ETC BRBG1211C

Product Guide
1211C Series Bi-Color Ultra Compact SMT LED
■ Features
■ Applications
• Superbright, compact bicolor package
• 1.6mm (L) x 1.5mm (W) x 0.7mm (H)
• Mobile devices (cellular telephone, PDAs, pagers)
• Telecommunications
■ Outline Dimensions
Unit: mm
Tolerances + 0.1
■ Electro-Optical Characteristics
Part No. Material
Emitted Lens
Color Color
Luminous
Intensity IV
MIN.
TYP.
IF
(Ta=25°C)
Forward
Voltage V
Wavelength
Peak
λp
TYP.
Dominant
λd
TYP.
Spectral Line
Half Width
λ
∆λ
TYP.
Reverse Viewing
Current IR Angle
F
IF
TYP.
MAX.
IF
MAX.
VR
(2 θ 1/2)
GaAIAs
Red (BR)
7.0 11.7 20
660
647
30
20
1.7
2.3
20
100
4
170°
GaP
Yellow-Green (PY)
7.0 11.7 20
570
572
30
20
2.1
2.8
20
100
4
150°
GaAIAs
Red (BR)
7.0 11.7 20
660
647
30
20
1.7
2.3
20
100
4
170°
GaP
Green (PG)
4.5
20
560
567
30
20
2.1
2.8
20
100
4
150°
GaAlAs
Red (BR)
7.0 11.7 20
660
647
30
20
1.7
2.3
20
100
4
170°
GaP
Pure Green (BG)
1.7
555
558
30
20
2.1
2.8
20
100
4
150°
mA
µA
V
Deg.
BRPY1211C
BRPG1211C
BRBG1211C
Units
Milky
White
6.4
2.4
mcd
20
mA
nm
mA
V
■ Absolute Maximum Ratings
Red (BR)
(Ta=25°C)
Yellow-Green (PY)
Red (BR)
Green (PG)
Red (BR)
Pure Green (BG)
Units
Item
Symbol
BRPY
BRPG
BRBG
Pd
70
70
70
mW
Forward Current
IF
25
25
25
mA
Peak Forward Current
IFM
60
60
60
mA
Reverse Voltage
VR
4
4
4
V
Power Dissipation
Operating Temperature
Topr
-30 to +85
°C
Storage Temperature
Tstg
-40 to +100
°C
∆IF
0.36 (DC) 0.86 (Pulse)
mA/°C
Derating*
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
(0.2)
2+0.05
(φ 0.6)
Center
Hole
3.5 + 0.05
1.8
(1.7)
Quantity on tape:
4,000 pieces
per reel
(1.8)
4+0.1
φ 1.5+0.1
0
8+0.2
■ Operation Current Derating Chart (DC)
1.75 + 0.1
■ Taping Specifications
(0.9)
2+0.5
φ 21+0.8
4+0.1
Direction to pull
BRPY, BRPG, BRBG
+1
φ 60 -0
φ 13+0.2
φ 13+0.2
9+0.3
11.4+1
+0
φ 180 3
■ Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Pre-heating
~
LED Surface Temperature
■ Spatial Distribution
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
120
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG1211C-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com