Product Guide F_1111C Series Ultra Compact AlInGaP SMT LED ■ Features ■ Applications • Meets industry standards for 1608 (0603) footprint • Provides bright, wide and uniform spatial distribution • Excellent for cellular telephone key pads, • LCD backlighting and pager display applications • Mobile devices (cellular telephones, PDAs, pagers) • Industrial / Medical instrumentation ■ Outline Dimensions Epoxy PCB PCB Warpage direction Unit: mm Tolerances + 0.1 ■ Electro-Optical Characteristics Part No. Material Emitted Lens Color Color FR1111C AlInGaP Red FA1111C AlInGaP Orange FY1111C AlInGaP Yellow Units Milky White (Ta=25°C) Luminous Intensity IV MIN. TYP. IF 25 50 20 635 626 25 65 20 609 25 65 20 592 mcd mA Forward Voltage V Wavelength Peak λp TYP. Dominant λd TYP. Spectral Line Half Width λ ∆λ TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR 15 20 1.9 2.4 20 100 5 605 15 20 1.9 2.4 20 100 5 590 15 20 1.9 2.4 20 100 5 mA µA V nm mA V (2 θ 1/2) 140° Deg. ■ Absolute Maximum Ratings (Ta=25°C) Red Yellow Orange Units Item Symbol FR FA FY Pd 81 81 81 mW Forward Current IF 30 30 30 mA Peak Forward Current IFM 100 100 100 mA Reverse Voltage VR 5 5 5 V Power Dissipation Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -40 to +100 °C ∆IF 0.43 (DC) 1.0 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. ■ Taping Specifications ■ Operation Current Derating Chart (DC) 1.75+0.1 4+0.1 φ 1.5 +0.1 0 (1) (0.2) Quantity on tape: Quantity on tape: 4000 pieces 4000 pieces per reel per reel FR, FA, FY 3.5+0.05 2+0.05 (φ 0.5) Center Hole (1.85) 8+0.2 Center Hole 4+0.1 (0.9) 2+0.5 φ 21+0.8 Direction to pull +1 φ 60 -0 φ 13+0.2 φ 13+0.2 9+0.3 11.4+1 +0 φ 180 3 ■ Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120°C ~ 150°C max. (resin surface temp.) 60-120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: °C Operation Heating 240 150 ~ LED Surface Temperature ■ Spatial Distribution Pre-heating Temperature rise: 5°C/sec. Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGF_1111C-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com