FAIRCHILD FDZ2552P

FDZ2552P
Dual P-Channel 2.5V Specified PowerTrenchTM BGA MOSFET
General Description
Features
Combining Fairchild’s advanced 2.5V specified
PowerTrench process with state of the art BGA
packaging, the FDZ2552P minimizes both PCB space
and RDS(ON). This dual BGA MOSFET embodies a
breakthrough in packaging technology which enables
the device to combine excellent thermal transfer
characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
•= –6 A, –20 V.
RDS(ON) = 0.045 Ω @ VGS = –4.5 V
RDS(ON) = 0.075 Ω @ VGS = –2.5 V.
•= Occupies only 0.10 cm2 of PCB area.
1/3 the area of SO-8.
•= Ultra-thin package: less than 0.70 mm height when
mounted to PCB.
Applications
•= Outstanding thermal transfer characteristics:
significantly better than SO-8.
•= Battery management
•= Load switch
•= Battery protection
•= Ultra-low Qg x RDS(ON) figure-of-merit.
•= High power and current handling capability.
D
D
D
S
S
S
G
S
S
S
Pin 1
G
S
S
S
G
S
S
D
D
D
F2552
Q2
Q1
Pin 1
PD
TJ, Tstg
Q2
Top
Absolute Maximum Ratings
VDSS
VGSS
ID
D
G
Bottom
Symbol
Q1
S
TA=25oC unless otherwise noted
Parameter
Ratings
Units
Drain-Source Voltage
Gate-Source Voltage
Drain Current – Continuous
(Note 1a)
– Pulsed
Power Dissipation (Steady State)
(Note 1a)
Operating and Storage Junction Temperature Range
–20
±12
–6
-20
3.0
–55 to +175
V
V
A
W
°C
50
8
°C/W
°C/W
Thermal Characteristics
RθJA
RθJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
Package Marking and Ordering Information
Device Marking
F2552
1999 Fairchild Semiconductor Corporation
Device
FDZ2552P
Reel Size
TBD
Tape width
TBD
Quantity
TBD
FDZ2552P Rev. A (w)
FDZ2552P
November 1999
ADVANCE INFORMATION
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min
Typ
Max Units
Off Characteristics
BVDSS
∆BVDSS
===∆TJ
IDSS
IGSSF
IGSSR
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage Current,
Forward
Gate–Body Leakage Current,
Reverse
On Characteristics
VGS(th)
RDS(on)
VGS = 0 V, ID = –250 µA
ID = –250 µA, Referenced to
25°C
VDS = –16 V, VGS = 0 V
VGS = –12 V,
VDS = 0 V
VGS = 12 V
–20
V
mV/°C
28
–1
–100
µA
nA
100
nA
–0.9
0.036
0.060
–1.5
0.045
0.075
V
Ω
–0.77
–2.5
–1.2
A
V
VDS = 0 V
(Note 2)
Gate Threshold Voltage
Static Drain–Source
On–Resistance
VDS = VGS, ID = –250 µA
VGS = –4.5 V, ID = –6 A
VGS = –2.5 V, ID = –4.5 A
–0.4
Drain–Source Diode Characteristics and Maximum Ratings
IS
VSD
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
VGS = 0 V, IS = –2.5 A
Voltage
(Note 2)
Notes:
1. RθJA is a function of the junction-to-case (RθJC), case-to-ambient (RθCA ) and the PC Board (RθBA ) thermal resistance where the case thermal reference is
defined the top surface of the package. RθJC is guaranteed by design while RθCA and RθBA are determined by the user's design. Maximum current ratings
assume single device operation.
(a). RθJA = 50°C/W (steady-state) when mounted on 1 in2 of 2 oz. copper.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDZ2552P Rev. A (w)
FDZ2552P
Electrical Characteristics
FDZ2552P
Dimensional Outline and Pad Layout
2.50
CL
ø
INDEX
SLOT
0.30
2
1
A
GATE 1
F2552
Date / Vendor
Code
CL
B
3
D
D
S1
S1
D
3.25
4.00
C
S1
S1
S1
S2
S2
0.65
D
GATE 2
E
S2
S2
S2
F
D
D
D
0.65
S1 = Source 1
S2 = Source 2
D = Drain
1.30
TOP VIEW
RECOMMENDED LAND
PATTERN
0.76
0.25
SOLDER
BALL,
ø 0.25
CL
F
SOLDER BALL,
ø 0.25
E
FRONT VIEW
3.25
D
INDEX SLOT
(HIDDEN)
CL
C
0.65
B
0.51
A
1
SEATING PLANE
2
3
0.65
1.30
SIDE VIEW
BOTTOM VIEW
NOTES: UNLESS OTHEWISE SPECIFIED
A) ALL DIMENSIONS ARE IN MILLIMETERS.
FDZ2552P Rev. A (w)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench 
QFET™
QS™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
ACEx™
CoolFET™
CROSSVOLT™
E2CMOSTM
FACT™
FACT Quiet Series™
FAST®
FASTr™
GTO™
HiSeC™
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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