LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 LM13700 Dual Operational Transconductance Amplifiers with Linearizing Diodes and Buffers Check for Samples: LM13700 FEATURES DESCRIPTION • • • • • • The LM13700 series consists of two current controlled transconductance amplifiers, each with differential inputs and a push-pull output. The two amplifiers share common supplies but otherwise operate independently. Linearizing diodes are provided at the inputs to reduce distortion and allow higher input levels. The result is a 10 dB signal-tonoise improvement referenced to 0.5 percent THD. High impedance buffers are provided which are especially designed to complement the dynamic range of the amplifiers. The output buffers of the LM13700 differ from those of the LM13600 in that their input bias currents (and hence their output DC levels) are independent of IABC. This may result in performance superior to that of the LM13600 in audio applications. 1 2 gm Adjustable over 6 Decades Excellent gm Linearity Excellent Matching between Amplifiers Linearizing Diodes High Impedance Buffers High Output Signal-to-Noise Ratio APPLICATIONS • • • • • • • Current-Controlled Amplifiers Current-Controlled Impedances Current-Controlled Filters Current-Controlled Oscillators Multiplexers Timers Sample-and-Hold circuits Connection Diagram Figure 1. PDIP and SOIC Packages-Top View See Package Number D0016A or NFG0016E 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage LM13700 Power Dissipation 36 VDC or ±18V (2) TA = 25°C LM13700N 570 mW Differential Input Voltage ±5V Diode Bias Current (ID) 2 mA Amplifier Bias Current (IABC) 2 mA Output Short Circuit Duration Buffer Output Current Continuous (3) 20 mA Operating Temperature Range LM13700N 0°C to +70°C +VS to −VS DC Input Voltage −65°C to +150°C Storage Temperature Range Soldering Information PDIP Package Soldering (10 sec.) 260°C SOIC Package (1) (2) (3) 2 Vapor Phase (60 sec.) 215°C Infrared (15 sec.) 220°C “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a thermal resistance, junction to ambient, as follows: LM13700N, 90°C/W; LM13700M, 110°C/W. Buffer output current should be limited so as to not exceed package dissipation. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Electrical Characteristics (1) Parameter Test Conditions LM13700 Units Typ Max Over Specified Temperature Range 0.4 4 IABC = 5 μA 0.3 4 VOS Including Diodes Diode Bias Current (ID) = 500 μA 0.5 5 mV Input Offset Change 5 μA ≤ IABC ≤ 500 μA 0.1 3 mV 0.1 0.6 μA 0.4 5 μA 1 8 9600 13000 Input Offset Voltage (VOS) Min Input Offset Current Input Bias Current Over Specified Temperature Range Forward Transconductance (gm) 6700 Over Specified Temperature Range μmho 5400 gm Tracking Peak Output Current mV RL = 0, IABC = 5 μA 0.3 dB 5 μA RL = 0, IABC = 500 μA 350 RL = 0, Over Specified Temp Range 300 Positive RL = ∞, 5 μA ≤ IABC ≤ 500 μA +12 +14.2 Negative RL = ∞, 5 μA ≤ IABC ≤ 500 μA −12 500 650 Peak Output Voltage V −14.4 V IABC = 500 μA, Both Channels 2.6 mA Positive ΔVOS/ΔV+ 20 150 μV/V Negative ΔVOS/ΔV− 20 150 μV/V Supply Current VOS Sensitivity CMRR 80 110 dB Common Mode Range ±12 ±13.5 V dB (2) Crosstalk Referred to Input 20 Hz < f < 20 kHz 100 Differential Input Current IABC = 0, Input = ±4V 0.02 100 Leakage Current IABC = 0 (Refer to Test Circuit) 0.2 100 Input Resistance 10 Open Loop Bandwidth Slew Rate Unity Gain Compensated Buffer Input Current (2) Peak Buffer Output Voltage (2) (1) (2) nA nA 26 kΩ 2 MHz 50 0.5 V/μs 2 10 μA V These specifications apply for VS = ±15V, TA = 25°C, amplifier bias current (IABC) = 500 μA, pins 2 and 15 open unless otherwise specified. The inputs to the buffers are grounded and outputs are open. These specifications apply for VS = ±15V, IABC = 500 μA, ROUT = 5 kΩ connected from the buffer output to −VS and the input of the buffer is connected to the transconductance amplifier output. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 3 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Schematic Diagram Figure 2. One Operational Transconductance Amplifier Typical Application Figure 3. Voltage Controlled Low-Pass Filter 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Typical Performance Characteristics Input Offset Voltage Input Offset Current Figure 4. Figure 5. Input Bias Current Peak Output Current Figure 6. Figure 7. Peak Output Voltage and Common Mode Range Leakage Current Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 5 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) 6 Input Leakage Transconductance Figure 10. Figure 11. Input Resistance Amplifier Bias Voltage vs. Amplifier Bias Current Figure 12. Figure 13. Input and Output Capacitance Output Resistance Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Distortion vs. Differential Input Voltage Voltage vs. Amplifier Bias Current Figure 16. Figure 17. Output Noise vs. Frequency Figure 18. Figure 19. Unity Gain Follower Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 7 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Figure 20. Leakage Current Test Circuit Figure 21. Differential Input Current Test Circuit Circuit Description The differential transistor pair Q4 and Q5 form a transconductance stage in that the ratio of their collector currents is defined by the differential input voltage according to the transfer function: (1) where VIN is the differential input voltage, kT/q is approximately 26 mV at 25°C and I5 and I4 are the collector currents of transistors Q5 and Q4 respectively. With the exception of Q12 and Q13, all transistors and diodes are identical in size. Transistors Q1 and Q2 with Diode D1 form a current mirror which forces the sum of currents I4 and I5 to equal IABC: I4 + I5 = IABC (2) where IABC is the amplifier bias current applied to the gain pin. For small differential input voltages the ratio of I4 and I5 approaches unity and the Taylor series of the In function can be approximated as: (3) (4) Collector currents I4 and I5 are not very useful by themselves and it is necessary to subtract one current from the other. The remaining transistors and diodes form three current mirrors that produce an output current equal to I5 minus I4 thus: (5) The term in brackets is then the transconductance of the amplifier and is proportional to IABC. Linearizing Diodes For differential voltages greater than a few millivolts, Equation 3 becomes less valid and the transconductance becomes increasingly nonlinear. Figure 22 demonstrates how the internal diodes can linearize the transfer function of the amplifier. For convenience assume the diodes are biased with current sources and the input signal is in the form of current IS. Since the sum of I4 and I5 is IABC and the difference is IOUT, currents I4 and I5 can be written as follows: (6) Since the diodes and the input transistors have identical geometries and are subject to similar voltages and temperatures, the following is true: 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 (7) Notice that in deriving Equation 7 no approximations have been made and there are no temperature-dependent terms. The limitations are that the signal current not exceed ID/2 and that the diodes be biased with currents. In practice, replacing the current sources with resistors will generate insignificant errors. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 9 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com APPLICATIONS Voltage Controlled Amplifiers Figure 23 shows how the linearizing diodes can be used in a voltage-controlled amplifier. To understand the input biasing, it is best to consider the 13 kΩ resistor as a current source and use a Thevenin equivalent circuit as shown in Figure 24. This circuit is similar to Figure 22 and operates the same. The potentiometer in Figure 23 is adjusted to minimize the effects of the control signal at the output. Figure 22. Linearizing Diodes For optimum signal-to-noise performance, IABC should be as large as possible as shown by the Output Voltage vs. Amplifier Bias Current graph. Larger amplitudes of input signal also improve the S/N ratio. The linearizing diodes help here by allowing larger input signals for the same output distortion as shown by the Distortion vs. Differential Input Voltage graph. S/N may be optimized by adjusting the magnitude of the input signal via RIN (Figure 23) until the output distortion is below some desired level. The output voltage swing can then be set at any level by selecting RL. Although the noise contribution of the linearizing diodes is negligible relative to the contribution of the amplifier's internal transistors, ID should be as large as possible. This minimizes the dynamic junction resistance of the diodes (re) and maximizes their linearizing action when balanced against RIN. A value of 1 mA is recommended for ID unless the specific application demands otherwise. Figure 23. Voltage Controlled Amplifier 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Figure 24. Equivalent VCA Input Circuit Stereo Volume Control The circuit of Figure 25 uses the excellent matching of the two LM13700 amplifiers to provide a Stereo Volume Control with a typical channel-to-channel gain tracking of 0.3 dB. RP is provided to minimize the output offset voltage and may be replaced with two 510Ω resistors in AC-coupled applications. For the component values given, amplifier gain is derived for Figure 23 as being: (8) If VC is derived from a second signal source then the circuit becomes an amplitude modulator or two-quadrant multiplier as shown in Figure 26, where: (9) The constant term in the above equation may be cancelled by feeding IS × IDRC/2(V− + 1.4V) into IO. The circuit of Figure 27 adds RM to provide this current, resulting in a four-quadrant multiplier where RC is trimmed such that VO = 0V for VIN2 = 0V. RM also serves as the load resistor for IO. Figure 25. Stereo Volume Control Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 11 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 26. Amplitude Modulator Figure 27. Four-Quadrant Multiplier Noting that the gain of the LM13700 amplifier of Figure 24 may be controlled by varying the linearizing diode current ID as well as by varying IABC, Figure 28 shows an AGC Amplifier using this approach. As VO reaches a high enough amplitude (3VBE) to turn on the Darlington transistors and the linearizing diodes, the increase in ID reduces the amplifier gain so as to hold VO at that level. Voltage Controlled Resistors An Operational Transconductance Amplifier (OTA) may be used to implement a Voltage Controlled Resistor as shown in Figure 29. A signal voltage applied at RX generates a VIN to the LM13700 which is then multiplied by the gm of the amplifier to produce an output current, thus: (10) where gm ≈ 19.2IABC at 25°C. Note that the attenuation of VO by R and RA is necessary to maintain VIN within the linear range of the LM13700 input. Figure 30 shows a similar VCR where the linearizing diodes are added, essentially improving the noise performance of the resistor. A floating VCR is shown in Figure 31, where each “end” of the “resistor” may be at any voltage within the output voltage range of the LM13700. 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Figure 28. AGC Amplifier Figure 29. Voltage Controlled Resistor, Single-Ended Figure 30. Voltage Controlled Resistor with Linearizing Diodes Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 13 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Voltage Controlled Filters OTA's are extremely useful for implementing voltage controlled filters, with the LM13700 having the advantage that the required buffers are included on the I.C. The VC Lo-Pass Filter of Figure 32 performs as a unity-gain buffer amplifier at frequencies below cut-off, with the cut-off frequency being the point at which XC/gm equals the closed-loop gain of (R/RA). At frequencies above cut-off the circuit provides a single RC roll-off (6 dB per octave) of the input signal amplitude with a −3 dB point defined by the given equation, where gm is again 19.2 × IABC at room temperature. Figure 33 shows a VC High-Pass Filter which operates in much the same manner, providing a single RC roll-off below the defined cut-off frequency. Additional amplifiers may be used to implement higher order filters as demonstrated by the two-pole Butterworth Lo-Pass Filter of Figure 34 and the state variable filter of Figure 35. Due to the excellent gm tracking of the two amplifiers, these filters perform well over several decades of frequency. Figure 31. Floating Voltage Controlled Resistor Figure 32. Voltage Controlled Low-Pass Filter 14 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Figure 33. Voltage Controlled Hi-Pass Filter Figure 34. Voltage Controlled 2-Pole Butterworth Lo-Pass Filter Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 15 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 35. Voltage Controlled State Variable Filter Voltage Controlled Oscillators The classic Triangular/Square Wave VCO of Figure 36 is one of a variety of Voltage Controlled Oscillators which may be built utilizing the LM13700. With the component values shown, this oscillator provides signals from 200 kHz to below 2 Hz as IC is varied from 1 mA to 10 nA. The output amplitudes are set by IA × RA. Note that the peak differential input voltage must be less than 5V to prevent zenering the inputs. A few modifications to this circuit produce the ramp/pulse VCO of Figure 37. When VO2 is high, IF is added to IC to increase amplifier A1's bias current and thus to increase the charging rate of capacitor C. When VO2 is low, IF goes to zero and the capacitor discharge current is set by IC. The VC Lo-Pass Filter of Figure 32 may be used to produce a high-quality sinusoidal VCO. The circuit of Figure 37 employs two LM13700 packages, with three of the amplifiers configured as lo-pass filters and the fourth as a limiter/inverter. The circuit oscillates at the frequency at which the loop phase-shift is 360° or 180° for the inverter and 60° per filter stage. This VCO operates from 5 Hz to 50 kHz with less than 1% THD. Figure 36. Triangular/Square-Wave VCO 16 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Figure 37. Ramp/Pulse VCO Figure 38. Sinusoidal VCO Figure 39 shows how to build a VCO using one amplifier when the other amplifier is needed for another function. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 17 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 39. Single Amplifier VCO Additional Applications Figure 40 presents an interesting one-shot which draws no power supply current until it is triggered. A positivegoing trigger pulse of at least 2V amplitude turns on the amplifier through RB and pulls the non-inverting input high. The amplifier regenerates and latches its output high until capacitor C charges to the voltage level on the non-inverting input. The output then switches low, turning off the amplifier and discharging the capacitor. The capacitor discharge rate is speeded up by shorting the diode bias pin to the inverting input so that an additional discharge current flows through DI when the amplifier output switches low. A special feature of this timer is that the other amplifier, when biased from VO, can perform another function and draw zero stand-by power as well. Figure 40. Zero Stand-By Power Timer The operation of the multiplexer of Figure 41 is very straightforward. When A1 is turned on it holds VO equal to VIN1 and when A2 is supplied with bias current then it controls VO. CC and RC serve to stabilize the unity-gain configuration of amplifiers A1 and A2. The maximum clock rate is limited to about 200 kHz by the LM13700 slew rate into 150 pF when the (VIN1–VIN2) differential is at its maximum allowable value of 5V. The Phase-Locked Loop of Figure 42 uses the four-quadrant multiplier of Figure 27 and the VCO of Figure 39 to produce a PLL with a ±5% hold-in range and an input sensitivity of about 300 mV. 18 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Figure 41. Multiplexer Figure 42. Phase Lock Loop The Schmitt Trigger of Figure 43 uses the amplifier output current into R to set the hysteresis of the comparator; thus VH = 2 × R × IB. Varying IB will produce a Schmitt Trigger with variable hysteresis. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 19 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 43. Schmitt Trigger Figure 44 shows a Tachometer or Frequency-to-Voltage converter. Whenever A1 is toggled by a positive-going input, an amount of charge equal to (VH–VL) Ct is sourced into Cf and Rt. This once per cycle charge is then balanced by the current of VO/Rt. The maximum FIN is limited by the amount of time required to charge Ct from VL to VH with a current of IB, where VL and VH represent the maximum low and maximum high output voltage swing of the LM13700. D1 is added to provide a discharge path for Ct when A1 switches low. The Peak Detector of Figure 45 uses A2 to turn on A1 whenever VIN becomes more positive than VO. A1 then charges storage capacitor C to hold VO equal to VIN PK. Pulling the output of A2 low through D1 serves to turn off A1 so that VO remains constant. Figure 44. Tachometer Figure 45. Peak Detector and Hold Circuit 20 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 The Ramp-and-Hold of Figure 47 sources IB into capacitor C whenever the input to A1 is brought high, giving a ramp-rate of about 1V/ms for the component values shown. The true-RMS converter of Figure 48 is essentially an automatic gain control amplifier which adjusts its gain such that the AC power at the output of amplifier A1 is constant. The output power of amplifier A1 is monitored by squaring amplifier A2 and the average compared to a reference voltage with amplifier A3. The output of A3 provides bias current to the diodes of A1 to attenuate the input signal. Because the output power of A1 is held constant, the RMS value is constant and the attenuation is directly proportional to the RMS value of the input voltage. The attenuation is also proportional to the diode bias current. Amplifier A4 adjusts the ratio of currents through the diodes to be equal and therefore the voltage at the output of A4 is proportional to the RMS value of the input voltage. The calibration potentiometer is set such that VO reads directly in RMS volts. Figure 46. Sample-Hold Circuit Figure 47. Ramp and Hold Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 21 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 48. True RMS Converter The circuit of Figure 49 is a voltage reference of variable Temperature Coefficient. The 100 kΩ potentiometer adjusts the output voltage which has a positive TC above 1.2V, zero TC at about 1.2V, and negative TC below 1.2V. This is accomplished by balancing the TC of the A2 transfer function against the complementary TC of D1. The wide dynamic range of the LM13700 allows easy control of the output pulse width in the Pulse Width Modulator of Figure 50. For generating IABC over a range of 4 to 6 decades of current, the system of Figure 51 provides a logarithmic current out for a linear voltage in. Since the closed-loop configuration ensures that the input to A2 is held equal to 0V, the output current of A1 is equal to I3 = −VC/RC. The differential voltage between Q1 and Q2 is attenuated by the R1,R2 network so that A1 may be assumed to be operating within its linear range. From Equation 5, the input voltage to A1 is: (11) The voltage on the base of Q1 is then (12) The ratio of the Q1 and Q2 collector currents is defined by: (13) Combining and solving for IABC yields: (14) This logarithmic current can be used to bias the circuit of Figure 25 to provide temperature independent stereo attenuation characteristic. 22 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 Figure 49. Delta VBE Reference Figure 50. Pulse Width Modulator Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 23 LM13700 SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 51. Logarithmic Current Source 24 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 LM13700 www.ti.com SNOSBW2E – NOVEMBER 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision D (March 2013) to Revision E • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 24 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM13700 25 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM13700M NRND SOIC D 16 48 TBD Call TI Call TI 0 to 70 LM13700M LM13700M/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM13700M LM13700MX NRND SOIC D 16 2500 TBD Call TI Call TI 0 to 70 LM13700M LM13700MX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM13700M LM13700N NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 LM13700N LM13700N/NOPB ACTIVE PDIP NFG 16 25 Pb-Free (RoHS) CU SN Level-1-NA-UNLIM 0 to 70 LM13700N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM13700MX SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 LM13700MX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM13700MX SOIC D 16 2500 367.0 367.0 35.0 LM13700MX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFG0016E N0016E N16E (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated