TI OPA140ATDD1

OPA140A-DIE
www.ti.com
SBOS610B – MARCH 2012 – REVISED MARCH 2012
HIGH-PRECISION, LOW-NOISE, RAIL-TO-RAIL OUTPUT,
11-MHZ JFET OPERATIONAL AMPLIFIER
Check for Samples: OPA140A-DIE
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
Very Low Offset Drift
Very Low Offset
Low Input Bias Current
Very Low 1/f Noise
Low Noise
Slew Rate
Low Supply Current
Input Voltage Range Includes V– Supply
Single-Supply Operation: 4.5 V to 36 V
Dual-Supply Operation: ±2.25 V to ±18 V
No Phase Reversal
APPLICATIONS
•
•
•
•
•
•
•
Battery-Powered Instruments
Industrial Controls
Medical Instrumentation
Photodiode Amplifiers
Active Filters
Data Acquisition Systems
Automatic Test Systems
DESCRIPTION
The OPA140A operational amplifier is a low-power JFET input amplifier that features good drift and low input
bias current. The rail-to-rail output swing and input range that includes V– allow designers to take advantage of
the low-noise characteristics of JFET amplifiers while also interfacing to modern, single-supply, precision analogto-digital converters (ADCs) and digital-to-analog converters (DACs). The OPA140A runs on a single 4.5-V to
36-V supply or dual ±2.25-V to ±18-V supplies.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE (2)
OPA140A
TD
Bare Die In Waffle Pack
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA140ATDD1
252
OPA140ATDD2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
OPA140A-DIE
SBOS610B – MARCH 2012 – REVISED MARCH 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
15 mils.
Silicon with backgrind
Floating
TiW/AlCu (0.5%)
1100 nm
Table 1. Bond Pad Coordinates in Microns
DISCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
VIN
1
469.600
-720.500
544.600
-645.500
N/C
2
49.500
-430.500
124.500
-355.500
-49.550
VIP
3
N/C
4
V-
5
1034.050
-124.550
1109.050
OUT
6
1264.500
-107.500
1339.500
-32.500
V+
7
1264.500
-737.500
1339.500
-662.500
2
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): OPA140A-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
OPA140ATDD1
ACTIVE
0
252
TBD
Call TI
N / A for Pkg Type
OPA140ATDD2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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