TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 24-Channel, 12-Bit PWM LED Driver with Internal Oscillator • FEATURES 1 • • • • • • 23 • • • • • • • 24 Channels, Constant Current Sink Output 30-mA Capability (Constant Current Sink) 12-Bit (4096 Steps) PWM Grayscale Control LED Power-Supply Voltage up to 30 V VCC = 3.0 V to 5.5 V Constant Current Accuracy: – Channel-to-Channel = ±2% (typ) – Device-to-Device = ±2% (typ) CMOS Logic Level I/O 30-MHz Data Transfer Rate (Standalone) 15-MHz Data Transfer Rate (Cascaded Devices, SCLK Duty = 50%) Shift Out Data Changes With Falling Edge to Avoid Data Shift Errors Auto Display Repeat 4-MHz Internal Oscillator Thermal Shutdown (TSD): – Automatic shutdown at over temperature conditions – Restart under normal temperature VLED • • • • DESCRIPTION The TLC5947 is a 24-channel, constant current sink LED driver. Each channel is individually adjustable with 4096 pulse-width modulated (PWM) steps. PWM control is repeated automatically with the programmed grayscale (GS) data. GS data are written via a serial interface port. The current value of all 24 channels is set by a single external resistor. The TLC5947 has a thermal shutdown (TSD) function that turns off all output drivers during an over-temperature condition. All of the output drivers automatically restart when the temperature returns to normal conditions. XLAT BLANK BLANK VLED ¼ ¼ ¼ ¼ ¼ ¼ ¼ ¼ OUT23 OUT0 SOUT TLC5947 IC1 OUT23 SOUT SCLK XLAT VCC BLANK GND IREF ¼ SIN VCC RIREF VLED ¼ SCLK XLAT Static LED Displays Message Boards Amusement Illumination TV Backlighting ¼ SIN SCLK Controller APPLICATIONS VLED OUT0 DATA • Noise Reduction: – 4-channel grouped delay to prevent inrush current Operating Temperature: –40°C to +85°C IREF VCC TLC5947 ICn VCC GND RIREF 3 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT (1) PACKAGE-LEAD TLC5947 HTSSOP-32 PowerPAD™ TLC5947 5-mm × 5-mm QFN-32 ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TLC5947DAPR Tape and Reel, 2000 TLC5947DAP Tube, 46 TLC5947RHBR Tape and Reel, 3000 TLC5947RHB Tape and Reel, 250 For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) (2) Over operating free-air temperature range, unless otherwise noted. PARAMETER TLC5947 VCC Supply voltage: VCC IO Output current (dc) OUT0 to OUT23 VI Input voltage range VO Output voltage range TJ(MAX) Operating junction temperature TSTG Storage temperature range (1) (2) –0.3 to +6.0 V 38 mA SIN, SCLK, XLAT, BLANK –0.3 to VCC + 0.3 V SOUT –0.3 to VCC + 0.3 V OUT0 to OUT23 Human body model (HBM) ESD rating UNIT Charged device model (CDM) –0.3 to +33 V +150 °C –55 to +150 °C 2 kV 500 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. All voltage values are with respect to network ground terminal. DISSIPATION RATINGS PACKAGE OPERATING FACTOR ABOVE TA = +25°C TA < +25°C POWER RATING TA = +70°C POWER RATING TA = +85°C POWER RATING HTSSOP-32 with PowerPAD soldered (1) 42.54 mW/°C 5318 mW 3403 mW 2765 mW HTSSOP-32 with PowerPAD not soldered (2) 22.56 mW/°C 2820 mW 1805 mW 1466 mW 27.86 mW/°C 3482 mW 2228 mW 1811 mW QFN-32 (1) (2) (3) 2 (3) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available for download at www.ti.com). With PowerPAD not soldered onto copper area on PCB. The package thermal impedance is calculated in accordance with JESD51-5. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 RECOMMENDED OPERATING CONDITIONS At TA= –40°C to +85°C, unless otherwise noted. TLC5947 PARAMETER TEST CONDITIONS MIN NOM MAX UNIT DC Characteristics: VCC = 3 V to 5.5 V VCC Supply voltage VO Voltage applied to output 3.0 5.5 V 30 VIH High-level input voltage V 0.7 × VCC VCC V VIL Low-level input voltage IOH High-level output current SOUT GND 0.3 × VCC –3 mA IOL Low-level output current SOUT 3 mA IOLC Constant output sink current 2 30 mA TA Operating free-air temperature range –40 +85 °C TJ Operating junction temperature –40 +125 °C OUT0 to OUT23 OUT0 to OUT23 V AC Characteristics: VCC = 3 V to 5.5 V fSCLK Data shift clock frequency TWH0 SCLK, Standalone operation 30 MHz SCLK, Duty 50%, cascade operation 15 MHz SCLK = High-level pulse width 12 ns SCLK = Low-level pulse width 10 ns TWH1 XLAT, BLANK High-level pulse width 30 ns TSU0 SIN–SCLK↑ 5 ns TWL0 TSU1 Pulse duration XLAT↑–SCLK↑ 100 ns TSU2 XLAT↑–BLANK↓ 30 ns TH0 SIN–SCLK↑ 3 ns XLAT↑–SCLK↑ 10 ns TH1 Setup time Hold time Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 3 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS At VCC = 3.0 V to 5.5 V and TA = –40°C to +85°C. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted. TLC5947 PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –3 mA at SOUT VOL Low-level output voltage IOL = 3 mA at SOUT IIN Input current VIN = VCC or GND at SIN, XLAT, and BLANK MIN TYP VCC – 0.4 MAX UNIT VCC V –1 0.4 V 1 µA SIN/SCLK/XLAT = low, BLANK = high, VOUTn = 1 V, RIREF = 24 kΩ 0.5 3 mA SIN/SCLK/XLAT = low, BLANK = high, VOUTn = 1 V, RIREF = 3.3 kΩ 1 6 mA ICC3 SIN/SCLK/XLAT = low, BLANK = low, VOUTn = 1 V, RIREF = 3.3 kΩ, GSn = FFFh 15 45 mA ICC4 SIN/SCLK/XLAT = low, BLANK = low, VOUTn = 1 V, RIREF = 1.6 kΩ, GSn = FFFh 30 90 mA 30.75 33.8 mA 0.1 µA ICC1 ICC2 Supply current (VCC) IOLC Constant output current All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V, RIREF = 1.6 kΩ IOLK Output leakage current BLANK = high, VOUTn = 30 V, RIREF = 1.6 kΩ, At OUT0 to OUT23 ΔIOLC Constant current error (channel-to-channel) (1) All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V, RIREF = 1.6 kΩ, At OUT0 to OUT23 ±2 ±4 % ΔIOLC1 Constant current error (device-to-device) (2) All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V, RIREF = 1.6 kΩ ±2 ±7 % ΔIOLC2 Line regulation (3) All OUTn = ON, VOUTn = 1 V, VOUTfix = 1 V, RIREF = 1.6 kΩ, At OUT0 to OUT23 ±1 ±3 %/V ΔIOLC3 Load regulation (4) All OUTn = ON, VOUTn = 1 V to 3 V, VOUTfix = 1 V, RIREF = 1.6 kΩ, At OUT0 to OUT23 ±2 ±6 %/V TDOWN Thermal shutdown threshold Junction temperature (5) +150 +162 +175 °C THYS Thermal error hysteresis Junction temperature (5) +5 +10 +20 °C VIREF Reference voltage output RIREF = 1.6 kΩ 1.16 1.20 1.24 V (1) The deviation of each output from the average of OUT0–OUT23 constant current. Deviation is calculated by the formula: D (%) = (2) 27.7 IOUTn -1 (IOUT0 + IOUT1 + ... + IOUT22 + IOUT23) ´ 100 24 . The deviation of the OUT0–OUT23 constant current average from the ideal constant current value. Deviation is calculated by the following formula: (IOUT0 + IOUT1 + ... IOUT22 + IOUT23) 24 D (%) = - (Ideal Output Current) ´ 100 Ideal Output Current Ideal current is calculated by the formula: IOUT(IDEAL) = 41 ´ (3) Line regulation is calculated by this equation: D (%/V) = (4) 4 (IOUTn at VCC = 5.5 V) - (IOUTn at VCC = 3.0 V) (IOUTn at VCC = 3.0 V) ´ 100 5.5 V - 3 V Load regulation is calculated by the equation: D (%/V) = (5) 1.20 RIREF (IOUTn at VOUTn = 3 V) - (IOUTn at VOUTn = 1 V) (IOUTn at VOUTn = 1 V) ´ 100 3V-1V Not tested. Specified by design. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 SWITCHING CHARACTERISTICS At VCC = 3.0 V to 5.5 V, TA = –40°C to +85°C, CL = 15 pF, RL = 150 Ω, RIREF = 1.6 kΩ, and VLED = 5.5 V. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted. TLC5947 PARAMETER tR0 tR1 tF0 tF1 fOSC TEST CONDITIONS Rise time Fall time MIN TYP MAX SOUT 10 15 UNIT ns OUTn 15 40 ns SOUT 10 15 ns OUTn 100 300 ns 4 5.6 MHz Internal oscillator frequency 2.4 tD0 SCLK↓ to SOUT 15 25 ns tD1 BLANK↑ to OUT0 sink current off 20 40 ns tD2 OUT0 current on to OUT1/5/9/13/17/21 current on 15 24 33 ns tD3 Propagation delay time OUT0 current on to OUT2/6/10/14/18/22 current on 30 48 66 ns tD4 OUT0 current on to OUT3/7/11/15/19/23 current on 45 72 99 ns FUNCTIONAL BLOCK DIAGRAM VCC VCC LSB MSB SIN D Q Grayscale (12 Bits ´ 24 Channels) Data Shift Register CK SCLK 0 SOUT 287 288 LSB MSB Grayscale (12 Bits ´ 24 Channels) Data Data Latch XLAT 0 287 288 4 MHz Internal Oscillator 12 Bits PWM Timing Control Thermal Detection 24 BL ANK IREF 24-Channel, Constant Current Driver GND ¼ OUT0 OUT1 OUT22 OUT23 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 5 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com DEVICE INFORMATION HTSSOP-32 DAP PACKAGE (TOP VIEW) OUT23 OUT22 OUT21 OUT20 OUT19 OUT18 OUT17 OUT16 24 23 22 21 20 19 18 17 5-mm × 5-mm QFN-32(1) RHB PACKAGE (TOP VIEW) GND 1 32 VCC BLANK 2 31 IREF SCLK 3 30 XLAT SIN 4 29 SOUT SOUT 25 16 OUT15 OUT0 5 28 OUT23 XLAT 26 15 OUT14 OUT1 6 27 OUT22 IREF 27 14 OUT13 OUT2 7 26 OUT21 VCC 28 13 OUT12 OUT3 8 25 OUT20 GND 29 12 OUT11 OUT4 9 24 OUT19 BLANK 30 11 OUT10 OUT5 10 23 OUT18 SCLK 31 10 OUT9 OUT6 11 22 OUT17 SIN 32 9 OUT8 OUT7 12 21 OUT16 OUT8 13 20 OUT15 OUT9 14 19 OUT14 OUT10 15 18 OUT13 OUT11 16 17 OUT12 1 2 3 4 5 6 7 8 OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 Thermal Pad (Bottom Side) Thermal Pad (Bottom Side) (1) This device is product preview. NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB pattern. 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 TERMINAL FUNCTIONS TERMINAL DAP RHB I/O SIN NAME 4 32 I Serial input for grayscale data SCLK 3 31 I Serial data shift clock. Schmitt buffer input. Data present on the SIN pin are shifted into the shift register with the rising edge of the SCLK pin. Data are shifted to the MSB side by 1-bit synchronizing of the rising edge of SCLK. The MSB data appears on SOUT at the falling edge of SCLK. A rising edge on the SCLK input is allowed 100 ns after an XLAT rising edge. I The data in the grayscale shift register are moved to the grayscale data latch with a low-to-high transition on this pin. When the XLAT rising edge is input, all constant current outputs are forced off until the next grayscale display period. The grayscale counter is not reset to zero with a rising edge of XLAT. XLAT 30 26 DESCRIPTION BLANK 2 30 I Blank (all constant current outputs off). When BLANK is high, all constant current outputs (OUT0 through OUT23) are forced off, the grayscale PWM timing controller initializes, and the grayscale counter resets to '0'. When BLANK is low, all constant current outputs are controlled by the grayscale PWM timing controller. IREF 31 27 I/O This pin sets the constant current value. OUT0 through OUT23 constant sink current is set to the desired value by connecting an external resistor between IREF and GND. SOUT 29 25 O Serial data output. This output is connected to the shift register placed after the MSB of the grayscale shift register. Therefore, the MSB data of the grayscale shift register appears at the falling edge of SCLK. This function reduces the data shifting errors caused by small timing margins between SIN and SCLK. OUT0 5 1 O Constant current output. Multiple outputs can be tied together to increase the constant current capability. Different voltages can be applied to each output. OUT1 6 2 O Constant current output OUT2 7 3 O Constant current output OUT3 8 4 O Constant current output OUT4 9 5 O Constant current output OUT5 10 6 O Constant current output OUT6 11 7 O Constant current output OUT7 12 8 O Constant current output OUT8 13 9 O Constant current output OUT9 14 10 O Constant current output OUT10 15 11 O Constant current output OUT11 16 12 O Constant current output OUT12 17 13 O Constant current output OUT13 18 14 O Constant current output OUT14 19 15 O Constant current output OUT15 20 16 O Constant current output OUT16 21 17 O Constant current output OUT17 22 18 O Constant current output OUT18 23 19 O Constant current output OUT19 24 20 O Constant current output OUT20 25 21 O Constant current output OUT21 26 22 O Constant current output OUT22 27 23 O Constant current output OUT23 28 24 O Constant current output VCC 32 28 — Power-supply voltage GND 1 29 — Power ground Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 7 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com PARAMETER MEASUREMENT INFORMATION PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS VCC VCC INPUT SOUT GND GND Figure 1. SIN, SCLK, XLAT, BLANK Figure 2. SOUT OUTn GND Figure 3. OUT0 Through OUT23 TEST CIRCUITS RL VCC VCC VCC OUTn IREF RIREF VLED SOUT VCC CL GND GND Figure 4. Rise Time and Fall Time Test Circuit for OUTn VCC Figure 5. Rise Time and Fall Time Test Circuit for SOUT OUT0 ¼ VCC CL IREF ¼ RIREF OUTn GND OUT23 VOUTn VOUTFIX Figure 6. Constant Current Test Circuit for OUTn 8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 TIMING DIAGRAMS TWH0, TWL0, TWH1: VCC INPUT (1) 50% GND TWH TWL TSU0, TSU1, TSU2, TH0, TH1: VCC CLOCK INPUT (1) 50% GND TSU TH VCC DATA/CONTROL INPUT (1) 50% GND (1) Input pulse rise and fall time is 1 ns to 3 ns. Figure 7. Input Timing tR0, tR1, tF0, tF1, tD0, tD1, tD2, tD3, tD4: VCC (1) INPUT 50% GND tD VOH or VOUTn 90% OUTPUT 50% 10% VOL or VOUTn tR or tF (1) Input pulse rise and fall time is 1 ns to 3 ns. Figure 8. Output Timing Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 9 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com SIN GS0 0A GS23 GS23 11B 10B GS23 9B TSU0 TH0 GS23 GS23 8B 7B GS0 3B fSCLK GS0 2B GS0 1B GS0 0B TH1 TWH0 GS23 11C GS23 10C GS23 9C GS23 8C GS23 7C GS23 6C GS23 5C 1 2 3 TWL0 4 5 6 7 TSU1 SCLK 1 2 3 4 285 5 286 287 288 TWH1 XLAT TSU2 TWH1 BLANK Grayscale Latch Data (Internal) Oscillator Clock (Internal) tD1 Previous Grayscale Data Counter 4094 4096 Value ¼ 4093 4095 1 2 3 4 Latest Grayscale Data fOSC ¼0 0 0 0 1 2 3 4 5 0 0 0 0 0 1 2 ¼ ¼ tD0 GS23 11A SOUT GS23 10A GS23 9A GS23 GS23 8A 7A GS0 3A GS0 2A GS0 1A GS0 0A GS23 11B GS23 10B GS23 9B GS23 8B GS23 7B GS23 6B GS23 5B tR0/tF0 OFF OUT0/4/8/ 12/16/20 (1) OUT1/5/9/ 13/17/21 (1) OUT2/6/10/ 14/18/22 (1) OUT3/7/11/ 15/19/23 (1) ON tR1 OFF tF1 ON tD2 OFF ON tD3 OFF ON tD4 (1) GS data = FFFh. Figure 9. Grayscale Data Write and OUTn Operation Timing 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 TYPICAL CHARACTERISTICS At VCC = 3.3 V and TA = +25°C, unless otherwise noted. REFERENCE RESISTOR vs OUTPUT CURRENT POWER DISSIPATION RATE vs FREE-AIR TEMPERATURE 6000 Power Dissipation Rate (mW) Reference Resistor (W) 100000 24600 9840 10000 4920 3280 2460 1968 TLC5947DAP PowerPAD Soldered 5000 4000 TLC5947RHB 3000 TLC5947DAP PowerPAD Not Soldered 2000 1000 1640 0 1000 0 15 10 5 20 25 30 -40 35 Figure 11. OUTPUT CURRENT vs OUTPUT VOLTAGE OUTPUT CURRENT vs OUTPUT VOLTAGE 35 IO = 30 mA Output Current (mA) Output Current (mA) IO = 20 mA 20 IO = 15 mA IO = 10 mA 10 IO = 2 mA IO = 5 mA 0 32 31 30 29 28 TA = -40°C 27 TA = +25°C 26 TA = +85°C 25 0 1.5 1.0 0.5 2.0 2.5 0 3.0 1.0 0.5 1.5 2.0 Output Voltage (V) Output Voltage (V) Figure 12. Figure 13. ΔIOLC vs AMBIENT TEMPERATURE 2.5 3.0 ΔIOLC vs OUTPUT CURRENT 4 4 IO = 30 mA TA = +25°C 3 3 2 2 1 1 DIOLC (%) DIOLC (%) 100 33 IO = 25 mA 25 15 80 IO = 30 mA 34 30 0 -1 -2 0 -1 -2 VCC = 3.3 V -3 -4 60 40 Free-Air Temperature (°C) Figure 10. TA = +25°C 5 20 0 -20 Output Current (mA) -40 -20 0 20 40 60 80 VCC = 3.3 V -3 VCC = 5 V 100 -4 VCC = 5 V 0 5 10 15 20 Ambient Temperature (°C) Output Current (mA) Figure 14. Figure 15. 25 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 30 11 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com TYPICAL CHARACTERISTICS (continued) At VCC = 3.3 V and TA = +25°C, unless otherwise noted. INTERNAL OSCILLATOR FREQUENCY vs AMBIENT TEMPERATURE CONSTANT CURRENT OUTPUT VOLTAGE WAVEFORM Internal Oscillator Frequency (MHz) 5.0 4.5 4.0 CH1-OUT0 (GSData = 001h) CH1 (2 V/div) VCC = +3.3 V VCC = +5 V 3.5 3.0 CH2 (2 V/div) 2.5 CH2-OUT0 (GSData = 002h) 2.0 1.5 IOLCMax = 30 mA TA = +25°C RL = 150 W CL = 15 pF VLED = 5.5 V CH3 (2 V/div) 1.0 CH3-OUT23 (GSData = 003h) 0.5 0 -40 -20 0 20 35 55 70 85 Time (100 ns/div) Ambient Temperature (°C) Figure 16. 12 Figure 17. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 DETAILED DESCRIPTION SETTING FOR THE CONSTANT SINK CURRENT VALUE The constant current value for all channels is set by an external resistor (RIREF) placed between IREF and GND. The resistor (RIREF) value is calculated by Equation 1. RIREF (W) = 41 ´ VIREF (V) IOLC (mA) (1) Where: VIREF = the internal reference voltage on the IREF pin (typically 1.20 V). IOLC must be set in the range of 2 mA to 30 mA. The constant sink current characteristic for the external resistor value is shown in Figure 10. Table 1 describes the constant current output versus external resistor value. Table 1. Constant-Current Output versus External Resistor Value IOLC (mA, Typical) RIREF (Ω) 30 1640 25 1968 20 2460 15 3280 10 4920 5 9840 2 24600 GRAYSCALE (GS) CONTROL FUNCTION Each constant current sink output OUT0–OUT23 (OUTn) turns on (starts to sink constant current) at the fifth rising edge of the grayscale internal oscillator clock after the BLANK signal transitions from high to low if the grayscale data latched into the grayscale data latch are not zero. After turn-on, the number of rising edges of the internal oscillator is counted by the 12-bit grayscale counter. Each OUTn output is turned off once its corresponding grayscale data values equal the grayscale counter or the counter reaches 4096d (FFFh). The PWM control operation is repeated as long as BLANK is low. OUTn is not turned on when BLANK is high. The timing is shown in Figure 18. All outputs are turned off at the XLAT rising edge. After that, each output is controlled again from the first clock of the internal oscillator for the next display period, based on the latest grayscale data. When the IC is powered on, the data in the grayscale data shift register and latch are not set to default values. Therefore, grayscale data must be written to the GS latch before turning on the constant current output. BLANK should be at a high level when powered on to keep the outputs off until valid grayscale data are written to the latch. This avoids the LED being randomly illuminated immediately after power-up. If having the outputs turn on at power-up is not a problem for the application, then BLANK does not need to be held high. The grayscale functions can be controlled directly by grayscale data writing, even though BLANK is connected to GND. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 13 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com BLANK 64 Counter Value Internal Oscillator Clock 63 0 0 0 0 1 2 3 66 65 1027 1030 1026 1029 1025 1028 1031 2049 2052 2048 2051 2047 2050 3073 3076 3072 3075 3071 3074 3077 4096 4095 4094 1 2 Grayscale counter starts to count from 5th clock of the internal oscillator clock after BLANK goes low. OUTn (GS Data = 000h) OFF OUTn (GS Data = 001h) OFF OUTn (GS Data = 002h) OFF OUTn (GS Data = 003h) OFF ON Drivers do not turn on when grayscale data are ‘0’. Dotted line indicates BLANK is high. T = Internal CLK ´ 1 ON T = Internal CLK ´ 2 ON T = Internal CLK ´ 3 ON OFF OUTn (GS Data = 040h) OFF OUTn (GS Data = 041h) OFF ¼ ¼ OUTn (GS Data = 03Fh) T = Internal CLK ´ 63 ON T = Internal CLK ´ 64 ON T = Internal CLK ´ 65 ON ¼ ¼ OUTn (GS Data = 400h) OFF OUTn (GS Data = 401h) OFF T = Internal CLK ´ 1024 ON T = Internal CLK ´ 1025 ¼ ¼ ON OUTn (GS Data = 800h) OFF ON ¼ ¼ OUTn (GS Data = C00h) T = Internal CLK ´ 2048 OFF T = Internal CLK ´ 3072 ON ¼ ¼ OUTn (GS Data = FFEh) OFF OUTn (GS Data = FFFh) OFF T = Internal CLK ´ 4094 ON T = Internal CLK ´ 4095 ON Figure 18. PWM Operation 14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 REGISTER CONFIGURATION The TLC5947 has a grayscale (GS) data shift register and data latch. Both the GS data shift register and latch are 288 bits long and are used to set the PWM timing for the constant current driver. Table 2 shows the on duty cycle for each GS data. Figure 19 shows the shift register and data latch configuration. The data at the SIN pin are shifted to the LSB of the shift register at the rising edge of the SCLK pin; SOUT data are shifted out on the falling edge of SCLK. The timing diagram for data writing is shown in Figure 20. The driver on duty is controlled by the data in the GS data latch. Grayscale Data Shift Register (12 Bits ´ 24 Channels) GS Data for OUT23 MSB 287 SOUT GS Data for Bit 11 of OUT23 ¼ GS Data for OUT22 276 275 GS Data for Bit 0 of OUT23 GS Data for Bit 11 of OUT22 ¼ ¼ GS Data for Bit 11 of OUT23 ¼ GS Data for OUT0 LSB 0 12 11 GS Data for Bit 0 of OUT1 GS Data for Bit 11 of OUT0 GS Data for OUT22 276 275 GS Data for Bit 0 of OUT23 GS Data for Bit 11 of OUT22 ¼ GS Data for OUT1 ¼ Grayscale Data Latch (12 Bits ´ 24 Channels) ¼ GS Data for Bit 0 of OUT0 SIN SCLK ¼ ¼ GS Data for OUT23 MSB 287 ¼ GS Data for OUT1 GS Data for OUT0 LSB 0 12 11 GS Data for Bit 0 of OUT1 GS Data for Bit 11 of OUT0 ¼ GS Data for Bit 0 of OUT0 XLAT 288 Bits To PWM Timing Control Block Figure 19. Grayscale Data Shift Register and Latch Configuration Table 2. GS Data versus On Duty GS DATA (Binary) GS DATA (Decimal) GS DATA (Hex) DUTY OF DRIVER TURN-ON TIME (%) 0000 0000 0000 0 000 0.00 0000 0000 0001 1 001 0.02 0000 0000 0010 2 002 0.05 0000 0000 0011 3 003 0.07 — — — — 0111 1111 1111 2047 7FF 49.98 1000 0000 0000 2048 800 50.00 1000 0000 0001 2049 801 50.02 — — — — 1111 1111 1101 4093 FFD 99.93 1111 1111 1110 4094 FFE 99.95 1111 1111 1111 4095 FFF 99.98 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 15 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com GS data are transferred from the shift register to the latch by the rising edge of XLAT. When powered up, the data in the grayscale shift register and data latch are not set to default values. Therefore, grayscale data must be written to the GS latch before turning on the constant current output. BLANK should be at a high level when powered on to avoid falsely turning on the constant current outputs due to random values in the latch at power-up. All of the constant current outputs are forced off when BLANK is high. However, if the random values turning on at power-up is not a concern in the application, BLANK can be at any level. GS can be controlled correctly with the grayscale data writing functions, even if BLANK is connected to GND. Equation 2 determines each output on duty. GSn ´ 100 On Duty (%) = 4096 (2) where: GSn = the programmed grayscale value for OUTn (GSn = 0 to 4095) SIN GS0 0A GS23 GS23 11B 10B GS23 9B GS23 GS23 8B 7B GS0 2B GS0 3B GS0 1B GS0 0B GS23 11C GS23 10C 1 2 GS23 GS23 GS23 GS23 9C 8C 7C 6C SCLK 1 2 3 4 5 285 286 287 288 3 4 5 6 7 XLAT GS0 0A GS23 GS23 11B 10B GS23 9B GS23 8B GS0 3B GS0 2B GS0 1B GS0 0B GS23 11C GS23 10C GS23 9C GS23 8C GS23 7C GS23 6C Shift Register Bit 1 Data (Internal) GS0 1A GS0 GS23 0A 11B GS23 10B GS23 9B GS0 4B GS0 3B GS0 2B GS0 1B GS0 0B GS23 11C GS23 GS23 10C 9C GS23 8C GS23 7C Shift Register Bit 286 Data (Internal) GS23 10A GS23 GS23 9A 8A GS23 7A GS23 6A GS0 1A GS0 0A GS23 11B GS23 10B GS23 9B GS23 8B GS23 7B GS23 6B GS23 5B GS23 4B Shift Register Bit 287 Data (Internal) GS23 11A GS23 GS23 10A 9A GS23 8A GS23 7A GS0 2A GS0 1A GS23 0A GS23 11B GS23 10B GS23 9B GS23 8B GS23 GS23 7B 6B GS23 5B ¼ ¼ ¼ ¼ Shift Register Bit 0 Data (Internal) Grayscale Latch Data (Internal) Previous Grayscale Latch Data GS23 11A SOUT GS23 10A GS23 9A GS23 GS23 8A 7A GS0 3A GS0 2A GS0 1A GS0 0A GS23 11B 4095 GS23 10B GS23 9B GS23 GS23 8B 7B GS23 6B GS23 5B 4094 4096 4094 4096 ¼ 4093 Latest Grayscale Latch Data 1 2 3 4 ¼ 4093 ¼ 4095 1 2 3 4 5 6 7 8 ¼ Oscillator Clock (Internal) OFF OFF (1) ON (1) ON (1) ON (1) ON OUT0/4/8/12/16/20 ON OFF OFF OUT1/5/9/13/17/21 OFF ON ON OFF OUT3/7/11/15/19/23 ON ON OFF OUT2/6/10/14/18/22 ON ON OFF ON ON (1) GS data = FFFh. Figure 20. Grayscale Data Write Operation 16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 TLC5947 www.ti.com ................................................................................................................................................. SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 AUTO DISPLAY REPEAT FUNCTION This function can repeat the total display period without any timing control signal, as shown in Figure 21. BLANK GS Counter Value ¼ 0 0 0 0 1 2 3 2048 ¼ 4095 ¼ 2048 ¼ 4095 2047 2049 4094 0 1 2 3 2047 2049 4094 0 ¼ 1 2 3 0 0 0 0 0 0 1 2 4095 4094 4096 1 2 Internal Oscillator Clock Grayscale counter starts to count from the fifth clock of the internal oscillator clock after BLANK goes low. Display period is turned on again by the auto display repeat function. OUTn OFF (GS Data = 001h) ON OUTn OFF (GS Data = 800h) ON OUTn OFF (GS Data = FFFh) ON First Display Period (4096 Internal Clock) First Display Period Second Display Period (4096 Internal Clock) Four Internal Clock Intervals After BLANK Goes Low Nth Display Period Second Display Period Four Internal Clock Intervals After BLANK Goes Low Figure 21. Auto Display Repeat Operation THERMAL SHUTDOWN (TSD) The thermal shutdown (TSD) function turns off all constant current outputs immediately when the IC junction temperature exceeds the high temperature threshold (T(TEF) = +162° C, typ). The outputs will remain disabled as long as the over-temperature condition exists. The outputs are turned on again at the first clock after the IC junction temperature falls below the temperature of T(TEF) – T(HYS). Figure 22 shows the TSD operation. TJ < T(TEF) - T(HYS) IC Junction Temperature (TJ) TJ < T(TEF) - T(HYS) TJ ³ T(TEF) TJ ³ T(TEF) High BLANK Low 4096 1 2 3 4095 4096 4096 1 2 4095 1 2 4095 4096 1 2 4095 4096 1 2 4095 4096 1 2 4095 1 2 Internal Oscillator Clock OFF OUTn (GS Data = FFFh) OFF ON OFF ON Figure 22. TSD Operation Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 17 TLC5947 SBVS114A – JULY 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com NOISE REDUCTION Large surge currents may flow through the IC and the board on which the device is mounted if all 24 LED channels turn on simultaneously at the start of each grayscale cycle. These large current surges could introduce detrimental noise and electromagnetic interference (EMI) into other circuits. The TLC5947 turns on the LED channels in a series delay, to provide a current soft-start feature. The output current sinks are grouped into four groups of six channels each. The first group is OUT0, 4, 8, 12, 16, 20; the second group is OUT1, 5, 9, 13, 17, 21; the third group is OUT2, 6, 10, 14, 18, 22; and the fourth group is OUT3, 7, 11, 15, 19, 23. Each group turns on sequentially with a small delay between groups; see Figure 9. Both turn-on and turn-off are delayed. POWER DISSIPATION CALCULATION The device power dissipation must be below the power dissipation rate of the device package (illustrated in Figure 11) to ensure correct operation. Equation 3 calculates the power dissipation of the device: PD = (VCC ´ ICC) + (VOUT ´ IOLC ´ N ´ dPWM) (3) Where: • • • • • • 18 VCC = device supply voltage ICC = device supply current VOUT = OUTn voltage when driving LED current IOLC = LED current adjusted by RIREF resistor N = number of OUTn driving LED at the same time dPWM = duty ratio defined by GS value Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5947 PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) TLC5947DAP ACTIVE HTSSOP DAP 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TLC5947 TLC5947DAPG4 ACTIVE HTSSOP DAP 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TLC5947 TLC5947DAPR ACTIVE HTSSOP DAP 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TLC5947 TLC5947DAPRG4 ACTIVE HTSSOP DAP 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TLC5947 TLC5947RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC 5947 TLC5947RHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC 5947 TLC5947RHBT ACTIVE VQFN RHB 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC 5947 TLC5947RHBTG4 ACTIVE VQFN RHB 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC 5947 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 27-Jul-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLC5947DAPR HTSSOP DAP 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1 TLC5947RHBR VQFN RHB 32 3000 330.0 TLC5947RHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC5947DAPR HTSSOP DAP 32 2000 367.0 367.0 45.0 TLC5947RHBR VQFN RHB 32 3000 367.0 367.0 35.0 TLC5947RHBT VQFN RHB 32 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated