MF70 MF70 Fast Recovery Diode Advance Information Replaces March 1998 version, DS4195-2.1 DS1955-3.0 January 2000 APPLICATIONS KEY PARAMETERS VRRM 1600V IF(AV) 70A IFSM 700A Qr 26µC trr 915ns ■ Inverse Parallel Or Series Connected Diode ■ Power Supplies ■ High Frequency Applications FEATURES ■ Glass Passivation ■ Fast Recovery Characteristics ■ High Voltage Capabilities VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V MF70-1600 MF70-1400 MF70-1200 1600 1400 1200 Conditions VRSM = VRRM + 100V Lower voltage grades available. For stud anode add suffix 'R' to type number. Outline type code: DO5. See Package Details for further information. CURRENT RATINGS Symbol Parameter Conditions Max. Units 70 A IF(AV) Mean forward current Half wave resistive load, Tcase = 75oC IF(RMS) RMS value Tcase = 75oC 110 A Continuous (direct) forward current Tcase = 75oC 90 A IF 1/8 MF70 SURGE RATINGS Symbol IFSM I2t Conditions Parameter Max. Units Surge (non-repetitive) forward current 10ms half sine; with 100% VRRM, Tj = 125oC 700 A I2t for fusing 10ms half sine; Tj = 125oC 2450 A2s THERMAL AND MECHANICAL DATA Conditions Parameter Symbol Min. Max. Units Rth(j-c) Thermal resistance - junction to case dc - 0.37 o Rth(c-h) Thermal resistance - case to heatsink Mounting torque 3.5Nm with mounting compound - 0.2 o Forward (conducting) - 125 o Reverse (blocking) - 125 o -55 125 ˚C 3.2 3.8 Nm Typ. Max. Units Tvj Tstg - C/W C/W C Virtual junction temperature Storage temperature range Mounting torque Use torque wrench C CHARACTERISTICS Symbol Conditions VFM Forward voltage At 210A peak, Tcase = 25oC - 2.0 V IRM Peak reverse current At VRRM, Tcase = 100oC - 10 mA trr Reverse recovery time IF = 1A, diRR/dt = 25A/µs Tcase = 25oC, VR = 100V - 300 ns Qr Recovered charge IF = 100A, diRR/dt = 100A/µs - 26 µC trr Reverse recovery time Tcase = 25oC, VR = 100V - 915 ns VTO Threshold voltage At Tvj = 125oC - 1.3 V rT Slope resistance At Tvj = 125oC - 3.34 mΩ Forward recovery voltage di/dt = 1000A/µs, Tj = 125oC 80 - V VFRM 2/8 Parameter MF70 CURVES 500 Measured under pulse conditions 80 Tcase = 25˚C Transient forward voltage - (V) Instantaneous forward current - (A) 400 300 200 100 95% 40 5% 20 Tj = 125˚C 0 Tj = 25˚C 0 60 0 0 200 400 600 800 1000 1200 Rate of rise of forward current - (A/µs) 1.0 2.0 3.0 Instantaneous forward voltage - (V) Fig.1 Maximum (limit) forward characteristics Fig.2 Forward recovery voltage vs rate of rise of forward voltage Thermal impedance - ˚C/W 0.5 0.4 d.c. 0.3 0.2 0.1 0 0.001 0.01 0.1 Time - (s) 1.0 10 Fig.3 Maximum transient thermal impedance - junction to case 3/8 MF70 Recovery time - (µs) 1.05 1.0 Tcase = 125˚C 0.9 IF = 100A 95% 0.8 IF = 50A 0.7 IF = 100A 5% 0.6 0.55 IF = 50A 1 1000 10 100 Rate of rise of reverse current - (A/µs) Recovered charge - (µC) Fig.4 Recovery time vs dIR/dt 40 IF = 100A T = 125˚C 36 case 95% 32 IF = 50A 28 IF = 100A 24 5% 20 IF = 50A 16 12 8 4 0 1 10 100 Rate of change of reverse current - (A/µs) 1000 Fig.5 Recovered charge vs dIR/dt Peak current - (A) 5000 Tcase = 55˚ 1000 50 10 00 00 25 00 10 00 500 300 10 50H 0 z 0 100 10 100 1000 Pulse width - (µs) Fig.6 Frequency curves - square waveform 4/8 10000 MF70 Peak current - (A) 500 Tcase = 85˚ 100 10 00 0 10 10 50 00 25 00 10 50 00 0 50 10 Hz 0 30 0 100 1000 Pulse width - (µs) 10000 Fig.7 Frequency curves - square waveform Peak current - (A) 500 2.0J 100 1.0 0.5 0.2 0.1 10 10 100 1000 Pulse width - (µs) 10000 Fig.8 Energy per pulse - square waveform Peak current - (A) 5000 Tcase = 55˚ 1000 50 10 00 0 100 10 00 25 00 10 3 00 500 00 10 0 100 1000 Pulse width - (µs) 50 Hz 10000 Fig.9 Frequency curves - sine waveform 5/8 MF70 Peak current - (A) 5000 Tcase = 85˚ 1000 50 10 00 00 25 00 10 00 50 30 0 0 10 0 50 Hz 0 100 10 100 1000 Pulse width - (µs) 10000 Fig.10 Frequency curves - sine waveform Peak current - (A) 500 2.0J 1.0 100 0.5 0.2 0.1 20 10 100 1000 Pulse width - (µs) Fig.11 Energy per pulse - sine waveform 6/8 10000 MF70 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hex. 17.35mm AF max 23 Ø4.0 11.5 Thread 1/4 in 28 UNF 2A Weight: 20g ASSOCIATED PUBLICATIONS Title Application Note Number Calculating the junction temperature or power semiconductors AN4506 Thyristor and diode measurement with a multi-meter AN4853 Use of V , r on-state characteristic AN5001 TO T 7/8 MF70 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4195-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 8/8