_CD
2
5.5
V
VIL
Low-level input voltage
PWM_A, PWM_B, PWM_C, PWM_D, M1, M2, M3,
RESET_AB, RESET_CD
0.8
V
llkg
Input leakage current
100
mA
kΩ
–100
OTW / FAULT
RINT_PU
Internal pullup resistance, OTW to VREG, FAULT to
VREG
VOH
High-level output voltage
VOL
Low-level output voltage
(1)
Internal pullup resistor only
External pullup of 4.7 kΩ to 5 V
IO = 4 mA
20
26
35
2.95
3.3
3.65
4.5
5
0.2
0.4
V
V
Specified by design
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
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TYPICAL CHARACTERISTICS
EFFICIENCY
vs
SWITCHING FREQUENCY (DRV8432)
NORMALIZED RDS(on)
vs
GATE DRIVE
1.10
100
TJ = 25°C
Normalized RDS(on) / (RDS(on) at 12 V)
90
80
Efficiency – %
70
60
50
40
30
Full Bridge
20
Load = 5 A
PVDD = 50 V
TC = 75°C
10
0
0
50
1.08
1.06
1.04
1.02
1.00
0.98
0.96
8.0
100 150 200 250 300 350 400 450 500
8.5
9.0
10.5
11.0
11.5
Figure 2.
NORMALIZED RDS(on)
vs
JUNCTION TEMPERATURE
DRAIN TO SOURCE DIODE FORWARD
ON CHARACTERISTICS
12
6
TJ = 25°C
GVDD = 12 V
5
1.4
4
1.2
I – Current – A
Normalized RDS(on) / (RDS(on) at 25oC)
10.0
Figure 1.
1.6
1.0
3
2
0.8
1
0.6
0.4
–40 –20
0
0
20
40
60
80
100 120 140
–1
0
0.2
o
Figure 3.
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0.4
0.6
0.8
1
1.2
V – Voltage – V
TJ – Junction Temperature – C
8
9.5
GVDD – Gate Drive – V
f – Switching Frequency – kHz
Figure 4.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
DRV8412
DRV8432
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SLES242C – DECEMBER 2009 – REVISED MAY 2010
TYPICAL CHARACTERISTICS (continued)
OUTPUT DUTY CYCLE
vs
INPUT DUTY CYCLE
100
fS = 500 kHz
TC = 25°C
90
Output Duty Cycle – %
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
Input Duty Cycle – %
Figure 5.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
THEORY OF OPERATION
POWER SUPPLIES
To facilitate system design, the DRV8412/32 need
only a 12-V supply in addition to H-Bridge power
supply (PVDD). An internal voltage regulator provides
suitable voltage levels for the digital and low-voltage
analog circuitry. Additionally, the high-side gate drive
requiring a floating voltage supply, which is
accommodated by built-in bootstrap circuitry requiring
external bootstrap capacitor.
To provide symmetrical electrical characteristics, the
PWM signal path, including gate drive and output
stage, is designed as identical, independent
half-bridges. For this reason, each half-bridge has a
separate gate drive supply (GVDD_X), a bootstrap
pin (BST_X), and a power-stage supply pin
(PVDD_X). Furthermore, an additional pin (VDD) is
provided as supply for all common circuits. Special
attention should be paid to place all decoupling
capacitors as close to their associated pins as
possible. In general, inductance between the power
supply pins and decoupling capacitors must be
avoided. Furthermore, decoupling capacitors need a
short ground path back to the device.
For a properly functioning bootstrap circuit, a small
ceramic capacitor (an X5R or better) must be
connected from each bootstrap pin (BST_X) to the
power-stage output pin (OUT_X). When the
power-stage output is low, the bootstrap capacitor is
charged through an internal diode connected
between the gate-drive power-supply pin (GVDD_X)
and the bootstrap pin. When the power-stage output
is high, the bootstrap capacitor potential is shifted
above the output potential and thus provides a
suitable voltage supply for the high-side gate driver.
In an application with PWM switching frequencies in
the range from 10 kHz to 500 kHz, the use of 100-nF
ceramic capacitors (X5R or better), size 0603 or
0805, is recommended for the bootstrap supply.
These 100-nF capacitors ensure sufficient energy
storage, even during minimal PWM duty cycles, to
keep the high-side power stage FET fully turned on
during the remaining part of the PWM cycle. In an
application running at a switching frequency lower
than 10 kHz, the bootstrap capacitor might need to be
increased in value.
10
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Special attention should be paid to the power-stage
power supply; this includes component selection,
PCB placement, and routing. As indicated, each
half-bridge has independent power-stage supply pin
(PVDD_X). For optimal electrical performance, EMI
compliance, and system reliability, it is important that
each PVDD_X pin is decoupled with a ceramic
capacitor (X5R or better) placed as close as possible
to each supply pin. It is recommended to follow the
PCB layout of the DRV8412/32 EVM board.
The 12-V supply should be from a low-noise,
low-output-impedance voltage regulator. Likewise, the
50-V power-stage supply is assumed to have low
output impedance and low noise. The power-supply
sequence is not critical as facilitated by the internal
power-on-reset circuit. Moreover, the DRV8412/32
are fully protected against erroneous power-stage
turn-on due to parasitic gate charging. Thus,
voltage-supply ramp rates (dv/dt) are non-critical
within the specified voltage range (see the
Recommended Operating Conditions section of this
data sheet).
SYSTEM POWER-UP/POWER-DOWN
SEQUENCE
Powering Up
The DRV8412/32 do not require a power-up
sequence. The outputs of the H-bridges remain in a
high impedance state until the gate-drive supply
voltage GVDD_X and VDD voltage are above the
undervoltage protection (UVP) voltage threshold (see
the Electrical Characteristics section of this data
sheet). Although not specifically required, holding
RESET_AB and RESET_CD in a low state while
powering up the device is recommended. This allows
an internal circuit to charge the external bootstrap
capacitors by enabling a weak pulldown of the
half-bridge output.
Powering Down
The DRV8412/32 do not require a power-down
sequence. The device remains fully operational as
long as the gate-drive supply (GVDD_X) voltage and
VDD voltage are above the UVP voltage threshold
(see the Electrical Characteristics section of this data
sheet). Although not specifically required, it is a good
practice to hold RESET_AB and RESET_CD low
during power down to prevent any unknown state
during this transition.
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ERROR REPORTING
Bootstrap Capacitor Under Voltage Protection
The FAULT and OTW pins are both active-low,
open-drain
outputs.
Their
function
is
for
protection-mode signaling to a PWM controller or
other system-control device.
When the device runs at a low switching frequency
(e.g. less than 10 kHz with a 100-nF bootstrap
capacitor), the bootstrap capacitor voltage might not
be able to maintain a proper voltage level for the
high-side gate driver. A bootstrap capacitor
undervoltage protection circuit (BST_UVP) will
prevent potential failure of the high-side MOSFET.
When the voltage on the bootstrap capacitors is less
than the required value for safe operation, the
DRV8412/32 will initiate bootstrap capacitor recharge
sequences (turn off high side FET for a short period)
until the bootstrap capacitors are properly charged for
safe operation. This function may also be activated
when PWM duty cycle is too high (e.g. less than 20
ns off time at 10 kHz). Note that bootstrap capacitor
might not be able to be charged if no load or
extremely light load is presented at output during
BST_UVP operation, so it is recommended to turn on
the low side FET for at least 50 ns for each PWM
cycle to avoid BST_UVP operation if possible.
Any fault resulting in device shutdown, such as
overtemperatue shut down, overcurrent shut-down, or
undervoltage protection, is signaled by the FAULT pin
going low. Likewise, OTW goes low when the device
junction temperature exceeds 125°C (see Table 1).
Table 1. Protection Mode Signal Descriptions
FAULT
OTW
DESCRIPTION
0
0
Overtemperature warning and
(overtemperature shut down or overcurrent
shut down or undervoltage protection) occurred
0
1
Overcurrent shut-down or GVDD undervoltage
protection occurred
1
0
Overtemperature warning
1
1
Device under normal operation
TI recommends monitoring the OTW signal using the
system microcontroller and responding to an OTW
signal by reducing the load current to prevent further
heating of the device resulting in device
overtemperature shutdown (OTSD).
To reduce external component count, an internal
pullup resistor to VREG (3.3 V) is provided on both
FAULT and OTW outputs. Level compliance for 5-V
logic can be obtained by adding external pull-up
resistors to 5 V (see the Electrical Characteristics
section of this data sheet for further specifications).
DEVICE PROTECTION SYSTEM
The DRV8412/32 contain advanced protection
circuitry carefully designed to facilitate system
integration and ease of use, as well as to safeguard
the device from permanent failure due to a wide
range of fault conditions such as short circuits,
overcurrent, overtemperature, and undervoltage. The
DRV8412/32 respond to a fault by immediately
setting the half bridge outputs in a high-impedance
(Hi-Z) state and asserting the FAULT pin low. In
situations other than overcurrent or overtemperature,
the device automatically recovers when the fault
condition has been removed or the gate supply
voltage has increased. For highest possible reliability,
reset the device externally no sooner than 1 second
after the shutdown when recovering from an
overcurrent shut down (OCSD) or OTSD fault.
For applications with lower than 10 kHz switching
frequency and not to trigger BST_UVP protection, a
larger bootstrap capacitor can be used (e.g., 1 µF
cap for 800 Hz operation). When using a bootstrap
cap larger than 220 nF, it is recommended to add 5 Ω
resistors between 12V GVDD power supply and
GVDD_X pins to limit the inrush current on the
internal bootstrap circuitry.
Overcurrent (OC) Protection
The DRV8412/32 have independent, fast-reacting
current detectors with programmable trip threshold
(OC threshold) on all high-side and low-side
power-stage FETs. There are two settings for OC
protection
through
mode
selection
pins:
cycle-by-cycle (CBC) current limiting mode and OC
latching (OCL) shut down mode.
In CBC current limiting mode, the detector outputs
are monitored by two protection systems. The first
protection system controls the power stage in order to
prevent the output current from further increasing,
i.e., it performs a CBC current-limiting function rather
than prematurely shutting down the device. This
feature could effectively limit the inrush current during
motor start-up or transient without damaging the
device. During short to power and short to ground
conditions, the current limit circuitry might not be able
to control the current to a proper level, a second
protection system triggers a latching shutdown,
resulting in the related half bridge being set in the
high-impedance (Hi-Z) state. Current limiting and
overcurrent
protection
are
independent
for
half-bridges A, B, C, and, D, respectively.
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Figure 6 illustrates cycle-by-cycle operation with high
side OC event and Figure 7 shows cycle-by-cycle
operation with low side OC. Dashed lines are the
operation waveforms when no CBC event is triggered
and solide lines show the waveforms when CBC
event is triggered. In CBC current limiting mode,
when low side FET OC is detected, devcie will turn
off the affected low side FET and keep the high side
FET at the same half brdige off until next PWM cycle;
when high side FET OC is detected, devcie will turn
off the affected high side FET and turn on the low
side FET at the half brdige until next PWM cycle.
In OC latching shut down mode, the CBC current limit
and error recovery circuitries are disabled and an
overcurrent condition will cause the device to
shutdown immediately. After shutdown, RESET_AB
and/or RESET_CD must be asserted to restore
normal operation after the overcurrent condition is
removed.
For added flexibility, the OC threshold is
programmable using a single external resistor
connected between the OC_ADJ pin and GND pin.
See Table 2 for information on the correlation
between programming-resistor value and the OC
threshold. It should be noted that a properly
functioning overcurrent detector assumes the
presence of a proper inductor or power ferrite bead at
the power-stage output. Short-circuit protection is not
guaranteed with direct short at the output pins of the
power stage.
Overtemperature Protection
The
DRV8412/32
have
a
two-level
temperature-protection system that asserts an
active-low warning signal (OTW) when the device
junction temperature exceeds 125°C (nominal) and, if
the device junction temperature exceeds 150°C
(nominal), the device is put into thermal shutdown,
resulting in all half-bridge outputs being set in the
high-impedance (Hi-Z) state and FAULT being
asserted low. OTSD is latched in this case and
RESET_AB and RESET_CD must be asserted low to
clear the latch.
Undervoltage Protection (UVP) and Power-On
Reset (POR)
The UVP and POR circuits of the DRV8412/32 fully
protect the device in any power-up/down and
brownout situation. While powering up, the POR
circuit resets the overcurrent circuit and ensures that
all circuits are fully operational when the GVDD_X
and VDD supply voltages reach 9.8 V (typical).
Although GVDD_X and VDD are independently
monitored, a supply voltage drop below the UVP
threshold on any VDD or GVDD_X pin results in all
half-bridge outputs immediately being set in the
high-impedance (Hi-Z) state and FAULT being
asserted low. The device automatically resumes
operation when all supply voltage on the bootstrap
capacitors have increased above the UVP threshold.
DEVICE RESET
Table 2. Programming-Resistor Values and OC
Threshold
OC-ADJUST RESISTOR
VALUES (kΩ)
MAXIMUM CURRENT BEFORE
OC OCCURS (A)
22(1)
11.6
24
10.7
27
9.7
30
8.8
36
7.4
39
6.9
43
6.3
47
5.8
56
4.9
68
4.1
82
3.4
100
2.8
120
2.4
150
1.9
200
1.4
Two reset pins are provided for independent control
of half-bridges A/B and C/D. When RESET_AB is
asserted low, all four power-stage FETs in
half-bridges A and B are forced into a
high-impedance (Hi-Z) state. Likewise, asserting
RESET_CD low forces all four power-stage FETs in
half-bridges C and D into a high- impedance state. To
accommodate bootstrap charging prior to switching
start, asserting the reset inputs low enables weak
pulldown of the half-bridge outputs.
A rising-edge transition on reset input allows the
device to resume operation after a shut-down fault.
E.g., when either or both half-bridge A and B have
OC shutdown, a low to high transition of RESET_AB
pin will clear the fault and FAULT pin; when either or
both half-bridge C and D have OC shutdown, a low to
high transition of RESET_CD pin will clear the fault
and FAULT pin as well. When an OTSD occurs, both
RESET_AB and RESET_CD need to have a low to
high transition to clear the fault and FAULT signal.
(1) Recommended to use in OC Latching Mode Only
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DIFFERENT OPERATIONAL MODES
The DRV8412/32 support four different modes of
operation:
1. Dual full bridges (FB) (two PWM inputs each full
bridge) or four half bridges (HB) with CBC current
limit
2. Dual full bridges (two PWM inputs each full
bridge) or four half bridges with OC latching
shutdown (no CBC current limit)
3. Parallel full bridge (PFB) with CBC current limit
4. Dual full bridges (one PWM input each full bridge)
with CBC current limit
In mode 1 and 2, PWM_A controls half bridge A,
PWM_B controls half bridge B, etc. Figure 8 shows
an application example for full bridge mode operation.
In parallel full bridge mode (mode 3), PWM_A
controls both half bridges A and B, and PWM_B
controls both half bridges C and D, while PWM_C
and PWM_D pins are not used (recommended to
connect to ground). Bridges A and B are
synchronized internally (even during CBC), and so
are bridges C and D. OUT_A and OUT_B should be
connected together and OUT_C and OUT_D should
be connected together after the output inductor or
ferrite bead. Figure 9 shows an example of parallel
full bridge mode connection.
In mode 4, one PWM signal controls one full bridge to
relieve some I/O resource from MCU, i.e., PWM_A
controls half bridges A and B and PWM_C controls
half bridges C and D. In this mode, the operation of
half bridge B is complementary to half bridge A, and
the operation of half bridge D is complementary to
half bridge C. For example, when PWM_A is high,
high side FET in half bridge A and low side FET in
half bridge B will be on and low side FET in half
bridge A and high side FET in half bridge B will be
off. Since PWM_B and PWM_D pins are not used in
this mode, it is recommended to connect them to
ground.
Because each half bridge has independent supply
and ground pins, a shunt sensing resistor can be
inserted between PVDD to PVDD_X or GND_X to
GND (ground plane). A high side shunt resistor
between PVDD and PVDD_X is recommended for
differential current sensing because a high bias
voltage on the low side sensing could affect device
operation. If low side sensing has to be used, a shunt
resistor value of 10 mΩ or less or sense voltage 100
mV or less is recommended.
The DRV8412/32 can be used for stepper motor
applications as illustrated in Figure 10; they can be
also used in three phase permanent magnet
synchronous motor (PMSM) and sinewave brushless
DC motor applications. Figure 11 and Figure 12 show
the three-phase application example with different
current sense locations.
Figure 13 shows an example of a TEC driver
application. Same configuration can also be used for
DC output applications.
CBC with High Side OC
During T_OC Period
PVDD
Current Limit
Load
Current
PWM_HS
PWM_HS
Load
PWM_LS
PWM_LS
GND_X
T_HS T_OC T_LS
Figure 6. Cycle-by-Cycle Operation with High Side OC (dashed line: normal operation; solid line: CBC
event)
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During T_OC Period
CBC with Low Side OC
PVDD
Current Limit
Load
Current
PWM_HS
PWM_HS
Load
PWM_LS
PWM_LS
T_LS T_OC T_HS
GND_X
Figure 7. Cycle-by-Cycle Operation with Low Side OC (dashed line: normal operation; solid line: CBC
event)
GVDD
1uF
330 uF
PVDD
3.3
1000 uF
GVDD_B
1uF
OTW
GVDD_A
10 nF
BST_A
100 nF
FAULT
Controller
(MSP430
C2000 or
Stellaris MCU)
Roc_adj
PVDD_A
PWM_A
OUT_A
RESET_AB
GND_A
PWM_B
GND_B
OC_ADJ
Rsense_AB (option)
100nF
Loc
100nF
Loc
M
OUT_B
1
GND
100 nF
PVDD_B
AGND
BST_B
VREG
BST_C
M3
PVDD_C
M2
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
OUT_D
100 nF
100 nF
Rsense_CD (option)
100nF
PWM_D
Loc
M
100nF
Loc
PVDD_D
100 nF
GVDD
VDD
47 uF
BST_D
1uF
GVDD_C
1uF
PVDD
GVDD_D
1uF
Figure 8. Application Diagram Example for Full Bridge Mode Operation
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GVDD
1uF
PVDD
330 uF
3.3
1000 uF
GVDD_B
1uF
OTW
GVDD_A
10 nF
BST_A
100 nF
FAULT
Controller
(MSP430
C2000 or
Stellaris MCU)
Rsense_AB
(option)
PVDD_A
PWM_A
OUT_A
RESET_AB
GND_A
PWM_B
GND_B
OC_ADJ
OUT_B
100nF
Roc_adj
100nF
Loc
Loc
1
GND
PVDD_B
AGND
BST_B
VREG
BST_C
M
100 nF
100 nF
100 nF
M3
Rsense_CD
(option)
PVDD_C
M2
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
OUT_D
100nF
100nF
PWM_D
Loc
Loc
PVDD_D
100 nF
GVDD
VDD
BST_D
1uF
47 uF
GVDD_C
PVDD
GVDD_D
1uF
1uF
PWM_A controls OUT_A and OUT_B; PWM_B controls OUT_C and OUT_D.
Figure 9. Application Diagram Example for Parallel Full Bridge Mode Operation
GVDD
1uF
330 uF
PVDD
3.3
1000 uF
GVDD_B
1uF
OTW
GVDD_A
10 nF
BST_A
100 nF
FAULT
PVDD_A
PWM_A
OUT_A
RESET_AB
GND_A
PWM_B
GND_B
OC_ADJ
OUT_B
100nF
Loc
M
Controller
(MSP430
C2000 or
Stellaris MCU)
Roc_adj
100nF
Loc
1
GND
PVDD_B
AGND
BST_B
VREG
BST_C
100 nF
100 nF
100 nF
M3
PVDD_C
M2
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
OUT_D
100nF
100nF
PWM_D
Loc
Loc
PVDD_D
100 nF
GVDD
VDD
BST_D
1uF
47 uF
GVDD_C
1uF
PVDD
GVDD_D
1uF
Figure 10. Application Diagram Example for Stepper Motor Operation
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GVDD
1uF
PVDD
330 uF
3.3
1000 uF
GVDD_B
1uF
OTW
GVDD_A
10 nF
BST_A
100 nF
FAULT
PVDD_A
PWM_A
OUT_A
RESET_AB
GND_A
PWM_B
GND_B
Loc
Rsense_A
100nF
Rsense_B
Controller
(MSP430
C2000 or
Stellaris MCU)
Roc_adj
OC_ADJ
OUT_B
M
Loc
100nF
1
GND
PVDD_B
AGND
BST_B
VREG
BST_C
100 nF
100 nF
100 nF
M3
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
OUT_D
PWM_D
GVDD
PVDD_C
M2
VDD
100nF
Loc
100nF
PVDD_D
BST_D
100 nF
Rsense_D
1uF
47 uF
GVDD_C
PVDD
GVDD_D
1uF
1uF
Figure 11. Application Diagram Example for Three Phase PMSM PVDD Sense Operation
GVDD
1uF
PVDD
330 uF
3.3
1000 uF
GVDD_B
1uF
OTW
GVDD_A
10 nF
BST_A
100 nF
FAULT
PVDD_A
PWM_A
OUT_A
RESET_AB
GND_A
Loc
Rsense_A
100nF
Rsense_B
Controller
(MSP430
C2000 or
Stellaris MCU)
PWM_B
M
GND_B
Loc
Roc_adj
OC_ADJ
1
GND
OUT_B
PVDD_B
AGND
BST_B
VREG
BST_C
100 nF
100nF
100 nF
M3
PVDD_C
M2
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
OUT_D
Rsense_x £ 10 mW or
Vsense_x < 100 mV
100 nF
100nF
Rsense_D
PWM_D
GVDD
VDD
47 uF
Loc
PVDD_D
BST_D
100 nF
100nF
1uF
GVDD_C
1uF
PVDD
GVDD_D
1uF
Figure 12. Application Diagram Example for Three Phase PMSM GND Sense Operation
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GVDD
1uF
PVDD
330 uF
3.3
1000 uF
GVDD_B
1uF
OTW
GVDD_A
10 nF
BST_A
100 nF
PWM_A
OUT_A
RESET_AB
GND_A
PWM_B
GND_B
OC_ADJ
OUT_B
100nF
Roc_adj
TEC
Controller
100nF
4.7 uH
4.7 uH
1
GND
47 uF
PVDD_B
AGND
BST_B
VREG
BST_C
100 nF
100 nF
100 nF
M3
47 uF
PVDD_C
M2
OUT_C
M1
GND_C
PWM_C
GND_D
RESET_CD
OUT_D
PWM_D
47 uF
TEC
FAULT
PVDD_A
100nF
100nF
4.7 uH
47 uF
4.7 uH
47 uF
PVDD_D
100 nF
GVDD
VDD
BST_D
1uF
47 uF
GVDD_C
1uF
PVDD
GVDD_D
1uF
Figure 13. Application Diagram Example for TEC Driver
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APPLICATION INFORMATION
SYSTEM DESIGN RECOMMENDATIONS
Voltage of Decoupling Capacitor
The voltage of the decoupling capacitors should be selected in accordance with good design practices.
Temperature, ripple current, and voltage overshoot must be considered. The high frequency decoupling capacitor
should use ceramic capacitor with X5R or better rating. For a 50-V application, a minimum voltage rating of 63 V
is recommended.
VREG Pin
The VREG pin is used for internal logic and not recommended to be used as a voltage source for external
circuitry.
VDD Pin
The transient current in VDD pin could be significantly higher than average current through that pin. A low
resistive path to GVDD should be used. A 22-µF to 47-µF capacitor should be placed on VDD pin beside the
100-nF to 1-µF decoupling capacitor to provide a constant voltage during transient.
OTW Pin
OTW reporting indicates the device approaching high junction temperature. This signal can be used with MCU to
decrease system power when OTW is low in order to prevent OT shut down at a higher temperature.
Mode Select Pin
Mode select pins (M1, M2, and M3) should be connected to either VREG (for logic high) or AGND for logic low. It
is not recommended to connect mode pins to board ground if 1-Ω resistor is used between AGND and GND.
Output Inductor Selection
For normal operation, inductance in motor (assume larger than 10 µH) is sufficient to provide low di/dt output
(e.g. for EMI) and proper protection during overload condition (CBC current limiting feature). So no additional
output inductors are needed during normal operation.
However during a short condition, the motor (or other load) is shorted, so the load inductance is not present in
the system anymore; the current in the device can reach such a high level that may exceed the abs max current
rating due to extremely low impendence in the short circuit path and high di/dt before oc detection circuit kickes
in. So a ferrite bead or inductor is recommended to utilize the short circuit protection feature in DRV8412/32.
With an external inductance or ferrite bead, the current will rise at a much slower rate and reach a lower current
level before oc protection starts. The device will then either operate CBC current limit or OC shut down
automatically (when current is well above the current limit threshold) to protect the system.
For a system that has limited space, a power ferrite bead can be used instead of an inductor. The current rating
of ferrite bead has to be higher than the RMS current of the system at normal operation. A ferrite bead designed
for very high frequency is NOT recommended. A minimum impedance of 10 Ω or higher is recommended at 10
MHz or lower frequency to effectively limit the current rising rate during short circuit condition.
The TDK MPZ2012S300A and MPZ2012S101A (with size of 0805 inch type) have been tested in our system to
meet a short circuit condition in the DRV8412. But other ferrite beads that have similar frequency characteristics
can be used as well.
For higher power applications, such as in the DRV8432, there might be limited options to select suitable ferrite
bead with high current rating. If an adequate ferrite bead cannot be found, an inductor can be used.
The inductance can be calculated as:
PVDD × Toc _ delay
Loc _ min =
Ipeak - Iave
(1)
Where Toc_delay = 250 nS, Ipeak = 15 A (below abs max rating).
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Because an inductor usually saturates pretty quickly after reaching its current rating, it is recommended to use an
inductor with a doubled value or an inductor with a current rating well above the operating condition.
Parallel Mode Operation
For a device operated in parallel mode, a minimum of 30 nH to 100 nH inductance or a ferrite bead is required
after the output pins (e.g. OUT_A and OUT_B) before connecting the two channels together. This will help to
prevent any shoot through between two paralleled channels during switching transient due to mismatch of
paralleled channels (e.g., processor variation, unsymmetrical PCB layout, etc).
TEC Driver Application
For TEC driver or other non-motor related applications (e.g. resistive load or dc output), a low-pass LC filter can
be used to meet the requirement.
PCB LAYOUT RECOMMENDATION
PCB Material Recommendation
FR-4 Glass Epoxy material with 2 oz. copper on both top and bottom layer is recommended for improved thermal
performance (better heat sinking) and less noise susceptibility (lower PCB trace inductance).
Ground Plane
Because of the power level of these devices, it is recommended to use a big unbroken single ground plane for
the whole system / board. The ground plane can be easily made at bottom PCB layer. In order to minimize the
impedance and inductance of ground traces, the traces from ground pins should keep as short and wide as
possible before connected to bottom ground plane through vias. Multiple vias are suggested to reduce the
impedance of vias. Try to clear the space around the device as much as possible especially at bottom PCB side
to improve the heat spreading.
Decoupling Capacitor
High frequency decoupling capacitors (100 nF) on PVDD_X pins should be placed close to these pins and with a
short ground return path to minimize the inductance on the PCB trace.
AGND
AGND is a localized internal ground for logic signals. A 1-Ω resistor is recommended to be connected between
GND and AGND to isolate the noise from board ground to AGND. There are other two components are
connected to this local ground: 0.1-µF capacitor between VREG to AGND and Roc_adj resistor between
OC_ADJ and AGND. Capacitor for VREG should be placed close to VREG and AGND pin and connected
without vias.
Current Shunt Resistor
If current shunt resistor is connected between GND_X to GND or PVDD_X to PVDD, make sure there is only one
single path to connect each GND_X or PVDD_X pin to shunt resistor, and the path is short and symmetrical on
each sense path to minimize the measurement error due to additional resistance on the trace.
PCB LAYOUT EXAMPLE
An example of the schematic and PCB layout of DRV8412 are shown in Figure 14, Figure 15, and Figure 16.
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8412 DRV8432
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
GVDD
C14
1.0ufd/16V
0603
U1
GND
44
1
43
C13
42
1.0ufd/16V
0603
41
PVDD
40
GND
2
+
3
C11
C12
47ufd/16V
FC
0.1ufd/16V
0603
C15
C16
0.1ufd/100V
0805
0.1ufd/100V
0805
4
GND
L1
39
GND
4.7uH/8.7A
931AS
GND
38
5
OUTD
Orange
37
6
GVDD
1
2
GRAY
6A/250V
L2
GND
J2
36
+
C4
C5
330ufd/16V
M
0.1ufd/16V
0603
4.7uH/8.7A
931AS
35
7
PVDD
8
GVDD = 12V
9
GND
C18
C19
0.1ufd/100V
0805
0.1ufd/100V
0805
PVDD
PVDD
10
GND
J1
+
34
11
1
33
2
C10
3
0.1ufd/16V
0603
4
5
R7
C20
C21
13
0.1ufd/100V
0805
0.1ufd/100V
0805
GND
8
R5
GND
Black
GND
GND
L3
31
14
OUTB
4.7uH/8.7A
931AS
0603
47K
C1
PVDD
12
1.0 1/4W
0805
7
Red
1000ufd/63V
VZ
32
6
OUTC
Orange
30
15
Orange
29
L4
GND
28
OUTA
16
4.7uH/8.7A
931AS
27
17
Orange
PVDD
26
18
19
C23
C24
0.1ufd/100V
0805
0.1ufd/100V
0805
20
U1
PowerPad
GND
25
21
24
22
GVDD
C9
GND
23
GVDD
C8
DRV8412DDW
HTSSOP44-DDW
1.0ufd/16V
0603
1.0ufd/16V
0603
GND
GND
Figure 14. DRV8412 Schematic Example
20
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DRV8412
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SLES242C – DECEMBER 2009 – REVISED MAY 2010
T1: PVDD decoupling capacitors C16, C19, C21, and C24 should be placed very close to PVDD_X pins and ground
return path.
T2: VREG decoupling capacitor C10 should be placed very close to VREG abd AGND pins.
T3: Clear the space above and below the device as much as possible to improve the thermal spreading.
T4: Add many vias to reduce the impedance of ground path through top to bottom side. Make traces as wide as
possible for ground path such as GND_X path.
Figure 15. Printed Circuit Board – Top Layer
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
B1: Do not block the heat transfer path at bottom side. Clear as much space as possible for better heat spreading.
Figure 16. Printed Circuit Board – Bottom Layer
THERMAL INFORMATION
The thermally enhanced package provided with the DRV8432 is designed to interface directly to heat sink using
a thermal interface compound, (e.g., Ceramique from Arctic Silver, TIMTronics 413, etc.). The heat sink then
absorbs heat from the ICs and couples it to the local air. It is also a good practice to connect the heatsink to
system ground on the PCB board to reduce the ground noise.
RqJA is a system thermal resistance from junction to ambient air. As such, it is a system parameter with the
following components:
• RqJC (the thermal resistance from junction to case, or in this example the power pad or heat slug)
• Thermal grease thermal resistance
• Heat sink thermal resistance
22
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Product Folder Link(s): DRV8412 DRV8432
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DRV8432
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SLES242C – DECEMBER 2009 – REVISED MAY 2010
The thermal grease thermal resistance can be calculated from the exposed power pad or heat slug area and the
thermal grease manufacturer's area thermal resistance (expressed in °C-in 2/W or °C-mm2/W). The approximate
exposed heat slug size is as follows:
• DRV8432, 36-pin PSOP3 …… 0.124 in2 (80 mm 2)
The thermal resistance of thermal pads is considered higher than a thin thermal grease layer and is not
recommended. Thermal tape has an even higher thermal resistance and should not be used at all. Heat sink
thermal resistance is predicted by the heat sink vendor, modeled using a continuous flow dynamics (CFD) model,
or measured.
Thus the system RqJA = RqJC + thermal grease resistance + heat sink resistance.
See the TI application report, IC Package Thermal Metrics (SPRA953A), for more thermal information.
DRV8412 Thermal Via Design Recommendation
Thermal pad of the DRV8412 is attached at bottom of device to improve the thermal capability of the device. The
thermal pad has to be soldered with a very good coverage on PCB in order to deliver the power specified in the
datasheet. The figure below shows the recommended thermal via and land pattern design for the DRV8412. For
additional information, see TI application report, PowerPad Made Easy (SLMA004B) and PowerPad Layout
Guidelines (SOLA120).
Figure 17. DRV8412 Thermal Via Footprint
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DRV8412
DRV8432
SLES242C – DECEMBER 2009 – REVISED MAY 2010
www.ti.com
REVISION HISTORY
Changes from Revision A (December 2009) to Revision B
Page
•
Added note to recommended operating conditions table ..................................................................................................... 2
•
Added TA = 125°C power rating of 1.0 W to package power deratings table ...................................................................... 3
Changes from Revision B (May 2010) to Revision C
Page
•
Deleted all DRV8422 related descriptions from this data sheet ........................................................................................... 1
•
Changed DRV8432 pinout .................................................................................................................................................... 4
•
Added Thermal Pad and Heat slug rows to end of Pin Functions table. Also added T=thermal in note ............................. 5
•
Added second paragraph to Bootstrap Capacitor....section ............................................................................................... 11
•
Deleted or GVDD undervoltage from DEVICE RESET section second paragraph ............................................................ 12
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Product Folder Link(s): DRV8412 DRV8432
PACKAGE OPTION ADDENDUM
www.ti.com
8-May-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
DRV8412DDW
ACTIVE
HTSSOP
DDW
44
DRV8412DDWR
ACTIVE
HTSSOP
DDW
44
DRV8432DKD
ACTIVE
HSSOP
DKD
36
29
DRV8432DKDR
ACTIVE
HSSOP
DKD
36
500
35
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Green (RoHS &
no Sb/Br)
NIPDAU
Level-4-260C-72 HR
Green (RoHS &
no Sb/Br)
NIPDAU
Level-4-260C-72 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DRV8412DDWR
HTSSOP
DDW
44
2000
330.0
24.4
DRV8432DKDR
HSSOP
DKD
36
500
330.0
24.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
15.6
1.8
12.0
24.0
Q1
14.7
16.4
4.0
20.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8412DDWR
HTSSOP
DDW
44
2000
346.0
346.0
41.0
DRV8432DKDR
HSSOP
DKD
36
500
346.0
346.0
41.0
Pack Materials-Page 2
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