DYNEX SV15XX

SV15..F
SV15..F
Fast Recovery Diode
Replaces March 1998 version, DS4209-2.2
DS4209-3.0 January 2000
APPLICATIONS
KEY PARAMETERS
VRRM
1600V
IF(AV)
205A
IFSM
3000A
Qr
35µC
trr
3.2µs
■ Induction Heating
■ A.C. Motor Drives
■ Snubber Diode
■ Welding
■ High Frequency Rectification
■ UPS
FEATURES
■ Thermal Fatigue Free Pressure Contact
■ High Surge Capability
■ Low Recovery Charge
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
VRRM
V
Conditions
SV15 16F M or K
VRSM = VRRM + 100V
1600
SV15 14F M or K
1400
SV15 12F M or K
1200
SV15 10F M or K
1000
SV15 08F M or K
800
SV15 06F M or K
600
For 1/2" 20 UNF thread, add suffix K, e.g. SV15 16FK.
For M12 thread, add suffix M, e.g. SV15 16FM.
For stud anode add 'R' to type number, e.g. SV15 16FMR.
For outline DO8C add suffix 'C' to typ number,
e.g. SV15 16FKC.
Outline type codes: DO8 and DO8C.
See Package Details for further information.
CURRENT RATINGS
Symbol
Parameter
Conditions
Max.
Units
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 65oC
205
A
IF(RMS)
RMS value
Tcase = 65oC
236
A
1/7
SV15..F
SURGE RATINGS
Symbol
IFSM
I2t
IFSM
I2t
Conditions
Parameter
Surge (non-repetitive) forward current
Max.
Units
3.0
kA
45 x 103
A2s
-
kA
-
A2s
10ms half sine; with 0% VRRM, Tj = 150oC
I2t for fusing
Surge (non-repetitive) forward current
10ms half sine; with 50% VRRM, Tj = 150oC
I2t for fusing
THERMAL AND MECHANICAL DATA
Conditions
Parameter
Symbol
dc
Min.
Max.
Units
-
0.23
o
o
C/W
Rth(j-c)
Thermal resistance - junction to case
Rth(c-h)
Thermal resistance - case to heatsink
Mounting torque 15Nm
with mounting compound
-
0.02
Tvj
Virtual junction temperature
On-state (conducting)
-
150
o
Tstg
Storage temperature range
-55
200
o
Mounting torque
12.0
15.0
Nm
Typ.
Max.
Units
-
C/W
C
C
CHARACTERISTICS
Symbol
VFM
Forward voltage
At 450A peak, Tcase = 25oC
-
1.6
V
IRRM
Peak reverse current
At VRRM, Tcase = 150oC
-
20
mA
-
3.2
µs
trr
Reverse recovery time
Recovered charge (50% chord)
IF = 450A, diRR/dt = 10A/µs
-
35
µC
IRM
Reverse recovery current
Tcase = 125oC, VR = 100V
-
21
A
K
Soft factor
-
-
-
QRA1
VTO
Threshold voltage
At Tvj = 150oC
-
1.0
V
rT
Slope resistance
At Tvj = 150oC
-
1.33
mΩ
Forward recovery voltage
di/dt = 1000A/µs, Tj = 125oC
-
-
V
VFRM
2/7
Conditions
Parameter
SV15..F
DEFINITION OF K FACTOR AND QRA1
QRA1 = 0.5x IRR(t1 + t2)
dIR/dt
t1
t2
k = t1/t2
τ
0.5x IRR
IRR
CURVES
3000
Measured under pulse conditions
Instantaneous forward current IF - (A)
2500
2000
Tj = 25˚C
1500
Tj = 150˚C
1000
500
1.0
2.0
3.0
4.0
5.0
Instantaneous forward voltage VF - (V)
Fig.1 Maximum (limit) forward characteristics
3/7
SV15..F
500
Measured under pulse conditions
Instantaneous forward current IF - (A)
400
300
200
Tj = 150˚C
Tj = 25˚C
100
0
1.0
1.2
1.4
1.6
1.8
Instantaneous forward voltage VF - (V)
Fig.2 Maximum (limit) forward characteristics
10000
QS = ∫
IF
50µs
Conditions:
0
Tj = 150˚C,
VR = 100V
Reverse recovered charge QS - (µC)
QS
tp = 1ms
dIR/dt
1000
IRR
IF = 2000
IF = 1000
IF = 200
IF = 100
100
10
1
10
100
Rate of rise of reverse current dIR/dt - (A/µs)
Fig.3 Recovered charge
4/7
IF = 500
1000
SV15..F
1000
Conditions:
Tj = 150˚C,
VR = 100V
Reverse recovery current IRR - (A)
IF = 2000A
IF = 1000A
IF = 500A
IF = 200A
100
10
IF = 100A
1
10
100
Rate of rise of reverse current dIR/dt - (A/µs)
1000
Fig.4 Typical reverse recovery current vs rate of rise of reverse current
Thermal impedance - (˚C/W)
0.1
d.c.
0.01
0.001
0.01
0.1
1
Time - (s)
10
100
Fig.5 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)
5/7
SV15..F
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Ø8.4 ± 0.3
8 min
20 max
12 ± 0.5
3.17 max
Thread M12
1/2" 20 UNF
8 min
3.17 max
Thread M12
1/2" 20 UNF
Nominal weight: 120g
Mounting torque: 15Nm ±10%
Nominal weight: 120g
Mounting torque: 15Nm ±10%
Package outine type code: DO8
Package outine type code: DO8C
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
AN4506
Thyristor and diode measurement with a multi-meter
AN4853
Use of VTO, rT on-state characteristic
AN5001
6/7
Ø27 max
Type No + K - 20.6 ± 0.6
Type No + M - 18.0 ± 0.5
8 min
60 max
Ø27 max
Type No + K - 20.6 ± 0.6
Type No + M - 18.0 ± 0.5
12 ± 0.5
163 ± 10
Ø5.2 ± 0.2
SV15..F
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Suite 410, 99 Bank Street,
Ottawa, Ontario, Canada K1P 6B9.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4209-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
7/7