ETC FY1111C

Product Guide
F_1112H Series Thin Type AlInGaP SMT LED
■ Features
■ Applications
• Compact 2012 (0805) package with super bright AlInGaP die
• Excellent for membrane switch panels and indicators
• Mobile devices (cellular telephones, PDAs, pagers)
• Audio visual equipment
• Telecommunications
■ Outline Dimensions
PCB Warpage direction
Unit: mm
Tolerances + 0.1
■ Electro-Optical Characteristics
Part No.
Material Emitted Lens
Color Color
FR1112H
AlInGaP
Red
FA1112H
AlInGaP
Orange
FY1112H
AlInGaP
Yellow
Units
Milky
White
(Ta=25°C)
Luminous
Intensity IV
MIN.
TYP.
IF
25
50
20
635
626
25
65
20
609
25
65
20
592
mcd
mA
Forward
Voltage V
Wavelength
Peak
λp
TYP.
Dominant
λd
TYP.
Spectral Line
Half Width
λ
∆λ
TYP.
Reverse Viewing
Current IR Angle
F
IF
TYP.
MAX.
IF
MAX.
VR
15
20
1.9
2.4
20
100
5
605
15
20
1.9
2.4
20
100
5
590
15
20
1.9
2.4
20
100
5
mA
µA
V
nm
mA
V
(2 θ 1/2)
150°
Deg.
■ Absolute Maximum Ratings
(Ta=25°C)
Red
Yellow
Orange
Units
Item
Symbol
FR
FA
FY
Pd
81
81
81
mW
Forward Current
IF
30
30
30
mA
Peak Forward Current
IFM
100
100
100
mA
Reverse Voltage
VR
5
5
5
V
Power Dissipation
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-40 to +100
°C
∆IF
0.43 (DC) 1.0 (Pulse)
mA/°C
Derating*
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
■ Taping Specifications
1.75+0.1
■ Operation Current Derating Chart (DC)
4+0.1
φ 1.5 +0.1
0
(1.45)
2+0.05
(2.25)
(φ 0.5)
Center
Hole
FR, FA, FY
Quantity on tape:
Quantity on tape:
4000 pieces
4000 pieces
per reel
per reel
3.5+0.05
8+0.2
(0.2)
(1)
2+0.5
4+0.1
φ 21+0.8
Direction to pull
+1
φ 60 -0
φ 13+0.2
φ 13+0.2
9+0.3
11.4+1
+0
φ 180 3
■ Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120° ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
~
LED Surface Temperature
■ Spatial Distribution
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
120
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1112H-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com