Product Guide D_1111C Series, Ultra Compact InGaN/SiC SMT LED ■ Applications ■ Features • High brightness (InGaN/SiC) die material • Available in green (525nm), bluish-green (505nm) • and blue (470nm) colors • Wide 130 degree viewing angle • Reflow and dip soldering compatible • 1000V minimum ESD protection • Portable phone key pad backlight • Various other backlight uses ■ Outline Dimensions Epoxy PCB PCB Warpage direction Unit: mm Tolerances + 0.1 ■ Electro-Optical Characteristics Part No. Material Emitted Lens Color Color DG1111C InGaN/SiC DC1111C InGaN/SiC Bluish-Green DB1111C InGaN/SiC Units Green Blue (Ta=25°C) Luminous Intensity IV Spectral Line Dominant Half Width λd λ ∆λ TYP. TYP. MIN. TYP. IF Peak λp TYP. 24 Milky 24 White 8.5 40 10 522 525 34 10 502 14 10 467 mcd mA Forward Voltage V Wavelength Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR 30 10 3.3 3.8 10 100 5 505 30 10 3.3 3.8 10 100 5 470 26 10 3.3 3.8 10 100 5 mA µA V nm mA V (2 θ 1/2) 130° Deg. ■ Absolute Maximum Ratings (Ta=25°C) Bluish-Green Green Blue Units Item Symbol DG DC DB Pd 76 76 76 mW Forward Current IF 20 20 20 mA Peak Forward Current IFM 48 48 48 mA Reverse Voltage VR 5 5 5 V Power Dissipation Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -40 to +100 °C ∆IF 0.28 (DC) 0.69 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. ■ Taping Specifications ■ Operation Current Derating Chart (DC) 1.75+0.1 4+0.1 φ 1.5 +0.1 0 (1) (0.2) 3.5+0.05 2+0.05 (φ 0.5) (1.85) 8+0.2 Center Hole Center Hole 4+0.1 Quantity on tape: 4000 pieces per reel (0.9) Direction to pull 2+0.5 φ 21+0.8 DG, DC, DB, +1 φ 60 -0 φ 13+0.2 φ 13+0.2 9+0.3 11.4+1 +0 φ 180 3 ■ Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: °C Operation Heating 240 150 ~ LED Surface Temperature ■ Spatial Distribution Pre-heating Temperature rise: 5°C/sec. Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGD1111C-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com