PLASTIC INFRARED LIGHT EMITTING DIODE QED422 QED423 PACKAGE DIMENSIONS REFERENCE SURFACE 0.190 (4.83) 0.178 (4.52) 0.220 (5.59) 0.030 (0.76) NOM 0.800 (20.3) MIN 0.050 (1.27) CATHODE 0.100 (2.54) NOM Ø 0.215 (5.46) NOM 45° SCHEMATIC 0.020 (0.51) SQ. (2X) ANODE R 0.022 (0.56) CATHODE NOTES: 1. Dimensions for all drawings are in inches (mm). 2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless otherwise specified. DESCRIPTION The QED422/423 is an 880 nm AlGaAs LED encapsulated in a clear, purple tinted, plastic TO-46 package. FEATURES • • • • • • • λ= 880 nm Chip material = AlGaAs Package type: Plastic TO-46 Matched Photosensor: QSD722/723/724 Medium Wide Emission Angle, 30° High Output Power Package material and color: clear, purple tinted, plastic © 2002 Fairchild Semiconductor Corporation Page 1 of 4 6/13/02 PLASTIC INFRARED LIGHT EMITTING DIODE QED422 QED423 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter Symbol Rating Unit Operating Temperature TOPR -40 to + 100 °C Storage Temperature TSTG -40 to + 100 °C (Iron)(2,3,4) TSOL-I 240 for 5 sec °C Soldering Temperature (Flow)(2,3) TSOL-F 260 for 10 sec °C Continuous Forward Current IF 100 mA Reverse Voltage VR 5 V PD 200 mW Soldering Temperature Power Dissipation(1) NOTES: 1. Derate power dissipation linearly 2.67 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. .4. Soldering iron 1/16" (1.6 mm) minimum from housing ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25°C) Parameter Test Conditions Symbol Min Typ Max Units Peak Emission Wavelength IF = 100 mA λPE — 880 — nm Emission Angle IF = 100 mA 2Θ1/2 — 30 — Deg. Forward Voltage IF = 100 mA, tp = 20 ms VF — — 1.8 V Reverse Current VR = 5 V IR — — 10 µA Radiant Intensity QEC522 IF = 100 mA, tp = 20 ms IE 10 — 40 mW/sr Radiant Intensity QEC523 IF = 100 mA, tp = 20 ms IE 20 — — mW/sr tr — 800 — ns tf — 800 — ns Rise Time Fall Time © 2002 Fairchild Semiconductor Corporation IF = 100 mA Page 2 of 4 6/13/02 PLASTIC INFRARED LIGHT EMITTING DIODE QED422 Fig. 2 Forward Voltage vs. Ambient Temperature Fig. 1 Normalized Radiant Intensity vs. Forward Current 2.0 10 IF = 50 mA Normalized to: IF = 100 mA Pulsed tpw = 100 µs Duty Cycle = 0.1 % TA = 25°C 1 VF - FORWARD VOLTAGE (V) Ie - NORMALIZED RADIANT INTENSITY QED423 0.1 0.01 IF = 100 mA 1.5 0.5 1 10 100 Normalized to: IF Pulsed tpw = 100 µs Duty Cycle = 0.1 % 0.0 -40 0.001 1000 IF = 10 mA IF = 20 mA 1.0 -20 0 IF - FORWARD CURRENT (mA) 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) Fig. 3 Normalized Radiant Intensity vs. Wavelength Fig. 4 Radiation Diagram NORMALIZED RADIANT INTENSITY 1.0 0.9 110 0.8 100 90 80 70 120 0.7 60 130 50 0.6 140 40 0.5 150 0.4 30 160 0.3 0.2 20 170 10 0.1 180 775 800 825 850 875 900 925 950 0 1.0 0.8 0.6 0.4 0.2 0.0 0.2 0.4 0.6 0.8 1.0 λ(nm) © 2002 Fairchild Semiconductor Corporation Page 3 of 4 6/13/02 PLASTIC INFRARED LIGHT EMITTING DIODE QED422 QED423 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2002 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 4 of 4 6/13/02