bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 System-Side Impedance Track™ Fuel Gauge With Direct Battery Connection FEATURES APPLICATIONS • • • • • 1 23 • • • Single series cell Li-Ion battery fuel gauge resides on system board – Integrated 2.5 VDC LDO – External low-value 10 mΩ sense resistor Patented Impedance Track™ technology – Adjusts for battery aging, self-discharge, temperature, and rate changes – Reports Remaining Capacity, State of Charge (SOC), and Time-to-Empty – Optional Smoothing Filter – Battery State of Health (aging) estimation – Supports embedded or removable packs with up to 32Ahr capacity – Accommodates pack swapping with 2 separate battery profiles Microcontroller peripheral supports: – 400-kHz I2C™ serial interface – 32 Bytes of Scratch-Pad FLASH NVM – Battery Low digital output warning – Configurable SOC Interrupts – External thermistor, internal sensor, or host reported temperature options Small 12-pin 2,5 mm × 4 mm SON Package Smartphones, Feature phones and Tablets Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players DESCRIPTION The Texas Instruments bq27510-G3 system-side LiIon battery fuel gauge is a microcontroller peripheral that provides fuel gauging for single-cell Li-Ion battery packs. The device requires little system microcontroller firmware development. The bq27510G3 resides on the system’s main board and manages an embedded battery (non-removable) or a removable battery pack. The bq27510-G3 uses the patented Impedance Track™ algorithm for fuel gauging, and provides information such as remaining battery capacity (mAh), state-of-charge (%), run-time to empty (min.), battery voltage (mV), temperature (°C) and state of health (%). Battery fuel gauging with the bq27510-G3 requires only PACK+ (P+), PACK– (P–), and optional Thermistor (T) connections to a removable battery pack or embedded battery circuit. TYPICAL APPLICATION Host System Single-Cell Li-ion Battery Pack VCC REG25 Power Management Controller 2 IC LDO REGIN PACK+ GPOUT Voltage Sense DATA Temp Sense PROTECTION IC T bq27510-G3 PACK- FETs CHG DSG Current Sense 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track is a trademark of Texas Instruments. I2C is a trademark of Phillips Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated bq27510-G3 SLUSAT1 – MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION AVAILABLE OPTIONS PART NUMBER FIRMWARE VERSION PACKAGE (1) TA COMMUNICATION FORMAT 4.00 (0X0400) 12-pin, 2,5-mm × 4mm SON –40°C to 85°C I2C bq27510DRZR-G3 bq27510DRZT-G3 (1) TAPE and REEL QUANTITY 3000 250 For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI website at www.ti.com. PIN DIAGRAM DRZ PACKAGE (TOP VIEW) BI/TOUT 1 12 GPOUT REG25 2 11 SCL REGIN 3 10 SDA BAT 4 9 TS Vcc 5 8 SRN Vss 6 7 SRP PIN FUNCTIONS PIN NAME TYPE (1) DESCRIPTION Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Open-drain I/O. Use with pull-up resistor >1MΩ (1.8 MΩ typical). NO. BI/TOUT 1 I/O REG25 2 P 2.5 V output voltage of the internal integrated LDO. REGIN 3 P Regulator input. Decouple with 0.1μF ceramic capacitor to Vss. BAT 4 I Cell voltage measurement input. ADC input. Vcc 5 P Processor power input. Decouple with 0.1μF ceramic capacitor minimum. Vss 6 P Device ground SRP 7 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRP is nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor. SRN 8 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRN is nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor. TS 9 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input SDA 10 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical). SCL 11 I Slave I2C serial communications clock input line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical). GPOUT 12 O General Purpose open-drain output. May be configured as Battery Low, Battery Good, or to perform interrupt functionality. (1) 2 I/O = Digital input/output; IA = Analog input; P = Power connection. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE MIN UNIT MAX VREGIN Regulator input voltage –0.3 24 V VCC Supply voltage range –0.3 2.75 V VIOD Open-drain I/O pins (SDA, SCL, GPOUT) –0.3 6 V VBAT BAT input pin –0.3 6 V VI Input voltage range to all other pins (TS, SRP, SRN, BI/TOUT) –0.3 VCC + 0.3 V TF Functional temperature range –40 100 °C TSTG Storage temperature range –65 150 °C ESD (1) Human Body Model (HBM), BAT pin 1.5 Human Body Model (HBM), all other pins KV 2 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION THERMAL METRIC (1) DRZ (12-PINS) θJA Junction-to-ambient thermal resistance 64.1 θJCtop Junction-to-case (top) thermal resistance 59.8 θJB Junction-to-board thermal resistance 52.7 ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 28.3 θJCbot Junction-to-case (bottom) thermal resistance 2.4 (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS TA = 25°C, VCC = 2.5 V (unless otherwise noted) PARAMETER VREGIN Supply voltage TEST CONDITION No operating restrictions MIN TYP MAX 2.7 5.5 No FLASH writes 2.45 2.7 CREG25 0.47 CREG25 External REG25 capacitor tPUCD Power Up Communication Delay ICC Normal operating mode current Fuel gauge in NORMAL mode, ILOAD > Sleep Current ISLP Low-power operating mode current ISLP+ UNIT V µF 250 ms 103 μA Fuel gauge in SLEEP mode. ILOAD < Sleep Current 18 μA Low-power operating mode current Fuel gauge in SLEEP+ mode. ILOAD < Sleep Current 60 μA IHIB Hibernate operating mode current Fuel gauge in HIBERNATE mode. ILOAD < Hibernate Current 4 μA VOL Output voltage low (SDA, GPOUT, BI/TOUT) IOL = 0.5 mA VOH(PP) Output high voltage (GPOUT) IOH = –1 mA VCC–0.5 VOH(OD) Output high voltage (SDA, SCL, BI/TOUT) External pull-up resistor connected to Vcc VCC–0.5 VIL VIH(OD) Input voltage low (SDA, SCL) Input voltage low (BI/TOUT) BAT INSERT CHECK MODE active Input voltage high (SDA, SCL) Input voltage high (BI/TOUT) BAT INSERT CHECK MODE active 0.4 V V V –0.3 0.6 –0.3 0.6 1.2 6 1.2 6 V V VA1 Input voltage range (TS) VSS–0.125 2 V VA2 Input voltage range (BAT) VSS–0.125 5 V Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 bq27510-G3 SLUSAT1 – MARCH 2013 www.ti.com RECOMMENDED OPERATING CONDITIONS (continued) TA = 25°C, VCC = 2.5 V (unless otherwise noted) PARAMETER VA3 Input voltage range (SRP, SRN) tPUCD Power-up communication delay TA Operating free-air temperature range 2.5 V LDO TEST CONDITION MIN TYP MAX VSS–0.125 0.125 250 UNIT V ms –40 85 °C (1) TA = 25°C, CREG = 0.47 μF, VREGIN = 3.6 V (unless otherwise noted) PARAMETER MIN NOM MAX 2.7 V ≤ VREGIN ≤ 5.5 V, IOUT ≤ 16mA TEST CONDITION TA = –40°C to 85°C 2.4 2.5 2.6 2.45 V ≤ VREGIN < 2.7 V (low battery), IOUT ≤ 3mA TA = –40°C to 85°C 2.40 2.7 V, IOUT ≤ 16 mA TA = –40°C to 85°C UNIT V VREG25 Regulator output voltage VDO Regulator dropout voltage ΔVREGTEMP Regulator output change with temperature VREGIN = 3.6 V, IOUT = 16 mA ΔVREGLINE Line regulation 2.7 V ≤ VREGIN ≤ 5.5 V, IOUT = 16 mA 11 25 mV ΔVREGLOAD Load regulation 0.2 mA ≤ IO UT ≤ 3 mA, VREGIN = 2.45 V 34 40 mV 3 mA ≤ IOUT ≤ 16 mA, VREGIN = 2.7 V 31 250 mA UNIT ISHORT (1) (2) (2) Short circuit current limit V 280 2.45 V, IOUT ≤ 3 mA mV 50 VREG25 = 0 V TA = –40°C to 85°C 0.3% TA = –40°C to 85°C LDO output current, IOUT, is the sum of internal and external load currents. Assured by design. Not production tested. POWER-ON RESET TA = –40°C to 85°C, typical values at TA = 25°C and VBAT = 3.6 V (unless otherwise noted) PARAMETER VIT+ Positive-going battery voltage input at VCC VHYS Power-on reset hysteresis TEST CONDITIONS MIN TYP MAX 2.05 2.20 2.31 V 45 115 185 mV INTERNAL TEMPERATURE SENSOR CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER GTEMP TEST CONDITIONS MIN Temperature sensor voltage gain TYP MAX –2 UNIT mV/°C INTERNAL CLOCK OSCILLATORS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fOSC High Frequency Oscillator 8.389 MHz fLOSC Low Frequency Oscillator 32.768 kHz INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS VSR_IN Input voltage range, V(SRN) and V(SRP) VSR = V(SRN) – V(SRP) tSR_CONV Conversion time Single conversion Resolution VSR_OS Input offset INL Integral nonlinearity error 4 Submit Documentation Feedback MIN TYP –0.125 MAX UNIT 0.125 V 1 14 s 15 ±0.007 bits μV 10 ±0.034 %FSR Copyright © 2013, Texas Instruments Incorporated bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS (continued) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER ZSR_IN Effective input resistance ISR_LKG Input leakage current (1) (1) TEST CONDITIONS (1) MIN TYP MAX UNIT 2.5 MΩ μA 0.3 Assured by design. Not production tested. ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER VADC_IN Input voltage range tADC_CONV Conversion time TEST CONDITIONS Resolution TYP Input offset ZADC1 Effective input resistance (TS) ZADC2 Effective input resistance (BAT) (1) IADC_LKG Input leakage current (1) MAX UNIT 1 14 VADC_OS (1) MIN –0.2 V 125 ms 15 bits 1 (1) bq27510-G3 not measuring cell voltage mV 8 MΩ 8 MΩ bq27510-G3 measuring cell voltage 100 kΩ μA 0.3 Assured by design. Not production tested. DATA FLASH MEMORY CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS Data retention (1) tDR TYP MAX 10 Flash programming write-cycles (1) Word programming time ICCPROG) Flash-write supply current (1) UNIT Years 20,000 Cycles (1) tWORDPROG) (1) MIN 5 2 ms 10 mA Assured by design. Not production tested. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 5 bq27510-G3 SLUSAT1 – MARCH 2013 www.ti.com 400 kHz I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tr SCL/SDA rise time 300 ns tf SCL/SDA fall time 300 ns tw(H) SCL pulse width (high) 600 ns tw(L) SCL pulse width (low) 1.3 μs tsu(STA) Setup for repeated start 600 ns td(STA) Start to first falling edge of SCL 600 ns tsu(DAT) Data setup time 100 ns th(DAT) Data hold time 0 ns tsu(STOP) Setup time for stop tBUF Bus free time between stop and start fSCL Clock frequency 600 ns 66 μs 400 kHz 100 kHz I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER tr SCL/SDA rise time tf SCL/SDA fall time tw(H) SCL pulse width (high) tw(L) TEST CONDITIONS MIN TYP MAX 1 300 UNIT µs ns 4 µs SCL pulse width (low) 4.7 μs tsu(STA) Setup for repeated start 4.7 µs td(STA) Start to first falling edge of SCL 4 µs tsu(DAT) Data setup time 250 ns th(DAT) Data hold time tsu(STOP) Setup time for stop tBUF Bus free time between stop and start fSCL Clock frequency tBUSERR Bus error timeout tSU(STA) tw(H) Receive mode 0 Transmit mode 300 tf tw(L) ns 4 µs 4.7 μs 10 100 kHz 17.3 21.2 s tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr REPEATED START th(DAT) tsu(DAT) STOP START Figure 1. I2C-Compatible Interface Timing Diagrams 6 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 GENERAL DESCRIPTION The bq27510-G3 fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as time-to-empty (TTE) and state-of-charge (SOC) as well as SOC interrupt signal to the host. Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command( ), read and write information contained within the device control and status registers, as well as its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine, and can be executed during application development, system manufacture, or end-equipment operation. Cell information is stored in the device in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by either use of the fuel gauge companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known. The key to the fuel gauge high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-ofcharge predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery. The fuel gauge measures charge and discharge activity by monitoring the voltage across a small-value series sense resistor (5 mΩ to 20 mΩ, typical) located between the system VSS and the battery PACK– terminal. When a cell is attached to the device, cell impedance is learned, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions. The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient (NTC) thermistor with R25 = 10.0 kΩ ±1%. B25/85 = 3435 kΩ ± 1% (such as Semitec NTC 103AT). Alternatively, the fuel gauge can also be configured to use its internal temperature sensor or receive temperature data from the host processor. When an external thermistor is used, a 18.2-kΩ pull-up resistor between BI/TOUT and TS pins is also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality. To minimize power consumption, the fuel gauge has several power modes: NORMAL, SLEEP, HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. For complete operational details, refer to bq27510-G3 Technical Reference Manual. Formatting conventions used in this document: Information Type Formatting Convention Example Commands Italics with parentheses and no breaking spaces RemainingCapacity( ) command NVM Data Italics, bold, and breaking spaces Design Capacity data Register bits and flags Brackets and italics [TDA] bit NVM Data bits Brackets, italics, and bold [LED1] bit Modes and states ALL CAPITALS UNSEALED mode Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 7 bq27510-G3 SLUSAT1 – MARCH 2013 www.ti.com DATA COMMANDS STANDARD DATA COMMANDS The bq27510-G3 fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 1. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. Additional options for transferring data are described in Section of COMMUNICATIONS. Standard commands are accessible in NORMAL operation. Read and write permissions depend on the active access mode, SEALED or UNSEALED. Additional details are found in the bq27510-G3 Technical Reference Manual. Table 1. Standard Commands COMMAND CODE UNITS SEALED ACCESS Control( ) 0x00 / 0x01 N/A R/W AtRate( ) 0x02 / 0x03 mA R/W AtRateTimeToEmpty( ) 0x04 / 0x05 Minutes R Temperature( ) 0x06 / 0x07 0.1 K R/W Voltage( ) 0x08 / 0x09 mV R Flags( ) 0x0a / 0x0b N/A R NominalAvailableCapacity( ) 0x0c / 0x0d mAh R FullAvailableCapacity( ) 0x0e / 0x0f mAh R RemainingCapacity( ) 0x10 / 0x11 mAh R FullChargeCapacity( ) 0x12 / 0x13 mAh R AverageCurrent( ) 0x14 / 0x15 mA R TimeToEmpty( ) 0x16 / 0x17 Minutes R StandbyCurrent( ) 0x18 / 0x19 mA R StandbyTimeToEmpty( ) 0x1a/ 0x1b Minutes R StateOfHealth( ) 0x1c / 0x1d % / num R CycleCount( ) 0x1e/ 0x1f num R StateOfCharge( ) 0x20/ 0x21 % R InstantaneousCurrent( ) 0x22 / 0x23 mA R InternalTemperature( ) 0x28 / 0x29 0.1 K R ResistanceScale( ) 0x2a / 0x2b OperationConfiguration( ) 0x2c/ 0x2d N/A R DesignCapacity( ) 0x2e / 0x2f mAh R NAME 8 Submit Documentation Feedback R Copyright © 2013, Texas Instruments Incorporated bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 Control( ): 0x00/0x01 Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control( ) command allows the system to control specific features of the fuel gauge during normal operation and additional features when the device is in different access modes, as described in Table 2. Additional details are found in the bq27510-G3 Technical Reference Manual. Table 2. Control( ) Subcommands CNTL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes Reports the status of DF checksum, hibernate, IT, etc. DEVICE_TYPE 0x0001 Yes Reports the device type (for example: 0x0520) FW_VERSION 0x0002 Yes Reports the firmware version on the device type PREV_MACWRITE 0x0007 Yes Returns previous Control( ) subcommand code CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration OCV_CMD 0x000C Yes Requests the fuel gauge to take an OCV measurement BAT_INSERT 0x000D Yes Forces Flags( ) [BAT_DET] bit set when OpConfig B [BIE] = 0 BAT_REMOVE 0x000E Yes Forces Flags( ) [BAT_DET] bit clear when OpConfig B [BIE] = 0 SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1 CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0 SET_SLEEP+ 0x0013 Yes Forces CONTROL_STATUS [SNOOZE] to 1 CLEAR_SLEEP+ 0x0014 Yes Forces CONTROL_STATUS [SNOOZE] to 0 DF_VERSION 0x001F Yes Returns the Data Flash Version code SEALED 0x0020 No Places the fuel gauge in SEALED access mode IT_ENABLE 0x0021 No Enables the Impedance Track™ (IT) algorithm RESET 0x0041 No Forces a full reset of the fuel gauge CNTL FUNCTION Copyright © 2013, Texas Instruments Incorporated DESCRIPTION Submit Documentation Feedback 9 bq27510-G3 SLUSAT1 – MARCH 2013 www.ti.com FUNCTIONAL DESCRIPTION FUEL GAUGING The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge monitors charge and discharge activity by sensing the voltage across a small-value (5 mΩ to 20 mΩ typ.) resistor between the SRP and SRN pins and in series with the cell. By integrating charge passing through the battery, the battery’s SOC is adjusted during battery charge or discharge. The total battery capacity is found by comparing states of charge before and after applying the load with the amount of charge passed. When an application load is applied, the impedance of the cell is measured by comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load. Measurements of OCV and charge integration determine chemical state of charge and chemical capacity (Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the batteryimpedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature. FullChargeCapacity() is reported as capacity available from a fully charged battery under the present load and temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and FullChargeCapacity() respectively. The fuel gauge has two flags accessed by the Flags() function that warns when the battery’s SOC has fallen to critical levels. When StateOfCharge() falls below the first capacity threshold, specified in SOC1 Set Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once StateOfCharge() rises above SOC1 Clear Threshold. The fuel gauge’s GPOUT pin puts out 3 pulses 10ms wide and in 10ms intervals whenever the SOC1 flag is set. This flag is enabled when RMC_IND bit in Operation Configuration B is set. This behavior also applies to the [SOCF] (State of Charge Final) flag. When Voltage( ) falls below the system shut down threshold voltage, SysDown Set Volt Threshold, the [SYSDOWN] flag is set, serving as a final warning to shut down the system. The GPOUT also signals. When Voltage( ) rises above SysDown Clear Voltage and the [SYSDOWN] flag has already been set, the [SYSDOWN] flag is cleared. The GPOUT also signals such change. All units are in mV. Additional details are found in the bq27510-G3 Technical Reference Manual 10 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 COMMUNICATIONS I2C Interface The bq27510-G3 fuel gauge supports the standard I2C read, incremental read, quick read, one byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8-bits of the I2C protocol is, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). The “quick read” returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data) The following command sequences are not supported: Attempt to write a read-only address (NACK after data sent by master): Attempt to read an address above 0x6B (NACK command): I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge was holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 11 bq27510-G3 SLUSAT1 – MARCH 2013 www.ti.com I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus free waiting time must be inserted between all packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand the reading the status result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host should not issue all standard commands more than two times per second. Otherwise, the fuel gauge could result in a reset issue due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL £ 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A S ADDR [6:0] 0 A CMD [7:0] A Sr DATA [7:0] ADDR [6:0] A 1 A DATA [7:0] A P DATA [7:0] A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL £ 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr N P ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (BAT INSERT CHECK, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of Data Flash are updated. The following table summarizes the approximate clock stretch duration for various fuel gauge operating conditions. Approximate Duration Gauging Mode Operating Condition or Comment SLEEP HIBERNATE Clock stretch occurs at the beginning of all traffic as the device wakes up. ≤ 4 ms BAT INSERT CHECK, NORMAL Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit). ≤ 4 ms Normal Ra table Data Flash updates. 24 ms 12 Data Flash block writes. 72 ms Restored Data Flash block write after loss of power. 116 ms End of discharge Ra table Data Flash update. 144 ms Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated bq27510-G3 www.ti.com SLUSAT1 – MARCH 2013 REFERENCE SCHEMATICS SCHEMATIC bq27510DRZ GPOUT GPOUT Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) BQ27510DRZR-G3 ACTIVE SON DRZ 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 7510 BQ27510DRZT-G3 ACTIVE SON DRZ 12 250 TBD Call TI Call TI -40 to 85 BQ 7510 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. 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