bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Single Cell Li-Ion Battery Fuel Gauge with Integrated Protection Check for Samples: bq27741-G1 FEATURES 1 • 23 • • • • Battery Fuel Gauge and Protector for 1-Series Li-Ion Applications Microcontroller Peripheral Provides: – Accurate Battery Fuel Gauging Supports up to 32 Ahr – External and Internal Temperature Sensors for Battery Temperature Reporting – Precision 16-bit High-Side Coulomb Counter with High-Side Low-Value Sense Resistor (5 mΩ to 20 mΩ) – Lifetime and Current Data Logging – 64 Bytes of Non-Volatile Scratch Pad Flash – SHA-1/HMAC Authentication Battery Fuel Gauging Based on Patented Impedance Track™ Technology – Models Battery Discharge Curve for Accurate Time-To-Empty Predictions – Automatically Adjusts for Aging, SelfDischarge, and Temperature- and RateInduced Effects on Battery Advanced Fuel Gauging Features – Internal Short Detection – Tab Disconnection Detection Safety and Protection: – Over- and Undervoltage Protection with Brown-out Low-Power Mode – Overcharging and Discharging Current Protection – Overtemperature Protection – Short-Circuit Protection – Low-Voltage Notification • • – Voltage Doubler to Support High-side NFET Protection HDQ and I2C™ Interface Formats for Communication With Host System Small 15-ball NanoFree™ (CSP) Packaging APPLICATIONS • • • • • Smartphones PDAs Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players DESCRIPTION The Texas Instruments bq27741-G1 Li-Ion battery fuel gauge is a microcontroller peripheral that provides fuel gauging for single-cell Li-Ion battery packs. The device requires little system microcontroller firmware development for accurate battery fuel gauging. The fuel gauge resides within the battery pack or on the system’s main board with an embedded battery (non-removable). The fuel gauge provides hardware-based overand undervoltage, overcurrent in charge or discharge, and short-circuit protections. The fuel gauge uses the patented Impedance Track™ algorithm for fuel gauging, and provides information such as remaining battery capacity (mAh), state-of-charge (%), run-time to empty (minimum), battery voltage (mV), and temperature (°C), as well as recording vital parameters throughout the lifetime of the battery. The CSP is a 15-ball package (2.776 mm x 1.96 mm) that is ideal for space-constrained applications. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track, NanoFree are trademarks of Texas Instruments. I2C is a trademark of NXP B.V. Corp Netherlands. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com DEVICE INFORMATION bq27741 PIN DIAGRAM (TOP VIEW) CSP-15 (BOTTOM VIEW) CSP-15 (TOP VIEW) A3 B3 C3 D3 E3 E3 D3 C3 B3 A3 A2 B2 C2 D2 E2 E2 D2 C2 B2 A2 A1 B1 C1 D1 E1 E1 D1 C1 B1 A1 BOTTOM VIEW SCL RC2 SDA PACKP DSG 3 TS HDQ BAT RA0 CHG 2 REG25 VSS VPWR SRN SRP 1 E D C B A Table 1. Terminal Functions TERMINAL (1) 2 TYPE (1) DESCRIPTION PIN NAME A1 SRP IA Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK+ connection. Connect to sense resistor. A2 CHG O External high side N-channel charge FET driver. A3 DSG O External high side N-channel discharge FET driver. B1 SRN IA Analog input pin connected to the internal coulomb counter where SRN is nearest the CELL+ connection. Connect to sense resistor. B2 RA0 IO General Purpose IO. Open-drain I/O. B3 PACKP IA Pack voltage measurement input for protector operation. C1 VPWR P Power input. Decouple with 0.1-µF ceramic capacitor to VSS. C2 BAT IA Cell-voltage measurement input. ADC input. C3 SDA IO Slave I2C serial communications data line for communication with system. Open-drain I/O. Use with 10-kΩ pullup resistor (typical). D1 VSS P Device ground. D2 HDQ IO HDQ serial communications line. Open-drain. D3 RC2 IO General purpose IO. Push-pull output. E1 REG25 P Regulator output and bq27741-G1 processor power. Decouple with 1.0-µF ceramic capacitor to VSS. E2 TS IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input. E3 SCL IO Slave I2C serial communications clock input line for communication with system. Use with 10-kΩ pullup resistor (typical). IO = Digital input-output, IA = Analog input, P = Power connection, O = Output Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Table 2. Default Configuration OVERVOLTAGE PROTECTION (VOVP) UNDERVOLTAGE PROTECTION (VUVP) OVERCURRENT IN DISCHARGE (VOCD) OVERCURRENT IN CHARGE (VOCC) SHORT CIRCUIT IN DISCHARGE (Vscd) 4.390 V 2.407 V 34.4 mV 20 mV 74.6 mV OVERVOLTAGE PROTECTION DELAY (tOVP) UNDERVOLTAGE PROTECTION DELAY (tUVP) OVERCURRENT IN DISCHARGE DELAY (tOCD) OVERCURRENT IN CHARGE DELAY (tOCC) SHORT CIRCUIT IN DISCHARGE DELAY (tscd) 1s 31.25 ms 31.25 ms 7.8125 ms 312.5 µs THERMAL INFORMATION THERMAL METRIC (1) bq27741-G1 YZF (15 PINS) θJA Junction-to-ambient thermal resistance 70 θJCtop Junction-to-case (top) thermal resistance 17 θJB Junction-to-board thermal resistance 20 ψJT Junction-to-top characterization parameter 1 ψJB Junction-to-board characterization parameter 18 θJCbot Junction-to-case (bottom) thermal resistance NA (1) UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 3 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX VVPWR Power input range PARAMETER –0.3 5.5 V VREG25 Supply voltage range –0.3 2.75 V VPACKP PACKP input pin –0.3 5.5 V PACK+ input when external 2-kΩ resistor is in series with PACKP input pin (see Reference Schematics) –0.3 28 V VOUT Voltage output pins (DSG, CHG) –0.3 10 V VIOD1 Push-pull IO pins (RC2) –0.3 2.75 V VIOD2 Open-drain IO pins (SDA, SCL, HDQ, RA0) –0.3 5.5 V VBAT BAT input pin –0.3 5.5 V VI Input voltage range to all other pins (SRP, SRN) –0.3 5.5 V VTS Input voltage range for TS –0.3 2.75 V ESD Human Body Model (HBM), all pins TA Operating free-air temperature range –40 85 °C TF Functional temperature range –40 100 °C TSTG Storage temperature range –65 150 °C (1) 4 2 UNIT kV Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Recommended Operating Conditions TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER VVPWR Supply voltage TEST CONDITION No operating restrictions No FLASH writes CVPWR External input capacitor for internal LDO between VPWR and VSS CREG25 External output capacitor for internal LDO between REG25 and VSS ICC Normal operating mode current (1) (2) (VPWR) ISLP NOM MAX 2.8 5.0 2.45 2.8 UNIT V 0.1 µF 1.0 µF Fuel gauge in NORMAL mode. ILOAD > Sleep Current with charge pumps on (FETs on) 167 µA SLEEP mode current (1) (2) (VPWR) Fuel gauge in SLEEP+ mode. ILOAD < Sleep Current with charge pumps on (FETs on) 88 µA IFULLSLP FULLSLEEP mode current (1) (2) (VPWR) Fuel gauge in SLEEP mode. ILOAD < Sleep Current with charge pumps on (FETs on) 40 µA ISHUTDOWN Shutdown mode current (1) (2) (VPWR) Fuel gauge in SHUTDOWN mode. UVP tripped with fuel gauge and protector turned off (FETs off) VVPWR = 2.5 V TA = 25°C 0.1 VOL Output voltage low (SCL, SDA, HDQ, RA0, RC2) VOH(OD) Output voltage high (SDA, SCL, HDQ, RA0, RC2) External pullup resistor connected to VREG25 VIL Input voltage low (SDA, SCL, HDQ, RA0) –0.3 0.6 V VIH(OD) Input voltage high (SDA, SCL, HDQ, RA0) 1.2 5.5 V VA1 Input voltage range (TS) VSS – 0.125 2 V VA2 Input voltage range (BAT) VSS – 0.125 5 V VA3 Input voltage range (SRP, SRN) VVPWR – 0.125 VVPWR + 0.125 V Ilkg Input leakage current (I/O pins) tPUCD Power-up communication delay (1) (2) Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. MIN 0.47 0.2 µA TA = –40°C to 85°C 0.5 µA IOL = 1 mA 0.4 V VREG25 – 0.5 V 0.3 250 µA ms All currents are specified as charge pump on (FETs on). All currents are continuous average over 5-second period. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 5 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Power-On Reset TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Increasing battery voltage input at VREG25 VHYS Power-on reset hysteresis MIN TYP MAX UNIT 2.09 2.20 2.31 V 45 115 185 mV MIN TYP MAX 2.3 2.5 2.6 2.5-V LDO Regulator (1) TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS 2.8 V ≤ VVPWR ≤ 4.5 V, IOUT (1) ≤ 16 mA VREG25 ISHORT (1) (2) Regulator output voltage (2) Short-circuit current limit 2.45 V ≤ VVPWR < 2.8 V (low battery), IOUT (1) ≤ 3 mA TA = –40°C to 85°C 2.3 V V TA = –40°C to 85°C VREG25 = 0 V UNIT 250 mA TYP MAX UNIT 2.7 3.0 LDO output current, IOUT, is the sum of internal and external load currents. Assured by characterization. Not production tested. Charger Attachment and Removal Detection TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER VCHGATT TEST CONDITIONS MIN Voltage threshold for charger attachment detection VCHGREM Voltage threshold for charger removal detection 0.5 1.0 V V Voltage Doubler TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 2 × VVPWR – 0.4 2 × VVPWR – 0.2 2 × VVPWR UNIT VFETON CHG and DSG FETs on IL = 1 µA TA = –40°C to 85°C VFETOFF CHG and DSG FETs off TA = –40°C to 85°C 0.2 V VFETRIPPLE (1) CHG and DSG FETs on IL = 1 µA TA = –40°C to 85°C 0.1 VPP tFETON FET gate rise time (10% to 90%) CL = 4 nF TA = –40°C to 85°C No series resistance 67 140 218 μs tFETOFF FET gate fall time (90% to 10%) CL = 4 nF TA = –40°C to 85°C No series resistance 10 30 60 μs (1) 6 V Assured by characterization. Not production tested. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Overvoltage Protection (OVP) TA = 25°C and CREG25 = 1.0 µF (unless otherwise noted) PARAMETER VOVP VOVPREL tOVP OVP detection voltage threshold OVP release voltage OVP delay time TEST CONDITIONS MIN TYP MAX TA = 25°C VOVP – 0.006 VOVP VOVP + 0.006 TA = 0°C to 25°C VOVP – 0.023 VOVP VOVP + 0.020 TA = 25°C to 50°C VOVP – 0.018 VOVP VOVP + 0.014 TA = –40°C to 85°C VOVP – 0.053 VOVP VOVP + 0.035 TA = 25°C VOVPREL – 0.012 VOVP – 0.215 VOVPREL + 0.012 TA = 0°C to 25°C VOVPREL – 0.023 VOVP – 0.215 VOVPREL + 0.020 TA = 25°C to 50°C VOVPREL – 0.018 VOVP – 0.215 VOVPREL + 0.014 TA = –40°C to 85°C VOVPREL – 0.053 VOVP – 0.215 VOVPREL + 0.035 TA = –40°C to 85°C tOVP – 5% tOVP tOVP + 5% UNIT V V s Undervoltage Protection (UVP) TA = 25°C and CREG25 = 1.0 µF (unless otherwise noted) PARAMETER VUVP VUVPREL tUVP UVP detection voltage threshold UVP release voltage UVP delay time MIN TYP MAX TA = 25°C TEST CONDITIONS VUVP – 0.012 VUVP VUVP + 0.012 TA = –5°C to 50°C VUVP – 0.020 VUVP VUVP + 0.020 TA = –40°C to 85°C VUVP – 0.040 VUVP VUVP + 0.040 TA = 25°C VUVPREL – 0.012 VUVP + 0.105 VUVPREL + 0.012 TA = –5°C to 50°C VUVPREL – 0.020 VUVP + 0.105 VUVPREL + 0.020 TA = –40°C to 85°C VUVPREL – 0.040 VUVP + 0.105 VUVPREL + 0.040 TA = –40°C to 85°C tUVP – 5% tUVP tUVP + 5% MIN TYP MAX VOCD – 3 VOCD VOCD + 3 TA = –20°C to 60°C VSRN – VSRP VOCD – 3.785 VOCD VOCD + 3.785 TA = –40°C to 85°C VSRN – VSRP VOCD – 4.16 VOCD VOCD + 4.16 TA = –40°C to 85°C tOCD – 5% tOCD tOCD + 5% UNIT V V ms Overcurrent in Discharge (OCD) TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER VOCD tOCD OCD detection voltage threshold OCD delay time TEST CONDITIONS TA = 25°C VSRN – VSRP UNIT mV ms Overcurrent in Charge (OCC) TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER VOCC tOCC OCC detection voltage threshold OCC delay time TEST CONDITIONS MIN TYP MAX VOCC – 3 VOCC VOCC + 3 TA = –20°C to 60°C VSRP – VSRN VOCC – 3.49 VOCC VOCC + 3.49 TA = –40°C to 85°C VSRP – VSRN VOCC – 3.86 VOCC VOCC + 3.86 TA = –40°C to 85°C tOCC – 5% tOCC tOCC + 5% TA = 25°C VSRP – VSRN Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 UNIT mV ms 7 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Short-Circuit in Discharge (SCD) TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER VSCD tSCD SCD detection voltage threshold SCD delay time TEST CONDITIONS MIN TYP MAX VSCD – 3 VSCD VSCD + 3 TA = –20°C to 60°C VSRN – VSRP VSCD – 4.5 VSCD VSCD + 4.5 TA = –40°C to 85°C VSRN – VSRP VSCD – 4.9 VSCD VSCD + 4.9 TA = –40°C to 85°C tSCD – 10% tSCD tSCD + 10% TA = 25°C VSRN – VSRP UNIT mV µs Low Voltage Charging TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted) PARAMETER VLVDET TEST CONDITIONS Voltage threshold for low-voltage charging detection TA = –40°C to 85°C MIN TYP MAX 1.4 1.55 1.7 MIN TYP MAX UNIT V Internal Temperature Sensor Characteristics TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V PARAMETER G(TEMP) TEST CONDITIONS Temperature sensor voltage gain –2 UNIT mV/°C High-Frequency Oscillator 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER fOSC Frequency error (1) fEIO (1) (2) (3) (2) Start-up time (3) tSXO TEST CONDITIONS MIN Operating frequency TYP MAX 8.389 MHz TA = 0°C to 60°C –2.0% 0.38% 2.0% TA = –20°C to 70°C –3.0% 0.38% 3.0% TA = –40°C to 85°C -4.5% 0.38% 4.5% 2.5 5 TA = –40°C to 85°C UNIT ms The frequency error is measured from 2.097 MHz. The frequency drift is included and measured from the trimmed frequency at VREG25 = 2.5 V, TA = 25°C. The startup time is defined as the time it takes for the oscillator output frequency to be ±3% of the typical oscillator frequency. Low-Frequency Oscillator 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER f(LOSC) f(LEIO) t(LSXO) (1) (2) (3) 8 TEST CONDITIONS MIN Operating frequency Frequency error (1) (2) Start-up time (3) TYP MAX 32.768 kHz TA = 0°C to 60°C –1.5% 0.25% 1.5% TA = –20°C to 70°C –2.5% 0.25% 2.5% TA = –40°C to 85°C -4.0% 0.25% 4.0% TA = –40°C to 85°C UNIT 500 μs The frequency drift is included and measured from the trimmed frequency at VREG25 = 2.5 V, TA = 25°C. The frequency error is measured from 32.768 kHz. The startup time is defined as the time it takes for the oscillator output frequency to be ±3% of the typical oscillator frequency. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Integrating ADC (Coulomb Counter) Characteristics TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS VSR_IN Input voltage range, VSRN and VSRP VSR = VSRN – VSRP tSR_CONV Conversion time MIN VVPWR – 0.125 MAX Input offset INL Integral nonlinearity error ZSR_IN Effective input resistance (1) ISR_LKG Input leakage current (1) V 1 s 14 VSR_OS UNIT VVPWR + 0.125 Single conversion Resolution (1) TYP 15 bits μV 10 ±0.007 ±0.034 %FSR 7 MΩ μA 0.3 Assured by design. Not production tested. ADC (Temperature and Cell Voltage) Characteristics TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER VADC_IN tADC_CONV TEST CONDITIONS VSS – 0.125 Input voltage range (other channels) VSS – 0.125 TYP Input offset ZADC1 Effective input resistance (TS) ZADC2 Effective input resistance (BAT) (1) IADC_LKG Input leakage current (1) UNIT V 1 14 VADC_OS MAX 5 Conversion time Resolution (1) MIN Input voltage range (VBAT channel) V 125 ms 15 bits 1 (1) Not measuring cell voltage mV 55 MΩ 55 MΩ Measuring cell voltage 100 kΩ μA 0.3 Assured by design. Not production tested. Data Flash Memory Characteristics TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS Data retention (1) tDR Flash programming write-cycles TYP Word programming time ICCPROG Flash-write supply current (1) MAX UNIT 10 years 20,000 cycles (1) tWORDPROG (1) (1) MIN 5 2 ms 10 mA Assured by design. Not production tested. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 9 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com I2C-Compatible Interface Timing Characteristics TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tR SCL or SDA rise time 300 ns tF SCL or SDA fall time 300 ns tw(H) SCL pulse width (high) 600 ns tw(L) SCL pulse width (low) 1.3 μs tsu(STA) Setup for repeated start 600 ns td(STA) Start to first falling edge of SCL 600 ns tsu(DAT) Data setup time 100 ns th(DAT) Data hold time 0 ns tsu(STOP) Setup time for stop tBUF Bus free time between stop and start fSCL Clock frequency 600 ns 66 μs 400 tSU(STA) tw(H) tf tw(L) tr kHz t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 1. I2C-Compatible Interface Timing Diagrams 10 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 HDQ Communication Timing Characteristics TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 205 250 μs μs t(CYCH) Cycle time, host to fuel gauge 190 t(CYCD) Cycle time, fuel gauge to host 190 t(HW1) Host sends 1 to fuel gauge 0.5 50 μs t(DW1) Fuel gauge sends 1 to host 32 50 μs t(HW0) Host sends 0 to fuel gauge 86 145 μs t(DW0) Fuel gauge sends 0 to host 80 145 μs t(RSPS) Response time, fuel gauge to host 190 950 μs t(B) Break time 190 t(BR) Break recovery time 40 t(RST) HDQ reset 1.8 t(RISE) HDQ line rise time to logic 1 (1.2 V) μs μs 2.2 s 950 ns 1.2V t(RISE) t(BR) t(B) (b) HDQ line rise time (a) Break and Break Recovery t(DW1) t(HW1) t(DW0) t(CYCD) t(HW0) t(CYCH) (d) Gauge Transmitted Bit (c) Host Transmitted Bit Break 7-bit address 1-bit 8-bit data R/W t(RSPS) (e) Gauge to Host Response t(RST) (f) HDQ Reset Figure 2. Timing Diagrams (a) (b) (c) (d) (e) (f) HDQ Breaking Rise time of HDQ line HDQ Host to fuel gauge communication Fuel gauge to Host communication Fuel gauge to Host response format HDQ Host to fuel gauge reset Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 11 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com FEATURE SET The bq27741-G1 fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-of-charge (SOC), time-to-empty (TTE), and time-to-full (TTF). Configuration Cell information is stored in the fuel gauge in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by either use of the companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known. The fuel gauge provides 96 bytes of user-programmable data flash memory, partitioned into three 32-byte blocks: Manufacturer Info Block A and Manufacturer Info Block B. This data space is accessed through a data flash interface. Fuel Gauging The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery. See application note SLUA364B, Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm, for further details. Power Modes To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, and FULLSLEEP. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. NORMAL Mode The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent( ), Voltage( ), and Temperature( ) measurements are taken, and the interface data set is updated. Decisions to change states are also made. This mode is exited by activating a different power mode. Because the fuel gauge consumes the most power in NORMAL mode, the Impedance Track™ algorithm minimizes the time the fuel gauge remains in this mode. SLEEP Mode SLEEP mode performs AverageCurrent(), Voltage(), and Temperature() less frequently which results in reduced power consumption. SLEEP mode is entered automatically if the feature is enabled (Pack Configuration [SLEEP] = 1) and AverageCurrent( ) is below the programmable level Sleep Current. Once entry into SLEEP mode has been qualified, but prior to entering it, the fuel gauge performs an ADC autocalibration to minimize offset. During the SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition. The fuel gauge exits SLEEP if any entry condition is broken, specifically when either: • AverageCurrent( ) rises above Sleep Current, or • A current in excess of IWAKE through RSENSE is detected. 12 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 FULLSLEEP Mode FULLSLEEP mode turns off the high-frequency oscillator and performs AverageCurrent(), Voltage(), and Temperature() less frequently which results in power consumption that is lower than that of the SLEEP mode. FULLSLEEP mode can be enabled by two methods: • Setting the [FULLSLEEP] bit in the Control Status register using the FULL_SLEEP subcommand and Full Sleep Wait Time (FS Wait) in data flash is set as 0. • Setting the Full Sleep Wait Time (FS Wait) in data flash to a number larger than 0. This method is disabled when the FS Wait is set as 0. FULLSLEEP mode is entered automatically when it is enabled by one of the methods above. When the first method is used, the gauge enters the FULLSLEEP mode when the fuel gauge is in SLEEP mode. When the second method is used, the FULLSLEEP mode is entered when the fuel gauge is in SLEEP mode and the timer counts down to 0. The fuel gauge exits the FULLSLEEP mode when there is any communication activity. Therefore, the execution of SET_FULLSLEEP sets the [FULLSLEEP] bit. The FULLSLEEP mode can be verified by measuring the current consumption of the gauge. During FULLSLEEP mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition. The fuel gauge exits SLEEP if any entry condition is broken, specifically when either: • AverageCurrent( ) rises above Sleep Current, or • A current in excess of IWAKE through RSENSE is detected. While in FULLSLEEP mode, the fuel gauge can suspend serial communications by as much as 4 ms by holding the comm line(s) low. This delay is necessary to correctly process host communication, because the fuel gauge processor is mostly halted in SLEEP mode. Battery Protector Description The battery protector controls two external high-side N-channel FETs in a back-to-back configuration for battery protection. The protector uses two voltage doublers to drive the CHG and DSG FETs on. High-Side NFET Charge and Discharge FET Drive The CHG or DSG FET is turned on by pulling the FET gate input up to VFETON. The FETs are turned off by pulling the FET gate input down to VSS. These FETs are automatically turned off by the protector based on the detected protection faults, or when commanded to turn off via the FETTest(0x74/0x75) extended command. Once the protection fault(s) is cleared, the FETs may be turned on again. Operating Modes The battery protector has several operating modes: • Virtual shutdown mode – Analog shutdown – Low voltage charging • UVP fault (POR state) • Normal mode • Shutdown wait • OCD or SCD fault mode • OCC fault mode • OVP fault mode The relationships among these modes are shown in Figure 3. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 13 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com UVP Fault (POR State) CHG FET on DSG FET off Fuel Gauge on LDO is on EL PR Normal W V VP OCC Fault CHG FET off DSG FET on Fuel Gauge on LDO on Fuel Gauge in Normal, SLEEP, FULLSLEEP Modes CHG FET on DSG FET on Fuel Gauge on LDO is on (VSRP – VSRN) > VOCC Fault recovery: Charger removed R UV >V R <V P UV FW(ROM) turns FETs off briefly PW VV POR (Force UVP set) Low Voltage Charging (VSRN – VSRP) > VOCD OR (VSRN – VSRP) > VSCD Charger removed VVPWR > VOVP Fault recovery: load removed Shutdown bit cleared Charger removed Shutdown Bit set VVPWR < VOVPREL AND Fault recovery: Charger removed OCD/SCD Fault CHG FET on DSG FET off Fuel Gauge on LDO on CHG FET control shorted to PACKP pin DSG FET off Protection off Fuel Gauge off LDO is off Charger attached AND VVPWR>VLVDET Analog Shutdown Shutdown Wait OVP Fault CHG FET off DSG FET on Fuel Gauge on LDO on CHG FET off DSG FET off Fuel Gauge on Charger removed LDO is on CHG FET off DSG FET off Fuel Gauge off LDO is off Virtual Shutdown Figure 3. Operating Modes Virtual Shutdown Mode In this mode, the fuel gauge is not functional and only certain portions of analog circuitry are running to allow device wakeup from shutdown and low voltage charging. Analog Shutdown Mode In this mode, the fuel gauge is not functional. Once the charger is connected, the fuel gauge determines if low voltage charging is allowed and then transitions to low voltage charging. Low Voltage Charging Mode In this mode, the fuel gauge closes CHG FET by shorting the gate to PACKP pin. Low voltage charging continues until the cell voltage (VVPWR) rises above the POR threshold. Undervoltage Fault Mode In this mode, the voltage on VPWR pin is below VUVP and the charger is connected. As soon as the charger disconnects, the fuel gauge transitions into Analog Shutdown Mode to save power. The fuel gauge can enter this mode from Low Voltage Charging Mode when the battery pack is being charged from a deeply discharged state or from Normal Mode when the battery pack is being discharged below the allowed voltage. 14 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 When the battery pack is charged above VUVPREL, the fuel gauge transitions to Normal Mode. Normal Mode In this mode, the protector is fully powered and operational. Both CHG and DSG FETs are closed, while further operation is determined by the firmware. Protector is continuously checking for all faults. The CHG or DSG FET may be commanded to be opened via the protector register by the firmware, but it does not affect protector operation nor changes the mode of operation. Firmware can also command the fuel gauge to go into shutdown mode based on the command from the host. In this case, firmware sets the Shutdown bit to indicate intent to go into shutdown mode. The fuel gauge then transitions to Shutdown Wait Mode. Shutdown Wait Mode In this mode, the shutdown bit was set by the firmware and the fuel gauge initiated the shutdown sequence. The shutdown sequence: 1. Open both CHG and DSG FETs 2. Determine if any faults are set. If any faults are set, then go back to Normal Mode. 3. Wait for charger removal. Once the charger is removed, turn off the LDO, which puts the fuel gauge into Analog Shutdown Mode. Overcurrent Discharge (OCD) and Short-Circuit Discharge (SCD) Fault Mode In this mode, a short-circuit discharge (SCD) or overcurrent discharge (OCD) protection fault is detected when the voltage across the sense resistor continuously exceeds the configured VOCD or VSCD thresholds for longer than the configured delay. The fuel gauge enables the fault removal detection circuitry, which monitors load removal. A special high resistance load is switched in to monitor load presence. The OCD/SCD fault is cleared when the load is removed, which causes the fuel gauge to transition into Normal Mode. Overcurrent Charge (OCC) Fault Mode In this mode, an overcurrent charge (OCC) protection fault is detected when the voltage across the sense resistor continuously exceeds the configured VOCC for longer than the configured delay. The fuel gauge enables the fault removal detection circuitry, which monitors the charger removal. The OCC fault is cleared once the charger voltage drops below the cell voltage by more than 300 mV, which causes the fuel gauge to transition to Normal Mode. Overvoltage Protection (OVP) Fault Mode In this mode, an overvoltage protection (OVP) fault mode is entered when the voltage on VPWR pin continuously exceeds the configured VOVP threshold for longer than the configured delay. The fuel gauge enables the fault removal detection circuitry, which monitors the charger removal. The OVP fault is cleared once the charger voltage drops below the cell voltage by more than 300 mV and the cell voltage drops below VOVPREL, which causes the fuel gauge to transition to Normal Mode. Firmware Control of Protector The firmware has control to open the CHG FET or DSG FET independently by overriding hardware control. However, it has no control to close the CHG FET or DSG FET and can only disable the FET override. Overtemperature Fault Mode Overtemperature protection is implemented in firmware. Gauging firmware monitors temperature every second and will open both CHG and DSG FETs if Temperature() > OT Prot Threshold for OT Prot Delay. CHG and DSG FETs override will be released when Temperature() < OT Prot Recover. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 15 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Wake-Up Comparator The wake-up comparator indicates a change in cell current while the fuel gauge is in SLEEP mode. Wake comparator threshold can be configured in firmware and set to the thresholds in Table 3. An internal event is generated when the threshold is breached in either charge or discharge directions. Table 3. IWAKE Threshold Settings(1) RSNS1 RSNS0 IWAKE Vth(SRP-SRN) 0 0 0 Disabled 0 0 1 Disabled 0 1 0 1.0 mV or –1.0 mV 0 1 1 2.2 mV or –2.2 mV 1 0 0 2.2 mV or –2.2 mV 1 0 1 4.6 mV or –4.6 mV 1 1 0 4.6 mV or –4.6 mV 1 1 1 9.8 mV or –9.8 mV (1) The actual resistance value versus the setting of the sense resistor is not important just the actual voltage threshold when calculating the configuration. The voltage thresholds are typical values under room temperature. Battery Parameter Measurements Charge and Discharge Counting The integrating delta-sigma ADC measures the charge or discharge flow of the battery by measuring the voltage drop across a small-value sense resistor between the SRP and SRN pins. The integrating ADC measures bipolar signals and detects charge activity when VSR = VSRP – VSRN is positive and discharge activity when VSR = VSRP – VSRN is negative. The fuel gauge continuously integrates the signal over time using an internal counter. Voltage The fuel gauge updates cell voltages at 1-second intervals when in NORMAL mode. The internal ADC of the fuel gauge measures the voltage, and scales and calibrates it appropriately. Voltage measurement is automatically compensated based on temperature. This data is also used to calculate the impedance of the cell for Impedance Track™ fuel gauging. Current The fuel gauge uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current using a 5-mΩ to 20-mΩ typical sense resistor. Auto-Calibration The fuel gauge provides an auto-calibration feature to cancel the voltage offset error across SRN and SRP for maximum charge measurement accuracy. The fuel gauge performs auto-calibration before entering the SLEEP mode. Temperature The fuel gauge external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient (NTC) thermistor with R25 = 10 kΩ ± 1% and B25/85 = 3435 kΩ ± 1% (such as Semitec 103AT for measurement). The fuel gauge can also be configured to use its internal temperature sensor. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality. 16 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 NOTE Formatting Conventions in This Document: Commands: italics with parentheses and no breaking spaces, for example, RemainingCapacity( ). Data Flash: italics, bold, and breaking spaces, for example, Design Capacity. Register Bits and Flags: brackets only, for example, [TDA] Data Flash Bits: italic and bold, for example, [XYZ1] Modes and states: ALL CAPITALS, for example, UNSEALED mode. Communications HDQ Single-Pin Serial Interface The HDQ interface is an asynchronous return-to-one protocol where a processor sends the command code to the fuel gauge. With HDQ, the least significant bit (LSB) of a data byte (command) or word (data) is transmitted first. The DATA signal on pin 12 is open-drain and requires an external pullup resistor. The 8-bit command code consists of two fields: the 7-bit HDQ command code (bits 0 through 6) and the 1-bit RW field (MSB bit 7). The RW field directs the fuel gauge either to: • Store the next 8 bits of data to a specified register, or • Output 8 bits of data from the specified register The HDQ peripheral can transmit and receive data as either an HDQ master or slave. HDQ serial communication is normally initiated by the host processor sending a break command to the fuel gauge. A break is detected when the DATA pin is driven to a logic low state for a time t(B) or greater. The DATA pin then is returned to its normal ready logic high state for a time t(BR). The fuel gauge is now ready to receive information from the host processor. The fuel gauge is shipped in the I2C mode. TI provides tools to enable the HDQ peripheral. HDQ Host Interruption The default fuel gauge behaves as an HDQ slave-only device. If the HDQ interrupt function is enabled, the fuel gauge is capable of mastering and also communicating to a HDQ device. There is no mechanism for negotiating which is to function as the HDQ master and care must be taken to avoid message collisions. The interrupt is signaled to the host processor with the fuel gauge mastering an HDQ message. This message is a fixed message that signals the interrupt condition. The message itself is 0x80 (slave write to register 0x00) with no data byte being sent as the command is not intended to convey any status of the interrupt condition. The HDQ interrupt function is not public and needs to be enabled by command. When the SET_HDQINTEN subcommand is received, the fuel gauge detects any of the interrupt conditions and asserts the interrupt at one-second intervals until either: • The CLEAR_HDQINTEN subcommand is received, or • The number of tries for interrupting the host has exceeded a predetermined limit. After the interrupt event, interrupts are automatically disabled. To re-enable interrupts, SET_HDQINTEN needs to be sent. Low Battery Capacity This feature works identically to SOC1. It uses the same data flash entries as SOC1 and triggers interrupts as long as SOC1 = 1 and HDQIntEN = 1. Temperature This feature triggers an interrupt based on the OTC (Overtemperature in Charge) or OTD (Overtemperature in Discharge) condition being met. It uses the same data flash entries as OTC or OTD and triggers interrupts as long as either the OTD or OTC condition is met and HDQIntEN = 1. (See detail in HDQ Host Interruption.) Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 17 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com I2C Interface The fuel gauge supports the standard I2C read, incremental read, one-byte write quick read, and functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The 8-bit device address is therefore 0xAA or 0xAB for write or read, respectively. GG Generated Host Generated S 0 A ADDR[6:0] CMD[7:0] P A P DATA[7:0] A S ADDR[6:0] 1 A (a) S ADDR[6:0] DATA[7:0] N P (b) 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] N P ( c) S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] A ... DATA[7:0] N P (d) Figure 4. Supported I2C Formats (a) (b) (c) (d) 1-byte write Quick read 1-byte read Incremental read (S = Start, Sr = Repeated Start, A = Acknowledge, N = No Acknowledge, and P = Stop). The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the I2C master. Quick writes function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data). Attempt to write a read-only address (NACK after data sent by master): S ADDR[6:0] 0 A CMD[7:0] A DATA[7:0] P P N P Attempt to read an address above 0x7F (NACK command): S 0 A ADDR[6:0] P P N P CMD[7:0] Attempt at incremental writes (NACK all extra data bytes sent): S ADDR[6:0] 0 A CMD[7:0] A DATA[7:0] A DATA[7:0] N ... N P Incremental read at the maximum allowed read address: S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] Address 0x7F A DATA[7:0] Data from addr 0x74 N P Data from addr 0x00 The I2C engine releases both SDA and SCL if the I2C bus is held low for t(BUSERR). If the fuel gauge was holding the lines, releasing them frees the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode. 18 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 I2C Time Out The I2C engine releases both SDA and SCL lines if the I2C bus is held low for about 2 seconds. If the fuel gauge was holding the lines, releasing them frees the master to drive the lines. I2C Command Waiting Time To ensure the correct results of a command with the 400-kHz I2C operation, a proper waiting time must be added between issuing a command and reading the results. For subcommands, the following diagram shows the waiting time required between issuing the control command and reading the status with the exception of the checksum command. A 100-ms waiting time is required between the checksum command and reading the result. For read-write standard commands, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer. xx xxxxxxxx xx xxxxxxxxx xxxxxxxxx xxxxxxxxx xx S ADDR[6:0] 0 A CMD[7:0] A DATA[7:0] A DATA[7:0] A P 66Ps xx xxxxxxxx xx xxxxxxxxx xxxxxxxxx xxxxxxxxx xx xxx xxxxxxxx xx xxx xx xxxxxxxx xx xxxxxxxxx xxxxxxxxx xxxxxxxxx xx S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] A DATA[7:0] xxx N xx P xx xxxxxxxx xx xxxxxxxxx xxx xxxxxxxx xx xxx xxx xx xx xxxxxxxx xx xxxxxxxxx xxx xxxxxxxx xx xxx xxx xx Waiting time between control subcommand and reading results xx xxxxxxxx xx xxxxxxxxx xxx xxxxxxx xxx Sxxxxxxxx ADDR[6:0] xx 0 A xxxxxxxxx CMD[7:0] Axxx Sr xxxxxxx ADDR[6:0]xxx 1 A xx xx xxxxxxxx xxxxxxxxx xxx xxxxxxx xxx xx xxx xx DATA[7:0] xx A DATA[7:0] xxx Nxx P 66Ps xx xxx xx DATA[7:0] xxx A xxx xxx DATA[7:0] 66Ps xx A xx xx Waiting time between continuous reading results The I2C clock stretch could happen in a typical application. A maximum 80-ms clock stretch could be observed during the flash updates. There is up to a 270-ms clock stretch after the OCV command is issued. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 19 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com DATA COMMANDS Standard Data Commands The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 4. Each protocol has specific means to access the data at each Command Code. Data RAM is updated and read by the gauge only once per second. Standard commands are accessible in NORMAL operation mode. Table 4. Standard Commands COMMAND CODE UNIT SEALED ACCESS CNTL 0x00 and 0x01 NA RW NAME Control( ) AtRate( ) AR 0x02 and 0x03 mA RW UnfilteredSOC() UFSOC 0x04 and 0x05 % R Temperature( ) TEMP 0x06 and 0x07 0.1°K R Voltage( ) VOLT 0x08 and 0x09 mV R Flags( ) FLAGS 0x0A and 0x0B NA R NomAvailableCapacity( ) NAC 0x0C and 0x0D mAh R FullAvailableCapacity( ) FAC 0x0E and 0x0F mAh R RemainingCapacity( ) RM 0x10 and 0x11 mAh R FullChargeCapacity( ) FCC 0x12 and 0x13 mAh R AI 0x14 and 0x15 mA R AverageCurrent( ) TimeToEmpty( ) FilteredFCC() StandbyCurrent( ) UnfilteredFCC() MaxLoadCurrent( ) UnfilteredRM() FilteredRM() AveragePower( ) TTE 0x16 and 0x17 minutes R FFCC 0x18 and 0x19 mAh R SI 0x1A and 0x1B mA R UFFCC 0x1C and 0x1D mAh R MLI 0x1E and 0x1F mA R UFRM 0x20 and 0x21 mAh R FRM 0x22 and 0x23 mAh R AP 0x24 and 0x25 mW or cW R INTTEMP 0x28 and 0x29 0.1°K R CC 0x2A and 0x2B Counts R StateOfCharge( ) SOC 0x2C and 0x2D % R StateOfHealth( ) SOH 0x2E and 0x2F % / num R PassedCharge( ) PCHG 0x34 and 0x35 mAh R DOD0( ) DOD0 0x36 and 0x37 hex# R SelfDischargeCurrent() SDSG 0x38 and 0x39 mA R InternalTemperature( ) CycleCount( ) 20 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Control( ): 0x00 and 0x01 Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control( ) command allows the system to control specific features of the fuel gauge during normal operation and additional features when the fuel gauge is in different access modes, as described in Table 5. Table 5. Control( ) Subcommands CNTL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes Reports the status of DF Checksum, Impedance Track™, etc. DEVICE_TYPE 0x0001 Yes Reports the device type of 0x0741 (indicating bq27741-G1) FW_VERSION 0x0002 Yes Reports the firmware version on the device type HW_VERSION 0x0003 Yes Reports the hardware version of the device type PROTECTOR_VERSION 0x0004 Yes Reports the hardware version of the protector portion of the device RESET_DATA 0x0005 Yes Returns reset data Reserved 0x0006 No Not to be used PREV_MACWRITE 0x0007 Yes Returns previous Control( ) subcommand code CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration BOARD_OFFSET 0x0009 No Forces the device to measure and store the board offset CC_OFFSET 0x000A No Forces the device to measure internal CC offset CNTL FUNCTION DESCRIPTION CC_OFFSET_SAVE 0x000B No Forces the device to store the internal CC offset DF_VERSION 0x000C Yes Reports the data flash version on the device SET_FULLSLEEP 0x0010 Yes Sets the CONTROL_STATUS [FULLSLEEP] bit to 1 SET_SHUTDOWN 0x0013 Yes Sets the CONTROL_STATUS [SHUTDN_EN] bit to 1 CLEAR_SHUTDOWN 0x0014 Yes Clears the CONTROL_STATUS [SHUTDN_EN] bit to 0 SET_HDQINTEN 0x0015 Yes Forces the CONTROL_STATUS [HDQIntEn] bit to 1 CLEAR_HDQINTEN 0x0016 Yes Forces the CONTROL_STATUS [HDQIntEn] bit to 0 STATIC_CHEM_CHKSUM 0x0017 Yes Calculates chemistry checksum ALL_DF_CHKSUM 0x0018 Yes Reports checksum for all data flash excluding device specific variables STATIC_DF_CHKSUM 0x0019 Yes Reports checksum for static data flash excluding device specific variables SEALED 0x0020 No Places the fuel gauge in SEALED access mode IT_ENABLE 0x0021 No Enables the Impedance Track™ algorithm START_FET_TEST 0x0024 No Starts FET Test based on data entered in FET Test register. Sets and clears the [FETTST] bit in CONTROL_STATUS register CAL_ENABLE 0x002D No Toggle calibration mode RESET 0x0041 No Forces a full reset of the fuel gauge EXIT_CAL 0x0080 No Exit calibration mode ENTER_CAL 0x0081 No Enter calibration mode OFFSET_CAL 0x0082 No Reports internal CC offset in calibration mode Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 21 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Extended Data Commands Extended commands offer additional functionality beyond the standard set of commands. same manner; however unlike standard commands, extended commands are not limited number of command bytes for a given extended command ranges in size from single specified in Table 6. For details on the SEALED and UNSEALED states, see the Access TRM, SLUUAA3. They are used in the to 2-byte words. The to multiple bytes, as Modes section in the Table 6. Extended Commands NAME PackConfig( ) DesignCapacity( ) COMMAND CODE UNIT SEALED ACCESS (1) (2) UNSEALED ACCESS (1) (2) R PCR 0x3A and 0x3B hex# R DCAP 0x3C and 0x3D mAh R R 0x3E NA NA RW DataFlashClass( ) (2) DFCLS DataFlashBlock( ) (2) DFBLK 0x3F NA RW RW A/DF 0x40 to 0x53 NA RW RW ACKS/DFD 0x54 NA RW RW BlockData( ) / Authenticate( ) (3) BlockData( ) / AuthenticateCheckSum( ) BlockData( ) (3) DFD 0x55 to 0x5F NA R RW BlockDataCheckSum( ) DFDCKS 0x60 NA RW RW BlockDataControl( ) DFDCNTL 0x61 NA NA RW DNAMELEN 0x62 NA R R DeviceName( ) DNAME 0x63 to 0x6C NA R R Protector Status AFESTAT1 0x6D hex R R RSVD 0x6E and 0x6F NA R R 0x70 and 0x71 NA R R 0x72 and 0x73 NA R R 0x74 and 0x75 NA NA RW DeviceNameLength( ) Reserved Simultaneous Current Reserved RSVD FETTest( ) Reserved Protector State Reserved (4) DODatEOC( ) (4) QStart( ) (4) FastQmax( ) (4) RSVD 0x76 and 0x77 NA R R AFESTATE 0x78 hex R R RSVD 0x79 NA R R 0x7A and 0x7B NA R R 0x7C and 0x7D mA R R 0x7E and 0x7F mAh R R AN_COUNTER (5) 0x79 AN_CURRENT_LSB (5) 0x7A AN_CURRENT_MSB (5) 0x7B AN_VCELL_LSB (5) 0x7C AN_VCELL_MSB (5) 0x7D AN_TEMP_LSB (5) 0x7E AN_TEMP_MSB (1) (2) (3) (4) (5) 22 (5) 0x7F SEALED and UNSEALED states are entered via commands to Control( ) 0x00 and 0x01 In SEALED mode, data flash cannot be accessed through commands 0x3E and 0x3F. The BlockData( ) command area shares functionality for accessing general data flash and for using Authentication. See Authentication in the bq27741-G1 TRM (SLUUAA3) for more details. If CONTROL_STATUS [CALMODE] bit = 0, then this address or command is valid. If CONTROL_STATUS [CALMODE] bit = 1, then this address or command is valid. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 DATA FLASH SUMMARY Table 7 through Table 13 summarize the data flash locations available to the user, including their default, minimum, and maximum values. Table 7. Data Flash Summary—Configuration Class SUBCLASS ID SUBCLASS 2 Safety 34 Charge 36 Charge Termination 48 Data NAME OFFSET DATA TYPE VALUE UNIT MIN MAX DEFAULT OT Chg 0 I2 0 1200 550 OT Chg Time 2 U1 0 60 5 0.1°C s OT Chg Recovery 3 I2 0 1200 500 0.1°C OT Dsg 5 I2 0 1200 600 0.1°C OT Dsg Time 7 U1 0 60 5 s OT Dsg Recovery 8 I2 0 1200 550 0.1°C OT Prot Threshold 10 I2 0 1200 600 0.1°C OT Prot Delay 12 U1 0 60 3 s OT Prot Recovery 13 I2 0 1200 550 0.1°C Charge Voltage 0 I2 0 4600 4200 mV Taper Current 0 I2 0 1000 100 mA Min Taper Capacity 2 I2 0 1000 25 mAh Taper Voltage 4 I2 0 1000 100 mV Current Taper Window 6 U1 0 60 40 s TCA Set % 7 I1 –1% 100% 99% TCA Clear % 8 I1 –1% 100% 95% FC Set % 9 I1 –1% 100% –1% FC Clear % 10 I1 –1% 100% 98% DODatEOC Delta T 11 I2 0 1000 50 0.1°C Initial Standby 8 I1 –256 0 –10 mA Initial MaxLoad 9 I2 –32767 0 –500 mA Cycle Count 17 U2 0 65535 0 Count CC Threshold 19 I2 100 32767 900 mAh Design Capacity 23 I2 0 32767 1000 mAh Design Energy 25 I2 0 32767 5400 mWh SOH Load I 27 I2 –32767 0 -400 mA TDD SOH Percent 29 I1 0% 100% 80% ISD Current 40 I2 0 32767 10 Hour Rate ISD I Filter 42 U1 0 255 127 Count Min ISD Time 43 U1 0 255 7 Hour Design Energy Scale 44 U1 1 10 1 number Device Name 45 S11 x x bq27741G1 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 23 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Table 7. Data Flash Summary—Configuration Class (continued) SUBCLASS ID SUBCLASS 49 Discharge 56 57 59 60 64 66 68 24 NAME OFFSET DATA TYPE VALUE UNIT MIN MAX DEFAULT SOC1 Set Threshold 0 U2 0 65535 150 mAh SOC1 Clear Threshold 2 U2 0 65535 175 mAh SOCF Set Threshold 4 U2 0 65535 75 mAh SOCF Clear Threshold 6 U2 0 65535 100 mAh BL Set Volt Threshold 9 I2 0 16800 2500 mV BL Set Volt Time 11 U1 0 60 2 s BL Clear Volt Threshold 12 I2 0 16800 2600 mV BH Set Volt Threshold 14 I2 0 16800 4500 mV BH Volt Time 16 U1 0 60 2 s BH Clear Volt Threshold 17 I2 0 16800 4400 mV 0 H2 0x0000 0xFFFF 0x0000 hex 2 H2 0x0000 0xFFFF 0x0000 hex Firmware Version 4 H2 0x0000 0xFFFF 0x0000 hex Hardware Revision 6 H2 0x0000 0xFFFF 0x0000 hex Cell Revision 8 H2 0x0000 0xFFFF 0x0000 hex DFl Config Version 10 H2 0x0000 0xFFFF 0x0000 hex Manufacturer Pack Lot Code Data PCB Lot Code Integrity Data All DF Checksum 6 H2 0x0000 0x7FFF 0x0000 hex Static Chem DF Checksum 8 H2 0x0000 0x7FFF 0x0000 hex Static DF Checksum 10 H2 0x0000 0x7FFF 0x0000 hex Lifetime Data Lifetime Max Temp 0 I2 0 1400 0 0.1°C Lifetime Min Temp 2 I2 –600 1400 500 0.1°C Lifetime Max Pack Voltage 4 I2 0 32767 2800 mV Lifetime Min Pack Voltage 6 I2 0 32767 4200 mV Lifetime Max Chg Current 8 I2 –32767 32767 0 mA Lifetime Max Dsg Current 10 I2 –32767 32767 0 mA Lifetime Temp Samples LT Flash Cnt 0 I2 0 32767 0 Count LT AFE Status 2 H1 0x00 0xFF 0x00 hex Registers Pack Configuration 0 H2 0x0000 0xFFFF 0x1171 flags Pack Configuration B 2 H1 0x00 0xFF 0xA7 flags Pack Configuration C 3 H1 0x00 0xFF 0x1C flags LT Temp Res 0 U1 0 255 10 °C LT V Res 1 U1 0 255 25 mV LT Cur Res 2 U1 0 255 100 mA LT Update Time 3 U2 0 65535 60 s Flash Update OK Voltage 0 I2 0 4200 2800 mV Sleep Current 2 I2 0 100 10 mA Shutdown V 11 I2 0 2600 0 mV FS Wait 13 U1 0 255 0 s Lifetime Resolution Power Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Table 8. Data Flash Summary—System Data Class SUBCLASS ID 58 SUBCLASS NAME OFFSET DATA TYPE VALUE UNIT MIN MAX DEFAULT Manufacturer Block A [0 through 31] Info 0 through 31 H1 0x00 0xFF 0x00 hex Block B [0 through 31] 32 through 63 H1 0x00 0xFF 0x00 hex Table 9. Data Flash Summary—Gas Gauging Class SUBCLASS SUBCLASS ID 80 81 IT Cfg Current Thresholds NAME OFFSET Load Select DATA TYPE VALUE UNIT MIN MAX DEFAULT 1 number 0 U1 0 255 Load Mode 1 U1 0 255 0 number Max Res Factor 21 U1 0 255 15 number Min Res Factor 22 U1 0 255 5 number Ra Filter 25 U2 0 1000 800 number Fast Qmax Start DOD % 42 U1 0% 255% 92% Fast Qmax End DOD % 43 U1 0% 255% 96% Fast Qmax Start Volt Delta 44 I2 0 4200 200 Fast Qmax Current Threshold 46 I2 0 1000 4 C/rate Qmax Capacity Err 64 U1 0 100 15 0.10% Max Qmax Change 65 U1 0% 255% 30% Terminate Voltage 67 I2 2800 3700 3000 mV Term V Delta 69 I2 0 4200 200 mV ResRelax Time 72 U2 0 65534 500 s User Rate-Pwr 78 I2 3000 14000 0 cW Reserve Cap-mAh 80 I2 0 9000 0 mAh Reserve Energy 82 I2 0 14000 0 cWh Max DeltaV 87 U2 0 65535 200 mV Min DeltaV 89 U2 0 65535 0 mV Max Sim Rate 91 U1 0 255 1 C/rate Min Sim Rate 92 U1 0 255 20 C/rate Ra Max Delta 93 U2 0 65535 43 mΩ Qmax Max Delta % 95 U1 0% 100% 5% Qmax Bound % 96 U1 0% 255% 130% DeltaV Max Delta 97 U2 0 65535 10 mV Max Res Scale 99 U2 0 32767 5000 number Min Res Scale 101 U2 0 32767 200 number Fast Scale Start SOC 103 U1 0% 100% 10% Charge Hys V Shift 104 I2 0 2000 40 mV Dsg Detection Threshold 0 I2 0 2000 60 mA Chg Detection Threshold 2 I2 0 2000 75 mA Quit Current 4 I2 0 1000 40 mA Dsg Relax Time 6 U2 0 8191 60 s Chg Relax Time 8 U1 0 255 60 s Quit Relax Time 9 U1 0 63 1 s Max IR Correct 10 U2 0 1000 400 mV mV Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 25 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Table 9. Data Flash Summary—Gas Gauging Class (continued) SUBCLASS SUBCLASS ID 82 State NAME OFFSET DATA TYPE VALUE UNIT MIN MAX DEFAULT Qmax Cell 0 0 I2 0 32767 1000 mAh Update Status 2 H1 0x0 0x6 0x0 hex V at Chg Term 3 I2 0 5000 4200 mV Avg I Last Run 5 I2 –32768 32767 –299 mA Avg P Last Run 7 I2 –32768 32767 –1131 Power (mA) Delta Voltage 9 I2 –32768 32767 2 mV T Rise 13 I2 0 32767 20 number T Time Constant 15 I2 0 32767 1000 number Table 10. Data Flash Summary—OCV Table Class SUBCLASS SUBCLASS ID 83 NAME OCVa Table Chem ID OFFSET DATA TYPE 0 H2 VALUE UNIT MIN MAX DEFAULT 0x0000 0xFFFF 0x128 flags Table 11. Data Flash Summary—Ra Table Class SUBCLASS SUBCLASS ID 88 26 R_a0 NAME OFFSET DATA TYPE MIN MAX DEFAULT Cell0 R_a flag 0 H2 0x0000 0x0000 0xFF55 hex Cell0 R_a 0 2 I2 183 183 407 2–10 Ω Cell0 R_a 1 4 I2 181 181 407 2–10 Ω Cell0 R_a 2 6 I2 198 198 396 2–10 Ω Cell0 R_a 3 8 I2 244 244 429 2–10 Ω Cell0 R_a 4 10 I2 254 254 287 2–10 Ω Cell0 R_a 5 12 I2 261 261 236 2–10 Ω Cell0 R_a 6 14 I2 333 333 249 2–10 Ω Cell0 R_a 7 16 I2 338 338 252 2–10 Ω Cell0 R_a 8 18 I2 345 345 211 2–10 Ω Cell0 R_a 9 20 I2 350 350 189 2–10 Ω Cell0 R_a 10 22 I2 382 382 238 2–10 Ω Cell0 R_a 11 24 I2 429 429 281 2–10 Ω Cell0 R_a 12 26 I2 502 502 560 2–10 Ω Cell0 R_a 13 28 I2 545 545 1475 2–10 Ω Cell0 R_a 14 30 I2 366 366 2350 2–10 Ω Submit Documentation Feedback VALUE UNIT Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 Table 11. Data Flash Summary—Ra Table Class (continued) SUBCLASS SUBCLASS ID 89 R_a0x NAME OFFSET DATA TYPE VALUE UNIT MIN MAX DEFAULT xCell0 R_a flag 0 H2 0xFFFF 0xFFFF 0xFFFF hex xCell0 R_a 0 2 I2 183 183 407 2–10 Ω xCell0 R_a 1 4 I2 181 181 407 2–10 Ω xCell0 R_a 2 6 I2 198 198 396 2–10 Ω xCell0 R_a 3 8 I2 244 244 429 2–10 Ω xCell0 R_a 4 10 I2 254 254 287 2–10 Ω xCell0 R_a 5 12 I2 261 261 236 2–10 Ω xCell0 R_a 6 14 I2 333 333 249 2–10 Ω xCell0 R_a 7 16 I2 338 338 252 2–10 Ω xCell0 R_a 8 18 I2 345 345 211 2–10 Ω xCell0 R_a 9 20 I2 350 350 189 2–10 Ω xCell0 R_a 10 22 I2 382 382 238 2–10 Ω xCell0 R_a 11 24 I2 429 429 281 2–10 Ω xCell0 R_a 12 26 I2 502 502 560 2–10 Ω xCell0 R_a 13 28 I2 545 545 1475 2–10 Ω xCell0 R_a 14 30 I2 366 366 2350 2–10 Ω Table 12. Data Flash Summary—Calibration SUBCLASS SUBCLASS ID 104 107 Data Current NAME OFFSET DATA TYPE VALUE MIN MAX UNIT DEFAULT CC Gain 0 F4 0.100 40.00 0.9536 mΩ CC Delta 4 F4 29800 1190000 1119000 mΩ CC Offset 8 I2 –32768 32767 –1500 mA Board Offset 10 I1 –128 127 0 µA Int Temp Offset 11 I1 –128 127 0 °C Ext Temp Offset 12 I1 –128 127 0 °C Pack V Offset 13 I1 –128 127 0 mV ADC I Offset 14 I1 –128 127 0 mA Filter 0 U1 0 255 239 number Deadband 1 U1 0 255 5 mA Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 27 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Table 13. Data Flash Summary—Security SUBCLASS SUBCLASS ID 112 Codes NAME OFFSET DATA TYPE VALUE MIN MAX UNIT DEFAULT Sealed to Unsealed 0 H4 0x0000 0000 0xFFFF FFFF 0x3672 0414 hex Unsealed to Full 4 H4 0x0000 0000 0xFFFF FFFF 0xFFFF FFFF hex Authen Key3 8 H4 0x0000 0000 0xFFFF FFFF 0x0123 4567 hex Authen Key2 12 H4 0x0000 0000 0xFFFF FFFF 0x89AB CDEF hex Authen Key1 16 H4 0x0000 0000 0xFFFF FFFF 0xFEDC BA98 hex Authen Key0 20 H4 0x0000 0000 0xFFFF FFFF 0x7654 3210 hex Table 14. Data Flash to EVSW Conversion Class SubClass ID SubClass Offset Gas Gauging 80 IT Cfg Calibration 104 Data EVSW Unit Data Flash to EVSW Conversion 0 mW/cW DF × 10 0 mWh/cW DF × 10 number 10.124 mΩ 4.768/DF number 10.147 mΩ 5677445/DF –1200 number –0.576 mV DF × 0.0048 0 number 0 µV DF × 0.0075 Name Data Type Data Flash Default Data Flash Unit EVSW Default 78 User Rate-Pwr I2 82 Reserve Energy I2 0 cW/10W 0 cWh/10cWh 0 CC Gain 4 CC Delta F4 0.47095 F4 5.595e5 8 10 CC Offset I2 Board Offset I1 Table 15. ORDERING INFORMATION PRODUCTION PART NO. (1) bq27741YZFR-G1 bq27741YZFT-G1 (1) (2) 28 FIRMWARE VERSION PACKAGE (2) TA COMMUNICATION FORMAT 1.08 CSP-15 –40°C to 85°C I2C, HDQ (1) TAPE and REEL QUANTITY 3000 250 bq27741-G1 is shipped in the I2C mode. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 APPLICATION INFORMATION Reference Schematics 0.1 µF 0.1 µF C10 1 G1 3 S1 6 S2A S1A 5 G2 4 S2 200 200 R12 2 Q1 UPA2375T1P R2 5 mΩ R11 C9 C5 C7 R16 0.1 µF 10 0.1 µF C6 C1 R1 10 0.1 µF C1 VPWR C2 E1 E2 C3 Ext Therm TB1 CELL+ 1 2 CELL– R5 1k U1 bq27741–G1 C2 1 µF R3 1k 0.1 µF 0.1 µF C4 RT1 .47 µF 10 k B2 D3 D1 BAT[RC3] REG25 TS RA0 RC2 VSS SRN R13 B1 2k A1 C8 PACKP B3 A2 CHG A3 DSG C3 SDA 0.1 µF SRP SCL E3 HDQ D2 3 C11 R4 R8 100 100 0.1 µF 4 PACK+ 3 I2C_SDA 2 R7 R10 100 100 I2C_CLK 1 PACK– TB2 D2 C12 0.1 µF Figure 5. I2C Mode Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 29 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com 0.1 µF 0.1 µF C10 1 S1 S2A S1A 5 6 S2 200 200 R12 2 Q1 UPA2375T1P R2 5 mΩ R11 C9 C5 C7 10 U1 bq27741–G1 C2 0.1 µF C3 Ext Therm 1 µF TB1 CELL+ 1 2 CELL– R5 1k R3 1k 0.1 µF 0.1 µF G1 C1 R1 3 0.1 µF C6 G2 0.1 µF 10 4 R16 C4 RT1 .47 µF 10 k 3 C1 VPWR C2 BAT[RC3] E1 REG25 E2 TS B2 RA0 D3 RC2 D1 VSS SRN R13 B1 2k A1 C8 PACKP B3 A2 CHG A3 DSG C3 SDA 0.1 µF SRP SCL E3 C11 0.1 µF PACK+/Load+ 2 R7 C12 100 4.7 k 100 HDQ 1 R10 HDQ D2 R17 3 PACK–/Load– TB3 0.1 µF D1 1.8 V pullup. HDQ requires pack-side pullup. Figure 6. HDQ Mode SPACER 30 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 MECHANICAL DATA SPACER Package Information YZF (R–XBGA–N15) DIE–SIZE BALL GRID ARRAY 1,00 1.99 1.93 A B 0,50 E D 2.81 2.75 2,00 C B A 0,50 PIN A1 INDEX AREA E 15X Ø 0,35 0,25 Ø 0,015 M C A B 0,35 0,15 C 0,625 MAX SEATING PLANE Ç 0,05 C NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M–1994. B. This drawing is subject to change without notice. TM C. NanoFree package configuration. Figure 7. Mechanical Package Package Dimensions The dimensions for the YZF package are shown in Table 16. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 31 bq27741-G1 SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 www.ti.com Table 16. YZF Package Dimension PACKAGED DEVICES D E BQ27741YZFR-G1 2.776 ± 0.030 mm 1.956 ± 0.030 mm Related Documentation from Texas Instruments To obtain a copy of any of the following TI documents, call the Texas Instruments Literature Response Center at (800) 477-8924 or the Product Information Center (PIC) at (972) 644-5580. When ordering, identify this document by its title and literature number. Updated documents also can be obtained through the TI Web site at www.ti.com. 1. bq27741-G1, Pack-Side Impedance Track™ Battery Fuel Gauge With Integrated Protector and LDO User's Guide (SLUUAA3) 2. bq27741EVM Single Cell Impedance Track™ Technology Evaluation Module User's Guide (SLUUAH1) Spacer REVISION HISTORY Changes from Original (July 2013) to Revision A • 32 Page Changed the FIRMWARE VERSION From 1.07 To 1.08 in Table 15 ............................................................................... 28 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 bq27741-G1 www.ti.com SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013 GLOSSARY ACK Acknowledge character ADC Analog-to-digital converter BCA Board calibration CC Coulomb counter CCA Coulomb counter calibration CE Chip enable cWh Centiwatt-hour DF Data flash DOD Depth of discharge in percent as related to Qmax. 100% corresponds to empty battery. DOD0 Depth of discharge that was looked up in the DOD (OCV) table based on OCV measurement in relaxed state. EOC End of charge FC Fully charged FCC Full charge capacity. Total capacity of the battery compensated for present load current, temperature, and aging effects (reduction in chemical capacity and increase in internal impedance). FIFO First in, first out FVCA Fast voltage and current acquisition GPIO General-purpose input output HDQ High-speed data queue IC Integrated circuit ID Identification IO Input or output IT Impedance Track™ I2C Inter-integrated circuit LDO Low dropout LSB Least significant bit LT Lifetime MAC Manufacturer access command or control command mAh Milliamp-hour MSB Most significant bit mWh Milliwatt-hour NACK Negative acknowledge character NTC Negative temperature coefficient OCV Open-circuit voltage. Voltage measured on fully-relaxed battery with no load applied. OTC Overtemperature in charge OTD Overtemperature in discharge Qmax Maximum chemical capacity RM Remaining capacity RW Read or write SCL Serial clock: programmable serial clock used in the I2C interface SDA Serial data: serial data bus in the I2C interface SE Shutdown enable SOC State-of-charge in percent related to FCC SOC1 State-of-charge initial SOCF State-of-charge final TCA TS Terminate charge alarm Temperature status TTE Time-to-empty TTF Time-to-full Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27741-G1 33 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) BQ27741YZFR-G1 ACTIVE DSBGA YZF 15 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27741-G1 BQ27741YZFT-G1 ACTIVE DSBGA YZF 15 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27741-G1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device BQ27741YZFR-G1 Package Package Pins Type Drawing SPQ DSBGA 3000 YZF 15 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 2.06 B0 (mm) K0 (mm) P1 (mm) 2.88 0.69 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ27741YZFR-G1 DSBGA YZF 15 3000 182.0 182.0 17.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated