LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 LM20 2.4V, 10µA, SC70, DSBGA Temperature Sensor Check for Samples: LM20 FEATURES 1 • • • • 2 Rated for full −55°C to +130°C range Available in an SC70 and DSBGA package Predictable Curvature Error Suitable for Remote Applications APPLICATIONS • • • • • • • • • Cellular Phones Computers Power Supply Modules Battery Management FAX Machines Printers HVAC Disk Drives Appliances KEY SPECIFICATIONS • • • • • • • Accuracy at 30°C ±1.5 to ±4 °C (max) Accuracy at 130°C and −55°C ±2.5 to ±5 °C (max) Power Supply Voltage Range 2.4 to 5.5 V Current Drain 10 μA (max) Nonlinearity ±0.4% (typ) Output Impedance 160 Ω (max) Load Regulation 0 μA < IL< 16 μA −2.5 mV (max) DESCRIPTION The LM20 is a precision analog output CMOS integrated-circuit temperature sensor that operates over a −55°C to 130°C temperature range. The power supply operating range is 2.4 V to 5.5 V. The transfer function of LM20 is predominately linear, yet has a slight predictable parabolic curvature. The accuracy of the LM20 when specified to a parabolic transfer function is ±1.5°C at an ambient temperature of 30°C. The temperature error increases linearly and reaches a maximum of ±2.5°C at the temperature range extremes. The temperature range is affected by the power supply voltage. At a power supply voltage of 2.7 V to 5.5 V the temperature range extremes are 130°C and −55°C. Decreasing the power supply voltage to 2.4 V changes the negative extreme to −30°C, while the positive remains at 130°C. The LM20 quiescent current is less than 10 μA. Therefore, self-heating is less than 0.02°C in still air. Shutdown capability for the LM20 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates or does not necessitate shutdown at all. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM20 SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 www.ti.com Typical Application Full-Range Celsius (Centigrade) Temperature Sensor (−55°C TO 130°C) Operating From a Single LI-Ion Battery Cell VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639 where: T is temperature, and VO is the measured output voltage of the LM20. Output Voltage vs Temperature Table 1. Output Voltage vs Temperature 2 Temperature (T) Typical VO 130°C 303 mV 100°C 675 mV 80°C 919 mV 30°C 1515 mV 25°C 1574 mV 0°C 1863.9 mV –30°C 2205 mV −40°C 2318 mV −55°C 2485 mV Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 Connection Diagrams GND (pin 2) may be grounded or left floating. For optimum thermal conductivity to the pc board ground plane, pin 2 must be grounded. NC (pin 1) must be left floating or grounded. Other signal traces must not be connected to this pin. Figure 1. SC70-5 Top View Package Number DCK0005A Pin numbers are referenced to the package marking text orientation. Reference JEDEC Registration MO-211, variation BA The actual physical placement of package marking will vary slightly from part to part. The package marking will designate the date code and will vary considerably. Package marking does not correlate to device type in any way. Figure 2. DSBGA Top View Package Number YZR0004ZZA These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage 6.5V to −0.2V Output Voltage (V+ + 0.6 V) to −0.6 V Output Current 10 mA Input Current at any pin (2) 5 mA −65°C to 150°C Storage Temperature Maximum Junction Temperature (TJMAX) ESD Susceptibility (3) 150°C Human Body Model 2500 V Machine Model 250 V Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. (4) (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V+), the current at that pin should be limited to 5 mA. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Reflow temperature profiles are different for lead-free and non-lead-free packages. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 3 LM20 SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 www.ti.com Operation Ratings (1) TMIN ≤ TA ≤ TMAX Specified Temperature Range: LM20B, LM20C with 2.4 V ≤ V+≤ 2.7 V −30°C ≤ TA ≤ 130°C LM20B, LM20C with 2.7 V ≤ V+≤ 5.5 V −55°C ≤ TA ≤ 130°C LM20S with 2.4 V ≤ V+≤ 5.5 V −30°C ≤ TA ≤ 125°C LM20S with 2.7 V ≤ V+≤ 5.5 V −40°C ≤ TA ≤ 125°C Supply Voltage Range (V+) 2.4 V to 5.5 V Thermal Resistance, θJA (2) SC70 DSBGA 415°C/W 340°C/W (1) (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air using the printed circuit board layout shown in PCB Layouts Used For Thermal Measurements. Electrical Characteristics Unless otherwise noted, these specifications apply for V+ = +2.7 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25°C; Unless otherwise noted. PARAMETER Temperature to Voltage Error VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639V (3) CONDITIONS TYPICAL (1) LM20B LM20C LM20S Limits Limits Limits UNIT (Limit) (2) (2) (2) TA = 25°C to 30°C ±1.5 ±4.0 ±2.5 TA = 130°C ±2.5 ±5.0 TA = 125°C ±2.5 ±5.0 ±3.5 °C (max) TA = 100°C ±2.2 ±4.7 ±3.2 °C (max) TA = 85°C ±2.1 ±4.6 ±3.1 °C (max) TA = 80°C ±2.0 ±4.5 ±3.0 °C (max) TA = 0°C ±1.9 ±4.4 ±2.9 °C (max) TA = –30°C ±2.2 ±4.7 ±3.3 °C (min) TA = –40°C ±2.3 ±4.8 ±3.5 °C (max) TA = –55°C ±2.5 ±5.0 °C (max) °C (max) °C (max) Output Voltage at 0°C 1.8639 V Variance from Curve ±1.0 °C Non-Linearity (4) –20°C ≤ TA ≤ 80°C Sensor Gain (Temperature Sensitivity or Average Slope) to –30°C ≤ TA ≤ 100°C equation: VO=−11.77 mV/°C×T+1.860V Output Impedance (1) (2) (3) (4) (5) (6) 4 ±0.4% −11.77 0 μA ≤ IL ≤ 16 μA (5) (6) −11.4 −12.2 −11.0 −12.6 −11.0 −12.6 mV/°C (min) mV/°C (max) 160 160 160 Ω (max) Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage, current, and temperature (expressed in°C). Non-Linearity is defined as the deviation of the calculated output-voltage-versus-temperature curve from the best-fit straight line, over the temperature range specified. Negative currents are flowing into the LM20. Positive currents are flowing out of the LM20. Using this convention the LM20 can at most sink −1 μA and source 16 μA. Load regulation or output impedance specifications apply over the supply voltage range of 2.4V to 5.5V. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 Electrical Characteristics (continued) Unless otherwise noted, these specifications apply for V+ = +2.7 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25°C; Unless otherwise noted. PARAMETER Load Regulation (7) Line Regulation (8) Quiescent Current Change of Quiescent Current CONDITIONS (7) (8) (1) LM20B LM20C LM20S Limits Limits Limits UNIT (Limit) (2) (2) (2) 0 μA ≤ IL ≤ 16 μA −2.5 −2.5 −2.5 mV (max) 2.4 V ≤ V+ ≤ 5.0V 3.3 3.7 3.7 mV/V (max) (5) (6) + 5.0 V ≤ V ≤ 5.5 V 11 11 11 mV (max) 2.4V ≤ V+ ≤ 5.0V 4.5 7 7 7 μA (max) 5.0V ≤ V+ ≤ 5.5V 4.5 9 9 9 μA (max) + 2.4V ≤ V ≤ 5.0V 4.5 10 10 10 μA (max) 2.4 V ≤ V+ ≤ 5.5V 0.7 μA −11 nA/°C 0.02 μA Temperature Coefficient of Quiescent Current Shutdown Current TYPICAL V+ ≤ 0.8 V Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest supply input voltage. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 5 LM20 SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 www.ti.com Typical Performance Characteristics Temperature Error vs Temperature Figure 3. PCB LAYOUTS USED FOR THERMAL MEASUREMENTS Figure 4. Layout Used For No Heat Sink Measurements Figure 5. Layout Used For Measurements With Small Heat Sink LM20 Transfer Function The LM20 transfer function can be described in different ways with varying levels of precision. A simple linear transfer function, with good accuracy near 25°C, is VO = −11.69 mV/°C × T + 1.8663 V (1) Over the full operating temperature range of −55°C to 130°C, best accuracy can be obtained by using the parabolic transfer function. VO = (−3.88×10−6×T2) + (−1.15×10−2×T) + 1.8639 (2) solving for T: (3) A linear transfer function can be used over a limited temperature range by calculating a slope and offset that give best results over that range. A linear transfer function can be calculated from the parabolic transfer function of the LM20. The slope of the linear transfer function can be calculated using the following equation: m = −7.76 × 10−6× T − 0.0115, 6 (4) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 where T is the middle of the temperature range of interest and m is in V/°C. For example for the temperature range of TMIN = −30 to TMAX = +100°C: T = 35°C (5) m = −11.77 mV/°C (6) and The offset of the linear transfer function can be calculated using the following equation: b = (VOP(TMAX) + VOP(T) − m × (TMAX+T))/2 (7) where: • VOP(TMAX) is the calculated output voltage at TMAX using the parabolic transfer function for VO • VOP(T) is the calculated output voltage at T using the parabolic transfer function for VO. Using this procedure the best fit linear transfer function for many popular temperature ranges was calculated in Table 2. As shown in Table 2 the error that is introduced by the linear transfer function increases with wider temperature ranges. Table 2. First Order Equations Optimized for Different Temperature Ranges Temperature Range Linear Equation VO = Maximum Deviation of Linear Equation from Parabolic Equation (°C) Tmin (°C) Tmax (°C) −55 130 −11.79 mV/°C × T + 1.8528 V ±1.41 −40 110 −11.77 mV/°C × T + 1.8577 V ±0.93 −30 100 −11.77 mV/°C × T + 1.8605 V ±0.70 -40 85 −11.67 mV/°C × T + 1.8583 V ±0.65 −10 65 −11.71 mV/°C × T + 1.8641 V ±0.23 35 45 −11.81 mV/°C × T + 1.8701 V ±0.004 20 30 –11.69 mV/°C × T + 1.8663 V ±0.004 Mounting The LM20 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM20 is sensing will be within about +0.02°C of the surface temperature to which the LM20's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM20 die is directly attached to the pin 2 GND pin. The tempertures of the lands and traces to the other leads of the LM20 will also affect the temperature that is being sensed. Alternatively, the LM20 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM20 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM20 or its connections. The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. For the LM20 the equation used to calculate the rise in the die temperature is as follows: TJ = TA + θJA [(V+ IQ) + (V+ − VO) IL] where IQ is the quiescent current and ILis the load current on the output. Since the LM20's junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM20 is required to drive. The tables shown in Table 3 summarize the rise in die temperature of the LM20 without any loading, and the thermal resistance for different conditions. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 7 LM20 SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 www.ti.com Table 3. Temperature Rise of LM20 Due to Self-Heating and Thermal Resistance (θJA) (1) SC70-5 SC70-5 No Heat Sink Small Heat Sink θJA TJ − TA θJA (°C/W) (°C) (°C/W) (°C) Still air 412 0.2 350 0.19 Moving air 312 0.17 266 0.15 (1) TJ − TA See PCB Layouts Used For Thermal Measurements for PCB layout samples. DSBGA DSBGA No Heat Sink Small Heat Sink θJA TJ − TA θJA (°C/W) (°C) (°C/W) TJ − TA (°C) Still air 340 0.18 TBD TBD Moving air TBD TBD TBD TBD Capacitive Loads The LM20 handles capacitive loading well. Without any precautions, the LM20 can drive any capacitive load less than 300 pF as shown in Figure 6. Over the specified temperature range the LM20 has a maximum output impedance of 160 Ω. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 μF be added from V+ to GND to bypass the power supply voltage, as shown in Figure 7. In a noisy environment it may even be necessary to add a capacitor from the output to ground with a series resistor as shown in Figure 7. A 1 μF output capacitor with the 160 Ω maximum output impedance and a 200 Ω series resistor will form a 442 Hz lowpass filter. Since the thermal time constant of the LM20 is much slower, the overall response time of the LM20 will not be significantly affected. Figure 6. LM20 No Decoupling Required for Capacitive Loads Less Than 300 pF R (Ω) 8 C (µF) 200 1 470 0.1 680 0.01 1k 0.001 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 Figure 7. LM20 with Filter for Noisy Environment and Capacitive Loading Greater Than 300 pF NOTE Either placement of resistor as shown above is just as effective. LM20 DSBGA Light Sensitivity Exposing the LM20 DSBGA package to bright sunlight may cause the output reading of the LM20 to drop by 1.5V. In a normal office environment of fluorescent lighting the output voltage is minimally affected (less than a millivolt drop). In either case it is recommended that the LM20 DSBGA be placed inside an enclosure of some type that minimizes its light exposure. Most chassis provide more than ample protection. The LM20 does not sustain permanent damage from light exposure. Removing the light source will cause LM20's output voltage to recover to the proper value. APPLICATION CIRCUITS V+ VTEMP R3 VT1 R4 VT2 LM4040 V+ VT R1 4.1V U3 0.1 PF LM20 R2 (High = overtemp alarm) + U1 - VOUT VOUT LM7211 VTemp U2 VT1 = (4.1)R2 R2 + R1||R3 VT2 = (4.1)R2||R3 R1 + R2||R3 Figure 8. Centigrade Thermostat Figure 9. Conserving Power Dissipation with Shutdown Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 9 LM20 SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 www.ti.com Figure 10. Suggested Connection to a Sampling Analog to Digital Converter Input Stage Most CMOS ADCs found in ASICs have a sampled data comparator input structure that is notorious for causing grief to analog output devices such as the LM20 and many op amps. The cause of this grief is the requirement of instantaneous charge of the input sampling capacitor in the ADC. This requirement is easily accommodated by the addition of a capacitor. Since not all ADCs have identical input stages, the charge requirements will vary necessitating a different value of compensating capacitor. This ADC is shown as an example only. If a digital output temperature is required please refer to devices such as the LM74. 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 LM20 www.ti.com SNIS106P – DECEMBER 1999 – REVISED FEBRUARY 2013 REVISION HISTORY Changes from Revision O (February 2013) to Revision P • Page Changed layout of National Data Sheet to TI Format ........................................................................................................ 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM20 11 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM20BIM7 NRND SC70 DCK 5 1000 TBD Call TI Call TI -55 to 130 T2B LM20BIM7/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 130 T2B LM20BIM7X NRND SC70 DCK 5 3000 TBD Call TI Call TI -55 to 130 T2B LM20BIM7X/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 130 T2B LM20CIM7 NRND SC70 DCK 5 1000 TBD Call TI Call TI -55 to 130 T2C LM20CIM7/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 130 T2C LM20CIM7X NRND SC70 DCK 5 3000 TBD Call TI Call TI -55 to 130 T2C LM20CIM7X/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 130 T2C LM20SITL/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 LM20SITLX/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 1-Nov-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM20BIM7 SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20BIM7/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20BIM7X SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20BIM7X/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20CIM7 SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20CIM7/NOPB SC70 DCK 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20CIM7X SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20CIM7X/NOPB SC70 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LM20SITL/NOPB DSBGA YZR 4 250 178.0 8.4 1.04 1.04 0.76 4.0 8.0 Q1 LM20SITLX/NOPB DSBGA YZR 4 3000 178.0 8.4 1.04 1.04 0.76 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM20BIM7 SC70 DCK 5 1000 210.0 185.0 35.0 LM20BIM7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 LM20BIM7X SC70 DCK 5 3000 210.0 185.0 35.0 LM20BIM7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0 LM20CIM7 SC70 DCK 5 1000 210.0 185.0 35.0 LM20CIM7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 LM20CIM7X SC70 DCK 5 3000 210.0 185.0 35.0 LM20CIM7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0 LM20SITL/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LM20SITLX/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 Pack Materials-Page 2 MECHANICAL DATA YZR0004xxx D 0.600±0.075 E TLA04XXX (Rev D) D: Max = 0.994 mm, Min =0.933 mm E: Max = 0.994 mm, Min =0.933 mm 4215042/A NOTES: A. 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