MP04HB910 MP04HB910 Dual Rectifier Diode Module Preliminary Information DS5425-1.2 February 2001 FEATURES KEY PARAMETERS VRRM 3000V 915A IF(AV) 20000A IFSM (per arm) 1440A IF(RMS) 3000V Visol ■ Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint ■ Alumina (Non-toxic) Isolation Medium APPLICATIONS ■ Power Supplies ■ Large IGBT Circuit 'Front Ends' ■ Rectifiers ■ Battery Chargers 1 2 3 VOLTAGE RATINGS Type Number MP04HB910-30 MP04HB910-28 MP04HB910-26 MP04HB910-24 Repetitive Peak Voltages VDRM VRRM V 3000 2800 2600 2400 Conditions Tvj = –40˚ to 150˚C, Fig.1 HB circuit configuration VRSM = VRRM + 100V Lower voltage grades available ORDERING INFORMATION Order As: MP04HB910-XX XX shown in the part number about represents VRRM/100 selection required. Note: When ordering, please use the complete part number. Please quote full part number in all correspondance. Outline type code: MP04 (See package details for further information) Fig. 2 Electrical connections - (not to scale) 1/7 www.dynexsemi.com MP04HB910 ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. Symbol IF(AV) IF(RMS) IFSM I2t IFSM I2t Visol Max. Units Tcase = 75oC 915 A Tcase = 85oC 830 A Tcase = 100oC 695 A Tcase = 75oC 1440 A Tcase = 85oC 1305 A Tcase = 100oC 1090 A 10ms half sine; Tj = 150oC 20 kA VR = 0 2.0 x 106 A2s 10ms half sine; Tj = 150oC 16 kA VR = 50% VRRM 1.28 x 106 A2s Commoned terminals to base plate AC RMS, 1 min, 50Hz 3000 V Parameter Mean forward current RMS value Conditions Half wave resistive load Surge (non-repetitive) forward current I2t for fusing Surge (non-repetitive) forward current I2t for fusing Isolation voltage THERMAL AND MECHANICAL DATA Rth(j-c) Thermal resistance - junction to case (per diode) Tvj Virtual junction temperature Tstg Storage temperature range - Conditions Min. Max. Units dc - 0.056 o Halfwave - 0.060 o 3 Phase - 0.066 o Reverse (blocking) - 150 o –40 150 o 6 (53) - Parameter Symbol Screw torque Mounting Electrical connections - Weight (nominal) - - C/W C/W C/W C C Nm (lb.ins) 12 (106) Nm (lb.ins) 1580 g 2/7 www.dynexsemi.com MP04HB910 CHARACTERISTICS Parameter Symbol Conditions Min. Max. Units IRRM Peak reverse current At VRRM, Tcase = 150oC - 50 mA QS Total stored charge IF = 1000A, dIRR/dt = 3A/µs - 1600 µC IRR Peak recovery current Tcase = 150˚C, VR = 100V - 85 A VTO Threshold voltage. See Note 1. At Tvj = 150˚C - 0.7 V Slope resistance. See Note 1. At Tvj = 150˚C - 0.29 mΩ rT Note 1: The data given in this datasheet with regard to forward voltage drop is the for the calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals will be in excess of these figures due to the impedance of the busbars from the terminals to the semiconductor. CURVES 2500 2200 Instantaneous forward current IF - (A) Measured under pulse conditions 2000 1800 Power dissipation (Watts, per arm) 2000 1500 Tj = 150˚C Tj = 25˚C 1000 500 1600 1400 1200 1000 800 600 30° 60° 90° 120° 180° DC 400 200 0 0.5 0.75 1.0 1.25 Instantaneous forward voltage VF - (V) Fig.3 Maximum (limit) forward characteristics 1.5 0 0 200 400 600 800 1000 1200 1400 1600 1800 Forward current, (Average, per arm) IF(AV) - (A) Fig.4 Power dissipation curves 3/7 www.dynexsemi.com MP04HB910 1000 Conditions: Tj = 150˚C VR = 100V IF = 1000A Conditions: Tj = 175˚C VR = 100V IF = 1000A Reverse current IRR - (A) Stored charge QS - (µC) 10000 1000 100 IF QS dIF/dt 100 0.1 IRR 1.0 10 Rate of decay of on-state current dIF/dt - (A/µs) 10 100 1.0 10 Rate of decay of forward current dIF/dt - (A/µs) 100 Fig.6 Maximum reverse recovery current Fig.5 Maximum stored charge 35 1.4 0.06 2 1.3 1.2 25 20 1.1 15 1.0 I2t I2t value - (A2s x 106) Peak half sine forward current - (kA) 30 10 0.9 5 0.8 0 1 10 1 ms 2 3 5 10 20 0.7 50 Cycles at 50Hz Thermal resistance, Rth(j-c) - (°C/W) I2t = Î2 x t 0.05 0.04 0.03 0.02 0.01 0 0.001 0.01 0.1 1 10 Time - (Seconds) 100 1000 Duration Fig.7 Surge (non-repetitive) forward current vs time (with 50% VRRM @ Tc - 150˚C) Fig.8 Transient thermal impedance - dc 4/7 www.dynexsemi.com MP04HB910 Maximum permissble case temperature - (°C) 90 30° 60° 90° 120° 180° DC 80 70 60 50 40 30 20 10 0 200 400 600 800 1000 1200 1400 Forward current (Average, per arm), IF(AV) - (A) 1600 Fig.9 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz 5/7 www.dynexsemi.com MP04HB910 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Recommended fixings for mounting: M6 socket head cap screws. Nominal weight: 1580g Module outline type code: MP04 6/7 www.dynexsemi.com MP04HB910 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5425-1 Issue No. 1.2 February 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 7/7 www.dynexsemi.com