Product Guide 1211C Series Bi-Color Ultra Compact SMT LED ■ Features ■ Applications • Superbright, compact bicolor package • 1.6mm (L) x 1.5mm (W) x 0.7mm (H) • Mobile devices (cellular telephone, PDAs, pagers) • Telecommunications ■ Outline Dimensions Unit: mm Tolerances + 0.1 ■ Electro-Optical Characteristics Part No. Material Emitted Lens Color Color Luminous Intensity IV MIN. TYP. IF (Ta=25°C) Forward Voltage V Wavelength Peak λp TYP. Dominant λd TYP. Spectral Line Half Width λ ∆λ TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR (2 θ 1/2) GaAIAs Red (BR) 7.0 11.7 20 660 647 30 20 1.7 2.3 20 100 4 170° GaP Yellow-Green (PY) 7.0 11.7 20 570 572 30 20 2.1 2.8 20 100 4 150° GaAIAs Red (BR) 7.0 11.7 20 660 647 30 20 1.7 2.3 20 100 4 170° GaP Green (PG) 4.5 20 560 567 30 20 2.1 2.8 20 100 4 150° GaAlAs Red (BR) 7.0 11.7 20 660 647 30 20 1.7 2.3 20 100 4 170° GaP Pure Green (BG) 1.7 555 558 30 20 2.1 2.8 20 100 4 150° mA µA V Deg. BRPY1211C BRPG1211C BRBG1211C Units Milky White 6.4 2.4 mcd 20 mA nm mA V ■ Absolute Maximum Ratings Red (BR) (Ta=25°C) Yellow-Green (PY) Red (BR) Green (PG) Red (BR) Pure Green (BG) Units Item Symbol BRPY BRPG BRBG Pd 70 70 70 mW Forward Current IF 25 25 25 mA Peak Forward Current IFM 60 60 60 mA Reverse Voltage VR 4 4 4 V Power Dissipation Operating Temperature Topr -30 to +85 °C Storage Temperature Tstg -40 to +100 °C ∆IF 0.36 (DC) 0.86 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. (0.2) 2+0.05 (φ 0.6) Center Hole 3.5 + 0.05 1.8 (1.7) Quantity on tape: 4,000 pieces per reel (1.8) 4+0.1 φ 1.5+0.1 0 8+0.2 ■ Operation Current Derating Chart (DC) 1.75 + 0.1 ■ Taping Specifications (0.9) 2+0.5 φ 21+0.8 4+0.1 Direction to pull BRPY, BRPG, BRBG +1 φ 60 -0 φ 13+0.2 φ 13+0.2 9+0.3 11.4+1 +0 φ 180 3 ■ Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: °C Operation Heating 240 150 Pre-heating ~ LED Surface Temperature ■ Spatial Distribution Temperature rise: 5°C/sec. Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1211C-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com