LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 LM2941/LM2941C 1A Low Dropout Adjustable Regulator Check for Samples: LM2941, LM2941C FEATURES DESCRIPTION • • • • • • • • • • The LM2941 positive voltage regulator features the ability to source 1A of output current with a typical dropout voltage of 0.5V and a maximum of 1V over the entire temperature range. Furthermore, a quiescent current reduction circuit has been included which reduces the ground pin current when the differential between the input voltage and the output voltage exceeds approximately 3V. The quiescent current with 1A of output current and an input-output differential of 5V is therefore only 30mA. Higher quiescent currents only exist when the regulator is in the dropout mode (VIN − VOUT ≤ 3V). 1 2 WSON Space Saving Package Output Voltage Adjustable From 5V to 20V Dropout Voltage Typically 0.5V @ IO = 1A Output Current in Excess of 1A Trimmed Reference Voltage Reverse Battery Protection Internal Short Circuit Current Limit Mirror Image Insertion Protection P+ Product Enhancement Tested TTL, CMOS Compatible ON/OFF Switch Designed also for vehicular applications, the LM2941 and all regulated circuitry are protected from reverse battery installations or two-battery jumps. During line transients, such as load dump when the input voltage can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both the internal circuits and the load. Familiar regulator features such as short circuit and thermal overload protection are also provided. Connection Diagrams TO-220 Plastic Package 8-Lead WSON Surface Mount Package ON/OFF 1 GND 2 8 ADJ 7 GND GND* Figure 1. Top View See Package Number KC INPUT 3 6 N/C N/C 4 5 OUTPUT TO-263 Surface-Mount Package * TIE TO GND OR LEAVE FLOATING Figure 3. Top View See Package Number NGN Figure 2. See Package Number KTT 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Input Voltage (Survival Voltage, ≤ 100ms) Internal Power Dissipation LM2941T, LM2941S, LM2941LD 60V LM2941CT, LM2941CS 45V (3) Internally Limited Maximum Junction Temperature 150°C −65°C ≤ TJ ≤ +150°C Storage Temperature Range Soldering Temperature ESD Rating (1) (2) (3) (4) (5) (4) TO-220 (T), Wave 260°C, 10s TO-263 (S) 235°C, 30s WSON-8 (LD) 235°C, 30s (5) ±2 kV Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time are for Sn-Pb (STD) only. The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. Test method is per JESD22–A114. Operating Ratings Maximum Input Voltage 26V −40°C ≤ TJ ≤ 125°C LM2941T 0°C ≤ TJ ≤ 125°C LM2941CT Temperature Range −40°C ≤ TJ ≤ 125°C LM2941S LM2941CS 0°C ≤ TJ ≤ 125°C LM2941LD −40°C ≤ TJ ≤ 125°C Electrical Characteristics—LM2941T, LM2941S, LM2941LD 5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C, while those in boldface type apply over the full Operating Temperature Range. Parameter Conditions (1) Typ LM2941T LM2941S LM2941LD Limit Units (Limits) 1.237/1.211 V(min) 1.313/1.339 V(max) 4 10/10 mV/V(max) 7 10/10 mV/V(max) Reference Voltage 5mA ≤ IO ≤ 1A Line Regulation VO + 2V ≤ VIN ≤ 26V, IO = 5mA Load Regulation 50mA ≤ IO ≤ 1A Output Impedance 100 mADC and 20 mArms fO = 120Hz 7 VO + 2V ≤ VIN < 26V, IO = 5mA 10 15/20 mA(max) VIN = VO + 5V, IO = 1A 30 45/60 mA(max) Quiescent Current (1) 2 1.275 mΩ/V The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 Electrical Characteristics—LM2941T, LM2941S, LM2941LD (continued) 5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C, while those in boldface type apply over the full Operating Temperature Range. Parameter Conditions Typ RMS Output Noise, % of VOUT 10Hz–100kHz IO = 5mA 0.003 Ripple Rejection fO = 120Hz, 1 Vrms, IL = 100mA 0.005 Long Term Stability LM2941T LM2941S LM2941LD Limit Units (Limits) % 0.02/0.04 0.4 %/V(max) %/1000 Hr IO = 1A 0.5 0.8/1.0 V(max) IO = 100mA 110 200/200 mV(max) Short Circuit Current VIN Max = 26V (2) 1.9 1.6 A(min) Maximum Line Transient VO Max 1V Above Nominal VO RO = 100, t ≤ 100ms 75 60/60 V(min) 31 26/26 VDC Dropout Voltage Maximum Operational Input Voltage Reverse Polarity DC Input Voltage RO = 100, VO ≥ −0.6V −30 −15/−15 V(min) Reverse Polarity Transient Input Voltage t ≤ 100ms, RO = 100Ω −75 −50/−50 V(min) ON/OFF Threshold Voltage ON IO ≤ 1A 1.30 0.80/0.80 V(max) ON/OFF Threshold Voltage OFF IO ≤ 1A 1.30 2.00/2.00 V(min) ON/OFF Threshold Current VON/OFF = 2.0V, IO ≤ 1A 50 100/300 μA(max) (2) Output current capability will decrease with increasing temperature, but will not go below 1A at the maximum specified temperatures. Electrical Characteristics—LM2941CT, LM2941CS 5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C, while those in boldface type apply over the full Operating Temperature Range. Parameter Conditions (2) Typ Limit (1) Units (Limits) 1.237/1.211 V(min) 1.313/1.339 V(max) 4 10 mV/V(max) 7 10 mV/V(max) Reference Voltage 5mA ≤ IO ≤ 1A Line Regulation VO + 2V ≤ VIN ≤ 26V, IO = 5mA Load Regulation 50mA ≤ IO ≤ 1A Output Impedance 100 mADC and 20 mArms fO = 120Hz 7 VO + 2V ≤ VIN < 26V, IO = 5mA 10 15 mA(max) VIN = VO + 5V, IO = 1A 30 45/60 mA(max) Quiescent Current 1.275 RMS Output Noise, % of VOUT 10Hz–100kHz IO = 5mA 0.003 Ripple Rejection fO = 120Hz, 1 Vrms, IL = 100mA 0.005 Long Term Stability Dropout Voltage Short Circuit Current (1) (2) (3) mΩ/V % 0.02 0.4 %/V(max) %/1000 Hr IO = 1A 0.5 0.8/1.0 V(max) IO = 100mA 110 200/200 mV(max) 1.9 1.6 A(min) VIN Max = 26V (3) All limits specified at room temperature (standard typeface) and at temperature extremes (boldface type). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. The output voltage range is 5V to 20V and is determined by the two external resistors, R1 and R2. See Typical Application Circuit. Output current capability will decrease with increasing temperature, but will not go below 1A at the maximum specified temperatures. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C 3 LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com Electrical Characteristics—LM2941CT, LM2941CS (continued) 5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C, while those in boldface type apply over the full Operating Temperature Range. Parameter Maximum Line Transient Conditions Typ VO Max 1V Above Nominal VO RO = 100Ω, T ≤ 100ms Maximum Operational Input Voltage Limit (1) Units (Limits) 55 45 V(min) 31 26 VDC Reverse Polarity DC Input Voltage RO = 100Ω, VO ≥ −0.6V −30 −15 V(min) Reverse Polarity Transient Input Voltage T ≤ 100ms, RO = 100Ω −55 −45 V(min) ON/OFF Threshold Voltage ON IO ≤ 1A 1.30 0.80 V(max) ON/OFF Threshold Voltage OFF IO ≤ 1A 1.30 2.00 V(min) ON/OFF Threshold Current VON/OFF = 2.0V, IO ≤ 1A 50 100 μA(max) 5-Lead TO-220 1 °C/W 5-Lead TO-263 1 °C/W 8-Lead WSON 5.3 °C/W 5-Lead TO-220 53 °C/W 5-Lead TO-263 (See TO-263 Mounting) 73 °C/W 8-Lead WSON (See WSON Mounting) 35 °C/W Thermal Performance Thermal Resistance Junction-to-Case, θJC Thermal Resistance Junction-to-Ambient, θJA (1) (1) 4 The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 Typical Performance Characteristics Dropout Voltage Dropout Voltage vs. Temperature Figure 4. Figure 5. Output Voltage Quiescent Current vs. Temperature Figure . Figure 6. Quiescent Current Quiescent Current Figure 7. Figure 8. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C 5 LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Line Transient Response Load Transient Response Figure 9. Figure 10. Ripple Rejection Output Impedance Figure 11. Figure 12. Low Voltage Behavior Low Voltage Behavior Figure 13. Figure 14. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Output Capacitor ESR Output at Voltage Extremes Figure 15. Figure 16. Output at Voltage Extremes Peak Output Current Figure 17. Figure 18. Maximum Power Dissipation (TO-220) Maximum Power Dissipation (TO-263) Figure 19. Figure 20. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C 7 LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com Definition of Terms Dropout Voltage: The input-voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100mV from the nominal value obtained at (VOUT + 5V) input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminals with respect to ground. Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will operate. Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature. Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range. Quiescent Current: That part of the positive input current that does not contribute to the positive load current. The regulator ground lead current. Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage. Temperature Stability of VO: The percentage change in output voltage for a thermal variation from room temperature to either temperature extreme. APPLICATION HINTS Output Capacitor A Tantalum capacitor with a minimum capacitance value of 22 μF, and ESR in the range of 0.01Ω to 5Ω, is required at the output pin for loop stability. It must be located less than 1 cm from the device. There is no limitation on any additional capacitance. Alternately, a high quality X5R/X7R 22 μF ceramic capacitor may be used for the output capacitor only if an appropriate value of series resistance is added to simulate the ESR requirement. The ceramic capacitor selection must include an appropriate voltage de-rating of the capacitance value due to the applied output voltage. The series resistor (for ESR simulation) should be in the range of 0.1Ω to 1.0Ω. Setting the Output Voltage The output voltage range is 5V to 20V and is set by the two external resistors, R1 and R2. See the Typical Applications. The output voltage is given by the formula: VOUT = VREF x ((R1+R2) / R1) (1) where VREF is typically 1.275V. Using 1.00 kΩ for R1 will ensure that the bias current error of the adjust pin will be negligible. Using a R1 value higher than 10 kΩ may cause the output voltage to shift across temperature due to variations in the adjust pin bias current. Calculating the upper resistor (R2) value of the pair when the lower resistor (R1) value is known is accomplished with the following formula: R2 = R1 x ((VOUT / VREF) - 1) (2) The resistors used for R1 and R2 should be high quality, tight tolerance, and with matching temperature coefficients. It is important to remember that, although the value of VREF is ensured, the final value of VOUT is not. The use of low quality resistors for R1 and R2 can easily produce a VOUT value that is unacceptable. 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 ON/OFF The ON/OFF pin has no internal pull-up or pull-down to establish a default condition and, as a result, this pin must be terminated externally, either actively or passively. The ON/OFF pin requires a low level to enable the output, and a high level to disable the output. To ensure reliable operation, the ON/OFF pin voltage must rise above the maximum ON/OFF(OFF) voltage threshold (2.00V) to disable the output, and must fall below the minimum ON/OFF(ON) voltage threshold (0.80V) to enable the output. If the ON/OFF function is not needed this pin can be connected directly to Ground. If the ON/OFF pin is being pulled to a high state through a series resistor, an allowance must be made for the ON/OFF pin current that will cause a voltage drop across the pull-up resistor. Thermal Overload Protection The LM2941 incorporates a linear form of thermal protection that limits the junction temperature (TJ) to typically 155°C. Should the LM2941 see a fault condition that results in excessive power dissipation and the junction temperature approaches 155°C, the device will respond by reducing the output current (which reduces the power dissipation) to hold the junction temperature at 155°C. Thermal Overload protection is not an ensured operating condition. Operating at, or near to, the Thermal Overload condition for any extended period of time is not encouraged, or recommended, as this may shorten the lifetime of the device. Power Dissipation Consideration should be given to the maximum power dissipation (PD(MAX)) which is limited by the maximum operating junction temperature (TJ(MAX)) of 125°C, the maximum operating ambient temperature (TA(MAX)) of the application, and the thermal resistance (θJA) of the package. Under all possible conditions, the junction temperature (TJ) must be within the range specified in the Operating Ratings. The total power dissipation of the device is given by: PD = ( (VIN − VOUT) x IOUT) + (VIN x IGND) (3) where IGND is the operating ground pin current of the device (specified under Electrical Characteristics). The maximum allowable junction temperature rise (ΔTJ) depends on the maximum expected ambient temperature (TA(MAX)) of the application, and the maximum allowable junction temperature (TJ(MAX)): ΔTJ = TJ(MAX) − TA(MAX) (4) The maximum allowable value for junction to ambient Thermal Resistance, θJA, required to keep the junction temperature, TJ, from exceeding maximum allowed can be calculated using the formula: θJA = ΔTJ / PD(MAX) (5) The maximum allowable power dissipation, PD(MAX), required allowed for a specific ambient temperature can be calculated using the formula: PD(MAX) = ΔTJ / θJA (6) Additional information for thermal performance of surface mount packages can be found in AN-1520: A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (literature number SNVA183), AN-1187: Leadless Leadframe Package (LLP) (literature number SNOA401), and AN-2020: Thermal Design By Insight, Not Hindsight (literature number SNVA419). TO-263 Mounting The thermal dissipation of the TO-263 package is directly related to the printed circuit board construction and the amount of additional copper area connected to the TAB. The TAB on the bottom of the TO-263 package is connected to the die substrate via a conductive die attach adhesive, and to device pin 3. As such, it is strongly recommend that the TAB area be connected to copper area directly under the TAB that is extended into the ground plane via multiple thermal vias. Alternately, but not recommended, the TAB may be left floating (i.e. no direct electrical connection). The TAB must not be connected to any potential other than ground. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C 9 LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com For the LM2941S in the KTT TO-263 package, the junction-to-case thermal rating, θJC, is 1°C/W, where the CASE is defined as the bottom of the package at the center of the TAB area. The junction-to-ambient thermal performance for the LM2941S in the TO-263 package, using the JEDEC JESD51 standards is summarized in the following table: Board Type Thermal Vias θJC θJA JEDEC 2-Layer JESD 51-3 None 1°C/W 73°C/W 1 1°C/W 35°C/W 2 1°C/W 30°C/W 4 1°C/W 26°C/W 8 1°C/W 24°C/W JEDEC 4-Layer JESD 51-7 6 POWER DISSIPATION (W) JA= 35°C/W 5 JA= 30°C/W JA= 26°C/W 4 JA= 24°C/W 3 2 1 LM2941S (TO-263) 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 Figure 21. PD(MAX) vs TA for LM2941S (TO-263) WSON Mounting The NGN (Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in Application Note 1187 (literature number SNOA401). Referring to the section PCB Design Recommendations in AN-1187 (Page 5), it should be noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask defined) type. The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the amount of additional copper area connected to the DAP. The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate via a conductive die attach adhesive, and to device pin 2 and pin 7. As such, it is strongly recommend that the DAP area be connected copper area directly under the DAP that is extended into the ground plane via multiple thermal vias. Alternately, but not recommended, the DAP area may be left floating (i.e. no direct electrical connection). The DAP area must not be connected to any potential other than ground. 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 For the LM2941LD in the NGN 8-Lead WSON package, the junction-to-case thermal rating, θJC, is 5.3°C/W, where the CASE is defined as the bottom of the package at the center of the DAP area. The junction-to-ambient thermal performance for the LM2941LD in the NGN 8-Lead WSON package, using the JEDEC JESD51 standards is summarized in the following table: Board Type Thermal Vias θJC θJA JEDEC 2-Layer JESD 51-3 None 5.3°C/W 181°C/W 1 5.3°C/W 58°C/W 2 5.3°C/W 49°C/W 4 5.3°C/W 40°C/W 6 5.3°C/W 35°C/W JEDEC 4-Layer JESD 51-7 POWER DISSIPATION (W) 6 JA= 58°C/W 5 JA= 49°C/W 4 JA= 40°C/W JA= 35°C/W 3 2 1 LM2941LD (LLP) 0 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 Figure 22. PD(MAX) vs TA for LM2941LD (WSON) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C 11 LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com Typical Applications Note: Using 1k for R1 will ensure that the bias current error from the adjust pin will be negligible. Do not bypass R1 or R2. This will lead to instabilities. * Required if regulator is located far from power supply filter. ** COUT must be at least 22μF to maintain stability. May be increased without bound to maintain regulation during transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating temperature range as the regulator and the ESR is critical; see curve. Figure 23. 5V to 20V Adjustable Regulator *** To assure shutdown, select Resistor R3 to ensure at least 300μA of pull-up current when S1 is open. (Assume 2V at the ON/OFF pin.) Figure 24. 1A Switch 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 Equivalent Schematic Diagram Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C 13 LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision F (April 2013) to Revision G • 14 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 13 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2941CS ACTIVE DDPAK/ TO-263 KTT 5 45 TBD Call TI Call TI 0 to 125 LM2941CS P+ LM2941CS/NOPB ACTIVE DDPAK/ TO-263 KTT 5 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2941CS P+ LM2941CSX ACTIVE DDPAK/ TO-263 KTT 5 500 TBD Call TI Call TI 0 to 125 LM2941CS P+ LM2941CSX/NOPB ACTIVE DDPAK/ TO-263 KTT 5 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR 0 to 125 LM2941CS P+ LM2941CT ACTIVE TO-220 KC 5 45 TBD Call TI Call TI 0 to 125 LM2941CT P+ LM2941CT/LB03 ACTIVE TO-220 NDH 5 45 TBD Call TI Call TI LM2941CT P+ LM2941CT/LF03 ACTIVE TO-220 NDH 5 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM2941CT P+ LM2941CT/LF04 ACTIVE TO-220 NEB 5 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM2941CT P+ LM2941CT/NOPB ACTIVE TO-220 KC 5 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 125 LM2941LD ACTIVE WSON NGN 8 1000 TBD Call TI Call TI -40 to 125 L2941LD LM2941LD/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L2941LD LM2941LDX ACTIVE WSON NGN 8 4500 TBD Call TI Call TI -40 to 125 L2941LD LM2941LDX/NOPB ACTIVE WSON NGN 8 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L2941LD LM2941S ACTIVE DDPAK/ TO-263 KTT 5 45 TBD Call TI Call TI -40 to 125 LM2941S P+ LM2941S/NOPB ACTIVE DDPAK/ TO-263 KTT 5 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2941S P+ LM2941SX ACTIVE DDPAK/ TO-263 KTT 5 500 TBD Call TI Call TI -40 to 125 LM2941S P+ LM2941SX/NOPB ACTIVE DDPAK/ TO-263 KTT 5 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2941S P+ Addendum-Page 1 LM2941CT P+ Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM2941T ACTIVE TO-220 KC 5 45 TBD Call TI Call TI -40 to 125 LM2941T/LB03 ACTIVE TO-220 NDH 5 45 TBD Call TI Call TI LM2941T P+ LM2941T/LB04 ACTIVE TO-220 NEB 5 45 TBD Call TI Call TI LM2941T P+ LM2941T/LB08 ACTIVE TO-220 NEC 5 45 TBD Call TI Call TI LM2941T P+ LM2941T/LF03 ACTIVE TO-220 NDH 5 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM2941T P+ LM2941T/NOPB ACTIVE TO-220 KC 5 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2941T P+ LM2941T P+ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2941CSX DDPAK/ TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2941CSX/NOPB DDPAK/ TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2941LD WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM2941LD/NOPB WSON NGN 8 LM2941LDX WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 LM2941LDX/NOPB WSON NGN Q1 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LM2941SX DDPAK/ TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM2941SX/NOPB DDPAK/ TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2941CSX DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0 LM2941CSX/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0 LM2941LD WSON NGN 8 1000 210.0 185.0 35.0 LM2941LD/NOPB WSON NGN 8 1000 213.0 191.0 55.0 LM2941LDX WSON NGN 8 4500 367.0 367.0 35.0 LM2941LDX/NOPB WSON NGN 8 4500 367.0 367.0 35.0 LM2941SX DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0 LM2941SX/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA NDH0005D www.ti.com MECHANICAL DATA NGN0008A LDC08A (Rev B) www.ti.com MECHANICAL DATA KTT0005B TS5B (Rev D) BOTTOM SIDE OF PACKAGE www.ti.com MECHANICAL DATA NEB0005F www.ti.com MECHANICAL DATA NEC0005D TA05D (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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