TI TPS63010YFFR

TPS63010
TPS63011
TPS63012
www.ti.com ...................................................................................................................................................................................................... SLVS653 – JUNE 2008
HIGH EFFICIENT SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 2-A SWITCHES
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
Up to 96% Efficiency
1200-mA Output Current at 3.3 V in Step Down
Mode (VIN = 3.6 V to 5.5 V)
Up to 800-mA Output Current at 3.3 V in Boost
Mode (VIN > 2.4 V)
Automatic Transition between Step Down and
Boost Mode
Device Quiescent Current less than 50µA
Input Voltage Range: 2 V to 5.5 V
Fixed and Adjustable Output Voltage Options
from 1.2 V to 5.5 V
Power Save Mode for Improved Efficiency at
Low Output Power
Forced Fixed Frequency Operation and
Synchronization possible
Load Disconnect During Shutdown
Overtemperature Protection
Available in Small 20 pin 2.14 mm x 1.93 mm,
WCSP Package
DESCRIPTION
The TPS6301x devices provide a power supply
solution for products powered by either a two-cell or
three-cell alkaline, NiCd or NiMH battery, or a
one-cell Li-Ion or Li-polymer battery. Output currents
can go as high as 1200 mA while using a single-cell
Li-Ion or Li-Polymer Battery, and discharge it down to
2.5 V or lower. The buck-boost converter is based on
a fixed frequency, pulse-width-modulation (PWM)
controller using synchronous rectification to obtain
maximum efficiency. At low load currents, the
converter enters Power Save mode to maintain high
efficiency over a wide load current range. The Power
Save mode can be disabled, forcing the converter to
operate at a fixed switching frequency. The maximum
average current in the switches is limited to a typical
value of 2200 mA. The output voltage is
programmable using an external resistor divider, or is
fixed internally on the chip. The converter can be
disabled to minimize battery drain. During shutdown,
the load is disconnected from the battery. The device
is packaged in a 20-pin WCSP package measuring
2.14 mm x 1.93 mm (YFF).
APPLICATIONS
•
•
•
•
•
•
All Two-Cell and Three-Cell Alkaline, NiCd or
NiMH or Single-Cell Li Battery
Powered Products
Portable Audio Players
PDAs
Cellular Phones
Personal Medical Products
White LEDs
Typical Application Circuit
L1
1.5 µH
L1
VIN
1.8 V to
5.5 V
L2
VIN
C1
10 µF
VOUT
VINA
EN
FB
C2
10 µF
VOUT
3.3 V
Up to
1200 mA
PS
VSEL
SYNC
GND
PGND
TPS63011
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPS63010
TPS63011
TPS63012
SLVS653 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OUTPUT VOLTAGE OPTIONS (1)
TA
- 40°C to 85°C
(1)
(2)
OUTPUT VOLTAGE
DC/DC at VSEL = 1
OUTPUT
VOLTAGE
DC/DC at
VSEL = 0
PACKAGE
MARKING
Adjustable
Adjustable
TPS63010
3.3 V
2.8 V
TPS63011
3.4 V
2.9 V
TPS63012
PART NUMBER (2)
PACKAGE
TPS63010YFF
20-Pin WCSP
TPS63011YFF
TPS63012YFF
Contact the factory to check availability of other fixed output voltage versions.
The YFF package is available taped and reeled. Add R suffix to device type (e.g., TPS63010YFFR) to order quantities of 3000 devices
per reel. Add T suffix to device type (e.g., TPS63010YFFT) to order quantities of 250 devices per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
TPS6301x
UNITS
– 0.3 to 7
V
Operating junction temperature range
– 40 to 150
°C
Storage temperature range
– 65 to 150
VI
Input voltage range on VIN, VINA, VINA1, L1, L2, VOUT, PS, SYNC, VSEL,
EN, FB
TJ
Tstg
Human Body Model (HBM)
ESD Voltage
Machine Model (MM)
(2)
2.5
(2)
Charged Device Model (CDM) (2)
(1)
(2)
kV
150
V
1
kV
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ESD testing is performed according to the respective JESD22 JEDEC standard.
DISSIPATION RATINGS TABLE
(1)
PACKAGE (1)
THERMAL RESISTANCE
ΘJA
POWER RATING
TA≤ 25°C
DERATING FACTOR ABOVE
TA = 25°C
YFF
84 °C/W
1190 mW
12 mW/°C
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
RECOMMENDED OPERATING CONDITIONS
MIN
Supply voltage at VIN, VINA
NOM
MAX UNIT
2
5.5
V
Operating free air temperature range, TA
– 40
85
°C
Operating junction temperature range, TJ
– 40
125
°C
2
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TPS63010
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TPS63012
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ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
DC/DC STAGE
PARAMETER
TEST CONDITIONS
VI
Input voltage range
VI
Input voltage range for startup
VO
TPS63010 output voltage range
VFB
TPS63010 feedback voltage
VFB
TPS63010 feedback voltage
f
ISW
MIN
TYP
V
2.1
5.5
V
1.2
0°C ≤ TA ≤ 60°C
5.5
V
492.5
500
503.5
mV
489
500
507
mV
TPS63011 output voltage
VSEL = LOW, 0°C ≤ TA ≤ 60°C
2.758
2.8
2.842
V
TPS63011 output voltage
VSEL = LOW
2.750
2.8
2.850
V
TPS63011 output voltage
VSEL = HIGH, 0°C ≤ TA ≤ 60°C
3.251
3.3
3.350
V
TPS63011 output voltage
VSEL = HIGH
3.241
3.3
3.359
V
TPS63012 output voltage
VSEL = LOW, 0°C ≤ TA ≤ 60°C
2.857
2.9
2.944
V
TPS63012 output voltage
VSEL = LOW
2.848
2.9
2.952
V
TPS63012 output voltage
VSEL = HIGH, 0°C ≤ TA ≤ 60°C
3.349
3.4
3.451
V
TPS63012 output voltage
VSEL = HIGH
3.339
3.4
3.461
V
Oscillator frequency
2200
2400
2600
kHz
Frequency range for synchronization
2200
3000
kHz
Switch current limit
VIN = VINA = 3.6 V, TA = 25°C
High side switch on resistance
VIN = VINA = 3.6 V
2000
2200
100
mΩ
Low side switch on resistance
VIN = VINA = 3.6 V
100
mΩ
Maximum line regulation
PS = HIGH
0.5%
Maximum load regulation
PS = HIGH
0.5%
VINA
Quiescent current
VOUT
(adjustable
output voltage
version)
VIN
Shutdown current
mA
1
2
µA
40
50
µA
4
6
µA
1
VEN = 0 V, VIN = VINA = 3.6 V
PS, SYNC, VSEL clamped on GND or
VINA
VINA
2400
IO = 0 mA, VEN = VIN = VINA = 3.6 V,
VOUT = 3.3 V
FB input impedance (fixed output
voltage versions)
IS
UNIT
5.5
VIN
Iq
MAX
2
MΩ
0.1
1
µA
0.1
1.5
µA
UNIT
CONTROL STAGE
PARAMETER
TEST CONDITIONS
UVLO
Under voltage lockout threshold
VIL
EN, PS, SYNC, VSEL input low
voltage
VIH
EN, PS, SYNC, VSEL input high
voltage
EN, PS, SYNC, VSEL input current
VINA voltage decreasing
MIN
TYP
MAX
1.5
1.7
1.8
V
0.4
V
1.2
Clamped on GND or VINA
V
0.01
0.1
µA
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
Copyright © 2008, Texas Instruments Incorporated
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TPS63011
TPS63012
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PIN ASSIGNMENTS
YFF PACKAGE
(TOP VIEW)
A4
B4
C4
D4
E4
A3
B3
C3
D3
E3
A2
B2
C2
D2
E2
A1
B1
C1
D1
E1
Terminal Functions
TERMINAL
NAME
NO.
EN
A4
FB
E3
GND
PS
I/O
DESCRIPTION
I
Enable input. (1 enabled, 0 disabled)
I
Voltage feedback of adjustable versions, must be connected to VOUT at fixed output
voltage versions
C3, D3, E4
Control / logic ground
C4
I
Enable / disable power save mode (1 disabled, 0 enabled)
L1
B1,B2
I
Connection for Inductor
L2
D1,D2
I
Connection for Inductor
PGND
C1,C2
SYNC
B4
I
Clock signal for synchronization, should be connected to GND if not used
VSEL
D4
I
Output voltage select for fixed output voltage options (1 programs higher output voltage
option, 0 programs lower output voltage option), must be connected to a defined logic
signal at adjustable output voltage option.
VIN
Power ground
A1, A2
I
Supply voltage for power stage
VINA
A3
I
Supply voltage for control stage
VINA1
B3
O
Output of the 100 Ω for designing the VINA filter
VOUT
E1,E2
O
Buck-boost converter output
4
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TPS63010
TPS63011
TPS63012
www.ti.com ...................................................................................................................................................................................................... SLVS653 – JUNE 2008
FUNCTIONAL BLOCK DIAGRAM (TPS63010)
L1
L2
VIN
VOUT
Current
Sensor
VINA1
VIN
VOUT
PGND PGND
Gate
Control
_
VINA
Modulator
PS
Oscillator
+
_
+
FB
VREF
SYNC
VSEL
+
−
Device
Control
EN
Temperature
Control
PGND
PGND
GND
FUNCTIONAL BLOCK DIAGRAM (TPS63011, TPS63012)
L1
L2
VIN
VOUT
Current
Sensor
VINA1
VIN
VOUT
PGND PGND
Gate
Control
FB
VSEL
_
VINA
Modulator
PS
Oscillator
SYNC
VSEL
+
+
−
VREF
Device
Control
EN
+
_
Temperature
Control
PGND
PGND
GND
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TPS63012
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TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Maximum output current
Efficiency
Waveforms
6
vs Input voltage (TPS63010, VOUT = 2.5 V / VOUT = 4.5 V)
1
vs Input voltage (TPS63011, VSEL = HIGH / VSEL = LOW)
2
vs Input voltage (TPS63012, VSEL = HIGH / VSEL = LOW)
3
vs Output current (TPS63010, Power Save Enabled, VOUT = 2.5 V / VOUT
= 4.5 V)
4
vs Output current (TPS63010, Power Save Disabled, VOUT = 2.5V / VOUT
= 4.5V)
5
vs Output current (TPS63011, Power Save Enabled, VSEL = HIGH / VSEL
= LOW)
6
vs Output current (TPS63011, Power Save Disabled, VSEL = HIGH / VSEL
= LOW)
7
vs Output current (TPS63012, Power Save Enabled, VSEL = HIGH / VSEL
= LOW)
8
vs Output current (TPS63012, Power Save Disabled, VSEL = HIGH / VSEL
= LOW)
9
vs Input voltage (TPS63010, Power Save Enabled, VOUT = 2.5V, IOUT =
{10; 100; 500; 1000 mA})
10
vs Input voltage (TPS63010, Power Save Enabled, VOUT = 4.5V, IOUT =
{10; 100; 500; 1000 mA})
11
vs Input voltage (TPS63010, Power Save Disabled, VOUT = 2.5V, IOUT =
{10; 100; 500; 1000 mA})
12
vs Input voltage (TPS63010, Power Save Disabled, VOUT = 4.5V, IOUT =
{10; 100; 500; 1000 mA})
13
vs Input voltage (TPS63011, Power Save Enabled, VSEL = HIGH, IOUT =
{10; 100; 500; 1000 mA})
14
vs Input voltage (TPS63011, Power Save Enabled, VSEL = LOW, IOUT =
{10; 100; 500; 1000 mA})
15
vs Input voltage (TPS63011, Power Save Disabled, VSEL = HIGH, IOUT =
{10; 100; 500; 1000 mA})
16
vs Input voltage (TPS63011, Power Save Disabled, VSEL = LOW, IOUT =
{10; 100; 500; 1000 mA})
17
vs Input voltage (TPS63012, Power Save Enabled, VSEL = HIGH, IOUT =
{10; 100; 500; 1000 mA})
18
vs Input voltage (TPS63012, Power Save Enabled, VSEL = LOW, IOUT =
{10; 100; 500; 1000 mA})
19
vs Input voltage (TPS63012, Power Save Disabled, VSEL = HIGH, IOUT =
{10; 100; 500; 1000 mA})
20
vs Input voltage (TPS63012, Power Save Disabled, VSEL = LOW, IOUT =
{10; 100; 500; 1000 mA})
21
Load transient response (TPS63011, VIN < VOUT, VSEL = HIGH)
22
Load transient response (TPS63011, VIN > VOUT, VSEL = HIGH)
23
Load transient response (TPS63012, VIN < VOUT, VSEL = HIGH)
24
Load transient response (TPS63012, VIN > VOUT, VSEL = HIGH)
25
Line transient response (TPS63011, VSEL = HIGH, Iout = 300 mA)
26
Line transient response (TPS63012, VSEL = HIGH, Iout = 300 mA)
27
Startup after enable (TPS63011, VSEL = HIGH)
28
Startup after enable (TPS63012, VSEL = HIGH)
29
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TPS63012
www.ti.com ...................................................................................................................................................................................................... SLVS653 – JUNE 2008
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
(TPS63010)
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
(TPS63011)
2500
2500
2250
VO = 2.5 V
IO − Maximum Output Current − mA
IO − Maximum Output Current − mA
2250
2000
1750
1500
1250
VO = 4.5 V
1000
750
500
250
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1750
1500
VO = 3.3 V
1250
1000
750
500
0
2.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
VI − Input Voltage − V
G001
Figure 1.
Figure 2.
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
(TPS63012)
EFFICIENCY
vs
OUTPUT CURRENT
(TPS63010)
2500
5.5
G002
100
2250
90
VO = 2.9 V
2000
80
1750
70
η − Efficiency − %
IO − Maximum Output Current − mA
2000
250
VI − Input Voltage − V
1500
VO = 3.4 V
1250
1000
VI = 2.4 V, VO = 2.5 V
50
500
20
250
10
3.0
3.5
4.0
4.5
VI − Input Voltage − V
5.0
5.5
G003
VI = 3.6 V, VO = 4.5 V
40
30
2.5
VI = 3.6 V, VO = 2.5 V
60
750
0
2.0
VO = 2.8 V
0
0.1
VI = 2.4 V, VO = 4.5 V
Power-Save Mode Enabled
1
10
Figure 3.
Copyright © 2008, Texas Instruments Incorporated
100
1k
IO − Output Current − mA
10k
G004
Figure 4.
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EFFICIENCY
vs
OUTPUT CURRENT
(TPS63010)
EFFICIENCY
vs
OUTPUT CURRENT
(TPS63011)
100
VI = 2.4 V, VO = 2.5 V
90
80
80
70
70
η − Efficiency − %
η − Efficiency − %
90
100
60
50
VI = 3.6 V,
VO = 4.5 V
40
VI = 2.4 V,
VO = 4.5 V
30
10
40
1
10
100
1k
0
0.1
10k
VI = 2.4 V, VO = 3.3 V
VI = 3.6 V, VO = 3.3 V
Power-Save Mode Enabled
1
10
G005
Figure 5.
Figure 6.
EFFICIENCY
vs
OUTPUT CURRENT
(TPS63011)
EFFICIENCY
vs
OUTPUT CURRENT
(TPS63012)
1k
10k
G006
100
90
VI = 2.4 V, VO = 2.8 V
VI = 3.6 V, VO = 2.9 V
80
70
70
η − Efficiency − %
VI = 3.6 V, VO = 3.3 V
60
50
VI = 3.6 V, VO = 2.8 V
40
30
60
VI = 2.4 V, VO = 2.9 V
50
40
VI = 2.4 V, VO = 3.4 V
VI = 3.6 V, VO = 3.4 V
30
VI = 2.4 V, VO = 3.3 V
20
10
20
10
Power-Save Mode Disabled
1
10
100
IO − Output Current − mA
1k
10k
G007
0
0.1
Power-Save Mode Enabled
1
10
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100
IO − Output Current − mA
Figure 7.
8
100
IO − Output Current − mA
80
η − Efficiency − %
50
10
100
0
0.1
VI = 2.4 V, VO = 2.8 V
20
Power-Save Mode Disabled
IO − Output Current − mA
90
60
30
VI = 3.6 V, VO = 2.5 V
20
0
0.1
VI = 3.6 V, VO = 2.8 V
1k
10k
G008
Figure 8.
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Product Folder Link(s): TPS63010 TPS63011 TPS63012
TPS63010
TPS63011
TPS63012
www.ti.com ...................................................................................................................................................................................................... SLVS653 – JUNE 2008
EFFICIENCY
vs
OUTPUT CURRENT
(TPS63012)
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63010)
100
90
100
90
VI = 2.4 V, VO = 2.9 V
80
80
70
VI = 2.4 V, VO = 3.4 V
η − Efficiency − %
η − Efficiency − %
70
60
50
VI = 3.6 V, VO = 2.9 V
40
30
50
40
10
Power-Save Mode Disabled
0
0.1
1
10
100
1k
0
2.0
10k
IO − Output Current − mA
2.5
3.0
3.5
4.0
G009
Figure 9.
Figure 10.
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63010)
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63010)
100
90
90
80
80
70
η − Efficiency − %
IO = 100 mA
IO = 10 mA
IO = 500 mA
70
IO = 1000 mA
IO = 500 mA
50
40
30
4.5
5.0
5.5
G010
IO = 100 mA
IO = 1000 mA
60
50
40
IO = 10 mA
30
20
0
2.0
VO = 2.5 V
Power-Save Mode Enabled
VI − Input Voltage − V
100
10
IO = 500 mA
IO = 10 mA
20
10
η − Efficiency − %
60
30
VI = 3.6 V, VO = 3.4 V
20
60
IO = 1000 mA
IO = 100 mA
20
VO = 4.5 V
Power-Save Mode Enabled
2.5
3.0
3.5
10
4.0
4.5
VI − Input Voltage − V
5.0
5.5
G011
0
2.0
VO = 2.5 V
Power-Save Mode Disabled
2.5
3.0
Figure 11.
Copyright © 2008, Texas Instruments Incorporated
3.5
4.0
4.5
5.0
VI − Input Voltage − V
5.5
G012
Figure 12.
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EFFICIENCY
vs
INPUT VOLTAGE
(TPS63010)
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63011)
100
100
90
90
80
IO = 500 mA
η − Efficiency − %
60
50
40
IO = 10 mA
IO = 10 mA
40
20
20
0
2.0
2.5
3.0
3.5
10
4.0
4.5
5.0
VI − Input Voltage − V
0
2.0
5.5
3.0
G013
4.0
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63011)
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63011)
90
80
80
70
70
IO = 100 mA
IO = 1000 mA
60
IO = 500 mA
IO = 10 mA
40
30
4.5
5.0
5.5
G014
IO = 100 mA
IO = 500 mA
IO = 1000 mA
60
50
40
IO = 10 mA
30
20
20
VO = 2.8 V
Power-Save Mode Enabled
2.5
3.0
3.5
10
4.0
4.5
VI − Input Voltage − V
5.0
5.5
G015
0
2.0
VO = 3.3 V
Power-Save Mode Disabled
2.5
3.0
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3.5
4.0
4.5
VI − Input Voltage − V
Figure 15.
10
3.5
Figure 14.
90
0
2.0
2.5
Figure 13.
100
10
VO = 3.3 V
Power-Save Mode Enabled
VI − Input Voltage − V
100
50
IO = 500 mA
50
30
VO = 4.5 V
Power-Save Mode Disabled
IO = 1000 mA
IO = 100 mA
60
30
10
η − Efficiency − %
70
IO = 1000 mA
η − Efficiency − %
η − Efficiency − %
70
80
IO = 100 mA
5.0
5.5
G016
Figure 16.
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS63010 TPS63011 TPS63012
TPS63010
TPS63011
TPS63012
www.ti.com ...................................................................................................................................................................................................... SLVS653 – JUNE 2008
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63011)
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63012)
100
100
90
90
80
80
IO = 1000 mA
60
50
40
IO = 10 mA
20
2.5
3.0
3.5
10
4.0
4.5
5.0
VI − Input Voltage − V
0
2.0
5.5
G017
3.5
4.0
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63012)
EFFICIENCY
vs
INPUT VOLTAGE
(TPS63012)
90
80
80
IO = 100 mA
η − Efficiency − %
IO = 10 mA
IO = 1000 mA
IO = 500 mA
40
30
4.5
5.0
5.5
G018
IO = 100 mA
IO = 500 mA
70
50
IO = 1000 mA
60
50
IO = 10 mA
40
30
20
0
2.0
3.0
Figure 18.
90
10
2.5
Figure 17.
100
60
VO = 3.4 V
Power-Save Mode Enabled
VI − Input Voltage − V
100
70
IO = 500 mA
40
20
0
2.0
IO = 10 mA
50
30
VO = 2.8 V
Power-Save Mode Disabled
IO = 1000 mA
IO = 100 mA
60
30
10
η − Efficiency − %
70
η − Efficiency − %
70
η − Efficiency − %
IO = 100 mA
IO = 500 mA
20
VO = 2.9 V
Power-Save Mode Enabled
2.5
3.0
3.5
10
4.0
4.5
VI − Input Voltage − V
5.0
5.5
G019
0
2.0
VO = 3.4 V
Power-Save Mode Disabled
2.5
3.0
Figure 19.
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3.5
4.0
4.5
5.0
VI − Input Voltage − V
5.5
G020
Figure 20.
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EFFICIENCY
vs
INPUT VOLTAGE
(TPS63012)
100
90
80
η − Efficiency − %
IO = 100 mA
IO = 500 mA
70
IO = 1000 mA
60
50
IO = 10 mA
40
30
20
10
VO = 2.9 V
Power-Save Mode Disabled
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VI − Input Voltage − V
G021
Figure 21.
LOAD TRANSIENT RESPONSE
(TPS63011)
VI = 2.4 V, IO = 80 mA to 750 mA
Output Voltage
200 mV/div, AC
Output Current
500 mA/div
TPS63011, VO = 3.3 V
Timebase 1 ms/div
G028
Figure 22.
12
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LOAD TRANSIENT RESPONSE
(TPS63011)
VI = 4.2 V, IO = 150 mA to 1300 mA
Output Voltage
200 mV/div, AC
Output Current
500 mA/div
TPS63011, VO = 3.3 V
Timebase 1 ms/div
G029
Figure 23.
LOAD TRANSIENT RESPONSE
(TPS63012)
VI = 2.4 V, IO = 80 mA to 630 mA
Output Voltage
200 mV/div, AC
Output Current
500 mA/div
TPS63012, VO = 3.4 V
Timebase 1 ms/div
G030
Figure 24.
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LOAD TRANSIENT RESPONSE
(TPS63012)
VI = 4.2 V, IO = 140 mA to 1100 mA
Output Voltage
200 mV/div, AC
Output Current
500 mA/div
TPS63012, VO = 3.4 V
Timebase 1 ms/div
G031
Figure 25.
LINE TRANSIENT RESPONSE
(TPS63011)
VI = 3 V to 3.6 V, IO = 300 mA
Input Voltage
500 mV/div, AC
Output Voltage
20 mV/div, AC
TPS63011, VO = 3.3 V
Timebase 2 ms/div
G032
Figure 26.
14
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LINE TRANSIENT RESPONSE
(TPS63012)
VI = 3 V to 3.6V, IO = 300 mA
Input Voltage
500 mV/div, AC
Output Voltage
10 mV/div, AC
TPS63012, VO = 3.4 V
Timebase 2 ms/div
G033
Figure 27.
START-UP AFTER ENABLE
(TPS63011)
Enable
5 V/div, DC
Output Voltage
1 V/div, DC
Inductor Current
500 mA/div, DC
Voltage at L1
2 V/div, DC
TPS63011, VO = 3.3 V
VI = 4.2 V, RL = 11 W
Timebase 100 ms/div
G034
Figure 28.
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START-UP AFTER ENABLE
(TPS63012)
Output Voltage
1 V/div, DC
Enable
5 V/div, DC
Inductor Current
500 mA/div, DC
Voltage at L1
2 V/div, DC
VI = 4.2 V, RL = 11 W
TPS63012, VO = 3.4 V
Timebase 100 ms/div
G035
Figure 29.
PARAMETER MEASUREMENT INFORMATION
L1
L1
L2
VOUT
VIN
VIN
VOUT
R1
VINA1
C1
C3
C2
VINA
FB
R2
EN
PS
VSEL
SYNC
GND
PGND
TPS6301X
List of Components
REFERENCE
DESCRIPTION
MANUFACTURER
TPS6301 0 / 1 / 2
Texas Instruments
L1
LPS3015-222
Coilcraft
C1
GRM188R60J106M (10 µF 6.3V,
0603)
Murata
C2
2 × GRM188R60J106M (10 µF 6.3V,
0603)
Murata
C3
0.1 µF, X7R ceramic
16
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PARAMETER MEASUREMENT INFORMATION (continued)
List of Components (continued)
REFERENCE
DESCRIPTION
R1, R2
Depending on the output voltage at TPS63010, not used at TPS6301 1 / 2 (R1 shorted)
MANUFACTURER
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DETAILED DESCRIPTION
CONTROLLER CIRCUIT
The controlling circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses
input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can
change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier
gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be
connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the
voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be
compared with the internal reference voltage to generate a stable and accurate output voltage.
The controller circuit also senses the average input current as well as the peak input current. With this, maximum
input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under
all possible conditions. To finally protect the device from overheating, an internal temperature sensor is
implemented.
Synchronous Operation
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range.
To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and
PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter.
Buck-Boost Operation
To be able to regulate the output voltage properly at all possible input voltage conditions, the device
automatically switches from step down operation to boost operation and back as required by the configuration. It
always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off.
Therefore, it operates as a step down converter (buck) when the input voltage is higher than the output voltage,
and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation
in which all 4 switches are permanently switching. Controlling the switches this way allows the converter to
maintain high efficiency at the most important point of operation; when input voltage is close to the output
voltage. The RMS current through the switches and the inductor is kept at a minimum, to minimize switching and
conduction losses. Switching losses are also kept low by using only one active and one passive switch.
Regarding the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus
causing no switching losses.
Power Save Mode
The PS pin can be used to select different operation modes. To enable power save, PS must be set low. Power
save mode is used to improve efficiency at light load. If power save mode is enabled, the converter stops
operating if the average inductor current gets lower than about 300 mA and the output voltage is at or above its
nominal value. If the output voltage decreases below its nominal value, the device ramps up the output voltage
again by starting operation using a programmed average inductor current higher than required by the current
load condition. Operation can last for one or several pulses. The converter again stops operating once the
conditions for stopping operation are met again.
The power save mode can be disabled by programming high at PS. The PS input supports standard logic
threshold voltages. If the device is synchronized to an external clock connected to SYNC, power save mode is
disabled.
18
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Synchronization
Connecting a clock signal at SYNC forces the device to synchronize to the connected clock frequency.
Synchronization is done by a PLL, so synchronizing to lower and higher frequencies compared to the internal
clock works without any issues. The PLL can also tolerate missing clock pulses without the converter
malfunctioning. The SYNC input supports standard logic thresholds. If synchronization is not used SYNC must
be tied low or connected to GND. Applying a clock signal to SYNC automatically disables the power save mode.
Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This also means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high
peak currents flowing from the input.
Output Voltage Selection
To program the output voltage at an adjustable device option, like TPS63010 an external resistive feedback
divider, connected to FB must be used. For the fixed output voltage versions, FB is used as an output voltage
sense and must be connected to the output voltage VOUT. All fixed output voltage versions have two different
output voltages programmed internally. They are selected by programming high or low at VSEL. The higher
output voltage is selected by programming VSEL high and the lower output voltage is selected by programming
VSEL low. VSEL also supports standard logic thresholds.
Softstart and Short-Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400 mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus, the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output.
When the output voltage does not increase above 1.2 V, the device assumes a short-circuit at the output, and
keeps the current limit low to protect itself and the application. At a short at the output during operation, the
current limit is also decreased accordingly. At 0 V at the output, for example, the output current will not exceed
about 400 mA.
Undervoltage Lockout
If the supply voltage on VINA is lower than its approximate threshold (see electrical characteristics table), an
undervoltage lockout function prevents device start-up. When in operation, the device automatically enters the
shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device automatically
restarts if the input voltage recovers to the minimum operating input voltage.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see electrical characteristics table), the device stops operating. As soon as
the IC temperature has decreased below the programmed threshold, it again starts operating. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
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APPLICATION INFORMATION
DESIGN PROCEDURE
The TPS6301x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with a
typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell
Alkaline, NiCd, or NiMH battery with a typical terminal voltage between 2 V and 5.5 V . Additionally, any other
voltage source with a typical output voltage between 2 V and 5.5 V can power systems where the TPS6301x is
used.
PROGRAMMING THE OUTPUT VOLTAGE
Within the TPS6301X family there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider is
used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When
the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500 mV. The maximum
recommended value for the output voltage is 5.5 V. The current through the resistive divider should be about 100
times greater than the current into the FB pin. The typical current into the FB pin is 0.01 µA, and the voltage
across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the
recommended value for R2 should be lower than 500 kΩ, in order to set the divider current at 1 µA or higher.
The recommended value for this resistor is in the range of 200 kΩ. From that, the value of the resistor connected
between VOUT and FB, R1, depending on the needed output voltage (VOUT), is calculated using Equation 1:
R 1 + R2
ǒ
VOUT
V FB
Ǔ
*1
(1)
As an example, if an output voltage of 3.3 V is needed, a 1-MΩ resistor should be chosen for R1.
L1
L1
L2
VOUT
VIN
VIN
VOUT
R1
VINA1
C1
C3
VINA
C2
FB
R2
EN
PS
VSEL
SYNC
GND
PGND
TPS6301X
Figure 30. Typical Application Circuit for Adjustable Output Voltage Option
INDUCTOR SELECTION
To properly configure the TPS6301X devices, an inductor must be connected between pin L1 and pin L2. To
estimate the inductance value Equation 2 and Equation 3 can be used.
μs
L1 = (VIN1 - VOUT ) × 0.5 ×
A
(2)
μs
L2 = VOUT × 0.5 ×
A
(3)
In Equation 2 the minimum inductance value, L1 for step down mode operation is calculated. VIN1 is the
20
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maximum input voltage. In Equation 3 the minimum inductance, L2, for boost mode operation is calculated. The
recommended minimum inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor
for generating 3.3 V from a Li-Ion battery with a battery voltage range from 2.5 V up to 4.2 V is 2.2 µH. The
recommended inductor value range is between 1 µH and 4.7 µH. In general, this means that at high voltage
conversion rates, higher inductor values offer better performance.
With the chosen inductance value, the peak current for the inductor in steady state operation can be calculated.
Equation 4 shows how to calculate the peak current I1 in step down mode operation and Equation 5 shows how
to calculate the peak current I2 in boost mode operation. VIN2 is the minimum input voltage.
VOUTǒV IN1 * V OUTǓ
I
I 1 + OUT )
0.8
2 V IN1 f L
(4)
ǒV OUT * V IN2Ǔ
V
I OUT VIN2
I 2 + OUT
)
2
0.8 V IN2
VOUT
f
L
(5)
The critical current value for selecting the right inductor is the higher value of I1 and I2. It also needs to be taken
into account that load transients and error conditions may cause higher inductor currents. This also needs to be
taken into account when selecting an appropriate inductor. The following inductor series from different suppliers
have been used with TPS6301x converters:
Table 1. List of Inductors
VENDOR
Coilcraft
FDK
INDUCTOR SERIES
LPS3015
LPS4012
MIPSA2520
LQH3NP
Murata
LQM2HP
Toko
FDSE0312
CAPACITOR SELECTION
Input Capacitor
At least a 4.7-µF input capacitor is recommended to improve transient behavior of the regulator and EMI
behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND
pins of the IC is recommended.
Output Capacitor
For the output capacitor, it is recommended to use small ceramic capacitors placed as close as possible to the
VOUT and PGND pins of the IC. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended.
This small capacitor should be placed as close as possible to the VOUT and PGND pins of the IC.
To get an estimate of the recommended minimum output capacitance, Equation 6 can be used.
mF
C OUT + 5 L
mH
(6)
A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain
control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit
for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output
voltage drop during load transients.
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LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces, separated from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
1. Improving the power dissipation capability of the PCB design
2. Improving the thermal coupling of the component to the PCB by soldering all pins to traces as wide as
possible.
3. Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6301x devices is 125°C. The thermal
resistance of this 20-pin chipscale package (YFF) is RθJA = 84°C/W, if all pins are soldered. Specified regulator
operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation
is about 476 mW, as calculated in Equation 7. More power can be dissipated if the maximum ambient
temperature of the application is lower.
T
*T
J(MAX)
A
P
+
+ 125°C * 85°C + 476 mW
D(MAX)
R
84 °CńW
qJA
(7)
PACKAGE INFORMATION
Package Dimensions
The package dimensions for this YFF package are shown in the table below. See the package drawing at the
end of this data sheet for more details.
YFF Package Dimensions
22
Packaged Devices
D
E
TPS63010YFF
2.14 ± 0.05 mm
1.93 ± 0.05 mm
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PACKAGE OPTION ADDENDUM
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27-Jun-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS63010YFFR
ACTIVE
DSBGA
YFF
20
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS63010YFFT
ACTIVE
DSBGA
YFF
20
250
Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS63011YFFR
ACTIVE
DSBGA
YFF
20
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS63011YFFT
ACTIVE
DSBGA
YFF
20
250
Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS63012YFFR
ACTIVE
DSBGA
YFF
20
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS63012YFFT
ACTIVE
DSBGA
YFF
20
250
SNAGCU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jun-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
TPS63010YFFR
DSBGA
YFF
20
3000
180.0
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.4
2.2
2.35
0.8
4.0
8.0
Q1
TPS63010YFFT
DSBGA
YFF
20
250
180.0
8.4
2.2
2.35
0.8
4.0
8.0
Q1
TPS63012YFFR
DSBGA
YFF
20
3000
180.0
8.4
2.2
2.35
0.8
4.0
8.0
Q1
TPS63012YFFT
DSBGA
YFF
20
250
180.0
8.4
2.2
2.35
0.8
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jun-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS63010YFFR
DSBGA
YFF
20
3000
190.5
212.7
31.8
TPS63010YFFT
DSBGA
YFF
20
250
190.5
212.7
31.8
TPS63012YFFR
DSBGA
YFF
20
3000
190.5
212.7
31.8
TPS63012YFFT
DSBGA
YFF
20
250
190.5
212.7
31.8
Pack Materials-Page 2
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