TI TMP112AIDRLT

TMP112
TM
P1
12
www.ti.com ......................................................................................................................................................... SBOS473B – MARCH 2009 – REVISED JUNE 2009
High-Accuracy, Low-Power, Digital Temperature Sensor
With SMBus™/Two-Wire Serial Interface in SOT563
0.30
0.22
0.14
0.06
-0.02
•
-0.10
•
•
•
•
•
TEMPERATURE ERROR AT +25°C
-0.18
•
The TMP112 is ideal for extended temperature
measurement
in
communication,
computer,
consumer,
environmental,
industrial,
and
instrumentation applications. It is specified for
operation over a temperature range of –40°C to
+125°C.
-0.26
•
PORTABLE AND BATTERY-POWERED
APPLICATIONS
POWER-SUPPLY TEMPERATURE
MONITORING
COMPUTER PERIPHERAL THERMAL
PROTECTION
NOTEBOOK COMPUTERS
BATTERY MANAGEMENT
OFFICE MACHINES
THERMOSTAT CONTROLS
ELECTROMECHANICAL DEVICE
TEMPERATURES
GENERAL TEMPERATURE MEASUREMENTS:
Industrial Controls
Test Equipment
Medical Instrumentation
The TMP112 features both SMBus and two-wire
interface compatibility, and allows up to four devices
on one bus. It also features an SMBus alert function.
-0.34
•
The TMP112 is a two-wire, serial output temperature
sensor available in a tiny SOT563 package. Requiring
no external components, the TMP112 is capable of
reading temperatures to a resolution of 0.0625°C.
The TMP112 slope-specification allows users to
calibrate for higher accuracy.
-0.42
APPLICATIONS
DESCRIPTION
Population
• TINY SOT563 PACKAGE
• ACCURACY:
0.5°C (max) from 0°C to +65°C
1.0°C (max) from –40°C to +125°C
• LOW QUIESCENT CURRENT:
10µA Active (max), 1µA Shutdown (max)
• SUPPLY RANGE: 1.4V to 3.6V
• RESOLUTION: 12 Bits
• DIGITAL OUTPUT: Two-Wire Serial Interface
23
-0.50
FEATURES
1
Temperature Error (°C)
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SMBus is a trademark of Intel, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TMP112
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION (1)
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP112
SOT563
DRL
OBS
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
TMP112
UNIT
Supply Voltage
5
V
–0.5 to +5
V
Input Voltage, Pins 1, 4, and 6
Input Voltage, Pin 3
–0.5 to (VS) + 0.5
V
Operating Temperature
–55 to +150
°C
Storage Temperature
–60 to +150
°C
Junction Temperature
+150
°C
Human Body Model (HBM)
2000
V
Charged Device Model (CDM)
1000
V
Machine Model (MM)
200
V
ESD Rating
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
PIN CONFIGURATION
DRL PACKAGE
SOT563
(TOP VIEW)
1
GND
2
ALERT
3
OBS
2
SCL
6
SDA
5
V+
4
ADD0
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ELECTRICAL CHARACTERISTICS
At TA = +25°C and VS = +1.4V to +3.6V, unless otherwise noted.
TMP112
PARAMETER
CONDITIONS
MIN
+25°C, VS = 3.3V
–0.5
0°C to +65°C, VS = 3.3V
–0.5
–40°C to +125°C
–1.0
TYP
MAX
UNIT
+125
°C
+0.3
°C
+0.5
°C
TEMPERATURE INPUT
Range
–40
Accuracy (Temperature Error)
vs Supply
Long-Term Stability
–0.1
1.0
°C
±0.25
°C/V
–40°C to +125°C
+0.0625
3000 Hours
<1
LSB
0.0625
°C
Resolution (LSB)
DIGITAL INPUT/OUTPUT
Input Logic Levels:
VIH
VIL
Input Current
IIN
0.7 (V+)
3.6
–0.5
0.3 (V+)
V
1
µA
0 < VIN < 3.6V
V
Output Logic Levels:
VOL SDA
VOL ALERT
V+ > 2V, IOL = 3mA
0
0.4
V
V+ < 2V, IOL = 3mA
0
0.2 (V+)
V
V+ > 2V, IOL = 3mA
0
0.4
V
V+ < 2V, IOL = 3mA
0
Resolution
0.2 (V+)
12
Conversion Time
26
Conversion Modes
V
Bits
35
ms
CR1 = 0, CR0 = 0
0.25
Conv/s
CR1 = 0, CR0 = 1
1
Conv/s
CR1 = 1, CR0 = 0 (default)
4
Conv/s
CR1 = 1, CR0 = 1
8
Conv/s
Timeout Time
30
40
ms
+3.6
V
10
µA
POWER SUPPLY
Operating Supply Range
Quiescent Current
Shutdown Current
+1.4
IQ
Serial Bus Inactive, CR1 = 1, CR0 = 0 (default)
7
Serial Bus Active, SCL Frequency = 400kHz
15
Serial Bus Active, SCL Frequency = 3.4MHz
85
Serial Bus Inactive
0.5
Serial Bus Active, SCL Frequency = 400kHz
10
µA
Serial Bus Active, SCL Frequency = 3.4MHz
80
µA
ISD
µA
µA
1
µA
TEMPERATURE RANGE
Specified Range
–40
+125
°C
Operating Range
–55
+150
°C
Thermal Resistance
θJA
SOT563
JEDEC Low-K Board
260
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3
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TYPICAL CHARACTERISTICS
At TA = +25°C and V+ = 3.3V, unless otherwise noted.
ACCURACY vs SUPPLY
-0.250
-0.225
-0.200
-0.175
-0.150
-0.125
-0.100
-0.075
-0.050
-0.025
0
0.025
0.050
0.075
0.100
0.125
0.150
0.175
0.200
0.225
0.250
0.30
0.22
0.14
0.06
-0.02
-0.10
-0.18
-0.26
-0.34
-0.42
-0.50
Population
Population
TEMPERATURE ERROR AT +25°C
Accuracy vs Supply (°C/V)
Figure 1.
Figure 2.
TEMPERATURE ERROR vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
(Four Conversions per Second)
1.0
20
0.8
18
0.6
16
0.4
14
0.2
12
IQ (mA)
Temperature Error (°C)
Temperature Error (°C)
0
-0.2
-0.4
6
-0.6
4
-0.8
2
1.4V Supply
0
-50
0
-25
25
75
50
100
125
-60 -40 -20
0
20
40
60
80
100 120 140 160
Temperature (°C)
Temperature (°C)
Figure 3.
Figure 4.
SHUTDOWN CURRENT vs TEMPERATURE
QUIESCENT CURRENT vs BUS FREQUENCY
(Temperature at 3.3V Supply)
10
100
9
90
8
80
7
70
6
60
5
3.6V Supply
IQ (mA)
ISD (mA)
3.6V Supply
8
-1.0
50
40
4
3
+125°C
30
1.4V Supply
2
20
1
10
+25°C
-55°C
0
0
-60 -40 -20
4
10
0
20
40
60
80
100 120 140 160
1k
10k
100k
Temperature (°C)
Bus Frequency (Hz)
Figure 5.
Figure 6.
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1M
10M
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C and V+ = 3.3V, unless otherwise noted.
CONVERSION TIME vs TEMPERATURE
40
Conversion Time (ms)
38
36
34
32
30
1.4V Supply
28
26
3.6V Supply
24
22
20
-60 -40 -20
0
20
40
60
80
100 120 140 160
Temperature (°C)
Figure 7.
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APPLICATION INFORMATION
The TMP112 is a digital temperature sensor that is
optimal
for
thermal-management
and
thermal-protection applications. A block diagram of
the TMP112 is shown in Figure 8. The TMP112 is
two-wire- and SMBus interface-compatible, and is
specified over an operating temperature range of
–40°C to +125°C. Figure 9 illustrates the ESD
protection circuitry contained in the TMP112.
Pull-up resistors are required on SCL, SDA, and
ALERT. A 0.01µF bypass capacitor is recommended,
as shown in Figure 10.
V+
0.01mF
5
Temperature
SCL
1
Diode
Temp.
Sensor
Control
Logic
6
SDA
To
Two-Wire
Controller
SCL
SDA
4
1
6
TMP112
3
ADD0
ALERT
(Output)
2
GND
2
DS
A/D
Converter
Serial
Interface
OSC
Config.
and Temp.
Register
5
NOTE: SCL, SDA, and ALERT
pins require pull-up resistors.
V+
GND
Figure 10. Typical Connections
ALERT
3
4
ADD0
TMP112
Figure 8. Internal Block Diagram
TMP112
SCL
SDA
The temperature sensor in the TMP112 is the chip
itself. Thermal paths run through the package leads
as well as the plastic package. The lower thermal
resistance of metal causes the leads to provide the
primary thermal path.
To maintain accuracy in applications that require air
or surface temperature measurement, care should be
taken to isolate the package and leads from ambient
air temperature. A thermally-conductive adhesive is
helpful in achieving accurate surface temperature
measurement.
V+
GND
Core
V+
ALERT
A0
Figure 9. Equivalent Internal ESD Circuitry
6
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POINTER REGISTER
TEMPERATURE REGISTER
Figure 11 shows the internal register structure of the
TMP112. The 8-bit Pointer Register of the device is
used to address a given data register. The Pointer
Register uses the two LSBs (see Table 11) to identify
which of the data registers should respond to a read
or write command. Table 1 identifies the bits of the
Pointer Register byte. During a write command, P2
through P7 must always be '0'. Table 2 describes the
pointer address of the registers available in the
TMP112. The power-up reset value of P1/P0 is '00'.
By default, the TMP112 reads the temperature on
power-up.
The Temperature Register of the TMP112 is
configured as a 12-bit, read-only register
(Configuration Register EM bit = '0'; see the Extended
Mode section), or as a 13-bit, read-only register
(Configuration Register EM bit = '1') that stores the
output of the most recent conversion. Two bytes must
be read to obtain data, and are described in Table 3
and Table 4. Note that byte 1 is the most significant
byte (MSB), followed by byte 2, the least significant
byte (LSB). The first 12 bits (13 bits in Extended
mode) are used to indicate temperature. The least
significant byte does not have to be read if that
information is not needed. The data format for
temperature is summarized in Table 5 and Table 6.
One LSB equals 0.0625°C. Negative numbers are
represented in binary twos complement format.
Following power-up or reset, the Temperature
Register reads 0°C until the first conversion is
complete. Bit D0 of byte 2 indicates Normal mode
(EM bit = '0') or Extended mode (EM bit = '1'), and
can be used to distinguish between the two
temperature register data formats. The unused bits in
the Temperature Register always read '0'.
Pointer
Register
Temperature
Register
SCL
Configuration
Register
I/O
Control
Interface
TLOW
Register
Table 3. Byte 1 of Temperature Register(1)
SDA
THIGH
Register
D7
D6
D5
D4
D3
D2
D1
T11
T10
T9
T8
T7
T6
T5
D0
T4
(T12)
(T11)
(T10)
(T9)
(T8)
(T7)
(T6)
(T5)
(1) Extended mode 13-bit configuration shown in parentheses.
Table 4. Byte 2 of Temperature Register(1)
Figure 11. Internal Register Structure
Table 1. Pointer Register Byte
P7
P6
P5
P4
P3
P2
0
0
0
0
0
0
P1
P0
D7
D6
D5
D4
D3
D2
D1
T3
T2
T1
T0
0
0
0
D0
0
(T4)
(T3)
(T2)
(T1)
(T0)
(0)
(0)
(1)
(1) Extended mode 13-bit configuration shown in parentheses.
Register Bits
Table 2. Pointer Addresses
P1
P0
REGISTER
0
0
Temperature Register (Read Only)
0
1
Configuration Register (Read/Write)
1
0
TLOW Register (Read/Write)
1
1
THIGH Register (Read/Write)
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Table 5. 12-Bit Temperature Data Format (1)
(1)
TEMPERATURE (°C)
DIGITAL OUTPUT (BINARY)
HEX
128
0111 1111 1111
7FF
127.9375
0111 1111 1111
7FF
100
0110 0100 0000
640
80
0101 0000 0000
500
75
0100 1011 0000
4B0
50
0011 0010 0000
320
25
0001 1001 0000
190
0.25
0000 0000 0100
004
0
0000 0000 0000
000
–0.25
1111 1111 1100
FFC
–25
1110 0111 0000
E70
–55
1100 1001 0000
C90
The resolution for the Temp ADC in Internal Temperature mode is 0.0625°C/count.
For positive temperatures (for example, +50°C):
Twos complement is not performed on positive numbers. Therefore, simply convert the number to binary
code with the 12-bit, left-justified format, and MSB = 0 to denote a positive sign.
Example: (+50°C)/(0.0625°C/count) = 800 = 320h = 0011 0010 0000
For negative temperatures (for example, –25°C):
Generate the twos complement of a negative number by complementing the absolute value binary number
and adding 1. Denote a negative number with MSB = 1.
Example: (|–25°C|)/(0.0625°C/count) = 400 = 190h = 0001 1001 0000
Twos complement format: 1110 0110 1111 + 1 = 1110 0111 0000
Table 6. 13-Bit Temperature Data Format
8
TEMPERATURE (°C)
DIGITAL OUTPUT (BINARY)
HEX
150
0 1001 0110 0000
0960
128
0 1000 0000 0000
0800
127.9375
0 0111 1111 1111
07FF
100
0 0110 0100 0000
0640
80
0 0101 0000 0000
0500
75
0 0100 1011 0000
04B0
50
0 0011 0010 0000
0320
25
0 0001 1001 0000
0190
0.25
0 0000 0000 0100
0004
0
0 0000 0000 0000
0000
–0.25
1 1111 1111 1100
1FFC
–25
1 1110 0111 0000
1E70
–55
1 1100 1001 0000
1C90
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CONFIGURATION REGISTER
CONVERSION RATE
The Configuration Register is a 16-bit read/write
register used to store bits that control the operational
modes of the temperature sensor. Read/write
operations are performed MSB first. The format and
power-up/reset values of the Configuration Register
are shown in Table 7. For compatibility, the first byte
corresponds to the Configuration Register in the
TMP75 and TMP275. All registers are updated byte
by byte.
The conversion rate bits, CR1 and CR0, configure the
TMP112 for conversion rates of 8Hz, 4Hz, 1Hz, or
0.25Hz. The default rate is 4Hz. The TMP112 has a
typical conversion time of 26ms. To achieve different
conversion rates, the TMP112 makes a conversion
and then powers down and waits for the appropriate
delay set by CR1 and CR0. Table 8 shows the
settings for CR1 and CR0.
Table 8. Conversion Rate Settings
Table 7. Configuration and Power-Up/Reset
Formats
BYTE
1
2
D7
D6
D5
D4
D3
D2
D1
D0
OS
R1
R0
F1
F0
POL
TM
SD
0
1
1
0
0
0
0
0
CR1
CR0
AL
EM
0
0
0
0
1
0
1
0
0
0
0
0
EXTENDED MODE (EM)
The Extended mode bit configures the device for
Normal mode operation (EM = 0) or Extended mode
operation (EM = 1). In Normal mode, the
Temperature Register and high- and low-limit
registers use a 12-bit data format. Normal mode is
used to make the TMP112 compatible with the
TMP75.
CR1
CR0
CONVERSION RATE
0
0
0.25Hz
0
1
1Hz
1
0
4Hz (default)
1
1
8Hz
After a power-up or general-call reset, the TMP112
immediately starts a conversion, as shown in
Figure 12. The first result is available after 26ms
(typical). The active quiescent current during
conversion is 40µA (typical at +27°C). The quiescent
current during delay is 2.2µA (typical at +27°C).
Delay
26ms
Extended mode (EM = 1) allows measurement of
temperatures above +128°C by configuring the
Temperature Register, and high- and low-limit
registers, for 13-bit data format.
ALERT (AL Bit)
(1)
26ms
Startup
Start of
Conversion
(1) Delay is set by CR1 and CR0.
The AL bit is a read-only function. Reading the AL bit
provides information about the comparator mode
status. The state of the POL bit inverts the polarity of
data returned from the AL bit. For POL = 0, the AL bit
reads as '1' until the temperature equals or exceeds
THIGH for the programmed number of consecutive
faults, causing the AL bit to read as '0'. The AL bit
continues to read as '0' until the temperature falls
below TLOW for the programmed number of
consecutive faults, when it again reads as '1'. The
status of the TM bit does not affect the status of the
AL bit.
Figure 12. Conversion Start
SHUTDOWN MODE (SD)
The Shutdown mode bit saves maximum power by
shutting down all device circuitry other than the serial
interface, reducing current consumption to typically
less than 0.5µA. Shutdown mode is enabled when
the SD bit = '1'; the device shuts down when current
conversion is completed. When SD = '0', the device
maintains a continuous conversion state.
THERMOSTAT MODE (TM)
The Thermostat mode bit indicates to the device
whether to operate in Comparator mode (TM = 0) or
Interrupt mode (TM = 1). For more information on
Comparator and Interrupt modes, see the High- and
Low-Limit Registers section.
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POLARITY (POL)
CONVERTER RESOLUTION (R1/R0)
The Polarity bit allows the user to adjust the polarity
of the ALERT pin output. If POL = 0, the ALERT pin
becomes active low, as shown in Figure 13. For POL
= 1, the ALERT pin becomes active high, and the
state of the ALERT pin is inverted.
R1/R0 are read-only bits. The TMP112 converter
resolution is set on start up to '11'. This sets the
temperature register to a 12 bit-resolution.
THIGH
Measured
Temperature
TLOW
TMP112 ALERT PIN
(Comparator Mode)
POL = 0
The TMP112 features a One-Shot Temperature
Measurement mode. When the device is in Shutdown
mode, writing a '1' to the OS bit starts a single
temperature conversion. During the conversion, the
OS bit reads '0'. The device returns to the shutdown
state at the completion of the single conversion. After
the conversion, the OS bit reads '1'. This feature is
useful for reducing power consumption in the
TMP112 when continuous temperature monitoring is
not required.
As a result of the short conversion time, the TMP112
can achieve a higher conversion rate. A single
conversion typically takes 26ms and a read can take
place in less than 20µs. When using One-Shot mode,
30 or more conversions per second are possible.
TMP112 ALERT PIN
(Interrupt Mode)
POL = 0
TMP112 ALERT PIN
(Comparator Mode)
POL = 1
TMP112 ALERT PIN
(Interrupt Mode)
POL = 1
HIGH- AND LOW-LIMIT REGISTERS
Read
Read
Read
Time
Figure 13. Output Transfer Function Diagrams
FAULT QUEUE (F1/F0)
A fault condition exists when the measured
temperature exceeds the user-defined limits set in the
THIGH and TLOW registers. Additionally, the number of
fault conditions required to generate an alert may be
programmed using the fault queue. The fault queue is
provided to prevent a false alert as a result of
environmental noise. The fault queue requires
consecutive fault measurements in order to trigger
the alert function. Table 9 defines the number of
measured faults that may be programmed to trigger
an alert condition in the device. For THIGH and TLOW
register format and byte order, see the High- and
Low-Limit Registers section.
Table 9. TMP112 Fault Settings
10
ONE-SHOT/CONVERSION READY (OS)
F1
F0
CONSECUTIVE FAULTS
0
0
1
0
1
2
1
0
4
1
1
6
In Comparator mode (TM = 0), the ALERT pin
becomes active when the temperature equals or
exceeds the value in THIGH and generates a
consecutive number of faults according to fault bits
F1 and F0. The ALERT pin remains active until the
temperature falls below the indicated TLOW value for
the same number of faults.
In Interrupt mode (TM = 1), the ALERT pin becomes
active when the temperature equals or exceeds the
value in THIGH for a consecutive number of fault
conditions (as shown in Table 9). The ALERT pin
remains active until a read operation of any register
occurs, or the device successfully responds to the
SMBus Alert Response address. The ALERT pin is
also cleared if the device is placed in Shutdown
mode. Once the ALERT pin is cleared, it becomes
active again only when temperature falls below TLOW,
and remains active until cleared by a read operation
of any register or a successful response to the
SMBus Alert Response address. Once the ALERT
pin is cleared, the above cycle repeats, with the
ALERT pin becoming active when the temperature
equals or exceeds THIGH. The ALERT pin can also be
cleared by resetting the device with the General Call
Reset command. This action also clears the state of
the internal registers in the device, returning the
device to Comparator mode (TM = 0).
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Both operating modes are represented in Figure 13.
Table 10 and Table 11 describe the format for the
THIGH and TLOW registers. Note that the most
significant byte is sent first, followed by the least
significant byte. Power-up reset values for THIGH and
TLOW are:
• THIGH = +80°C
• TLOW = +75°C
The format of the data for THIGH and TLOW is the same
as for the Temperature Register.
Table 10. Bytes 1 and 2 of THIGH Register(1)
BYTE
1
BYTE
2
D7
D6
D5
D4
D3
D2
D1
SERIAL BUS ADDRESS
H11
H10
H9
H8
H7
H6
H5
H4
(H12)
(H11)
(H10)
(H9)
(H8)
(H7)
(H6)
(H5)
D7
D6
D5
D4
D3
D2
D1
D0
H3
H2
H1
H0
0
0
0
0
(H4)
(H3)
(H2)
(H1)
(H0)
(0)
(0)
(0)
Table 11. Bytes 1 and 2 of TLOW Register(1)
1
BYTE
2
The TMP112 operates as a slave device only on the
two-wire bus and SMBus. Connections to the bus are
made via the open-drain I/O lines SDA and SCL. The
SDA and SCL pins feature integrated spike
suppression filters and Schmitt triggers to minimize
the effects of input spikes and bus noise. The
TMP112 supports the transmission protocol for both
fast (1kHz to 400kHz) and high-speed (1kHz to
3.4MHz) modes. All data bytes are transmitted MSB
first.
D0
(1) Extended mode 13-bit configuration shown in parenthesis.
BYTE
SERIAL INTERFACE
D7
D6
D5
D4
D3
D2
D1
D0
L11
L10
L9
L8
L7
L6
L5
L4
(L12)
(L11)
(L10)
(L9)
(L8)
(L7)
(L6)
(L5)
D7
D6
D5
D4
D3
D2
D1
D0
L3
L2
L1
L0
0
0
0
0
(L4)
(L3)
(L2)
(L1)
(L0)
(0)
(0)
(0)
To communicate with the TMP112, the master must
first address slave devices via a slave address byte.
The slave address byte consists of seven address
bits, and a direction bit indicating the intent of
executing a read or write operation.
The TMP112 features an address pin to allow up to
four devices to be addressed on a single bus.
Table 12 describes the pin logic levels used to
properly connect up to four devices.
Table 12. Address Pin and Slave Addresses
DEVICE TWO-WIRE
ADDRESS
A0 PIN CONNECTION
1001000
Ground
1001001
V+
1001010
SDA
1001011
SCL
(1) Extended mode 13-bit configuration shown in parenthesis.
BUS OVERVIEW
The device that initiates the transfer is called a
master, and the devices controlled by the master are
slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls
the bus access, and generates the START and STOP
conditions.
To address a specific device, a START condition is
initiated, indicated by pulling the data-line (SDA) from
a high to low logic level while SCL is high. All slaves
on the bus shift in the slave address byte on the
rising edge of the clock, with the last bit indicating
whether a read or write operation is intended. During
the ninth clock pulse, the slave being addressed
responds to the master by generating an
Acknowledge and pulling SDA low.
Data transfer is then initiated and sent over eight
clock pulses followed by an Acknowledge Bit. During
data transfer SDA must remain stable while SCL is
high, because any change in SDA while SCL is high
is interpreted as a START or STOP signal.
WRITING/READING OPERATION
Accessing a particular register on the TMP112 is
accomplished by writing the appropriate value to the
Pointer Register. The value for the Pointer Register is
the first byte transferred after the slave address byte
with the R/W bit low. Every write operation to the
TMP112 requires a value for the Pointer Register
(see Figure 16).
When reading from the TMP112, the last value stored
in the Pointer Register by a write operation is used to
determine which register is read by a read operation.
To change the register pointer for a read operation, a
new value must be written to the Pointer Register.
This action is accomplished by issuing a slave
address byte with the R/W bit low, followed by the
Pointer Register byte. No additional data are
required. The master can then generate a START
condition and send the slave address byte with the
R/W bit high to initiate the read command. See
Figure 17 for details of this sequence. If repeated
Once all data have been transferred, the master
generates a STOP condition indicated by pulling SDA
from low to high, while SCL is high.
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reads from the same register are desired, it is not
necessary to continually send the Pointer Register
bytes, because the TMP112 remembers the Pointer
Register value until it is changed by the next write
operation.
For POL = '0', this bit is low if the temperature is
greater than or equal to THIGH; this bit is high if the
temperature is less than TLOW. The polarity of this bit
is inverted if POL = '1'. Refer to Figure 18 for details
of this sequence.
Note that register bytes are sent with the most
significant byte first, followed by the least significant
byte.
If multiple devices on the bus respond to the SMBus
Alert command, arbitration during the slave address
portion of the SMBus Alert command determines
which device clears its ALERT status. The device
with the lowest two-wire address wins the arbitration.
If the TMP112 wins the arbitration, its ALERT pin
becomes inactive at the completion of the SMBus
Alert command. If the TMP112 loses the arbitration,
its ALERT pin remains active.
SLAVE MODE OPERATIONS
The TMP112 can operate as a slave receiver or slave
transmitter. As a slave device, the TMP112 never
drives the SCL line.
Slave Receiver Mode:
GENERAL CALL
The first byte transmitted by the master is the slave
address, with the R/W bit low. The TMP112 then
acknowledges reception of a valid address. The next
byte transmitted by the master is the Pointer
Register. The TMP112 then acknowledges reception
of the Pointer Register byte. The next byte or bytes
are written to the register addressed by the Pointer
Register. The TMP112 acknowledges reception of
each data byte. The master can terminate data
transfer by generating a START or STOP condition.
The TMP112 responds to a two-wire General Call
address (0000000) if the eighth bit is '0'. The device
acknowledges the General Call address and
responds to commands in the second byte. If the
second byte is 00000110, the TMP112 internal
registers are reset to power-up values. The TMP112
does not support the General Address acquire
command.
Slave Transmitter Mode:
In order for the two-wire bus to operate at frequencies
above 400kHz, the master device must issue an
Hs-mode master code (00001xxx) as the first byte
after a START condition to switch the bus to
high-speed operation. The TMP112 does not
acknowledge this byte, but switches its input filters on
SDA and SCL and its output filters on SDA to operate
in Hs-mode, allowing transfers at up to 3.4MHz. After
the Hs-mode master code has been issued, the
master transmits a two-wire slave address to initiate a
data transfer operation. The bus continues to operate
in Hs-mode until a STOP condition occurs on the bus.
Upon receiving the STOP condition, the TMP112
switches the input and output filters back to
fast-mode operation.
The first byte transmitted by the master is the slave
address, with the R/W bit high. The slave
acknowledges reception of a valid slave address. The
next byte is transmitted by the slave and is the most
significant byte of the register indicated by the Pointer
Register. The master acknowledges reception of the
data byte. The next byte transmitted by the slave is
the least significant byte. The master acknowledges
reception of the data byte. The master can terminate
data transfer by generating a Not-Acknowledge on
reception of any data byte, or generating a START or
STOP condition.
SMBus ALERT FUNCTION
The TMP112 supports the SMBus Alert function.
When the TMP112 operates in Interrupt mode (TM =
'1'), the ALERT pin may be connected as an SMBus
Alert signal. When a master senses that an ALERT
condition is present on the ALERT line, the master
sends an SMBus Alert command (00011001) to the
bus. If the ALERT pin is active, the device
acknowledges the SMBus Alert command and
responds by returning its slave address on the SDA
line. The eighth bit (LSB) of the slave address byte
indicates if the ALERT condition was caused by the
temperature exceeding THIGH or falling below TLOW.
12
HIGH-SPEED (Hs) MODE
TIMEOUT FUNCTION
The TMP112 resets the serial interface if SCL is held
low for 30ms (typ). The TMP112 releases the bus if it
is pulled low and waits for a START condition. To
avoid activating the timeout function, it is necessary
to maintain a communication speed of at least 1kHz
for SCL operating frequency.
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NOISE
The TMP112 is a very low-power device and
generates very low noise on the supply bus. Applying
an RC filter to the V+ pin of the TMP112 can further
reduce any noise that the TMP112 might propagate
to other components. RF in Figure 14 should be less
than 5kΩ and CF should be greater than 10nF.
Supply Voltage
TMP112
RF £ 5kW
SCL
SDA
GND
V+
ALERT
CF ³ 10nF
ADD0
Figure 14. Noise Reduction Techniques
TIMING DIAGRAMS
The TMP112 is two-wire and SMBus compatible.
Figure 15 to Figure 18 describe the various
operations on the TMP112. Parameters for Figure 15
are defined in Table 13. Bus definitions are:
Start Data Transfer: A change in the state of the
SDA line, from high to low, while the SCL line is high,
defines a START condition. Each data transfer is
initiated with a START condition.
Stop Data Transfer: A change in the state of the
SDA line from low to high while the SCL line is high
defines a STOP condition. Each data transfer is
terminated with a repeated START or STOP
condition.
Data Transfer: The number of data bytes transferred
between a START and a STOP condition is not
limited and is determined by the master device. It is
also possible to use the TMP112 for single byte
updates. To update only the MS byte, terminate the
communication by issuing a START or STOP
communication on the bus.
Acknowledge: Each receiving device, when
addressed, is obliged to generate an Acknowledge
bit. A device that acknowledges must pull down the
SDA line during the Acknowledge clock pulse in such
a way that the SDA line is stable low during the high
period of the Acknowledge clock pulse. Setup and
hold times must be taken into account. On a master
receive, the termination of the data transfer can be
signaled
by
the
master
generating
a
Not-Acknowledge ('1') on the last byte that has been
transmitted by the slave.
Bus Idle: Both SDA and SCL lines remain high.
Table 13. Timing Diagram Definitions
FAST MODE
PARAMETER
HIGH-SPEED MODE
TEST CONDITIONS
MIN
MAX
MIN
MAX
UNIT
f(SCL)
SCL Operating Frequency, VS > 1.7V
0.001
0.4
0.001
3.4
MHz
f(SCL)
SCL Operating Frequency, VS < 1.7V
0.001
0.4
0.001
2.75
MHz
t(BUF)
Bus Free Time Between STOP and START
Condition
600
160
ns
t(HDSTA)
Hold time after repeated START condition.
After this period, the first clock is generated.
100
100
ns
t(SUSTA)
Repeated START Condition Setup Time
100
100
ns
t(SUSTO)
STOP Condition Setup Time
100
100
ns
t(HDDAT)
Data Hold Time
0
0
ns
t(SUDAT)
Data Setup Time
100
10
ns
t(LOW)
SCL Clock Low Period, VS > 1.7V
1300
160
ns
t(LOW)
SCL Clock Low Period, VS < 1.7V
1300
200
ns
t(HIGH)
SCL Clock High Period
600
60
ns
tF
Clock/Data Fall Time
300
tR
Clock/Data Rise Time
300
tR
Clock/Data Rise Time for SCLK ≤ 100kHz
1000
ns
160
ns
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TWO-WIRE TIMING DIAGRAMS
t(LOW)
tF
tR
t(HDSTA)
SCL
t(HDSTA)
t(HIGH)
t(SUSTO)
t(SUSTA)
t(HDDAT)
t(SUDAT)
SDA
t(BUF)
P
S
S
P
Figure 15. Two-Wire Timing Diagram
1
9
1
9
¼
SCL
SDA
1
0
0
1
0
A1(1)
A0(1)
R/W
Start By
Master
0
0
0
0
0
0
P1
¼
P0
ACK By
TMP112
ACK By
TMP112
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
9
1
1
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
ACK By
TMP112
D1
D0
ACK By
TMP112
Stop By
Master
Frame 4 Data Byte 2
Frame 3 Data Byte 1
NOTE: (1) The values of A0 and A1 are determined by the ADD0 pin.
Figure 16. Two-Wire Timing Diagram for Write Word Format
14
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1
9
1
9
¼
SCL
SDA
1
0
0
1
0
A1
(1)
A0
(1)
R/W
Start By
Master
0
0
0
0
0
0
P1
P0
ACK By
TMP112
Stop By
Master
ACK By
TMP112
Frame 1 Two-Wire Slave Address Byte
Frame 2 Pointer Register Byte
1
9
1
9
¼
SCL
(Continued)
SDA
(Continued)
1
0
0
1
0
A1
(1)
A0
(1)
R/W
Start By
Master
D7
D6
D5
D4
D3
D1
¼
D0
From
TMP112
ACK By
TMP112
Frame 3 Two-Wire Slave Address Byte
1
D2
ACK By
Master
(2)
Frame 4 Data Byte 1 Read Register
9
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
From
TMP112
ACK By
Master
Stop By
Master
(3)
Frame 5 Data Byte 2 Read Register
NOTE: (1) The values of A0 and A1 are determined by the ADD0 pin.
(2) Master should leave SDA high to terminate a single-byte read operation.
(3) Master should leave SDA high to terminate a two-byte read operation.
Figure 17. Two-Wire Timing Diagram for Read Word Format
ALERT
1
9
1
9
SCL
SDA
0
0
0
1
Start By
Master
1
0
0
R/W
1
0
0
1
A1
ACK By
TMP112
Frame 1 SMBus ALERT Response Address Byte
A0
From
TMP112
Status
NACK By
Master
Stop By
Master
Frame 2 Slave Address From TMP112
NOTE: (1) The values of A0 and A1 are determined by the ADD0 pin.
Figure 18. Timing Diagram for SMBus ALERT
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CALIBRATING FOR IMPROVED ACCURACY
There are many temperature monitoring applications that require better than 0.5°C accuracy over a limited
temperature range. Knowing the offset of a temperature sensor at a given temperature in conjunction with the
average temperature span (slope) error over a fixed range makes it possible to achieve this improved accuracy.
The TMP112 has three distinct slope regions that conservatively approximate its inherent curvature:
1. Slope1 applies over –40°C to +25°C
2. Slope2 applies over +25°C to +85°C
3. Slope3 applies over +85°C to +125°C
These slopes are defined in Table 14 and shown in Figure 19.It is important to note that each slope is increasing
with respect to 25°C.
Table 14. Specifications for User-Calibrated Systems
(1)
PARAMETER
CONDITION
MIN
MAX
UNIT
Average Slope
(Temperature Error vs
Temperature) (1)
VS = +3.3, –40°C to +25°C
VS = +3.3, +25°C to +85°C
–7
0
m°C/°C
0
+5
VS = +3.3, +85°C to +125°C
m°C/°C
0
+8
m°C/°C
User-calibrated temperature accuracy can be within ±1LSB because of quantization noise.
0.8
Slope3MAX
Slope1MAX
Temperature Error (°C)
0.6
Slope2MAX
0.4
0.2
0
-0.2
-0.4
Slope1MIN
Slope2MIN
Slope3MIN
-0.6
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Temperature (°C)
Figure 19. Accuracy and Slope Curves versus Temperature
Equation 1 determines the worst-case accuracy at a specific temperature:
Accuracy(worst-case) = Accuracy(25°C) + DT ´ Slope
16
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EXAMPLE 1: Finding Worst-Case Accuracy From –15°C to +50°C
As an example, if the user is concerned only about the temperature accuracy between –15°C to +50°C, the
worst-case accuracy could be determined by using the two slope calculations of Equation 2 and Equation 4:
AccuracyMAX (-15°C to 25°C) = Accuracy(25°C) + DT ´ Slope1MAX
AccuracyMAX (-15°C to 25°C) = 0.3°C + (-15°C - 25°C) -7
(2)
m°C
°C
= +0.58°C
(3)
AccuracyMAX (25°C to 50°C) = Accuracy(25°C) + DT ´ Slope2MAX
AccuracyMAX (25°C to 50°C) = 0.3°C + (50°C - 25°C) ´ 5
m°C
°C
(4)
= +0.425°C
(5)
The same calculations must be applied to the minimum case:
AccuracyMIN (-15°C to 25°C) = Accuracy(25°C) + DT ´ Slope1MIN
(6)
m°C
AccuracyMIN (-15°C to 25°C) = -0.5°C + (-15°C - 25°C) 0
°C
(7)
= -0.5°C
AccuracyMIN (25°C to 50°C) = Accuracy(25°C) + DT ´ Slope2MIN
AccuracyMIN (25°C to 50°C) = -0.5°C + (50°C - 25°C) 0
m°C
°C
(8)
= -0.5°C
(9)
Based on the above calculations, a user can expect a worst-case accuracy of +0.58°C to –0.5°C in the
temperature range of –15°C to +50°C.
EXAMPLE 2: Finding Worst-Case Accuracy From +25°C to +100°C
If the desired temperature range falls in the region of slope 3, it is necessary to first calculate the worst-case
value from +25°C to +85°C and add it to the change in temperature multiplied by the span error of slope 3. As an
example, consider the temperature range of +25°C to +125°C as shown in Equation 10:
AccuracyMAX (25°C to 100°C) = Accuracy(25°C) + DT ´ Slope2MAX + DT ´ Slope3MAX
(10)
AccuracyMAX (25°C to 100°C) = 0.3°C + (85°C - 25°C) 4.5
m°C
°C
+ (100°C - 85°C) 8
m°C
°C
= +0.690°C
(11)
Performing the same calculation for the minimum case is shown in Equation 12:
AccuracyMIN (25°C to 100°C) = Accuracy(25°C) + DT ´ Slope2MIN + DT ´ Slope3MIN
m°C
AccuracyMIN (25°C to 100°C) = -0.5°C + (85°C - 25°C) 0
°C
m°C
+ (100°C - 85°C) 0
°C
(12)
= -0.5°C
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USING THE SLOPE SPECIFICATIONS WITH A
1-POINT CALIBRATION
The initial accuracy assurance at +25°C with the
slope regions provides an accuracy that is high
enough for most applications; however, if higher
accuracy is desired, this increase can be achieved
with a 1-point calibration at +25°C. This calibration
removes the offset at room temperature, thereby
reducing the source of error in a TMP112
temperature reading down to the curvature. Figure 20
shows the error of a calibrated TMP112.
0.8
Slope3MAX
Temperature Error (°C)
0.6
0.4
Slope1MAX
Slope2MAX
0.2
0
-0.2
Calibration at +25°C Removes Offset
Using the previous example temperature range of
0°C to +50°C, the worst-case temperature error is
now reduced to the worst-case slopes because the
offset at +25°C (that is, the maximum and minimum
temperature errors of +0.3°C and –0.5°C) is removed.
Therefore, a user can expect the worst-case accuracy
to improve to +0.175°C.
Power-Supply Level Contribution to Accuracy
The superior accuracy that can be achieved with the
TMP112 is complemented by its immunity to dc
variations from a 3.3V supply voltage. This immunity
is important because it spares the user from having to
use another LDO to produce 3.3V to achieve
accuracy. Nevertheless, the noise quantization that
results from changing supply can add some slight
change in temperature measurement accuracy. As an
example, if the user chooses to operate at 1.8V, the
worst-case expected change in accuracy can be
calculated by Equation 14:
AccuracyPSR = ±(VS - 3.3V) ´
-0.4
-0.6
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
(14)
+0.250°C
AccuracyPSR = ±(1.8V - 3.3V) ´
= +0.375°C
V
Temperature (°C)
(15)
Figure 20. Calibrated Accuracy and Slope Curves
versus Temperature
18
+0.250°C
V
This example is a worst-case accuracy contribution
as a result of variation in power supply that should be
added to the accuracy + slope maximum.
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2009) to Revision B .................................................................................................. Page
•
•
•
Changed footnote 1 of Table 14 .......................................................................................................................................... 16
Clarified Example 1; extended worst-case accuracy to be from –15°C to +50°C ............................................................... 17
Corrected Equation 15 ......................................................................................................................................................... 18
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Jun-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TMP112AIDRLR
ACTIVE
SOT
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMP112AIDRLT
ACTIVE
SOT
DRL
6
250
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jun-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TMP112AIDRLR
SOT
DRL
6
4000
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
TMP112AIDRLT
SOT
DRL
6
250
180.0
8.4
1.78
1.78
0.69
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jun-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP112AIDRLR
SOT
DRL
6
4000
202.0
201.0
28.0
TMP112AIDRLT
SOT
DRL
6
250
202.0
201.0
28.0
Pack Materials-Page 2
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