TI TLC59211

TLC59211
www.ti.com .................................................................................................................................................................................................. SCLS712 – MARCH 2009
8-BIT DMOS SINK DRIVER
FEATURES
1
•
•
•
•
•
•
•
N OR PW PACKAGE
(TOP VIEW)
DMOS Process
High Voltage Output (Vds = 30 V)
Output Current on Each Channel
(Ids Max = 200 mA)
Latch-Up Performance Exceeds 250 mA Per
JEDEC Standard JESD-17
ESD Protection Exceeds JESD 22
– 2000-V Human Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged Device Model (C101)
LED Driver Application
Output Clamp Diode (Parasitic)
N.C.
D1
D2
D3
D4
D5
D6
D7
D8
N.C.
1
20
VCC
2
19
3
18
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
GND
4
17
5
16
6
15
7
14
8
13
9
12
10
11
N.C. – Not internally connected
APPLICATIONS
•
•
•
Lamp and Display (LED)
Hammer
Relay
DESCRIPTION
The TLC59211 is an 8-bit LED and solenoid driver designed for 5-V VCC operation.
The TLC59211 is characterized for operation from –40°C to 85°C.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
PDIP – N
Reel of 1000
TLC59211IN
Y59211
TSSOP – PW
Reel of 2000
TLC59211IPWR
Y59211
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
(EACH LATCH) (1)
INPUTS
D
(1)
OUTPUT
Y
L
H*
H
L
L: Low-level
H: High-level
H*: with pullup resistor
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TLC59211
SCLS712 – MARCH 2009 .................................................................................................................................................................................................. www.ti.com
OUTPUT SCHEMATIC
Y
D
GND
LOGIC SYMBOL(1)
Y1
Y2
19
2
D1
(1)
Y3
18
3
D2
Y4
17
4
5
D3
Y5
16
D4
Y6
15
6
D5
Y7
14
7
D6
Y8
13
8
12
9
D7
11
D8 GND
This symbol is in accordance with ANSI/IEEE Standard 91-1984 and IEC Publication 617-12.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
7
V
D
Input voltage range
–0.5
7
V
Vds
Output voltage range
H output
–0.5
32
V
Ids
Output current range
1 bit for output low
200
mA
IIK
Input clamp current
VI < 0 V
–20
mA
θJA
Tstg
(1)
(2)
2
Package thermal impedance (2)
N package
69
PW package
83
UNIT
°C/W
Operating free-air temperature range
–40
85
°C
Storage temperature range
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TLC59211
TLC59211
www.ti.com .................................................................................................................................................................................................. SCLS712 – MARCH 2009
RECOMMENDED OPERATING CONDITIONS
VCC = 3 V to 5.5 V
CONDITIONS
MIN
MAX
3
5.5
V
High-level input voltage
VCC × 0.7
VCC
V
VIL
Low-level input voltage
0
VCC × 0.3
V
Vds
Output voltage
30
V
VCC
Supply voltage
VIH
N package
Ids
Output current
PW package
TA
Duty cycle < 42%
200
Duty cycle < 100%
130
Duty cycle < 24%
200
Duty cycle < 100%
95
Operating free-air temperature
–40
UNIT
mA
85
°C
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 4.5 V to 5.5 V, TA = –40°°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Vt+
Positive-going input threshold
D, CLR, CLK
Vt–
Negative-going input threshold
D, CLR, CLK
1.5
Vt
Hysteresis
D, CLR, CLK
0.5
IIH
High-level input current
VCC = 5.5 V, VI = 5.5 V
IIL
Low-level input current
VCC = 5.5 V, VI = 0 V
IOZ
Leakage current
Vds= 30 V
Ioff
Leakage current
VI = 0 to 5 V, VO = 0 to 30 V, VCC = 0
TYP
MAX
3.5
V
V
2
V
0
1
µA
0
–1
µA
5
µA
µA
0
5
Output = all OFF
0
5
Output = all ON
0
5
VCC = 4.5 V, IO = 100 mA
0.2
0.35
VI = 0 to 5 V, VO = 0 to 30 V, VCC = 0
UNIT
µA
ICC
Supply current
VOL
Low-level output voltage
VCC = 4.5 V, IO = 200 mA
0.5
0.7
V
rON
ON-state resistance
VCC = 4.5 V, IO = 100 mA
2
3.5
Ω
Ci
Input capacitance
VI = VCC or GND
5
V
pF
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCC = 4.5 V to 5.5 V, TA = –40°°C to 85°C (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
LOAD
CAPACITANCE
TA = 25°C
MIN
TA = –40°C to 85°C
TYP
MAX
MIN
MAX
UNIT
tTLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
180
220
260
ns
tTHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
290
430
460
ns
tPLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
320
470
510
ns
tPHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
320
470
510
ns
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TLC59211
3
TLC59211
SCLS712 – MARCH 2009 .................................................................................................................................................................................................. www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3 V to 3.6 V, TA = –40°°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.52
V
Vt+
Positive-going input threshold
D
Vt–
Negative-going input threshold
D
0.9
Vt
Hysteresis
D
0.33
1.32
V
IIH
High-level input current
VCC = 3.6 V, VI = 3.6V
0
1
µA
IIL
Low-level input current
VCC = 3.6 V, VI = 0 V
0
–1
µA
IOZ
Leakage current
Vds= 30 V
Ioff
Leakage current
VI = 0 to 3.6 V, VO = 0 to 30 V, VCC = 0
V
5
µA
0
5
µA
Output = all OFF
0
5
Output = all ON
0
5
ICC
Supply current
VI = 0 to 3.6 V, VCC = 3.6 V
VOL
Low-level output voltage
VCC = 3 V, IOL = 100 mA
0.35
0.7
rON
ON-state resistance
VCC = 3 V, IO = 100 mA
3.5
7
Ci
Input capacitance
VI = VCC or GND
5
µA
V
V
Ω
pF
SWITCHING CHARACTERISTICS
over operating free-air temperature range, VCC = 3 V to 3.6 V, TA = –40°°C to 85°C (unless otherwise noted)
PARAMETER
4
TEST
CONDITIONS
LOAD
CAPACITANCE
TA = 25°C
MIN
TA = –40°C to 85°C
TYP
MAX
MIN
MAX
UNIT
tTLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
200
450
450
ns
tTHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
300
450
480
ns
tPLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
450
650
800
ns
tPHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
450
650
800
ns
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TLC59211
TLC59211
www.ti.com .................................................................................................................................................................................................. SCLS712 – MARCH 2009
THERMAL INFORMATION
MAXIMUM OUTPUT CURRENT
vs
DUTY CYCLE
N=1
200
N=2
N=3
Maximum Output Current, Ids (mA)
N=4
160
N=8
120
N=7
N=6
N=5
80
TA = 85°C
N = Number of outputs
conducting
simultaneously
40
0
0
10
20
30
40 50 60
Duty Cycle (%)
70
80
90
100
TSSOP (PW) PACKAGE
MAXIMUM OUTPUT CURRENT
vs
DUTY CYCLE
N = 1–3
200
Maximum Output Current, Ids (mA)
N=4
N=5
160
N=6
N=7
120
N=8
80
TA = 85°C
N = Number of outputs
conducting
simultaneously
40
0
0
10
20
30
40 50 60
Duty Cycle (%)
70
80
90
100
DIP (N) PACKAGE
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Product Folder Link(s): TLC59211
5
TLC59211
SCLS712 – MARCH 2009 .................................................................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
24 V
RL = 240 Ω
Test
Y
CL= 30 pF
LOAD CIRCUIT
FOR O/D OUTPUT
5V
50%
D
50%
tPHL
GND
tPLH
90%
VCC
90%
50%
10%
tTHL
50%
10%
Y
GND
tTLH
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the
output control.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns,
and tf ≤ 3 ns.
D.
The outputs are measured one at a time with one transition per measurement.
E.
tPLH and tPHL are the same as tpd.
Figure 1. Test Circuit and Voltage Waveforms
6
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TLC59211
TLC59211
www.ti.com .................................................................................................................................................................................................. SCLS712 – MARCH 2009
APPLICATION INFORMATION
VLED
8-Bit Sink Current Driver
TLC59211
Character
Generator Circuit
and
LED Power Circuit
SRCLR
RCLK
SRCLK
SER
8-Bit Shift Register
SN74LV595A
SN74LV164A
SN74LV165A
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TLC59211
7
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLC59211IN
ACTIVE
PDIP
N
20
TLC59211IPWR
ACTIVE
TSSOP
PW
20
20
Pb-Free
(RoHS)
2000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
N / A for Pkg Type
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Apr-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TLC59211IPWR
Package Package Pins
Type Drawing
TSSOP
PW
20
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
6.95
7.1
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Apr-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC59211IPWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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