1CY74FCT2827T Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT2827T 10-Bit Buffer SCCS045 - May 1994 - Revised March 2000 Features Functional Description • Function and pinout compatible with FCT, F, and AM29827 logic • FCT-C speed at 5.0 ns max. (Com’l), FCT-A speed at 8.0 ns max. (Com’l) • 25Ω output series resistors to reduce transmission line reflection noise • Reduced VOH (typically = 3.3V) versions of equivalent FCT functions • Edge-rate control circuitry for significantly improved noise characteristics • Power-off disable feature • ESD > 2000V • Matched rise and fall times • Fully compatible with TTL input and output logic levels • Extended commercial temp. range of –40˚C to +85˚C • Sink current 12 mA Source current 15 mA The FCT2827T 10-bit bus driver provides high-performance bus interface buffering for wide data/address paths or buses carrying parity. This 10-bit buffer has NAND-ed output enables for maximum control flexibility. The FCT2827T is designed for high-capacitance load drive capability, while providing low-capacitance bus loading at both inputs and outputs. All inputs have clamp diodes and all outputs are designed for low-capacitance bus loading in the high impedance state. On-chip termination resistors have been added to the outputs to reduce system noise caused by reflections. The FCT2827T can be used to replace the FCT827T to reduce noise in an existing design. The outputs are designed with a power-off disable feature to allow for live insertion of boards. Pin Configurations Logic Block Diagram SOIC/QSOP Top View Y0 D0 Y1 D1 Y2 D2 Y3 D3 Y4 D4 Y5 D5 Y6 Y7 D6 D7 Y8 D8 Y9 D9 OE1 OE2 FCT2827T–3 OE1 1 24 VCC D0 2 23 Y0 D1 3 22 Y1 D2 4 21 Y2 D3 5 20 Y3 D4 6 19 Y4 D5 7 18 Y5 D6 8 17 Y6 D7 9 16 Y7 D8 10 15 Y8 D9 11 14 Y9 GND 12 13 OE2 FCT2827T–2 Function Table[1] Inputs Outputs OE1 OE2 D Y Function L L L L L H L H Transparent H X X H X X Z Z Three-State Note: 1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Copyright © 2000, Texas Instruments Incorporated CY74FCT2827T Maximum Ratings[2, 3] DC Output Current (Maximum Sink Current/Pin) ...... 120 mA Power Dissipation .......................................................... 0.5W (Above which the useful life may be impaired. For user guidelines, not tested.) Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Storage Temperature .................................–65°C to +150°C Ambient Temperature with Power Applied .............................................–65°C to +135°C Operating Range Supply Voltage to Ground Potential ............... –0.5V to +7.0V Range DC Input Voltage............................................ –0.5V to +7.0V Commercial DC Output Voltage ......................................... –0.5V to +7.0V Ambient Temperature VCC –40°C to +85°C 5V ± 5% Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Typ.[4] 2.4 3.3 Max. Unit VOH Output HIGH Voltage VCC = Min., IOH = –15 mA VOL Output LOW Voltage VCC = Min., IOL = 12 mA ROUT Output Resistance VCC = Min., IOL = 12 mA VIH Input HIGH Voltage VIL Input LOW Voltage VH Hysteresis[5] All inputs 0.2 VIK Input Clamp Diode Voltage VCC = Min., IIN = –18 mA –0.7 –1.2 V II Input HIGH Current VCC = Max., VIN = VCC 5 µA IIH Input HIGH Current VCC = Max., VIN = 2.7V ±1 µA IIL Input LOW Current VCC = Max., VIN = 0.5V ±1 µA IOZH Off State HIGH-Level Output Current VCC = Max., VOUT = 2.7V 10 µA IOZL Off State LOW-Level Output Current VCC = Max., VOUT = 0.5V –10 µA IOS Output Short Circuit Current[6] VCC = Max., VOUT = 0.0V –225 mA IOFF Power-Off Disable VCC = 0V, VOUT = 4.5V ±1 µA 20 V 0.3 0.55 V 25 40 Ω 2.0 V 0.8 –60 –120 V V Capacitance[5] Parameter Description Typ.[4] Max. Unit CIN Input Capacitance 5 10 pF COUT Output Capacitance 9 12 pF Notes: 2. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. Typical values are at VCC=5.0V, TA=+25˚C ambient. 5. This parameter is specified but not tested. 6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 2 CY74FCT2827T Power Supply Characteristics Parameter Description Test Conditions Typ.[4] Max. Unit ICC Quiescent Power Supply Current VCC=Max., VIN ≤ 0.2V, VIN ≥ VCC-0.2V 0.1 0.2 mA ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max., VIN=3.4V,[7] f1=0, Outputs Open 0.5 2.0 mA ICCD Dynamic Power Supply Current[8] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE1 or OE2=GND, VIN ≤ 0.2V or VIN ≥ VCC-0.2V 0.06 0.12 mA/ MHz IC Total Power Supply Current[9] VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, OE1 or OE2=GND, VIN ≤ 0.2V or VIN ≥ VCC-0.2V 0.7 1.4 mA VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, OE1 or OE2=GND, VIN=3.4V or VIN=GND 1.0 2.4 mA VCC=Max., 50% Duty Cycle, Outputs Open, Ten Bits Toggling at f1=2.5 MHz, OE1 or OE2=GND, VIN ≤ 0.2V or VIN ≥ VCC-0.2V 1.6 3.2[10] mA VCC=Max., 50% Duty Cycle, Outputs Open, Ten Bits Toggling at f1=2.5 MHz, OE1 or OE2=GND, VIN=3.4V or VIN=GND 4.1 13.2[10] mA Notes: 7. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 8. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. = IQUIESCENT + IINPUTS + IDYNAMIC 9. IC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) DH = Duty Cycle for TTL inputs HIGH NT = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 N1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 10. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. ] 3 CY74FCT2827T Switching Characteristics Over the Operating Range[11] CY74FCT2827AT Param. Description CY74FCT2827CT Test Load Min. Max. Min. Max. Unit Fig. No.[12] tPLH tPHL Propagation Delay D to Y CL=50 pF RL=500Ω 1.5 8.0 1.5 4.4 ns 1, 3 tPLH tPHL Propagation Delay D to Y[5] CL=300 pF RL=500Ω 1.5 15.0 1.5 10.0 ns 1, 3 tPZH tPZL Output Enable Time OE to Y CL=50 pF RL=500Ω 1.5 12.0 1.5 7.0 ns 1, 7, 8 tPZH tPZL Output Enable Time OE to Y[5] CL=300 pF RL=500Ω 1.5 23.0 1.5 14.0 ns 1, 7, 8 tPHZ tPHL Output Disable Time OE to Y[5] CL=5 pF RL=500Ω 1.5 9.0 1.5 5.7 ns 1, 7, 8 tPHZ tPHL Output Disable Time OE to Y CL=50 pF RL=500Ω 1.5 9.0 1.5 6.0 ns 1, 7, 8 Ordering Information Speed (ns) Ordering Code Package Name Package Type Operating Range 4.4 CY74FCT2827CTQCT Q13 24-Lead (150-Mil) QSOP Commercial 8.0 CY74FCT2827ATQCT Q13 24-Lead (150-Mil) QSOP Commercial Note: 11. Minimum limits are specified but not tested on Propagation Delays. 12. See “Parameter Measurement Information” in the General Information section. Document #: 38-00347-A 4 CY74FCT2827T Package Diagram 24-Lead Quarter Size Outline Q13 5 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. 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