TPD2E2U06 www.ti.com SLLSEG9A – JUNE 2013 – REVISED JUNE 2013 Dual-Channel High-Speed ESD Protection Device Check for Samples: TPD2E2U06 FEATURES DESCRIPTION • The TPD2E2U06 is a dual-channel ultra-low capacitance ESD-protection device. The device offers ±25-KV IEC contact and ±30-KV IEC air-gap ESD protection. The 1.5-pF line capacitance of the TPD2E2U06 makes the device suitable for a wide range of applications. Typical application interfaces are USB 2.0, LVDS, and I2C™. 2 • • • • • • • Provides System-Level ESD Protection for Low-Voltage IO Interface IEC 61000-4-2 Level 4 – ±25 kV (contact discharge) – ±30 kV (air-gap discharge) IO Capacitance 1.5 pF (Typ) DC Breakdown Voltage 6.5 V (Min) Ultra-Low Leakage Current 10 nA (Max) Low ESD Clamping Voltage Industrial Temperature Range: –40°C to +125°C Small Easy-to-Route DRL Package APPLICATIONS • • • • Gaming Machines eBook Portable Media Players Digital Camera DRL 1.65 mm × 1.2 mm × 0.6 mm (0.5-mm PITCH) NC NC IO1 1 5 IO2 2 3 4 GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. I2C is a trademark of NXP Semiconductors. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2013, Texas Instruments Incorporated PRODUCT PREVIEW 1 TPD2E2U06 SLLSEG9A – JUNE 2013 – REVISED JUNE 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT IPP Peak pulse current (tp = 8/20 μs) 5.5 (1) A PPP Peak pulse power (tp = 8/20 μs) 85 (1) W IEC 61000-4-2 air-gap ESD ±30 (1) kV IEC 61000-4-2 contact ESD ±25 (1) kV (1) Operating temperature –40 125 °C Storage temperature –65 155 °C Measured at 25°C. ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PRODUCT PREVIEW PARAMETER TEST CONDITIONS MIN TYP VRWM Reverse stand-off voltage IIO < 10 µA VCLAMP IO to GND IPP = 1 A, TLP (1) 9.7 IPP = 5 A, TLP (1) 12.4 IPP = 1 A, TLP (1) 1.9 IPP = 5 A, TLP (1) 4 VCLAMP GND to IO MAX 5.5 UNIT V V V RDYN Dynamic resistance IO to GND (2) 0.5 Ω RDYN Dynamic resistance GND to IO (2) 0.25 Ω (3) CL Line capacitance f = 1 MHz, VBIAS = 2.5 V CCROSS Channel-to-channel input capacitance Pin 4 = 0 V, f = 1 MHz, VBIAS = 2.5 V, between channel pins (3) ∆CIO-TO-GND Variation of channel input capacitance Pin 4 = 0 V, f = 1 MHz, VBIAS = 2.5 V, channel_x pin to GND – channel_y pin to GND VBR Break-down voltage IIO = 1 mA ILEAK Leakage current VIO = 2.5 V (1) (2) (3) 2 (3) 1.5 1.9 pF 0.02 0.03 pF 0.03 0.1 pF 6.5 1 8.5 V 10 nA Transmission Line Pulse with 10-ns rise time, 100-ns width. Extraction of RDYN Using least squares fit of TLP characteristics between I = 20 A and I = 30 A. Measured at 25°C. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPD2E2U06 TPD2E2U06 www.ti.com SLLSEG9A – JUNE 2013 – REVISED JUNE 2013 DEVICE INFORMATION FUNCTIONAL BLOCK DIAGRAM IO1 IO2 PRODUCT PREVIEW GND Figure 1. CIRCUIT SCHEMATIC DIAGRAM PIN FUNCTIONS PIN NAME NO. I/O DESCRIPTION The IO1 and IO2 pins are an ESD protected channel. Connect these pins to the data line as close to the connector as possible. IO1 3 I/O IO2 5 I/O NC 1, 2 - This pin is not connected and is left floating, grounded, or connected to VCC. 4 - The GND (ground) pin is connected to ground. GND Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPD2E2U06 3 TPD2E2U06 SLLSEG9A – JUNE 2013 – REVISED JUNE 2013 www.ti.com TYPICAL CHARACTERISTICS TLP, GND TO DATA 30 25 25 20 20 Current (A) Current (A) TLP, DATA TO GND 30 15 15 10 10 5 5 0 0 0 5 10 15 20 25 30 35 40 45 Voltage (V) 50 0 5 10 15 20 25 30 35 40 45 Voltage (V) C002 Figure 2. 50 C003 Figure 3. IEC 61000-4-2 CLAMPING VOLTAGE, +8 kV CONTACT IEC 61000-4-2 CLAMPING VOLTAGE, –8 kV CONTACT 120 15 0 105 ±15 90 PRODUCT PREVIEW ±30 ±45 Voltage (V) Voltage (V) 75 60 45 ±60 ±75 ±90 30 ±105 15 ±120 0 ±135 ±15 ±150 0 25 50 75 100 125 150 175 200 Time (ns) 0.001 ±10 40 65 90 115 140 165 Time (ns) Figure 4. Figure 5. IV CURVE, TA = 25°C ILEAK vs TEMPERATURE, VIN 2.5 V 500 190 C005 400 Current (pA) 0.0005 Current (A) 15 C004 0 300 200 -0.0005 100 -0.001 ±2 ±1 0 1 2 3 4 5 Voltage (V) 6 7 8 9 10 C006 0 0 20 40 60 Temperature (ƒC) Figure 6. 4 80 100 120 C007 Figure 7. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPD2E2U06 TPD2E2U06 www.ti.com SLLSEG9A – JUNE 2013 – REVISED JUNE 2013 TYPICAL CHARACTERISTICS (continued) SURGE CURVE (tp = 8/20 μs) IO TO GND CAPACITANCE ACROSS VBIAS f = 1 mHZ 2.2 6.5 100 Current 90 Power 5.2 80 1.8 1.6 3.9 60 50 2.6 40 Power (W) 70 Current (A) Capacitance (pF) 2 30 1.4 1.3 1.2 0.0 20 10 0 ±5 F = 1 MHz 0 5 10 15 20 25 30 35 40 45 50 Time ( S) 1 0 1 2 3 4 IO Voltage (V) C009 5 C008 Figure 8. Figure 9. 1M 10M 100M Frequency (Hz) Figure 10. 1000M 10000M C010 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPD2E2U06 PRODUCT PREVIEW Gain (dB) INSERTION LOSS 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 ±10 ±11 ±12 100k 5 PACKAGE OPTION ADDENDUM www.ti.com 28-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) TPD2E2U06DRLR-P ACTIVE Package Type Package Pins Package Drawing Qty SOT DRL 5 4000 Eco Plan Lead/Ball Finish (2) TBD MSL Peak Temp Op Temp (°C) Device Marking (3) Call TI Call TI (4/5) DT6 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated