TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 16-Channel, Constant-Current LED Driver with 4-Channel Grouped Delay Check for Samples: TLC59282 FEATURES 1 • 2 • • • • • • • • • DESCRIPTION 16 Channels, Constant-Current Sink Output with On/Off Control Capability (Constant-Current Sink): 35 mA (VCC ≤ 3.6 V), 45 mA (VCC > 3.6 V) LED Power-Supply Voltage up to 17 V VCC = 3 V to 5.5 V Constant-Current Accuracy: – Channel-to-Channel = ±0.6% (typ) – Device-to-Device = ±1% (typ) CMOS Logic Level I/O Data Transfer Rate: 35 MHz BLANK Pulse Width: 30 ns Four-Channel Grouped Delay for Noise Reduction Operating Temperature: –40°C to +85°C The TLC59282 is a 16-channel, constant-current sink driver. Each channel can be individually controlled via a simple serial communications protocol that is compatible with 3.3 V or 5 V CMOS logic levels, depending on the operating VCC. Once the serial data buffer is loaded, a rising edge on LATCH transfers the data to the LEDx outputs. The BLANK pin can be used to turn off all OUTn outputs during power-on and output data latching to prevent unwanted image displays during these times. The constant-current value of all 16 channels is set by a single external resistor. Multiple TLC59282s can be cascaded together to control additional LEDs from the same processor. APPLICATIONS • • • Video Displays Message Boards Illumination VLED VLED OUT0 DATA Controller ¼ ¼ ¼ ¼ ¼ ¼ SOUT OUT15 SOUT VCC SCLK LAT VCC VCC BLANK BLANK IREF ¼ SIN VCC LAT BLANK OUT0 OUT15 SCLK LAT VLED ¼ SIN SCLK VLED TLC59282 IC1 RIREF IREF GND TLC59282 ICn GND RIREF 3 Typical Application Circuit (Multiple Daisy-Chained TLC59282s) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD TLC59282 (1) ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TLC59282DBQR Tape and Reel, 2500 TLC59282DBQ Tube, 50 SSOP-24/QSOP-24 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) (2) Over operating free-air temperature range, unless otherwise noted. PARAMETER TLC59282 VCC Supply voltage IOUT Output current (dc) OUT0 to OUT15 VIN Input voltage range VOUT Output voltage range TJ(MAX) Operating junction temperature TSTG Storage temperature range (1) (2) –0.3 to +6 V 50 mA SIN, SCLK, LAT, BLANK, IREF –0.3 to VCC + 0.3 V SOUT –0.3 to VCC + 0.3 V OUT0 to OUT15 ESD rating UNIT –0.3 to +18 V +150 °C –55 to +150 °C Human body model (HBM) 4000 V Charged device model (CDM) 1000 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. All voltage values are with respect to network ground terminal. THERMAL INFORMATION TLC59282 THERMAL METRIC (1) DBQ UNITS 24 PINS qJA Junction-to-ambient thermal resistance 73.2 qJCtop Junction-to-case (top) thermal resistance 44.6 qJB Junction-to-board thermal resistance 38.9 yJT Junction-to-top characterization parameter 12.3 yJB Junction-to-board characterization parameter 39.7 qJCbot Junction-to-case (bottom) thermal resistance n/a (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 RECOMMENDED OPERATING CONDITIONS At TA= –40°C to +85°C, unless otherwise noted. TLC59282 PARAMETER TEST CONDITIONS MIN NOM MAX UNIT DC Characteristics: VCC = 3 V to 5.5 V VCC Supply voltage VO Voltage applied to output VIH High-level input voltage VIL Low-level input voltage IOH High-level output current SOUT –1 mA IOL Low-level output current SOUT 1 mA IOLC 3 5.5 V 17 V 0.7 × VCC VCC V GND 0.3 × VCC OUT0 to OUT15 Constant output sink current V OUT0 to OUT15, 3 V ≤ VCC < 3.6 V 2 35 mA OUT0 to OUT15, 3.6 V ≤ VCC < 5.5 V 2 45 mA TA Operating free-air temperature range –40 +85 °C TJ Operating junction temperature range –40 +125 °C AC Characteristics: VCC = 3 V to 5.5 V fCLK (SCLK) Data shift clock frequency SCLK 35 MHz TWH0 SCLK 10 ns TWL0 SCLK 10 ns TWH1 LAT 20 ns TWH2 BLANK 60 ns TWL2 BLANK 30 ns TSU0 SIN–SCLK↑ 4 ns LAT↓–SCLK↑ 10 ns SIN–SCLK↑ 4 ns LAT↓–SCLK↑ 10 ns TSU1 TH0 TH1 Pulse duration Setup time Hold time Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 3 TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS At VCC = 3 V to 5.5 V and TA = –40°C to +85°C. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted. TLC59282 PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA at SOUT VOL Low-level output voltage IOL = 1 mA at SOUT IIN Input current VIN = VCC or GND at SIN, SCLK, LAT, and BLANK MIN TYP VCC – 0.4 MAX UNIT VCC V –1 0.4 V 1 mA ICC0 SIN/SCLK/LAT = low, BLANK = high, VOUTn = 1 V, RIREF = open 0.1 1 mA ICC1 SIN/SCLK/LAT = low, BLANK = high, VOUTn = 1 V, RIREF = 3 kΩ (IOUT = 16.8 mA target) 4.5 6 mA 7 15 mA 16 34 mA 33.7 35.3 mA 0.1 mA Supply current (VCC) ICC2 All OUTn = ON, SIN/SCLK/LAT/BLANK = low, VOUTn = 1 V, RIREF = 3 kΩ ICC3 All OUTn = ON, SIN/SCLK/LAT/BLANK = low, VOUTn = 1 V, RIREF = 1.5 kΩ (IOUT = 33.6mA target) IOLC Constant output current All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ at OUT0 to OUT15 (see Figure 6), TA = +25°C IOLKG Output leakage current OUTn = OFF, VOUTn = VOUTfix = 17 V, BLANK = high, RIREF = 1.5 kΩ at OUT0 to OUT15 (see Figure 6) ΔIOLC0 Constant-current error (channel-to-channel) (1) All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ at OUT0 to OUT15 ±0.6 ±2 % ΔIOLC1 Constant-current error (device-to-device) (2) All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ at OUT0 to OUT15, TA = +25°C ±1 ±3 % ΔIOLC2 Line regulation (3) All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ at OUT0 to OUT15, VCC = 3 V to 5.5 V ±0.5 ±1 %/V ΔIOLC3 Load regulation (4) All OUTn = ON, VOUTn = 1 V to 3V, VOUTfix = 1 V, RIREF = 1.5 kΩ ±1 ±3 %/V VIREF Reference voltage output RIREF = 1.5 kΩ, TA = +25°C 1.18 1.205 1.23 V RPUP Pull-up resistor BLANK 250 500 750 kΩ RPDWN Pull-down resistor LAT 250 500 750 kΩ (1) 32.1 The deviation of each output from the average of OUT0–OUT15 constant-current. Deviation is calculated by the formula: IOUTn D (%) = -1 ´ 100 (IOUT0 + IOUT1 + ... + IOUT14 + IOUT15) (2) 16 . The deviation of the OUT0–OUT15 constant-current average from the ideal constant-current value. Deviation is calculated by the following formula: (IOUT0 + IOUT1 + ... IOUT14 + IOUT15) - (Ideal Output Current) 16 D (%) = ´ 100 Ideal Output Current Ideal current is calculated by the formula: IOUT(IDEAL) = 41.9 ´ (3) 1.205 RIREF Line regulation is calculated by this equation: D (%/V) = (IOUTn at VCC = 5.5 V) - (IOUTn at VCC = 3 V) (4) 5.5 V - 3 V Load regulation is calculated by the equation: D (%/V) = (IOUTn at VOUTn = 3 V) - (IOUTn at VOUTn = 1 V) 100 ´ (IOUTn at VOUTn = 1 V) 4 100 ´ (IOUTn at VCC = 3 V) 3V-1V Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 SWITCHING CHARACTERISTICS At VCC = 3 V to 5.5 V, TA = –40°C to +85°C, CL = 15 pF, RL = 130 Ω, RIREF = 1.5 kΩ, and VLED = 5.5 V. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted. TLC59282 PARAMETER tR0 Rise time tR1 tF0 Fall time tF1 TEST CONDITIONS MIN TYP MAX SOUT (see Figure 5) 5 12 UNIT ns OUTn (see Figure 4) 10 30 ns SOUT (see Figure 5) 5 12 ns OUTn (see Figure 4) 10 30 ns 8 20 ns tD0 SCLK↑ to SOUT↑↓ tD1 LAT↑ or BLANK↑↓ to OUT0/OUT7/OUT8/OUT15 on/off 18 36 ns tD2 LAT↑ or BLANK↑↓ to OUT1/OUT6/OUT9/OUT14 on/off 38 69 ns tD3 LAT↑ or BLANK↑↓ to OUT2/OUT5/OUT10/OUT13 on/off 58 102 ns tD4 LAT↑ or BLANK↑↓ to OUT3/OUT4/OUT11/OUT12 on/off 78 135 ns 15 ns Propagation delay time tON_ERR (1) Output on-time error (1) On/off latch data = all '1', 30 ns BLANK low level one-shot pulse input –15 Output on-time error (tON_ERR) is calculated by the formula: tON_ERR (ns) = tOUT_ON – BLANK low level one-shot pulse width (TWL2). tOUT_ON indicates the actual on-time of the constant-current output. FUNCTIONAL BLOCK DIAGRAM VCC VCC SIN LSB MSB 16-Bit Shift Register (1 Bit x 16 Channels) SCLK 0 SOUT 15 ¼ MSB LSB LAT Output On/Off Data Latch (1 Bit x 16 Channels) 0 15 ¼ BLANK 16-Channel Constant-Current Sink Driver with 4-Channel Grouped Delay IREF GND GND ¼ OUT0 OUT1 OUT14 OUT15 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 5 TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 www.ti.com DEVICE INFORMATION SSOP-24/QSOP-24 DBQ PACKAGE (TOP VIEW) 6 GND 1 24 VCC SIN 2 23 IREF SCLK 3 22 SOUT LAT 4 21 BLANK OUT0 5 20 OUT15 OUT1 6 19 OUT14 OUT2 7 18 OUT13 OUT3 8 17 OUT12 OUT4 9 16 OUT11 OUT5 10 15 OUT10 OUT6 11 14 OUT9 OUT7 12 13 OUT8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 TERMINAL FUNCTIONS TERMINAL NAME NO. I/O DESCRIPTION SIN 2 I Serial data input for driver on/off control; Schmitt buffer input. When SIN is high, data '1' are written into the LSB of the 16-bit shift register at the SCLK rising edge. SCLK 3 I Serial data shift clock; Schmitt buffer input. All data in the 16-bit shift register are shifted toward the MSB by 1-bit synchronization of SCLK. LAT 4 I Level triggered latch; Schmitt buffer input. The data in the 16-bit shift register continue to transfer to the output on/off data latch while LAT is high. Therefore, if the data in the 16-bit shift register are changed when LAT is high, the data in the data latch are also changed. The data in the data latch are held when LAT is low. This pin is internally pulled down to GND with a 500 kΩ (typ) resistor. BLANK 21 I Blank, all outputs; Schmitt buffer input. When BLANK is high, all constant-current outputs (OUT0–OUT15) are forced off. When BLANK is low, all constant-current outputs are controlled by the data in the output on/off data latch. This pin is internally pulled up to VCC with a 500 kΩ (typ) resistor. IREF 23 I/O Constant-current value setting, OUT0–OUT15 sink constant-current is set to desired value by connection to an external resistor between IREF and GND. SOUT 22 O Serial data output. This output is connected to the MSB of the 16-bit shift register. SOUT data changes at the rising edge of SCLK. OUT0 5 O Constant-current output. Each output can be tied together with others to increase the constant-current. Different voltages can be applied to each output. OUT1 6 O Constant-current output OUT2 7 O Constant-current output OUT3 8 O Constant-current output OUT4 9 O Constant-current output OUT5 10 O Constant-current output OUT6 11 O Constant-current output OUT7 12 O Constant-current output OUT8 13 O Constant-current output OUT9 14 O Constant-current output OUT10 15 O Constant-current output OUT11 16 O Constant-current output OUT12 17 O Constant-current output OUT13 18 O Constant-current output OUT14 19 O Constant-current output OUT15 20 O Constant-current output VCC 24 — Power-supply voltage GND 1 — Power ground Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 7 TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS VCC VCC INPUT OUTPUT GND GND Figure 1. SIN, SCLK, LAT, BLANK Figure 2. SOUT OUTn GND Figure 3. OUT0 Through OUT15 TEST CIRCUITS RL VCC VCC VCC OUTn IREF RIREF VLED (1) CL GND SOUT VCC GND CL (1) (1) CL includes measurement probe and jig capacitance. Figure 4. Rise Time and Fall Time Test Circuit for OUTn VCC Figure 5. Rise Time and Fall Time Test Circuit for SOUT OUT0 ¼ VCC (1) CL includes measurement probe and jig capacitance. IREF ¼ RIREF OUTn GND OUT15 VOUTfix VOUTn Figure 6. Constant-Current Test Circuit for OUTn 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 TIMING DIAGRAMS TWH0, TWL0, TWH1, TWH2, TWL2: VCC (1) INPUT 50% GND TWH TWL TSU0, TSU1, TH0, TH1: VCC CLOCK (1) INPUT 50% GND TSU TH VCC DATA/CONTROL (1) INPUT 50% GND (1) Input pulse rise and fall time is 1 ns to 3 ns. Figure 7. Input Timing tR0, tR1, tF0, tF1, tD0, tD1, tD2, tD3, tD4: VCC (1) INPUT 50% GND tD VOH or VOUTn 90% OUTPUT 50% 10% VOL or VOUTn tR or tF (1) Input pulse rise and fall time is 1 ns to 3 ns. Figure 8. Output Timing Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 9 TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 SIN DATA 0A DATA 15B DATA 13B DATA 14B DATA 12B DATA 11B www.ti.com DATA 3B DATA 2B DATA 1B DATA 0B TH0 TSU0 DATA 15C DATA 14C DATA 13C DATA 12C DATA 11C DATA 10C 1 2 3 TWL0 4 5 6 TH1 TWH0 TSU1 SCLK 1 2 3 4 5 13 14 15 16 TWH1 LAT DATA 0A DATA 15B DATA 14B DATA 13B DATA 12B DATA 3B DATA 2B DATA 1B DATA 0B DATA 15C DATA 14C DATA 13C DATA 12C DATA 11C Shift Register LSB+1 Data (Internal) DATA 1A DATA 0A DATA 15B DATA 14B DATA 13B DATA 4B DATA 3B DATA 2B DATA 1B DATA 0B DATA 15C DATA 14C DATA 13C DATA 12C Shift Register MSB-1 Data (Internal) DATA 14A DATA 13A DATA 12A DATA 11A DATA 10A DATA 2A DATA 1A DATA 15B DATA 14B DATA 13B DATA 12B DATA 11B DATA 10B DATA 9B Shift Register MSB Data (Internal) DATA 15A DATA 14A DATA 13A DATA 12A DATA 11A DATA 3A DATA 2A DATA 1A DATA 15B DATA 14B DATA 13B DATA 12B DATA 11B DATA 10B ¼ ¼ Output On/Off Control Data Latch (Internal) SOUT ¼ Shift Register LSB Data (Internal) Previous On/Off Control Data DATA 15A DATA 14A DATA 13A DATA 12A tD0 DATA 2A DATA 1A DATA 0A Latest On/Off Control Data DATA 15B DATA 14B DATA 13B DATA 12B DATA 11B DATA 10B tWH2 tR0/tF0 BLANK tWL2 tD1 OUT0/7/8/15 (1) tD1 OFF OFF ON ON tOUTON OUT1/6/9/14 (1) OFF tD2 OFF tD2 ON ON tD3 OUT2/5/10/13 (1) tD3 OFF OFF ON ON tF1 tD4 OUT3/4/11/12 (1) tD4 OFF OFF ON ON tR1 (1) Output on/off data = FFFFh. (2) tON_ERR = tOUTON – TWL2. Figure 9. Timing Diagram 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 TYPICAL CHARACTERISTICS At VCC = 3.3 V and TA = +25°C, unless otherwise noted. REFERENCE RESISTOR vs OUTPUT CURRENT POWER DISSIPATION RATE vs FREE-AIR TEMPERATURE 2000 Power Dissipation Rate (mW) Reference Resistor (W) 100 k 25245 10098 10 k 5049 3366 2524 2020 1683 1443 1k 0 20 10 1262 1000 500 1122 1010 0 40 30 TLC59282DBQ 1500 50 -40 Figure 10. Figure 11. OUTPUT CURRENT vs OUTPUT VOLTAGE OUTPUT CURRENT vs OUTPUT VOLTAGE 40 TA = +25°C 39 40 IO = 35 mA 38 35 IO = 30 mA IO = 45 mA Output Current (mA) Output Current (mA) IO = 40 mA 30 25 IO = 20 mA 20 15 IO = 10 mA 10 37 36 35 34 33 TA = -40°C TA = +25°C 5 31 TA = +85°C 0 30 IO = 5 mA 1.5 1 0.5 100 IO = 35 mA 32 IO = 2 mA 0 2 2.5 0 3 1.5 1 0.5 Output Voltage (V) 2 2.5 3 Output Voltage (V) Figure 12. Figure 13. ΔIOLC vs AMBIENT TEMPERATURE ΔIOLC vs OUTPUT CURRENT 4 4 TA = +25°C IO = 35 mA 3 3 2 2 1 1 DIOLC (%) DIOLC (%) 80 60 40 Free-Air Temperature (°C) 50 45 20 0 -20 Output Current (mA) 0 -1 0 -1 -2 -2 VCC = 3.3 V -3 VCC = 3.3 V -3 VCC = 5 V VCC = 5 V -4 -4 -40 -20 0 20 40 60 80 100 0 10 20 30 Ambient Temperature (°C) Output Current (mA) Figure 14. Figure 15. 40 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 50 11 TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) At VCC = 3.3 V and TA = +25°C, unless otherwise noted. CONSTANT-CURRENT OUTPUT VOLTAGE WAVEFORM CH1-BLANK (30 ns) CH1 (2 V/div) CH2-OUT0 (BLANK = 30 ns) CH2 (2 V/div) CH3 (2 V/div) IOLC = 35 mA, TA = +25°C RL = 130 W, CL = 15 pF VCC = 3.3 V, VLED = 5.5 V CH3-OUT3 (BLANK = 30 ns) Time (20 ns/div) Figure 16. 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 DETAILED DESCRIPTION SETTING FOR THE CONSTANT SINK CURRENT VALUE The constant-current values are determined by an external resistor (RIREF) placed between IREF and GND. The resistor (RIREF) value is calculated by Equation 1. RIREF (kW) = VIREF (V) ´ 41.9 IOLC (mA) Where: VIREF = the internal reference voltage on the IREF pin (typically 1.205 V) (1) IOLC must be set in the range of 2 mA to 35 mA when VCC is less than 3.6 V. Also, when VCC is equal to 3.6 V or greater, IOLC must be set in the range of 2 mA to 45 mA. The constant sink current characteristic for the external resistor value is shown in Figure 10. Table 1 describes the constant-current output versus external resistor value. Table 1. Constant-Current Output versus External Resistor Value IOLC (mA, Typical) RIREF (kΩ) 45 (VCC > 3.6 V only) 1.12 40 (VCC > 3.6 V only) 1.26 35 1.44 30 1.68 25 2.02 20 2.52 15 3.37 10 5.05 5 10.1 2 25.2 CONSTANT-CURRENT DRIVER ON/OFF CONTROL When BLANK is low, the corresponding output is turned on if the data in the on/off control data latch are '1' and remains off if the data are '0'. When BLANK is high, all outputs are forced off. This control is shown in Table 2. Table 2. On/Off Control Data Truth Table OUTPUT ON/OFF DATA CONSTANT-CURRENT OUTPUT STATUS 0 Off 1 On When the IC is initially powered on, the data in the 16-bit shift register and output on/off data latch are not set to the respective default value. Therefore, the output on/off data must be written to the data latch before turning the constant-current output on. BLANK should be at a high level when powered on because the constant-current may be turned on as a result of random data in the output on/off data latch. The output on/off data corresponding to any unconnected OUTn outputs should be set to '0' before turning on the remaining outputs. Otherwise, the supply current (ICC) increases while the LEDs are on. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 13 TLC59282 SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 www.ti.com REGISTER CONFIGURATION The TLC59282 has a 16-bit shift register and an output on/off data latch. Both the shift register and data latch are 16 bits long and are used to turn the constant-current outputs on and off. Figure 17 shows the shift register and data latch configuration. The data at the SIN pin are shifted in to the LSB of the 16-bit shift register at the rising edge of the SCLK pin; SOUT data change at the rising edge of SCLK. The output on/off data in the 16-bit shift register continue to transfer to the output on/off data latch while LAT is high. Therefore, if the data in the 16-bit shift register are changed when LAT is high, the data in the data latch are also changed. The data in the data latch are held when LAT is low. When the IC initially powers on, the data in the output on/off shift register and latch are not set to the default values; on/off control data must be written to the on/off control data latch before turning the constant-current output on. BLANK should be high when the IC is powered on because the constant-current may be turned on at that time as a result of random values in the on/off data latch. All constant-current outputs are forced off when BLANK is high. The OUTn on/off are controlled by the data in the output on/off data latch. The timing diagram and truth table for writing data are shown in Figure 18 and Table 3. 16-Bit Shift Register (1 Bit ´ 16 Channels) SOUT MSB 15 14 13 12 On/Off Data for OUT15 On/Off Data for OUT14 On/Off Data for OUT13 On/Off Data for OUT12 4 11 ¼ 3 2 1 LSB 0 On/Off Data for OUT3 On/Off Data for OUT2 On/Off Data for OUT1 On/Off Data for OUT0 3 2 1 LSB 0 On/Off Data for OUT3 On/Off Data for OUT2 On/Off Data for OUT1 On/Off Data for OUT0 SIN SCLK ¼ MSB 15 14 13 12 On/Off Data for OUT15 On/Off Data for OUT14 On/Off Data for OUT13 On/Off Data for OUT12 Output On/Off Data Latch (1 Bit ´ 16 Channels) 4 11 ¼ LAT 16 Bits To Constant-Current Driver Control Block Figure 17. 16-Bit Shift Register and Output On/Off Data Latch Configuration 14 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 TLC59282 www.ti.com SBVS152A – DECEMBER 2010 – REVISED DECEMBER 2010 0 1 2 3 4 5 6 D15 D14 D13 D12 D11 D10 7 8 9 10 11 12 13 14 15 SCLK D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 SIN LAT BLANK D0 OFF OUT0 ON OUT1 D1 OUT2 D2 OFF ON OFF ON D3 OFF OUT3 ON ¼ ¼ ¼ ¼ OFF D15 OUT15 SOUT ON D15 Don’t Care Figure 18. Operation Timing Diagram Table 3. Truth Table in Operation SCLK LAT BLANK SIN OUT0…OUT7…OUT15 SOUT ↑ High Low Dn Dn…Dn – 7…Dn – 15 Dn – 15 ↑ Low Low Dn + 1 No change Dn – 14 ↑ High Low Dn + 2 Dn + 2…Dn – 5…Dn – 13 Dn – 13 ↓ — Low Dn + 3 Dn + 2…Dn – 5…Dn – 13 Dn – 13 ↓ — High Dn + 3 Off Dn – 13 NOISE REDUCTION Large surge currents may flow through the IC and the board if all 16 outputs turn on or off simultaneously. These large current surges could induce detrimental noise and electromagnetic interference (EMI) into other circuits. The TLC59282 independently turns on or off the outputs for each color group with a 20 ns (typ) delay time; see Figure 9. The output current sinks are grouped into four groups. The first group that is turned on/off are OUT0/7/8/15; the second group that is turned on/off are OUT1/6/9/14; the third group that is turned on/off are OUT2/5/10/13; and the fourth group is OUT3/4/11/12. Both turn-on and turn-off are delayed. However, the state of each output is controlled by the data in the output on-off data latch and BLANK level. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC59282 15 PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLC59282DBQ ACTIVE SSOP/QSOP DBQ 24 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples TLC59282DBQR ACTIVE SSOP/QSOP DBQ 24 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLC59282DBQR Package Package Pins Type Drawing SSOP/ QSOP DBQ 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC59282DBQR SSOP/QSOP DBQ 24 2500 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated